WO2008001651A1 - Procédé d'inspection de carte et dispositif d'inspection de carte - Google Patents

Procédé d'inspection de carte et dispositif d'inspection de carte Download PDF

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Publication number
WO2008001651A1
WO2008001651A1 PCT/JP2007/062337 JP2007062337W WO2008001651A1 WO 2008001651 A1 WO2008001651 A1 WO 2008001651A1 JP 2007062337 W JP2007062337 W JP 2007062337W WO 2008001651 A1 WO2008001651 A1 WO 2008001651A1
Authority
WO
WIPO (PCT)
Prior art keywords
terminals
contact
terminal
inspection
wiring pattern
Prior art date
Application number
PCT/JP2007/062337
Other languages
English (en)
Japanese (ja)
Inventor
Munehiro Yamashita
Original Assignee
Nidec-Read Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec-Read Corporation filed Critical Nidec-Read Corporation
Publication of WO2008001651A1 publication Critical patent/WO2008001651A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07385—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Definitions

  • the present invention relates to a substrate inspection method and a substrate inspection apparatus for inspecting electrical characteristics of a substrate having a plurality of wiring patterns.
  • the present invention is not limited to a printed wiring board, but includes, for example, various substrates such as a flexible board, a multilayer wiring board, an electrode plate for a liquid crystal display or a plasma display, a package board for a semiconductor package, and a film carrier.
  • substrate various substrates such as a flexible board, a multilayer wiring board, an electrode plate for a liquid crystal display or a plasma display, a package board for a semiconductor package, and a film carrier.
  • substrate such as a flexible board, a multilayer wiring board, an electrode plate for a liquid crystal display or a plasma display, a package board for a semiconductor package, and a film carrier.
  • Patent Document 1 relates to an insulation inspection method for inspecting the insulation of wiring patterns arranged side by side in a mutually insulated state. Techniques such as those disclosed in are proposed.
  • Patent Document 1 relates to an insulation test, and is not applied to a wiring pattern continuity test.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2006-105795
  • the present invention has been made in view of such a situation, and can reduce the number of inspections at the time of continuity inspection of a wiring pattern provided on a substrate and shorten the inspection time and the substrate. Provide inspection equipment.
  • a plurality of nets are formed by a plurality of terminals formed on one surface and the other surface and a plurality of wiring patterns connecting the terminals.
  • a substrate inspection method for inspecting electrical characteristics of a substrate wherein the plurality of wiring patterns are formed on a wiring pattern group connecting the terminals formed on the one surface, and on the other surface. The wiring pattern group connecting the terminals, and the wiring pattern group connecting the terminal formed on the one surface and the terminal formed on the other surface, and formed on the one surface.
  • the wiring pattern that is the object of the first inspection process is the wiring that is the object of the second inspection process.
  • the pattern belongs to a net different from the pattern, and the first inspection process and the second inspection process are simultaneously performed in parallel.
  • the third inspection processing is performed on the one surface connected by different nets.
  • a step of simultaneously inspecting electrical characteristics of a wiring pattern connecting the terminals for a plurality of combinations of the terminals and the terminals on the other surface is included.
  • the two contact terminals in contact with the same terminal prior to the inspection of the electrical characteristics between the terminals.
  • the contact state of the two contact terminals to the terminal is determined based on the conduction state between them.
  • a board inspection apparatus for inspecting electrical characteristics comprising a storage unit for storing net information relating to the net provided on the board, and a plurality of contacts for contacting the terminals to be inspected.
  • the at least two inspection means for inspecting electrical characteristics between the terminals via a contact and the terminals to be inspected by the at least two inspection means based on net information stored in the storage unit
  • a control unit that controls the order of the first and second wiring patterns formed on the other surface and the first set of wiring patterns that connect the terminals formed on the one surface.
  • the terminal to be Are classified into a second group consisting of those that connect the terminals, and a third group that consists of the forces that connect the terminals formed on the one surface and the terminals formed on the other surface, and the classification. Based on the result, the order of inspection of the terminals is controlled.
  • the inspection of the plurality of wiring patterns formed on the substrate is performed on the wiring pattern connecting the terminals formed on one surface, and the other surface.
  • the wiring pattern connecting the terminals formed on one surface and the wiring pattern connecting the terminals formed on the other surface are used.
  • the inspection time can be further shortened because the inspection is performed in parallel.
  • the third inspection processing is performed between the terminals for a plurality of combinations of the terminals on the one surface and the terminals on the other surface connected by different nets.
  • the inspection time can be further shortened because it includes a step of simultaneously inspecting the electrical characteristics of the wiring pattern connecting the wires.
  • the contact terminal for current supply and the contact terminal for voltage measurement are provided, the contact resistance between the contact terminal and the terminal at the time of voltage measurement is provided.
  • the voltage applied across the terminals can be accurately measured.
  • electrical characteristics such as resistance between terminals can be accurately measured, and the reliability of the continuity test can be improved.
  • the two contact terminals prior to the inspection of the electrical characteristics between the terminals, are connected based on the conduction state between the two contact terminals in contact with the same terminal. Since the contact state between the terminals is determined, it is possible to prevent an error in the conduction test between the terminals due to poor contact between the contact terminals.
  • the inspection of the plurality of wiring patterns formed on the substrate, the inspection of the wiring patterns connecting the terminals formed on one surface, and the other surface A wiring pattern that connects terminals formed in a single line! / Inspection at the time of continuity inspection of the wiring pattern provided on the board, because it is performed separately for the inspection of the wiring pattern that connects the terminal formed on one surface and the terminal formed on the other surface.
  • the number of times can be reduced and the inspection time can be shortened.
  • a substrate inspection method and a substrate inspection apparatus used therefor according to an embodiment of the present invention will be described.
  • the substrate inspection method according to the present embodiment is an electrical circuit for a substrate in which a plurality of nets are formed by a plurality of terminals formed on one surface and the other surface and a plurality of wiring patterns connecting the terminals. Applies to property inspection.
  • FIG. 1 is a diagram schematically showing an example of a substrate to which the substrate inspection method according to the present embodiment is applied.
  • a substrate 10 shown in FIG. 1 is a substrate to be inspected by a substrate inspection apparatus, for example, a package substrate used in a BGA (Ball Grid Array) package.
  • BGA All Grid Array
  • One surface 11 (surface 11) of 10 is an element arrangement surface to which a semiconductor chip is attached.
  • an upper terminal T (terminal) that is a conductor portion for connecting the semiconductor chip by flip chip bonding or wire bonding ⁇ 1 ⁇ ⁇ ⁇ ⁇ 13)
  • the other surface 12 (back surface 12) of the substrate 10 is provided with, for example, lower terminal pins (terminals B1... -B13) that are pads for soldering terminals of solder balls.
  • the upper terminal ⁇ , the lower terminal ⁇ , the upper terminal ⁇ , and the lower terminal are connected to internal wiring and internal wiring patterns (hereinafter referred to as internal via patterns) provided on the inside or the surface of the substrate 10, respectively.
  • the wiring pattern is electrically connected to the bottom.
  • the pitch at which each upper terminal T is provided is different from the lower terminal B.
  • the interval is smaller than that.
  • 13 upper terminals T and 13 lower terminals B on the substrate 10 in FIG. 1 this is for the convenience of explanation and is not particularly limited.
  • the upper terminal T1 is connected to the lower terminals Bl and B4, the upper terminal T2 is connected to the upper terminal T3, the upper terminal T4 is connected to the upper terminal T5, and the lower terminals ⁇ 5 and ⁇ 6.
  • Upper terminal ⁇ 6 is connected to upper terminal ⁇ 9
  • upper terminal T10 is connected to lower terminals ⁇ 9
  • B10 upper terminal T11 is connected to upper terminal T12
  • upper terminal T13 is connected to lower terminal B13 Connected
  • lower terminal ⁇ 2 is connected to lower terminal ⁇ 3, and lower terminal B11 is connected to lower terminal B12.
  • a plurality of nets are formed by an upper terminal ⁇ , a lower terminal ⁇ , and a wiring pattern that electrically connects these terminals.
  • the number of force nets on which ten nets are formed is not particularly limited.
  • FIG. 2 is a block diagram of the substrate inspection apparatus 1. As shown in FIG.
  • the board inspection apparatus 20 includes a storage unit 21, a control unit 22, an output unit 23, first and second current supply units 24 and 25, and first and second voltage measurement units. 26, 27, first and second switching portions 28, 29, and first and second contact portions 30, 31.
  • the inspection means according to the present invention includes first and second current supply units 24, 25, first and second voltage measurement units 26, 27, first and second switching units 28, 29, and first And the second contact portions 30, 31 correspond.
  • the storage unit 21 stores rewritable net information relating to terminal positions of the substrate 10, wiring pattern arrangement, and the like.
  • the net information stored in the storage unit 21 is appropriately updated as the type of the board to be inspected 10 is changed.
  • the output unit 23 is used for outputting inspection results and the like, and is configured by a display device or the like.
  • the first and second contact portions 30 and 31 are configured to include a plurality of contacts 32 (see FIG. 4) and a jig 33 that holds the contacts 32. ing.
  • the contact 32 is provided such that its tip end protrudes from the substrate facing surface 33 a facing the substrate 10 of the jig 33.
  • the arrangement position of the contact 32 is set so as to correspond to the arrangement positions of the terminals ⁇ and B provided on the front surface 11 and the back surface 12 of the substrate 10.
  • each contact 32 comes into contact (contact) with the corresponding terminal ⁇ , B.
  • the contact 32 is moved by bringing the jig 32 closer to the vertical force as shown by arrows Al and A2 with respect to the substrate 10 set at a predetermined position in the apparatus 1.
  • one of the jigs 33 (for example, the lower jig 33) is fixed, and the board 10 is set at a predetermined position.
  • the contact 32 provided on the fixed jig 33 may come into contact with the terminals ⁇ and B of the board 10.
  • each contact 32 provided in the first and second contact portions 30, 31 has two contact terminals 32a, 32b that simultaneously contact one terminal ⁇ , B. Is provided.
  • one of the two contact terminals 32a and 32b is used for current supply, and the other is used for voltage measurement.
  • the jig 33 is omitted for simplification of the drawing, and only some of the contacts 32 are shown, and the other contacts 32 are connected. Are omitted (the same applies to Figs. 5 and 7).
  • Each contact terminal 32a, 32b provided in the first contact portion 30 is connected to a switch 28a in the first switching portion 28 via a wiring, and the first and second current supply is performed by the switch 28a.
  • the connection relationship between the units 24 and 25 and the first and second voltage measuring units 26 and 27 can be switched.
  • each contact terminal 32a, 32b provided in the second contact portion 31 is connected to a switch 29a in the second switching portion 29 via a wiring, and the first and second current supply are provided by the switch 29a.
  • the connection relationship between the units 24 and 25 and the first and second voltage measuring units 26 and 27 can be switched.
  • the first and second current supply units 24 and 25 include, for example, a power supply circuit (for example, a power supply circuit capable of adjusting the output voltage) and a current control circuit that controls the current value of the output current.
  • the current supply operation is performed under the control of the control unit 22.
  • the current supply units 24 and 25 output a predetermined constant current by the action of the current control circuit.
  • the first and second switching units 28 and 29 form a circuit with any two contact terminals 32a and 32b in the first and second contact units 30 and 31.
  • the current supplied by the first current supply unit 24 is supplied to the corresponding terminals ⁇ and B of the substrate 10 through the contact terminals 32a and 32b.
  • any two contact terminals 32a, 32b in the first and second contact portions 30, 31 are connected by the first and second switching portions 28, 29 so as to form a circuit.
  • the current supplied by the two-current supply unit 25 is supplied to the corresponding terminals ⁇ and B of the substrate 10 through the contact terminals 32a and 32b.
  • the first voltage measuring unit 26 is connected to any two contact terminals 32a, 32b in the first and second contact units 30, 31 via the first and second switching units 28, 29, and Measure the voltage between terminals ⁇ and B of board 10 with which contact terminals 32a and 32b are in contact. To give.
  • the second voltage measuring unit 27 is connected to any two contact terminals 32a, 32b in the first and second contact units 30, 31 via the first and second switching units 28, 29. Then, the voltage between the terminals ⁇ and B of the substrate 10 in contact with the contact terminals 32a and 32b is measured, and the measurement result is given to the control unit 22.
  • the first switching unit 28 includes a plurality of switches 28 a such as semiconductor switching elements that operate independently under the control of the control unit 22, and a plurality of switches provided in the first contact unit 30.
  • the connection relationship between the contact terminals 32a and 32b, the first and second current supply units 24 and 25, and the first and second voltage measurement units 26 and 27 is switched.
  • the second switching unit 29 includes a plurality of switches 29a including semiconductor switching elements that operate independently under the control of the control unit 22, and a plurality of switches provided in the second contact unit 31.
  • the connection relationship between the contact terminals 32a and 32b, the first and second current supply units 24 and 25, and the first and second voltage measurement units 26 and 27 is switched.
  • the control unit 22 determines an inspection procedure for the wiring pattern provided on the substrate 10 based on the net information stored in the storage unit 21 (this inspection procedure will be described in detail later). According to the procedure, the switches 28a and 29b of the first and second switching units 28 and 29 are operated, and the first and second current supply units 24 and 25 and the first and second voltage measuring units 26 and 27 are operated. The contact terminals 32a and 32b in the first and second contact portions 30 and 31 connected to are sequentially switched. In synchronism with this switching operation, the control unit 22 supplies current to the first and second current supply units 24 and 25 via the contact terminals 32a and 32b between the terminals of the substrate 10 corresponding to the inspection procedure. The voltage between the terminals is supplied to the first and second voltage measuring units 26, 27 and the contact terminals 3 2a, 3
  • Measurement is performed via 2b, and the quality of each wiring pattern is determined based on the measurement result.
  • the quality determination is performed based on, for example, the current value supplied by the current supply units 24 and 25 and the voltage value measured by the voltage measurement units 26 and 27. More specifically, for example, the resistance value of the wiring pattern is calculated based on the current value and the voltage value, and whether or not the resistance value is within a predetermined allowable range or the resistance value. A pass / fail judgment is made based on the magnitude relationship between the value and the predetermined threshold. [0043] For example, as shown in FIG.
  • one of the contact terminals 32A of the contact 32A corresponding to the upper terminal T4 , 32b (for example, terminal 32a) and one contact terminal 32a, 32b (for example, terminal 32b) of the contact 32B corresponding to the upper terminal T5 are connected to the positive / negative current of the first current supply unit 24 by the first switching unit 28.
  • Each is connected to the output unit.
  • the other contact terminals 32a, 32b (for example, terminal 32b) of the contact 32A and the other contact terminals 32a, 32b (for example, terminal 32a) of the contact 32B are connected to the first voltage by the first switching unit 28.
  • control unit 22 performs a continuity test on the wiring pattern of the substrate 10 when the contact terminals 32a and 32b of the first and second contact portions 30 and 31 are in contact with the terminals ⁇ and B of the substrate 10. Prior to this, contact detection is performed to confirm whether the contact terminals 32a and 32b are in contact with terminals ⁇ and B.
  • an inspection for the upper terminal T on the front surface 11 side of the substrate 10 and an inspection for the lower terminal B on the rear surface 12 side are performed in parallel. More specifically, for the one surface 11, an order is given to a plurality of terminals T with which the contacts 32 are contacted, and according to the order, the contact terminals 32 a and 32 b that are in contact with the terminals T are the first switching unit. 28 is connected to the first current supply unit 24, and current is supplied between the contact terminals 32 a and 32 b via the terminal T.
  • the order is given to the plurality of terminals B with which the contact 32 is contacted, and the contact terminals 32a and 32b that are in contact with each terminal B are arranged in accordance with the order.
  • the second switching unit 29 is connected to the second current supply unit 25, and it is determined whether or not a current flows between the contact terminals 32a and 32b via the terminal B! /.
  • the contact terminals 32a and 32b of the contact 32A corresponding to the upper terminal T4 are the first switching unit 2 8 is connected to the positive and negative current output sections of the first current supply section 24, respectively.
  • the inspection is performed by determining whether or not the current flowing through the upper terminal T4 between the contact terminals 32a and 32b of the contact 32A is determined by one current supply unit 24. In this way, the contact inspection for the lower terminal B is performed in parallel with the contact inspection for the upper terminal T! /.
  • control unit 22 classifies the wiring patterns provided on the substrate 10 into first to third groups based on the net information stored in the storage unit 21.
  • wiring patterns that connect only the upper terminals T on the surface 11 side are classified.
  • the wiring pattern connecting the upper terminal T7 and the upper terminal T8, and the wiring pattern connecting the upper terminal T11 and the upper terminal T12 are classified into the first group.
  • the wiring pattern connecting the lower terminal B1 and the lower terminal B4 the wiring pattern connecting the lower terminal B2 and the lower terminal B3, and connecting the lower terminal B5 and the lower terminal B6.
  • Wiring patterns, wiring patterns connecting lower terminal B7 and lower terminal B8, wiring patterns connecting lower terminal B9 and lower terminal B10, and wiring patterns connecting lower terminal B11 and lower terminal B12 are classified.
  • the wiring pattern connecting the upper terminal T on the front surface 11 side and the lower terminal B on the rear surface 12 side is classified.
  • one of these terminals T here, the smallest of the symbols “ ⁇ 1...” Terminal ⁇
  • the lower terminal ⁇ when there are a plurality of lower terminals ⁇ classified in this third group in one net, one of these terminals ⁇ (here, the symbol ⁇ ⁇ 1 "Smallest!, Terminal ⁇ ) is representatively classified as the third group for inspection!
  • the inspection efficiency is improved.
  • the upper terminal T1 and the lower terminal B1 or the lower terminal B4 in the net N1 are used as a wiring pattern for connecting the upper terminal T and the lower terminal B.
  • the wiring pattern connecting the upper terminal T10 and the lower terminal B9 or the lower terminal B10 in the net N6 and the wiring pattern connecting the upper terminal T13 and the lower terminal B13 in the net N8 are applicable.
  • the continuity test of the wiring pattern classified as the first set is performed using the two upper terminals T connected to the first set of wiring patterns, and the wiring pattern classified as the second set.
  • the continuity test is performed using the two lower terminals B to which the second set of wiring patterns are connected.
  • the continuity test for the first set of wiring patterns and the continuity test for the second set of wiring patterns are performed in parallel by performing tests on the wiring patterns belonging to the mutually independent nets. It ’s like that.
  • the continuity test of the wiring pattern connecting the upper terminal T4 and the upper terminal T5 classified as the first set is performed at the same time.
  • the wiring pattern that does not belong to the network N3 to which the wiring pattern that connects the upper terminal T4 and the upper terminal T5 belongs for example, the wiring pattern that connects the lower terminal B1 and the lower terminal B4, the lower terminal B9
  • the continuity test of the wiring pattern connecting the lower terminal B10 (or the wiring pattern connecting the lower terminal B7 and the lower terminal B8) is started.
  • At least one wiring pattern (upper terminal T or lower terminal B) that does not belong to the same net N can be selected from the first group and the second group, and the continuity test can be performed at the same time. . For this reason, it becomes possible to shorten the time of a normal continuity test.
  • Specific examples of the continuity test for the wiring pattern belonging to the first group and the continuity test for the wiring pattern belonging to the second group include those shown in FIG. In the inspection process shown in FIG. 4, the continuity test for the wiring pattern connecting the upper terminals T4 and T5 and the continuity test for the wiring pattern connecting the lower terminals B9 and B10 are simultaneously performed.
  • one contact terminal 32a of the contact 32A corresponding to the upper terminal T4 and one contact terminal 32b of the contact 32B corresponding to the upper terminal T 5 are connected to each other by the first switching unit 28.
  • the current supply unit 24 is connected to the positive and negative current output units, respectively.
  • the other contact terminal 32b of the contact 32A and the other contact terminal 32a of the contact 32B are connected to the positive and negative voltage input sections of the first voltage measuring section 26 by the first switching section 28, respectively. Then, in a state where a current is supplied between the upper terminals T4 and T5 by the first current supply unit 24, the voltage between the upper terminals T4 and T5 is measured by the first voltage measurement unit 26.
  • one contact terminal 32a of the contact 32C corresponding to the lower terminal B9 and one contact terminal 32b of the contact 32D corresponding to the lower terminal B10 are connected by the second switching unit 29 to the second.
  • the current supply unit 25 is connected to the positive and negative current output units.
  • the other contact terminal 32b of the contact 32D and the other contact terminal 32a of the contact 32D are connected to the positive and negative voltage input sections of the second voltage measurement section 27 by the second switching section 29, respectively. Then, in the state where the current is supplied between the lower terminals B9 and B10 by the second current supply unit 25, the voltage between the lower terminals B9 and B10 is measured by the second voltage measuring unit 27.
  • the first and second switching units 28 The combination of contact terminals 32a and 32b corresponding to terminals ⁇ and B to which the next wiring pattern to be inspected is connected is changed to the first and second current supply units 24, 25, and 29 It is connected to the first and second voltage measuring units 26 and 27.
  • the wiring patterns classified into the third group are all wiring patterns belonging to different nets N. Therefore, even if a plurality of wiring patterns are arbitrarily selected, the selected wiring patterns can be inspected at the same time. I'm getting ready.
  • FIG. 7 A specific example of the continuity test for the wiring patterns belonging to the third group is shown in FIG. 7, for example.
  • the continuity test for the wiring pattern connecting the terminals T6 and B7 and the continuity test for the wiring pattern connecting the terminals TIO and B10 are simultaneously performed.
  • one contact terminal 32b of the contact 32E corresponding to the upper terminal T6 and one contact terminal 32b of the contact 32F corresponding to the lower terminal B 7 are connected to the first and second switching units 28. , 29 are connected to the positive and negative current output sections of the first current supply section 24, respectively.
  • the other contact terminal 32a of the contact 32E and the other contact terminal 32a of the contact 32F are connected to the positive and negative voltage input sections of the first voltage measuring section 26 by the first and second switching sections 28 and 29. Each is connected. Then, with the current supplied between the terminals T6 and B7 by the first current supply unit 24, the voltage between the terminals T6 and B7 is measured by the first voltage measurement unit 26.
  • one contact terminal 32b of the contact 32B corresponding to the upper and lower terminals T10 and one contact terminal 32b of the contact 32D corresponding to the lower terminal B10 are connected to the first and second switching sections 28. , 29 are connected to the positive and negative current output sections of the second current supply section 25, respectively.
  • the other contact terminal 32a of the contact 32B and the other contact terminal 32a of the contact 32D are connected to the positive and negative voltage input parts of the second voltage measuring part 27 by the first and second switching parts 28, 29. And connected respectively. Then, in the state where the current is supplied between the terminals TIO and B10 by the second current supply unit 25, the voltage between the terminals TIO and B10 is measured by the second voltage measurement unit 27.
  • FIG. 8 is a diagram (table) showing the procedure of continuity inspection for the wiring pattern of the substrate 10 of FIG. Prior to this continuity test, a contact test for confirming the contact state between the contact terminals 32a, 32b of the first and second contact portions 30, 31, and the terminals ⁇ , B is performed. ing.
  • the wiring pattern due to the lower terminal B remains. Since there is no wiring pattern due to the upper terminal T, the wiring pattern connecting the lower terminal B7 and the lower terminal B8 belonging to different nets N And the inspection of the wiring pattern connecting the lower terminal B5 and the lower terminal B6 are performed at the same time. The above is the inspection for the wiring patterns belonging to the first group and the second group.
  • FIG. 7 shows the state of the fifth continuity test in FIG. 10, and the inspection of the wiring pattern connecting the upper terminal T6 and the lower terminal B 7, and the upper terminal T10 and the lower terminal B10 are connected.
  • the wiring pattern to be connected is inspected at the same time.
  • FIG. 9 is a flowchart showing the operation of the substrate inspection apparatus 20.
  • the storage unit 21 stores the net information of the board 10 to be inspected.
  • the information in the storage unit 21 is read out by the control unit 22 in order to perform a continuity inspection of the substrate 10 to be inspected (Sl).
  • the operation is controlled so that the contact of the ing probe contacts.
  • the control unit 22 classifies the wiring patterns into the first group, the second group, and the third group based on the information stored in the storage unit 21 ( S4). Then, the control unit 22 sets a wiring pattern inspection process for conducting a continuity test in accordance with the classified wiring pattern set. At this time, as described above, at least one wiring pattern of each set is inspected for the first set and the second set of wiring patterns. For this reason, the inspection time can be shortened by the substrate inspection apparatus 1.
  • the continuity test for the third set of wiring patterns is performed (S6). At this time, one third wiring pattern is set for each net, but when the first and second wiring patterns are confirmed to be conductive, this third wiring pattern is used.
  • a net continuity test can be performed simply by performing a continuity test.
  • the first and second switching units 28 and 29, the first current supply unit 24, the first voltage measurement unit 26, the second current supply unit 25, and the second voltage included in the substrate inspection apparatus 1 are also provided. Since the measurement unit 27 can be used without separation between the front surface and the back surface of the substrate 10, the inspection time for the continuity inspection of the substrate 10 can be shortened, and the current supply units 24 and 25 and the voltage measurement unit 26 , 27 can be used efficiently for inspection.
  • the output unit 23 displays that there is a defect (S8). If no defect is found, the inspected substrate 10 has a poor continuity. If so, it is determined (displayed) as the substrate 10 (S7).
  • the inspection for the plurality of wiring patterns formed on the substrate 10 is performed on the wiring pattern for connecting the terminals T formed on the surface 11. And an inspection of the wiring pattern connecting the terminals B formed on the back surface 12, and an inspection of the wiring pattern connecting the terminal T formed on the front surface 11 and the terminal B formed on the back surface 12. Therefore, the number of inspections during the continuity inspection of the wiring pattern provided on the substrate 10 can be reduced, and the inspection time can be shortened.
  • the inspection for the wiring pattern connecting the terminals T formed on the front surface 11 and the inspection for the wiring pattern connecting the terminals B formed on the back surface 12 are performed in parallel.
  • the inspection time can be further shortened.
  • a wiring pattern that connects between the terminals T on the front surface 11 connected by the nets N independent of each other and a wiring pattern that connects between the terminals B on the back surface 12 are selected, and at least the selected wiring pattern is selected. Since the electrical characteristics of two wiring patterns are inspected at the same time,
  • the interval can be shortened effectively.
  • the continuity test is performed at the same time for every two wiring patterns, so that the test time can be further reduced.
  • the contact 32 that is in contact with one terminal ⁇ , B is provided with two contact terminals 32a, 32b, one of the contact terminals 32a, 32b is used for current supply, Either one of the contact terminals 32a and 32b can be used for voltage measurement, which effectively affects the effect of contact resistance between contact terminals 32a and 32b and terminals ⁇ and B during voltage measurement.
  • the voltage applied between terminals ⁇ and B can be accurately measured.
  • electrical characteristics such as the resistance value between terminals ⁇ and B can be accurately measured, and the reliability of the continuity test can be improved.
  • the two contact terminals 32a and 32b Prior to the continuity test between the terminals ⁇ and B, the two contact terminals 32a and 32b are connected to each other based on the continuity between the two contact terminals 32a and 32b in contact with the same terminal ⁇ and B. Since the contact state with the terminals T and B is determined, it is possible to prevent an error in the continuity test between the terminals ⁇ and B due to poor contact between the contact terminals 32a and 32b and the terminals ⁇ and B.
  • two sets of current supply units 24 and 25 and voltage measurement units 26 and 27 are connected to the contact units 30 and 31 via the switching units 28 and 29. More than set power
  • the flow supply unit and the voltage measurement unit may be connected to the contact units 30 and 31 via the switching units 28 and 29.
  • the force using the contact portions 30, 31 having the multi-needle contact 32 is movable in the X, y, and z directions, and can be rotated about the z axis.
  • a plurality of (for example, two) probes may be provided on the front surface 11 side and the back surface 12 side of the substrate 10.
  • the contact 32 that is in contact with each of the terminals ⁇ and B may be configured to include two contact terminals 32a and 32b.
  • the contactor 32 may include a single contact terminal. Good.
  • the current supply unit and the voltage measurement unit are commonly connected to one contact terminal for each of the positive electrode side and the negative electrode side.
  • FIG. 1 is a diagram schematically showing an example of a substrate to which a substrate inspection method according to an embodiment of the present invention is applied.
  • FIG. 2 is a block diagram of a substrate inspection apparatus used in a substrate inspection method according to an embodiment of the present invention.
  • FIG. 3 is a diagram showing a configuration of first and second substrate contact portions and the like of the substrate inspection apparatus of FIG.
  • FIG. 4 is an explanatory diagram relating to a continuity test.
  • FIG. 5 is an explanatory diagram regarding contact inspection.
  • FIG. 6 is a diagram showing a result of classifying the wiring pattern of the substrate of FIG.
  • FIG. 7 is an explanatory diagram relating to a continuity test.
  • FIG. 8 is a diagram showing a procedure of continuity inspection for the wiring pattern of the substrate in FIG. 1.
  • FIG. 9 is a flowchart showing the operation of the substrate processing apparatus of FIG.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

L'invention concerne un procédé et un dispositif d'inspection de carte pour inspecter les connexions électriques des schémas de câblage sur une carte avec un nombre réduit d'inspections en un temps d'inspection raccourci. Les connexions électriques des schémas de câblage présents sur une carte (10) et divisés en premier à troisième ensembles sont inspectées selon des informations précises stockées dans une section de stockage. Le premier ensemble comprend des schémas de câblage pour interconnexions entre les bornes supérieures (T) sur le côté avant (11). Le deuxième ensemble comprend des schémas de câblage pour interconnexions uniquement entre les bornes supérieures (B) sur le côté arrière (12). Le troisième ensemble comprend des schémas de câblage pour interconnexions uniquement entre la borne supérieure (T) sur le côté avant (11) et les bornes inférieures (B) sur le côté arrière (12). Les schémas de câblage du premier ensemble et ceux du deuxième ensemble sont inspectés en parallèle. Un contact (32) possède deux bornes de contact (32a, 32b). Avant l'inspection de la connexion électrique, une inspection des bornes de contact (32a, 32b) et des bornes (T, B) est effectuée en fonction de la connexion électrique entre les deux bornes de contact (32a, 32b).
PCT/JP2007/062337 2006-06-29 2007-06-19 Procédé d'inspection de carte et dispositif d'inspection de carte WO2008001651A1 (fr)

Applications Claiming Priority (2)

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JP2006-179826 2006-06-29
JP2006179826A JP2008008773A (ja) 2006-06-29 2006-06-29 基板検査方法及び基板検査装置

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KR (1) KR20090031663A (fr)
TW (1) TW200809227A (fr)
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WO2020095810A1 (fr) * 2018-11-09 2020-05-14 日本電産リード株式会社 Dispositif de génération d'informations d'instructions d'inspection, système d'inspection de cartes, procédé et programme de génération d'informations d'instructions d'inspection

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JP5260163B2 (ja) * 2008-07-02 2013-08-14 日置電機株式会社 測定装置および測定方法
JP5260164B2 (ja) * 2008-07-04 2013-08-14 日置電機株式会社 測定装置および測定方法
JP5428748B2 (ja) * 2009-10-21 2014-02-26 日本電産リード株式会社 検査用治具のメンテナンス方法及び基板検査装置

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JPH0666832A (ja) * 1992-08-24 1994-03-11 Hitachi Ltd プローブ及び検査装置
JPH06207963A (ja) * 1993-01-12 1994-07-26 Matsushita Electric Ind Co Ltd プリント基板検査データ作成方法

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JPH0419574A (ja) * 1990-05-14 1992-01-23 Fujitsu Ltd プリント配線板の検査治具
JPH07191076A (ja) * 1993-12-27 1995-07-28 Fujitsu Ltd 印刷配線板試験装置
JP4544810B2 (ja) * 2002-04-23 2010-09-15 日本特殊陶業株式会社 基板製造方法

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JPH0666832A (ja) * 1992-08-24 1994-03-11 Hitachi Ltd プローブ及び検査装置
JPH06207963A (ja) * 1993-01-12 1994-07-26 Matsushita Electric Ind Co Ltd プリント基板検査データ作成方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020095810A1 (fr) * 2018-11-09 2020-05-14 日本電産リード株式会社 Dispositif de génération d'informations d'instructions d'inspection, système d'inspection de cartes, procédé et programme de génération d'informations d'instructions d'inspection
CN112969925A (zh) * 2018-11-09 2021-06-15 日本电产理德股份有限公司 检查指示信息产生装置、基板检查系统、检查指示信息产生方法以及检查指示信息产生程序
JPWO2020095810A1 (ja) * 2018-11-09 2021-09-30 日本電産リード株式会社 検査指示情報生成装置、基板検査システム、検査指示情報生成方法、及び検査指示情報生成プログラム
JP7384169B2 (ja) 2018-11-09 2023-11-21 ニデックアドバンステクノロジー株式会社 検査指示情報生成装置、基板検査システム、検査指示情報生成方法、及び検査指示情報生成プログラム
TWI834728B (zh) * 2018-11-09 2024-03-11 日商日本電產理德股份有限公司 檢查指示資訊產生裝置、基板檢查系統、檢查指示資訊產生方法以及檢查指示資訊產生程式

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KR20090031663A (ko) 2009-03-27

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