JP2007178318A - Substrate inspection device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate inspection device capable of more efficiently performing four-terminal measurement for a high-density wiring pattern. <P>SOLUTION: In the substrate inspection device composed of first and second probes each brought into contact with an inspection point of the wiring of the substrate to be inspected, wherein one is used as the probe for voltage measurement and the other is used as the probe for current supply, and the resistance value of the wiring is calculated using a plurality of inspection probes with the first and second probes brought into contact with the inspection points; the substrate inspection device includes: a current supply means for supplying a current to the probe for current supply; a voltage measurement means for measuring the voltage between the probes for voltage measurement; a processing means for calculating the resistance value of the wiring by a current value supplied by the current supply means and a voltage value measured by the voltage measurement means; and an integrally formed conductive connection member conductively connecting the plurality of probes for current supply with the current supply means and electrically interconnecting the plurality of probes for current supply. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a board inspection apparatus and method, and more particularly, to a board inspection apparatus and method using a four-terminal measurement method for measurement of resistance values between wiring patterns on a circuit board and disconnection inspection.

  The term “circuit board” used in the application documents is not limited to a package substrate for a semiconductor package or a film carrier, but a printed wiring board, for example, a flexible board, a multilayer wiring board, an electrode plate for a liquid crystal display or a plasma display, etc. A generic term for substrates to which various wirings are applied. That is, the circuit board includes all boards that can be subjected to four-terminal measurement.

  Conventionally, in a continuity inspection of a semiconductor package substrate, probes are brought into contact with both ends of a wiring forming a wiring pattern, and only the continuity of the wiring is detected. However, in recent years, it has become necessary to accurately measure not only the continuity but also the resistance value of the wiring to conduct a continuity test. Terminal measurement is commonly used.

In such four-terminal measurement, it is necessary that the voltage measurement probe and the current application probe are provided as close as possible to each other and reliably contact substantially the same inspection point, and various means have been proposed.
JP 2004-279133 A discloses a configuration in which a current supply needle pin and a voltage measurement needle pin are integrally held by a holding member, and a probe used in four-terminal measurement is shown. ing.

  The four-terminal probe as disclosed in Patent Document 1 can be used on the side of the ball grid surface on which a wiring pattern having a relatively wide wiring pitch interval is formed, but the wiring pitch is relatively narrow and the density is high. The flip chip surface on which the wiring pattern is formed has a problem that it is difficult to use.

  This is because the number of four-terminal probes per unit area increases when an attempt is made to contact a four-terminal probe on the inspection surface side where a high-density wiring pattern is formed, such as a flip chip surface. This is because it cannot be arranged sufficiently.

  For this reason, it is desired that a four-terminal probe be more efficiently arranged on a surface on which a higher-density wiring pattern is formed, such as a flip chip surface, and a resistance value is measured by four-terminal measurement. Yes.

  In order to solve the above problems, a substrate inspection apparatus according to the present invention is in contact with inspection points of wiring on a substrate to be inspected, one of which is used as a voltage measurement probe and the other as a current supply probe. A substrate inspection apparatus for calculating a resistance value of a wiring by using a plurality of inspection probes in contact with a point to be inspected, the first and second probes being used, and a probe for supplying current Current supply means for supplying current to the voltage, voltage measurement means for measuring the voltage between the probes for voltage measurement, resistance value of the wiring by the current value supplied by the current supply means and the voltage value measured by the voltage measurement means And a plurality of current supply probes and a current supply means are connected so as to be conductive, and the plurality of current supply probes are electrically connected to each other. Characterized in that it has a made conductive connecting member.

  According to the substrate inspection method of the present invention, the first and second probes of the inspection probe comprising the first and second probes, one of which is used as a voltage measurement probe and the other is used as a current supply probe, are covered. Arrangement step for placing the test board wiring in contact with the point to be inspected, supplying step for supplying current to the probe for supplying current, measuring step for measuring the voltage between the probes for voltage measurement, and supplying step A process step of calculating a resistance value of the wiring based on the value of the current supplied by the voltage and the value of the voltage measured in the measurement step, and using a plurality of conductive connection members formed integrally in the arrangement step The inspection probes are arranged to be electrically connected to each other, and a current is simultaneously supplied to a plurality of inspection probes via a connection member in the supply process. .

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate test | inspection apparatus and method which can perform a four-terminal measurement also to a higher-density wiring pattern like a flip chip surface can be provided.

  In addition, according to the present invention, a substrate inspection apparatus and method capable of performing four-terminal measurement more efficiently are provided.

Hereinafter, preferred embodiments of a probe according to the present invention will be described with reference to the accompanying drawings. In addition, in the figure, the same code | symbol is attached | subjected to the same element and the overlapping description is abbreviate | omitted.
[Four-terminal measuring device]
FIG. 1 is a diagram for explaining the concept of a four-terminal measuring apparatus. The apparatus includes a current generation unit 10 and a voltage measurement unit 12. The current generation unit 10 is connected to first and second current probes 10F1 and 10F2 for supplying current, and the voltage measurement unit 12 is connected to first and second voltage probes 12S1 and 12S2 for voltage measurement.

As shown in FIG. 1, when the resistance 14 of the wiring of the circuit board 16 is measured, the first and second voltage probes 12S1 and 12S2 and the first and second current probes 10F1 and 10F2 are connected to the resistance of the wiring. 14 is arranged so as to be in contact with both ends, and a current of a predetermined magnitude for measurement is supplied from the current generator 10 to the wiring resistor 14 via the first and second current probes 10F1 and 10F2. As a result, a potential difference is generated at both ends of the resistance 14 of the wiring, and the voltage measurement unit 12 measures the potential difference between the both ends via the first and second voltage probes 12S1 and 12S2. When the value of the potential difference, that is, the voltage value is obtained, the resistance value of the wiring resistor 14 can be obtained from the current value for measurement and the measured voltage value.
[Configuration of board inspection equipment]
FIG. 2A shows a preferred embodiment of the substrate inspection apparatus 23 according to the present invention for inspecting a wiring pattern on a substrate by four-terminal measurement. In FIG. 2 (a), the inspection object by the apparatus is the land 21a, 21b,. The resistance value of the wiring 28 between the predetermined land in 21n and the land 25 of the wiring pattern portion formed on the back side (downward in FIG. 2) of the substrate and the presence or absence of disconnection.

  The substrate inspection apparatus 23 performs four-terminal measurement using the inspection probes 20-1, 20-2, 20-n and the inspection probe 26. Inspection probes 20-1, 20-2, and 20-n are probes arranged at one end of a measurement object, and all have the same structure. For this reason, the inspection probe 20-1 will be described as a representative example. The inspection probe 20-1 includes a cylindrical voltage probe 20S1 for voltage measurement and a current supply coaxially disposed so as to surround the voltage probe 20S1. Current probe 20F. An insulating layer (not shown) is formed between them.

  FIG. 2B is an enlarged view of the distal end portion of the inspection probe 20-n surrounded by a broken line A in FIG. As shown in the figure, the tip of the inspection probe 20-n is configured such that the pointed tip of the annular current probe 20F is disposed so as to surround the pointed tip of the voltage probe 20Sn. Both of them are in contact with the land 21a.

  As shown in FIG. 2A, the inspection probes 20-1, 20-2, and 20-n pass through the intermediate plate 22 and are held therein. The intermediate plate 22 is formed by integrally forming a conductive material, for example, conductive rubber in a plate shape, and functions as a connection member that electrically connects the current generator 12 and the current probe 20F.

  FIG. 3 is a plan view of only the intermediate plate 22 as viewed from above. A large number of through holes 34 are formed in the intermediate plate 22 at substantially equal intervals. The size of each through hole is a size corresponding to the outer diameter of the inspection probes 20-1, 20-2, 20-n, and the inspection probes 20-1, 20-2, When 20-n is inserted, the current probes 20F of the inspection probes are brought into close contact with the intermediate plate 22 forming the through hole 34, so that the current supply current probe 20F and the intermediate plate 22 are connected to each other. An electrical connection is formed between them.

  Returning to FIG. 2 and continuing the description, the inspection probes 20-1, 20-2 and 20-n are inserted and fixed to the intermediate plate 22, and the intermediate plate 22 is connected to the current generator 12. . Further, the voltage probes 20S1, 20S2, and 20Sn of the respective inspection probes are connected to the voltage measuring unit 10. In this way, all voltage probes for voltage measurement on the surface side of the substrate may be connected to the same voltage measuring unit, but connected to separate voltage measuring units individually or in several groups. It may be. When all the voltage probes are connected to the same voltage measuring unit, it is only necessary to measure the voltage of each voltage probe by shifting the measurement time, and when using different voltage measuring units, the measurement can be performed simultaneously. .

  On the other hand, in FIG. 2, an inspection probe 26 having a structure different from that of the inspection probes 20-1, 20-2, 20-n used on the front side of the substrate is used on the back side of the substrate. The inspection probe 26 is a probe disposed on the opposite side, and includes a current probe 26F for supplying current and a voltage probe 26S for measuring voltage, which are fixed integrally. However, the inspection probe 26 having the same structure as the inspection probes 20-1, 20-2, and 20-n may be used.

  The tip portions of the current probe 26F of the inspection probe 26 and the voltage probe 26S for voltage measurement (the portion located on the upper side in FIG. 2) are both in contact with the land 25. The current probe 26 </ b> F is connected to the current generator 12, and the voltage probe 26 </ b> S is connected to the voltage measurement unit 10.

Although not shown, an arithmetic processing unit is connected to the current generation unit 12 and the voltage measurement unit 10, and the value of the current supplied from the current generation unit 12 and the voltage value measured by the voltage measurement unit 10 are determined. Each piece of data is received, and a resistance value is calculated from these values. Further, a display device is connected to the arithmetic processing unit, and data such as the calculated resistance value is displayed (not shown).
[Operation of substrate inspection equipment]
4, for example, as shown in FIG. 2, the substrate inspection apparatus 23 using the inspection probe 20-1 and the inspection probe 26 is used to connect the land 21a on the front side of the substrate and the land 25 on the back side of the substrate. The flow of operation when inspecting the wiring 28 is shown.

  In step S41, first, the inspection probe 20-1 is moved to the position of the land 21a together with the intermediate plate 22, and the tip of the inspection probe 20-1 is brought into contact with the surface of the land 21a. In this case, an X-axis direction and a Y-axis direction perpendicular to the X-axis direction along a plane parallel to the surface of the substrate and a vertical Z-axis direction perpendicular to the surface are defined, and the coordinates of the land 21a are defined by these coordinates. The position may be specified, and the inspection probe 20-1 may be moved to the position of the land 21a using a probe moving device (not shown) so that the tip of the inspection probe is brought into contact therewith.

  Next, in step S <b> 42, the inspection probe 26 is moved to the position of the land 25, and the tip of the inspection probe 26 is brought into contact with the surface of the land 25. In this case, a probe moving device (not shown) may be used for positioning the inspection probe 26 as in the case of positioning the inspection probe 20-1.

  When the positioning of these inspection probes is completed, a current having a predetermined magnitude is supplied from the current generator 12 to the intermediate plate 22 in step S43. Since the intermediate plate is made of a conductive material, the current supplied to the intermediate plate 22 is transmitted to the current probe 20F from the periphery of the through hole 34 via the intermediate plate, and further via the current probe 20F. It is supplied to the land 21a. The current reaches the other land 25 from the land 21 a via the wiring 28, and then flows through the current probe 26 F of the inspection probe 26 and flows into the other terminal of the current generator 12. The direction of this current flow may be reversed. As described above, when a current flows from the land 21 a to the other land 25 via the wiring 28, a potential difference is generated between the positions of both ends of the wiring 28, that is, between the land 21 a and the land 25.

  In step S44, since the potential difference is generated between the voltage probe 20S1 and the voltage probe 26S, the voltage measurement unit 10 measures the voltage difference.

  Next, in step S45, the resistance value is calculated from the value of the current supplied from the current generator 12 and the measured voltage value by the arithmetic processing unit, and the value is stored.

Subsequently, in step S46, the calculated resistance value is compared with a predetermined resistance value of r ohms. If the calculated resistance value is smaller than the predetermined resistance value, in step S48, the calculated resistance value is displayed on the display device as a calculated resistance value. On the other hand, if the calculated resistance value is larger than the predetermined resistance value, it is determined in step S47 that the wiring 28 is disconnected, and this is displayed on the display device.
[Flow of substrate inspection when multiple inspection probes are used]
FIG. 5 shows a flow of processing in the case of obtaining the resistance value or the like at a predetermined location in order using a plurality of inspection probes in the substrate inspection apparatus 23 shown in FIG. In this case, a plurality of inspection probes 20-1, 20-2, 20 -n... 20 -m are inserted into the predetermined through hole 34 and attached to the intermediate plate 22 in advance.

  First, in step S51, a plurality of inspection probes 20-1, 20-2, 20-n... 20-m attached to the intermediate plate 22 by moving the intermediate plate 22 are predetermined on one side of the measurement object. Position them so that they touch the lands.

  Next, in step S53, in order to arrange at the other end of the predetermined measurement object, the inspection probe 26 is moved and positioned so as to contact the land related to the measurement object on the back side of the substrate.

  When the positioning of these inspection probes is completed, a current of a predetermined value is supplied from the current generator 10 to the intermediate plate 22 in step S54. Since the intermediate plate 22 is formed of a conductive material, when a current is supplied to the intermediate plate 22, a current is supplied from the intermediate plate to the current probe 20 </ b> F of each inspection probe via the through hole 34. . The current flows from the tip of the current 21 through the land 21a, the wiring 28, and the other land 25, and further through the current probe 26F of the inspection probe 26 and flows into the other terminal of the current generator 12.

  In step S55, the voltage generated between the land 21a to which the inspection probe 20-1 is connected and the land 25 to which the current probe 26 is connected is measured.

  In step S56, a resistance value is calculated from the voltage value and the current value supplied from the current generator 12 by the arithmetic processing unit, and the value is stored.

  Subsequently, the substrate inspection apparatus operates to measure the next measurement object.

  In step S53, the inspection probe 26 on the back side of the substrate is moved to the land associated with the next measurement object and positioned so as to come into contact therewith.

  In step S54, when the positioning is completed, a current having a predetermined value is supplied from the current generator 10 to the intermediate plate 22. The current flows from the intermediate plate via the through hole 34 to, for example, the inspection probe 20-2 in contact with the land associated with the next measurement object, and further, via the measurement target wiring, the inspection probe 26. Flows from the newly contacted land through the current probe 26F of the inspection probe 26 and flows into the other terminal of the current generator 12.

  In step S55, the voltage generated at both ends of the measurement target at that time is measured by the voltage measurement unit 10 via the voltage probe 20S2 of the inspection probe 20-2 and the voltage probe 26S of the inspection probe 26.

  In step S56, the arithmetic processing unit calculates a resistance value from the voltage value and the value of the supplied current, and stores the resistance value.

As described above, thereafter, steps S53 to S56 are repeated so that the measurement target is sequentially selected and the voltage measurement between the voltage probes related thereto is performed.
[Other Examples of Inspection Probe]
FIG. 6 shows an inspection probe 60 according to another embodiment.

  As shown in FIG. 6, the inspection probe 80 includes a columnar voltage probe 60 </ b> S for voltage measurement, and a cylindrical current probe 60 </ b> F arranged coaxially so as to surround it. An insulating film (not shown) is formed on the surface of the voltage probe 60S, and the voltage probe 60S can move inside the current probe 60F. As is clear from FIG. 6, the length of the current probe 60F is shorter than the length of the voltage probe 60S, and the contact portion 63 at the tip of the voltage probe 60S protrudes from the voltage probe 60F. Further, the current probe 60F and the voltage probe 60S are formed of a material having flexibility and elasticity. As a result, as will be described later, the current probe 60F and the voltage probe 60S can bend and bend between the base plate and the circuit board to be measured, and the tip portions thereof can be brought into appropriate contact with the circuit board.

  FIG. 7 shows an inspection apparatus 70 provided with probes 60-1, 60-2, 60-3 having the same structure as the probe 60 shown in FIG. In the inspection apparatus 70, the portion near the upper end of the current probe 60F of each probe 60-1, 60-2, 60-3 is fixed to the intermediate plate 74, but the lower end is formed on the guide plate 72. It is movably inserted into the formed hole. The intermediate plate 74 may not only fix the current probe 60F but also function as an electrode for supplying a current to all of the current probes 60F fixed thereto by being formed of a conductive material.

  Next, based on FIG. 7, the operation of the inspection apparatus 70 when the tip portions of the inspection probes 60-1, 60-2, 60-3 are brought into contact with the wiring circuit pattern 66 to be measured will be described.

  First, the base plate 62 to which the voltage probe 60S is fixed and the intermediate plate 74 to which the upper end portion of the current probe 60F is fixed are simultaneously lowered while keeping the distance therebetween, so that the contact portion 63 of the voltage probe 60S is moved. The wiring circuit pattern 66 on the circuit board 68 is brought into contact with the circuit board 68. At this time, the current probe 60F and the voltage probe 60S are straight. Portions 60S 'and 60F' indicated by broken lines indicate a state in which each probe is not bent.

  Next, in a state where the contact portion 63 is in contact with the wiring circuit pattern 66, the base plate 62 and the intermediate plate 74 are further lowered to continue pressing the contact portion 63 against the wiring circuit pattern 66. Then, since the distance between the base plate 62 and the wiring circuit pattern 66 becomes smaller than the length of the voltage probe 60S, the elastic voltage probe 60S starts to bend. When the lowering of the base plate 62 and the intermediate plate 74 continues, the tip of the current probe 60F comes into contact with the wiring circuit pattern 66. The state corresponds to the state of the inspection probe 60-1 in FIG. 7, and the current probe 60F remains straight.

On the other hand, the surface of the substrate 68 or the wiring circuit pattern 66 may be uneven. For this reason, before the tip of the inspection probe 60-1 comes into contact with the surface of the wiring circuit pattern 66, the tip of another inspection probe has already come into contact with the surface of the corresponding wiring circuit pattern 66. There is a case. In this case, when the base plate 62 and the intermediate plate 74 continue to descend, the inspection probe with which the tip is already in contact begins to bend and bend because it has flexibility. Thereafter, when the tips of the voltage probes 60S and the current probes 60F of all the probes for inspection come into contact with the surfaces of the corresponding wiring circuit patterns 66, the descent of the base plate 62 and the intermediate plate 74 is stopped. At that time, as shown in FIG. 7, the current probes 60 </ b> F of the inspection probes 60-2 and 60-3 that have been in contact with the wiring circuit pattern 66 previously are bent and curved. The reason why the current probe 60F bends in this way is that the interval between the intermediate plate 74 to which the current probe 60F is attached and the surface of the wiring circuit pattern 66 corresponding to the intermediate plate 74 may be different among a plurality of inspection probes. This is to absorb the difference.
When the wiring inspection is performed using the inspection probe 60-1 or the like according to the embodiment of FIGS. 6 and 7, the current generation unit 12 is connected to the intermediate plate 74 and the voltage measurement unit 10 is used for the inspection. Connected to the probes 60-1, 60-2, 60-3, etc., the resistance value of the wiring is measured based on the procedure shown in FIGS. 4 and 5 similarly to the inspection apparatus shown in FIG. That is, the inspection probe 60-1 or the like is brought into contact with the wiring (land), current is supplied from the current supply unit 12 to the current probe 60F via the intermediate plate 74, and current is supplied from the current probe to the wiring. To do. By supplying the current, a voltage is generated between the two contact points of the wiring to be inspected. Since the voltage probe 60S is in contact with those contact points, the voltage measuring unit 10 is used to measure the voltage generated between the pair of voltage probes 60S. Next, the wiring resistance value is calculated from the measured voltage value and supply current value, and the wiring state is inspected.

  According to the embodiment of FIGS. 6 and 7, the tip portions of both the voltage probe 60 </ b> S and the current probe 60 </ b> F can be brought into firm contact with the measurement object simply by pressing the current probe 60 </ b> F against the measurement object.

  In the description of the operation of the measuring device 70, the gap between the base plate 62 and the intermediate plate 74 is held constant, the tip of the voltage probe 60S is first brought into contact with the surface of the wiring circuit pattern 66, and then The tip of the current probe 60F was brought into contact with the wiring circuit pattern 66. Instead, the measuring device 70 may be operated as follows.

  That is, in the measuring apparatus 70, first, the intermediate plate 74 and the current probe 60F having the upper end fixed thereto are lowered, and the tip of the current probe 60F is brought into contact with the surface of the wiring circuit pattern 66. At this time, since the surface of the substrate 68 or the wiring circuit pattern 66 may be uneven, the tip portions of all the current probes 60F may not contact the surface of the wiring circuit pattern 66 at the same time. Therefore, the lowering of the intermediate plate 74 is continued until the tips of all the current probes 60F are in contact with the surface of the wiring circuit pattern 66. Along with the lowering, the current probe 60F previously abutting on the surface of the wiring circuit pattern 66 is bent as the intermediate plate 74 is lowered. At the stage where the tips of all the current probes 60F are in contact with the surface of the wiring circuit pattern 66, the lowering of the intermediate plate 74 is stopped.

  Next, the base plate 62 is lowered together with the voltage probe 60S. As a result, the tip of the voltage probe 60 </ b> S comes into contact with the surface of the wiring circuit pattern 66. At that time, due to the unevenness of the surface of the substrate 68 or the wiring circuit pattern 66, the tips of the plurality of voltage probes 60S may not contact the surface of the wiring circuit pattern 66 at the same time as in the case of the current probe 60F. Therefore, the lowering of the base plate 62 is continued until the tip portions of all the voltage probes 60S come into contact with the surface of the wiring circuit pattern 66. Along with the descending, the voltage probe 60 </ b> S that previously contacts the surface of the wiring circuit pattern 66 is curved. At the stage where the tips of all the voltage probes 60S come into contact with the surface of the wiring circuit pattern 66, the lowering of the base plate 62 is stopped.

As described above, when the measuring device 70 is operated, the difference in height and the length of the probe due to the unevenness of the surface to be measured are absorbed by the deflection of the current probe 60F and the voltage probe 60S, and all the probes are absorbed. The tip of each can properly contact the surface to be measured, and the tip can be pressed against the surface with an appropriate force to form a good electrical contact.
[Alternative examples]
As mentioned above, although several embodiment of the probe which concerns on this invention was described, this invention is not restrained by these embodiment. It should be understood that additions, deletions, modifications, and the like that can be easily made by those skilled in the art are included in the present invention. The technical scope of the present invention is defined by the description of the appended claims.

  For example, in FIG. 2, the current probe 20F and the voltage probes 20S1, 20S2, and 20n are interchanged, and the inspection probes 20-1, 20-2, and 20-n are replaced with the cylindrical current probes 20F that are located at the center. You may comprise so that voltage probe 20S1, 20S2, and 20n may be formed in the circumference | surroundings so that it may be enclosed. When such a probe is used, the current generating unit 12 is connected to the current probe 20F located inside each inspection probe, and the voltage probes 20S1, formed so as to surround each current probe 20F. The voltage measuring unit 10 is connected to 20S2 and 20n via the intermediate plate 22. In this state, a current is passed through each current probe 20F and current probe 26F, and a voltage generated between the voltage probe 26S and the voltage probes 20S1, 20S2, and 20n is passed through the intermediate plate 22 to the voltage measuring unit 10. Measure with Subsequent calculation processing in the processing apparatus is the same as that described with reference to FIG.

  Further, in the explanation of the operation of the substrate inspection apparatus in FIG. 5 above, the inspection probe on the back side of the substrate is moved to the position of the next measurement object every time the voltage is measured. The plurality of inspection probes are first positioned only once, and then the respective voltages of the inspection probe on the front side of the substrate and the inspection probe on the back side of the substrate are used. By measuring the voltage between the probes, all the objects to be measured may be inspected at the same time. Or, when measuring the voltage between the voltage probes of the inspection probe on the front side of the substrate and the inspection probe on the back side of the substrate, by switching the connection between the voltage measuring device and the voltage probe pair, You may make it perform the voltage measurement of a predetermined measuring object in order.

  Further, in the above-described embodiments of FIGS. 2 and 3, the configuration in which the intermediate plate is configured by a plate-like member and thereby supports a plurality of inspection probes is described. The intermediate plate may be formed of a member on a conductive soft film, and may have only a function of supplying current to a plurality of current probes.

FIG. 1 is a diagram for explaining the concept of the four-terminal measurement method. FIG. 2A is a schematic side view of an embodiment of a substrate inspection apparatus according to the present invention. FIG. 2B is an enlarged view of the tip portion of the inspection probe used in the substrate inspection apparatus. 3 is a plan view of an intermediate plate used in the substrate inspection apparatus according to the present invention shown in FIG. FIG. 4 is a flowchart of the operation of the apparatus when inspecting a substrate using the substrate inspection apparatus according to the present invention. FIG. 5 is a flowchart for performing substrate inspection using a plurality of inspection probes in the substrate inspection apparatus according to the present invention. FIG. 6 is a view for explaining another embodiment of the inspection probe according to the present invention. FIG. 7 is a view for explaining a substrate inspection apparatus according to another embodiment using the inspection probe of FIG.

Explanation of symbols

10: Voltage measurement unit, 12: Current generation unit, 20-1, 20-2, 20-n, 26: Probe for inspection, 20S1, 20S2, 20Sn: Voltage probe, 20F, 26F: Current probe, 22, 74: Intermediate plate 34: Through hole 60: Inspection probe 70: Substrate inspection device

Claims (7)

The first and second probes comprise first and second probes that are in contact with the test points of the wiring of the board to be inspected, one of which is used as a voltage measuring probe and the other of which is used as a current supply probe. A board inspection apparatus that calculates a resistance value of the wiring by using a plurality of inspection probes in which a probe contacts the inspection point,
Current supply means for supplying a current to the current supply probe;
Voltage measuring means for measuring a voltage between the voltage measuring probes;
Processing means for calculating a resistance value of the wiring based on a current value supplied by the current supply means and a voltage value measured by the voltage measurement means;
A plurality of the current supply probes and the current supply means are connected so as to be conductive, and the plurality of current supply probes are electrically connected to each other, and the conductive connection members are integrally formed. A substrate inspection apparatus.   2. The substrate inspection apparatus according to claim 1, wherein the connection member electrically connects the plurality of current supply probes arranged on the front side or the back side of the substrate to be inspected.   3. The substrate inspection apparatus according to claim 1, wherein the connection member electrically connects all the current supply probes arranged on the front surface or the back surface.   4. The substrate inspection apparatus according to claim 1, wherein the first probe is disposed on a peripheral edge of the second probe via an insulating layer.   5. The substrate inspection apparatus according to claim 4, wherein the first probe and the second probe are formed concentrically.   6. The substrate inspection apparatus according to claim 1, wherein the connecting member is a plate-like member formed of a conductive material, and a plurality of through holes are formed in the plate-like member, and the current supply is supplied to the through-hole. A substrate inspection device in which a probe for use is fixed in a conductive manner. The first and second probes of the inspection probe composed of the first and second probes, one of which is used as a voltage measurement probe and the other is used as a current supply probe, are the inspection points of the wiring of the substrate to be inspected. An arrangement step of arranging to be in contact with
Supplying a current to the current supply probe; and
A measuring step of measuring a voltage between the voltage measuring probes;
A processing step of calculating a resistance value of the wiring based on a value of the current supplied by the supplying step and a voltage value measured by the measuring step;
In the arranging step, the plurality of inspection probes are electrically connected to each other using an integrally formed conductive connecting member, and the plurality of inspection probes are arranged via the connecting member in the supplying step. A method for inspecting a substrate, comprising simultaneously supplying current to the inspection probes.

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