TW202234077A - Resistance measurement device and resistance measurement method - Google Patents

Abstract

In the present invention, an intermediate substrate B comprises: a metal plate MP that is flatly spread out; substrate surfaces BS1 facing the metal plate MP; and pairs of electroconduction sections PA1-PF1 provided to the substrate surfaces BS1 and connection sections RA-RF electrically connecting the electroconduction sections to the metal plate MP, with three or more such pairs being provided.With respect to the intermediate substrate, the following are provided: a current supply unit CS for allowing current to flow via the metal plate MP between the electroconduction section PB1 (first electroconduction section) and the electroconduction section PC1 (second electroconduction section), from among the electroconduction sections PA1-PF1; a voltage detection unit VM1 for detecting a voltage between the electroconduction section PA1 (third electroconduction section) and the electroconduction section PB1 (first electroconduction section); and a resistance calculation unit 22 for calculating a resistance value of the connection section RB that is paired with the electroconduction section PB1 (first electroconduction section) on the basis of a current I passed in by the current supplyunit CS and the voltage detected by the voltage detection unit VM1.

Description

Resistance measuring device and resistance measuring method

The present invention relates to a resistance measuring device and a resistance measuring method for measuring the resistance of a substrate.

Conventionally, there has been known a board inspection apparatus in which a measurement current is passed to the measurement object when a device that continuously penetrates from one surface to the other surface of a circuit board, such as a through hole formed in a circuit board, is used as a measurement object. , and measure the voltage generated by the measurement object, thereby measuring the resistance value of the measurement object based on the current value and the voltage value (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-117991

[The problem to be solved by the invention] In addition, as for a substrate having a conductor (hereinafter, referred to as a planar conductor) extending in a planar shape inside, there is a substrate having a structure in which conductive parts such as pads, bumps, and wirings on the surface of the substrate and planar conductors extend along the surface of the substrate. Electrical connection in the thickness direction. 11 and 12 are conceptual schematic diagrams showing an example of the substrate.

FIG. 11 is a conceptual schematic diagram showing a multilayer substrate WB as an example of a substrate including a planar inner layer pattern IP in the inner layer of the substrate. Regarding the multilayer substrate WB shown in FIG. 11 , conductive portions PA and PB such as pads and wiring patterns are formed on the substrate surface BS. The conductive portion PA and the conductive portion PB are electrically connected to the inner layer pattern IP through the connection portion RA and the connection portion RB such as through holes and wiring patterns. In the example of the multilayer substrate WB, the inner layer pattern IP corresponds to a planar conductor.

In addition, as a method of manufacturing a substrate, there is a method of forming a printed wiring board by using a conductive metal plate as a base, forming a printed wiring board on both surfaces of the metal plate, and peeling the formed substrate from the metal plate as a base, thereby forming two sheet printed wiring board. In the manufacturing method of the said board|substrate, the board|substrate (henceforth an intermediate board|substrate) in the state before peeling a board|substrate from the metal plate as a base has a state in which a metal plate is pinched|interposed between two board|substrates.

FIG. 12 is a conceptual schematic diagram showing an example of the intermediate substrate B. As shown in FIG. As for the intermediate board|substrate B shown in FIG. 12, the board|substrate WB1 is formed in one surface of the metal plate MP, and the board|substrate WB2 is formed in the other surface of the metal plate MP. On the board|substrate surface BS1 of the board|substrate WB1, the conductive part PA1, conductive part PB1, ..., conductive part PF1, such as a pad and a wiring pattern, is formed. On the contact surface BS2 with the metal plate MP of the board|substrate WB1, the conductive part PA2, conductive part PB2, ..., conductive part PF2, such as a pad and a wiring pattern, is formed. The metal plate MP is, for example, a conductive metal plate having a thickness of about 1 mm to 10 mm.

The conductive part PA1 - the conductive part PF1 are electrically connected to the conductive part PA2 - the conductive part PF2 by the connection part RA - the connection part RF, such as a via hole or a wiring pattern. Since the conductive part PA2 - the conductive part PF2 are in close contact with the metal plate MP and conduct|electrically connected, the conductive part PA1 - the conductive part PF1 are electrically connected to the metal plate MP by the connection part RA - the connection part RF. The conductive portion PA1 is paired with the connection portion RA, the conductive portion PB1 is paired with the connection portion RB, and the conductive portion is paired with the connection portion, respectively. Since the board|substrate WB2 has the same structure as the board|substrate WB1, its description is abbreviate|omitted. In the example of the intermediate substrate B, the metal plate MP corresponds to the planar conductor.

The resistance value Ra and the resistance value Rb of the connection portion RA and the connection portion RB may be measured for inspection of the multilayer substrate WB, the intermediate substrate B, or the like.

13 is an explanatory diagram for explaining a measurement method for measuring the resistance value Ra and the resistance value Rb of the connection portion RA and the connection portion RB of the intermediate substrate B shown in FIG. 12 . In order to measure the resistance value Ra and the resistance value Rb of the connection part RA and the connection part RB, it is considered that the current I for measurement flows between the conductive part PA1 and the conductive part PB1, and the generation between the conductive part PA1 and the conductive part PB1 is measured. The voltage V, and the resistance value is calculated in the form of V/I. In this case, the resistance value calculated from V/I is Ra+Rb.

However, there is a requirement that the resistance value of each connection part is to be measured separately, not the total resistance value of the connection parts of the two parts.

An object of the present invention is to provide a resistance measurement device and a resistance measurement method capable of separately measuring the resistance of each connection portion of a substrate to be measured, the substrate to be measured having: a conductive planar conductor extending in a planar shape; a substrate surface with conductors facing each other; and a pair of conductive parts provided on the substrate surface and a connection part electrically connecting the conductive parts and the planar conductors. [Means of Solving Problems]

The resistance measurement device of the present invention is a resistance measurement device for measuring the resistance of a connection portion of a substrate to be measured, the substrate to be measured having: a conductive planar conductor extending in a planar shape; a substrate surface; and a pair of conductive parts provided on the substrate surface and the connection parts electrically connecting the conductive parts and the planar conductor, and having three or more of the pairs, and each The resistance measurement device includes: a current supply part, via the planar conductor, between a first conductive part that is one of the three or more pairs of conductive parts and a different conductive part from the first conductive part A current flows between the second conductive parts of the conductive parts; a first voltage detection part detects a third conductive part which is a conductive part different from the first conductive part and the second conductive part in each of the conductive parts, and a voltage between the first conductive parts; and a resistance calculation part that calculates the voltage between the first conductive parts and the first voltage detection part based on the current flowing by the current supply part and the voltage detected by the first voltage detection part The resistance value of the paired connection portion of the conductive portion.

According to the above-described configuration, the current flowing by the current supply unit does not flow in the path connecting the third conductive portion for voltage measurement by the first voltage detection portion and the first conductive portion. As a result, the voltage measured by the first voltage detection unit includes the voltage drop at the connection portion paired with the first conductive portion, but does not include the voltage drop at the connection portion paired with the third conductive portion. As a result, the resistance calculation unit calculates the resistance value based on the current flowing through the current supply unit and the voltage detected by the first voltage detection unit, and the resistance value of the connection part paired with the first conductive part. roughly equal. Thereby, the resistance value of the connection part paired with the first conductive part can be measured, respectively.

In addition, it is preferable that the resistance measurement device further includes a second voltage detection unit that detects a conductivity that is different from the first conductive portion and the second conductive portion in each of the conductive portions. The voltage between the fourth conductive part of the part and the second conductive part is further detected by the resistance calculation part based on the current flowing through the current supply part and the second voltage detection part voltage, and calculate the resistance value of the connecting portion paired with the second conductive portion.

According to the above-described configuration, the current flowing by the current supply unit does not flow in the path connecting the fourth conductive portion for voltage measurement by the second voltage detection portion and the second conductive portion. As a result, the voltage measured by the second voltage detection unit includes the voltage drop at the connection portion paired with the second conductive portion, but does not include the voltage drop at the connection portion paired with the fourth conductive portion. As a result, the resistance calculation unit calculates the resistance value based on the current flowing through the current supply unit and the voltage detected by the second voltage detection unit, and the resistance value of the connection part paired with the second conductive part. roughly equal. Thereby, the resistance value of each connecting portion paired with the first conductive portion and the second conductive portion can be measured, respectively. The voltage measurement by the first voltage detection part and the second voltage detection part can be performed simultaneously, and the resistance value of each connection part paired with the first conductive part and the second conductive part can be measured separately, so the resistance measurement time can be shortened .

In addition, the fourth conductive portion is preferably the same conductive portion as the third conductive portion.

According to the above configuration, one conductive portion serves as both the third conductive portion and the fourth conductive portion. In this case, the measurement can be performed between two conductive parts (first conductive part, second conductive part) among the three conductive parts (first conductive part, second conductive part, third conductive part, and fourth conductive part) The resistance value of the two connection parts of the pair. Therefore, it is only necessary to secure the conductive portion of the other site in addition to the conductive portion of the two sites to be the object of resistance measurement, so that the resistance measurement becomes easy.

In addition, it is preferable to further include a conductive portion selection unit that selects a conductive portion paired with a connection portion different from the connection portion for which the resistance value is calculated, among the conductive portions. As a new first conductive portion, a conductive portion that satisfies a first condition different from the new first conductive portion among the conductive portions is selected as a new second conductive portion and a third conductive portion, and the The current supply part further flows current between the new first conductive part and the new second conductive part, and the first voltage detection part further detects the new third conductive part and the new second conductive part. A voltage between conductive parts, the resistance calculation part further calculates the voltage between the first voltage detection part and the new first voltage based on the current flowing through the current supply part and the voltage detected by the first voltage detection part The resistance value of the paired connection portion of the conductive portion.

According to the above configuration, the conductive part selection unit sequentially selects the conductive parts paired with the connection parts whose resistance values have not been measured as the first conductive parts, whereby the resistance values of the conductive parts provided on the substrate to be measured can be sequentially measured.

In addition, it is preferable to further include a conductive portion selection unit that selects a conductive portion paired with a connection portion different from the connection portion for which the resistance value is calculated, among the conductive portions. As the new first conductive portion and the second conductive portion, a conductive portion that satisfies the first condition, which is different from the new first conductive portion and the second conductive portion, among the conductive portions, is selected as the new third conductive portion. A conductive portion and a fourth conductive portion, the current supply portion further flows current between the new first conductive portion and the new second conductive portion via the planar conductor, and the first voltage is detected The voltage detection part further detects the voltage between the new third conductive part and the new first conductive part, and the second voltage detection part further detects the new fourth conductive part and the new second conductive part the voltage between the parts, the resistance calculation part further calculates the difference between the resistance calculation part based on the current flowing through the current supply part and the voltage detected by the first voltage detection part and the second voltage detection part The resistance value of the connecting portion paired with the new first conductive portion and the resistance value of the connecting portion paired with the new second conductive portion.

According to the above configuration, the conductive portion selection portion sequentially selects the conductive portions paired with the connection portion whose resistance value has not been measured as the first conductive portion and the second conductive portion, whereby the conductive portions provided on the substrate to be measured can be sequentially measured in units of two. The resistance value of each conductive part on it.

In addition, the third conductive portion is preferably a conductive portion that is different from the first conductive portion and the second conductive portion in each of the conductive portions, and reaches the first conductive portion from the third conductive portion The shortest conductive path of the portion does not overlap with the current path through which the current flowing through the current supply portion flows through the planar conductor.

According to the above configuration, the voltage detected by the first voltage detection unit does not include the voltage generated by the current flowing in the planar conductor, so that the measurement accuracy of the voltage generated in the connection part paired with the first conductive part As a result, the calculation accuracy of the resistance value of the connection portion paired with the first conductive portion by the resistance calculation portion is improved.

In addition, the fourth conductive portion is preferably a conductive portion that is different from the first conductive portion and the second conductive portion in each of the conductive portions, and reaches the second conductive portion from the fourth conductive portion The shortest conductive path of the portion does not overlap with the current path through which the current flowing through the current supply portion flows through the planar conductor.

According to the above configuration, the voltage detected by the second voltage detection unit does not include the voltage generated by the current flowing in the planar conductor, so that the measurement accuracy of the voltage generated in the connecting portion paired with the second conductive portion As a result, the calculation accuracy of the resistance value of the connection portion paired with the second conductive portion by the resistance calculation portion is improved.

In addition, it is preferable that the conductive portion selection portion selects a conductive portion paired with a connection portion different from the connection portion for which the resistance value is calculated among the conductive portions as a new first conductive portion, and selects the conductive portion as a new first conductive portion. The new second conductive portion and the new third conductive portion are selected so as to satisfy the first condition and the second condition that are different from the new first conductive portion in each of the conductive portions. The second condition is the shortest conductive path from the new third conductive part to the new first conductive part and the new first conductive part through the current supply part, and the new second conductive part The current paths that flow through the planar conductors of the current flowing between the conductive parts do not overlap.

According to the above configuration, the conductive portion selection portion sequentially selects the conductive portion paired with the connection portion whose resistance value has not been measured as the first conductive portion, whereby the resistance value of each conductive portion provided on the substrate to be measured can be sequentially measured, In addition, the voltage detected by the first voltage detection part does not include the voltage generated by the current flowing in the planar conductor, so the measurement accuracy of the voltage generated in the connection part paired with the new first conductive part is improved, As a result, the calculation accuracy of the resistance value of the connection part paired with the new first conductive part by the resistance calculation part improves.

In addition, it is preferable that the conductive portion selection portion selects a conductive portion that satisfies the first condition and does not satisfy the second condition when the conductive portion that satisfies the first condition and the second condition does not exist. part as the new second conductive part and the third conductive part.

According to the above configuration, the resistance value of the connection portion paired with the conductive portion that does not satisfy the second condition can be calculated by the resistance calculation portion.

In addition, it is preferable that the conductive portion selection portion selects, among the conductive portions, a pair of conductive portions with a connection portion different from the connection portion for which the resistance value is calculated, as the new first conductive portion and the second conductive portion. There are two conductive parts, and the new third conductive part and the For the new fourth conductive portion, the second condition is the shortest conductive path from the new third conductive portion to the new first conductive portion and the shortest conductive path from the new fourth conductive portion to the new first conductive portion. The shortest conductive path of the two conductive parts is different from the current path in which the current flowing between the new first conductive part and the new second conductive part by the current supply part flows through the planar conductor overlapping.

According to the above configuration, the conductive portion selection portion sequentially selects the conductive portions paired with the connection portion whose resistance value has not been measured as the first conductive portion and the second conductive portion, whereby the conductive portions provided on the substrate to be measured can be sequentially measured in units of two. The resistance value of each conductive part above, and the voltage detected by the first voltage detection part and the second voltage detection part does not include the voltage generated by the current flowing in the planar conductor, so it is related to the new first conductive part. As a result, the measurement accuracy of the voltage generated in the paired connection portion of the first conductive portion and the second conductive portion is improved, and as a result, the resistance calculation portion is used to calculate the resistance value of the new paired connection portion of the first conductive portion and the second conductive portion. Accuracy improved.

In addition, it is preferable that the conductive portion selection unit selects the conductive portion that satisfies the first condition and does not satisfy the second condition when there are not two or more conductive portions that satisfy the first condition and the second condition The conditioned conductive portion is used as at least one of the new second conductive portion and the third conductive portion.

According to the above configuration, the resistance value of the connection portion paired with the conductive portion that does not satisfy the second condition can be calculated by the resistance calculation portion.

In addition, the resistance measurement method of the present invention is a resistance measurement method for measuring the resistance of a connection portion of a substrate to be measured, the substrate to be measured having: a conductive planar conductor extending in a planar shape; and the planar conductor Opposing substrate surfaces; and a pair of conductive parts provided on the substrate surface and the connection parts electrically connecting the conductive parts and the planar conductor, and having three or more of the pairs, In addition, the resistance measurement method includes the step of supplying a current that flows between a first conductive portion, which is one of the conductive portions, and a second conductive portion, which is a conductive portion different from the first conductive portion. electric current; a first voltage detection step of detecting a voltage between a third conductive part and the first conductive part, which is a conductive part different from the first conductive part and the second conductive part in each of the conductive parts and a resistance calculation step of calculating the resistance value of the connection portion paired with the first conductive portion based on the current flowing by the current supply step and the voltage detected by the first voltage detection step .

According to the above configuration, the current flowing in the current supplying step does not flow in the path connecting the third conductive portion and the first conductive portion for which the voltage measurement is performed in the first voltage detection step. As a result, the voltage measured by the first voltage detection step includes the voltage drop at the connection portion paired with the first conductive portion, but does not include the voltage drop at the connection portion paired with the third conductive portion. As a result, in the resistance calculation step, the resistance value calculated based on the current flowing in the current supply step and the voltage detected in the first voltage detection step, and the relationship between the connection portion paired with the first conductive portion. The resistance values are approximately equal. Thereby, the resistance value of the connection part paired with the first conductive part can be measured, respectively. [Effect of invention]

The resistance measurement device and the resistance measurement method of the above-described configuration can measure the resistance of the connection portion of the substrate to be measured, the substrate to be measured has: a conductive planar conductor extending in a planar shape; a substrate surface; and a pair of conductive parts provided on the substrate surface and the connection parts electrically connecting the conductive parts and the planar conductor.

Hereinafter, embodiments of the present invention will be described based on the drawings. In addition, the structure which attached|subjected the same code|symbol to each figure shows the same structure, and abbreviate|omits the description. FIG. 1 is a schematic diagram conceptually showing the configuration of a resistance measurement apparatus 1 using a resistance measurement method according to an embodiment of the present invention. The resistance measurement apparatus 1 shown in FIG. 1 is an apparatus for measuring the resistance of the to-be-measured board|substrate which is a measurement object. The resistance measurement apparatus 1 may be a board inspection apparatus which judges the quality of the board|substrate to be measured based on the measured resistance value.

The substrate to be measured is, for example, an intermediate substrate or a multilayer substrate, and may also be an encapsulation substrate for semiconductor packaging, a film carrier, a printed wiring substrate, a flexible substrate, a ceramic multilayer wiring substrate, an electrode plate for a liquid crystal display or a plasma display, and an electrode plate for manufacturing the same. Intermediate substrate for the process of these substrates. The multilayer substrate WB shown in FIG. 11 and the intermediate substrate B shown in FIG. 12 correspond to an example of the substrate to be measured. In FIG. 1, the example in which the intermediate|middle board|substrate B was mounted in the resistance measurement apparatus 1 as a measurement target board|substrate is shown.

The resistance measurement device 1 shown in FIG. 1 has a housing 112 . The substrate fixing device 110 , the measurement part 121 , the measurement part 122 , the measurement part moving mechanism 125 , and the control part 20 are mainly provided in the inner space of the frame body 112 . The substrate fixing device 110 is configured to fix the intermediate substrate B to be measured at a predetermined position.

The measurement unit 121 is located above the intermediate substrate B fixed to the substrate fixing device 110 . The measurement unit 122 is located below the intermediate substrate B fixed to the substrate fixing device 110 . The measurement unit 121 and the measurement unit 122 include a measurement jig 4U and a measurement jig 4L for bringing the probe into contact with the conductive portion formed on the intermediate substrate B. As shown in FIG.

A plurality of probes Pr are attached to the measurement jig 4U and the measurement jig 4L. The measurement jig 4U and the measurement jig 4L are arranged and hold the plurality of probes Pr so as to correspond to the arrangement of the conductive portions that are the measurement objects formed on the surface of the intermediate substrate B. As shown in FIG. The measurement part moving mechanism 125 appropriately moves the measurement part 121 and the measurement part 122 in the housing 112 according to the control signal from the control part 20 , and makes the probes Pr of the measurement jig 4U and the measurement jig 4L and the intermediate substrate B conduct electricity. Ministry contact.

Furthermore, the resistance measurement device 1 may include only one of the measurement unit 121 and the measurement unit 122 . In addition, the resistance measurement device 1 may perform measurement on both sides of the substrate to be measured by turning the substrate to be measured inside and outside by any of the measuring units 121 and 122 .

The control unit 20 includes, for example, a central processing unit (CPU) that executes predetermined arithmetic processing, a random access memory (Random Access Memory, RAM) that temporarily stores data, and a read-only memory (ROM) that stores a predetermined control program. It is composed of storage units such as Read Only Memory (ROM) or Hard Disk Drive (HDD), and peripheral circuits of these. Further, the control unit 20 functions as the conductive portion selection unit 21 and the resistance calculation unit 22 by, for example, executing a control program stored in the storage unit.

FIG. 2 is a block diagram showing an example of the electrical configuration of the measurement unit 121 shown in FIG. 1 . In addition, since the measurement part 122 is comprised similarly to the measurement part 121, the description is abbreviate|omitted. The measurement unit 121 shown in FIG. 2 includes a scanning unit 31 , a current supply unit CS, a voltage detection unit VM1 (first voltage detection unit), a voltage detection unit VM2 (second voltage detection unit), a current detection unit AM, and a plurality of detectors. Needle Pr.

The current supply unit CS is a constant current circuit that outputs a current I corresponding to a control signal from the control unit 20 . The voltage detection unit VM1 and the voltage detection unit VM2 are voltage detection circuits that measure voltage and transmit the voltage value to the control unit 20 . The current detection unit AM is a current detection circuit that measures the current I and transmits the current value Ic to the control unit 20 . In addition, the structure which does not have the voltage detection part VM2 may be used.

The scanning unit 31 is, for example, a switching circuit configured using switching elements such as transistors and relay switches. The scanning unit 31 includes a current terminal +F for supplying the resistance measurement current I to the intermediate substrate B, a current terminal -F, and a voltage detection for detecting a voltage generated between the conductive parts of the intermediate substrate B by the current I Terminal +S1, voltage detection terminal -S1, voltage detection terminal +S2, voltage detection terminal -S2. In addition, the plurality of probes Pr are electrically connected to the scanning unit 31 . The scanning unit 31 switches between the current terminal +F, the current terminal -F, the voltage detection terminal +S1 , the voltage detection terminal -S1 , the voltage detection terminal +S2 , the voltage detection terminal -S2 and the plurality of probes according to the control signal from the control unit 20 connection between Pr.

One end of the output terminal of the current supply unit CS is connected to the circuit ground, and the other end is connected to the current terminal +F. As for the current detection unit AM, one end is connected to the current terminal -F, and the other end is connected to the circuit ground. The voltage detection unit VM1 has one end connected to the voltage detection terminal +S1 and the other end connected to the voltage detection terminal -S1. As for the voltage detection part VM2, one end is connected to the voltage detection terminal +S2, and the other end is connected to the voltage detection terminal -S2.

Further, the scanning unit 31 can turn on the current terminal +F, the current terminal -F, the voltage detection terminal +S1, the voltage detection terminal -S1, the voltage detection terminal +S2, and the voltage detection terminal -S2 according to the control signal from the control unit 20. Connect to any probe Pr. Thereby, the scanning part 31 can flow the current I between any conductor parts contacted by the probe Pr according to the control signal from the control part 20, measure the current I by the current detecting part AM, and detect the current I by the voltage detection The part VM1 and the voltage detection part VM2 measure the voltage V generated between the arbitrary conductor parts.

In addition, the current supply part CS only needs to be able to flow the current I to the intermediate substrate B via the scanning part 31, and is not limited to the example in which one end of the current supply part CS is connected to the circuit ground. For example, one end of the current supply unit CS may be connected to the other end of the current detection unit AM to form a current loop. In addition, the current detection unit AM may be arranged on the path through which the current I flows, and is not necessarily limited to the example connected to the current terminal -F. For example, the current detection unit AM may be connected in series with the current supply unit CS, and may be connected to the current terminal +F.

Thereby, the control unit 20 can flow the current I between the arbitrary probes Pr by the current supply unit CS by outputting the control signal to the scanning unit 31, and can detect the arbitrary probes by the voltage detection unit VM1 and the voltage detection unit VM2. Voltage between pins Pr.

The conductive portion selection portion 21 selects a first conductive portion, a second conductive portion, a third conductive portion, and a fourth conductive portion from among the conductive portions contacted by the probe Pr. The resistance value of the connection part paired with the conductive parts selected as the first conductive part and the second conductive part is calculated by the resistance calculation part 22, so the conductive part selection part 21 sequentially selects and has not yet calculated the resistance. A pair of new conductive parts of the connection part of the value is used as the first conductive part and the second conductive part, and the resistance value of all the connection parts whose resistance value is to be measured is measured.

The conductive part selection part 21 connects the probe Pr in contact with the first conductive part and the current detection part AM (current terminal -F) by the scanning part 31 , and connects the probe Pr in contact with the second conductive part and the current supply part CS (current terminal +F) is connected, the probe Pr in contact with the third conductive part is connected to one end (voltage detection terminal + S1 ) of the voltage detection part VM1, and the probe Pr in contact with the first conductive part is connected to the voltage detection The other end (voltage detection terminal - S1 ) of the part VM1 is connected, the probe Pr in contact with the second conductive part and one end (voltage detection terminal + S2 ) of the voltage detection part VM2 are connected, and the probe in contact with the fourth conductive part is connected. The pin Pr is connected to the other end (voltage detection terminal - S2 ) of the voltage detection unit VM2 .

Thereby, the conductive portion selection portion 21 allows the current to flow between the first conductive portion and the second conductive portion through the metal plate MP through the current supply portion CS, and detects the first conductive portion and the third conductive portion by the voltage detection portion VM1. The voltage between the conductive parts is detected by the voltage detection part VM2 between the second conductive part and the fourth conductive part.

The resistance calculation unit 22 calculates the current value Ic measured by the current detection unit AM, that is, the current I flowing by the current supply unit CS, and the voltage V1 detected by the voltage detection unit VM1. resistance value of the paired connection parts. Moreover, the resistance calculation part 22 calculates the resistance value of the connection part paired with the 2nd conductive part based on the current value Ic and the voltage V2 detected by the voltage detection part VM2.

Next, the operation of the resistance measuring device 1 will be described. A resistance measurement method for measuring the resistance of the substrate WB1 using the measurement unit 121 will be described by taking a case where the substrate to be measured is the intermediate substrate B as an example. In the case of performing the resistance measurement of the substrate WB2 using the measurement unit 122 , it is the same as the case of performing the resistance measurement of the substrate WB1 using the measurement unit 121 , so the description thereof is omitted.

3 to 5 are flowcharts showing an example of the operation of the resistance measurement device 1 using the resistance measurement method according to the embodiment of the present invention. The flowcharts shown in FIGS. 3 to 5 illustrate the case where the measurement of the intermediate substrate B is performed. 6 to 9 are explanatory diagrams for explaining the operation of the resistance measurement device 1 shown in FIG. 1 . In FIGS. 6 to 9 , the description of the scanning unit 31 is omitted for convenience of description.

First, the control unit 20 moves the measurement unit 121 by the measurement unit moving mechanism 125 and brings the probes Pr of the measurement jig 4U into contact with the intermediate substrate B fixed to the substrate fixing device 110 (step S1 ). In the example shown in FIG. 6, the case where the resistance measurement is performed by the so-called four-terminal measurement method is illustrated, and two probes Pr are respectively contacted on the conductive part PA1 - the conductive part PF1, respectively.

In addition, the resistance measurement device 1 is not limited to the example in which the resistance measurement is performed by the four-terminal method, and may be configured as follows: the probes Pr are brought into contact with the respective conductive parts one by one, and one probe Pr is also used as a current. Supply and voltage measurement.

Next, the conductive part selection unit 21 selects any conductive part from the conductive parts PA1 to PF1, for example, the conductive part PB1 and the conductive part PC1, and sets the conductive part PB1 as the first conductive part and the conductive part PC1 as the second conductive part Conductive portion (step S2: conductive portion selection step).

Next, the conductive portion selection unit 21 searches for the third conductive portion and the fourth conductive portion that satisfy the first condition and the second condition, which are different from the first conductive portion and the second conductive portion, and selects the one satisfying the first condition and the second condition. The conductive part PA1 is used as the third conductive part, and the conductive part PD1 is selected as the fourth conductive part, and the second condition is the shortest conductive path from the third conductive part to the first conductive part and the shortest conductive path from the fourth conductive part to the second conductive part The shortest conductive path of the conductive portion does not overlap with the current path flowing through the metal plate MP (step S3 : conductive portion selection step).

Next, the conductive portion selection portion 21 connects the current detection portion AM to the conductive portion PB1 (first conductive portion) and the current supply portion CS to the conductive portion PC1 (second conductive portion) through the scanning portion 31, The supply portion CS supplies the current I between the conductive portion PB1 (first conductive portion) and the conductive portion PC1 (second conductive portion) (step S4 : current supply step), and the current of the current I is measured by the current detection portion AM value Ic (step S5 ) (refer to FIG. 6 ).

Next, the conductive portion selection portion 21 connects one terminal of the voltage detection portion VM1 to the conductive portion PB1 (first conductive portion) via the scanning portion 31 , and connects the other terminal of the voltage detection portion VM1 to the conductive portion PA1 (third conductive portion). The conductive part) is connected, and the voltage V1 between the conductive part PB1 (first conductive part) and the conductive part PA1 (third conductive part) is measured by the voltage detection part VM1 (step S6: the first voltage detection step) (refer to FIG. 6).

Next, the conductive portion selection portion 21 connects one terminal of the voltage detection portion VM2 to the conductive portion PC1 (second conductive portion) via the scanning portion 31, and connects the other terminal of the voltage detection portion VM2 to the conductive portion PD1 (fourth conductive portion). The conductive part) is connected, and the voltage V2 between the conductive part PC1 (second conductive part) and the conductive part PD1 (fourth conductive part) is measured by the voltage detection part VM2 (step S7 : the second voltage detection step) (refer to FIG. 6).

The conductive portion PA1 (third conductive portion) is a conductive portion different from the conductive portion PB1 (first conductive portion) and the conductive portion PC1 (second conductive portion), and therefore satisfies the first condition. As shown in FIG. 6 , the shortest conductive path from the conductive portion PA1 (third conductive portion) to the conductive portion PB1 (first conductive portion) is the conductive path X from the conductive portion PA1 via the connection portion RA, the metal plate MP, and the connection portion. RB to reach the path of the conductive portion PB1. The conductive path X does not overlap with the current path through the metal plate MP for the current I flowing between the conductive portion PB1 (first conductive portion) and the conductive portion PC1 (second conductive portion). Therefore, the conductive portion PA1 (third conductive portion), the conductive portion PB1 (first conductive portion), and the conductive portion PC1 (second conductive portion) satisfy the first condition and the second condition.

The conductive portion PD1 (fourth conductive portion) is a conductive portion different from the conductive portion PB1 (first conductive portion) and the conductive portion PC1 (second conductive portion), and therefore satisfies the first condition. The shortest conductive path from the conductive portion PD1 (fourth conductive portion) to the conductive portion PC1 (second conductive portion) is, as shown in FIG. 6 , the conductive path Y from the conductive portion PD1 via the connection portion RD, the metal plate MP, and the connection portion RC to reach the path of the conductive part PC1. The conductive path Y does not overlap with the current path through the metal plate MP for the current I flowing between the conductive portion PB1 (first conductive portion) and the conductive portion PC1 (second conductive portion). Therefore, the conductive portion PB1 (first conductive portion), the conductive portion PC1 (second conductive portion), and the conductive portion PD1 (fourth conductive portion) satisfy the first condition and the second condition.

According to the conductive portion PA1 (third conductive portion), conductive portion PB1 (first conductive portion), and conductive portion PC1 (second conductive portion) selected in the manner described above, current does not flow through the conductive path X and the connection portion RA, so Since no voltage is generated at this portion, the voltage V1 measured by the voltage detection portion VM1 does not include the voltage generated in the conductive path X and the connection portion RA. Therefore, the voltage V1 is approximately equal to the voltage generated by the current I flowing through the connection portion RB.

In addition, according to the conductive portion PD1 (fourth conductive portion), conductive portion PB1 (first conductive portion), and conductive portion PC1 (second conductive portion) selected in the manner described above, current does not flow through the conductive path Y and the connection portion RD , so that no voltage is generated at this portion, so the voltage V2 measured by the voltage detection portion VM2 does not include the voltage generated in the conductive path Y and the connection portion RD. Therefore, the voltage V2 is approximately equal to the voltage generated by the current I flowing through the connection portion RD.

Next, the resistance value Rb of the connection part RB and the resistance value Rc of the connection part RC are calculated by the resistance calculation unit 22 based on the following equations (1) and (2) (step S8 : resistance calculation step). Rb=V1/Ic (1) Rc=V2/Ic (2)

Thereby, the resistance values of the connection part RB and the connection part RC can be measured, respectively. In addition, it is not necessarily limited to the example in which the current value Ic is measured by the current detection part AM. A configuration may be adopted in which the current detection unit AM is not provided, and the current supply unit CS outputs the current I of the preset current value Ic.

Furthermore, the conductive portion selection unit 21 is not necessarily limited to the example in which the third conductive portion and the fourth conductive portion are selected so as to satisfy the second condition, and the third conductive portion and the fourth conductive portion that do not satisfy the second condition may also be selected. department. Even when the third conductive portion and the fourth conductive portion that do not satisfy the second condition are selected, the resistance value of each connection portion can be measured separately.

7 is an explanatory diagram for explaining an example of selecting a third conductive portion and a fourth conductive portion that do not satisfy the second condition. In the example shown in FIG. 7 , the conductive portion PA1 is selected as the first conductive portion, the conductive portion PD1 as the second conductive portion, the conductive portion PB1 as the third conductive portion, and the conductive portion PC1 as the fourth conductive portion. In this case, since the current path through which the current I flows through the metal plate MP overlaps with the conductive path X and the conductive path Y, the third conductive portion and the fourth conductive portion do not satisfy the second condition.

Even in this case, since the current I does not flow through the connection part RB and the connection part RC, the resistance calculation part 22 can calculate the resistance value Ra of the connection part RA and the resistance value Rd of the connection part RD, respectively.

However, since the voltage drop due to the flowing current I occurs in the conductive path X and the conductive path Y, the resistance value Ra of the connection portion RA calculated by the resistance calculation unit 22 includes the resistance value Ra of the conductive path X of the metal plate MP. The resistance value Rx and the resistance value Rd of the connection portion RD calculated by the resistance calculation unit 22 include the resistance value Ry of the conductive path Y of the metal plate MP. However, with regard to planar conductors such as the metal plate MP and the inner layer pattern IP, since the conductor area is wide, the resistance value Rx and the resistance value Ry are small. In particular, the conductor area of the metal plate MP is wide and the thickness is as thick as 1 mm to 10 mm. Since the cross-sectional area is wide on the order of mm, the resistance value Rx and the resistance value Ry are so small that they can be ignored.

However, as shown in step S3, the third conductive portion and the fourth conductive portion that satisfy the second condition are selected, whereby the voltage V1 and the voltage V2 do not include the voltage generated by the current I flowing through the metal plate MP, so the It is more preferable in that the calculation accuracy of the resistance value of the connection portion can be further improved.

The conductive portion selection portion 21 selects a connection portion RB and a connection portion RC different from the connection portion RB and the connection portion RC for which the resistance value has been calculated in order to calculate the resistance value of the new connection portion when there is a connection portion whose resistance value has not yet been calculated. The connecting parts, such as the paired conductive parts PD1 and PE1 of the connecting part RD and the connecting part RE, are used as new first and second conductive parts (step S11 : conductive part selection step) (see FIG. 8 ).

Next, the conductive portion selection unit 21 searches for the third conductive portion and the fourth conductive portion that satisfy the first condition and the second condition, which are different from the new first conductive portion and the second conductive portion, and selects the first and second conductive portions. The conductive part PC1 of the condition is used as the new third conductive part, and the conductive part PF1 is selected as the fourth conductive part, and the second condition is the shortest conductive path from the third conductive part to the first conductive part and from the fourth conductive part. The shortest conductive path from the conductive portion to the second conductive portion does not overlap with the current path flowing through the metal plate MP (step S12 : conductive portion selection step).

Next, the conductive portion selection portion 21 connects the current detection portion AM to the conductive portion PD1 (first conductive portion) and the current supply portion CS to the conductive portion PE1 (second conductive portion) through the scanning portion 31 . The supply portion CS supplies the current I between the conductive portion PD1 (first conductive portion) and the conductive portion PE1 (second conductive portion) (step S13 : current supply step), and the current of the current I is measured by the current detection portion AM value Ic (step S14 ) (refer to FIG. 8 ).

Next, the conductive portion selection portion 21 connects one terminal of the voltage detection portion VM1 to the conductive portion PD1 (first conductive portion) via the scanning portion 31, and connects the other terminal of the voltage detection portion VM1 to the conductive portion PC1 (third conductive portion). The conductive part) is connected, and the voltage V1 between the conductive part PD1 (the first conductive part) and the conductive part PC1 (the third conductive part) is measured by the voltage detection part VM1 (step S15 : the first voltage detection step) (refer to FIG. 8).

Next, the conductive portion selection portion 21 connects one terminal of the voltage detection portion VM2 to the conductive portion PE1 (second conductive portion) via the scanning portion 31, and connects the other terminal of the voltage detection portion VM2 to the conductive portion PF1 (fourth conductive portion). The conductive part) is connected, and the voltage V2 between the conductive part PE1 (the second conductive part) and the conductive part PF1 (the fourth conductive part) is measured by the voltage detection part VM2 (step S16 : the second voltage detection step) (refer to FIG. 8).

The conductive portion PC1 (third conductive portion) is a conductive portion different from the conductive portion PD1 (first conductive portion) and the conductive portion PE1 (second conductive portion), and therefore satisfies the first condition. As shown in FIG. 8 , the shortest conductive path from the conductive portion PC1 (third conductive portion) to the conductive portion PD1 (first conductive portion) is the conductive path X from the conductive portion PC1 via the connection portion RC, the metal plate MP, and the connection portion. RD to reach the path of the conductive portion PD1. The conductive path X does not overlap with the current path through the metal plate MP for the current I flowing between the conductive portion PD1 (first conductive portion) and the conductive portion PE1 (second conductive portion). Therefore, the conductive portion PC1 (third conductive portion), the conductive portion PD1 (first conductive portion), and the conductive portion PE1 (second conductive portion) satisfy the first condition and the second condition.

The conductive portion PF1 (fourth conductive portion) is a conductive portion different from the conductive portion PD1 (first conductive portion) and the conductive portion PE1 (second conductive portion), and therefore satisfies the first condition. The shortest conductive path from the conductive portion PF1 (fourth conductive portion) to the conductive portion PE1 (second conductive portion) is, as shown in FIG. 8 , the conductive path Y from the conductive portion PF1 via the connection portion RF, the metal plate MP, and the connection portion RE to reach the path of the conductive portion PE1. The conductive path Y does not overlap with the current path through the metal plate MP for the current I flowing between the conductive portion PD1 (first conductive portion) and the conductive portion PE1 (second conductive portion). Therefore, the conductive portion PD1 (first conductive portion), the conductive portion PE1 (second conductive portion), and the conductive portion PF1 (fourth conductive portion) satisfy the first condition and the second condition.

The voltage V1 and the voltage V2 obtained in the above-described manner are substantially equal to the voltages generated by the current I flowing through the connection portion RD and the connection portion RE, as in the case of the connection portion RB and the connection portion RC.

Next, the resistance value Rd of the connection portion RD and the resistance value Re of the connection portion RE are calculated by the resistance calculation unit 22 based on the following equations (3) and (4) (step S17 : resistance calculation step). Rd=V1/Ic (3) Re=V2/Ic (4)

Thereby, the resistance values of the connection part RD and the connection part RE can be measured, respectively.

The conductive part selection unit 21 selects the sum of the connection parts RB, the connection parts RC, The connection part RD, the connection part different from the connection part RE, for example, the connection part RA, the connection part RF paired conductive part PA1, the conductive part PF1 are used as the new first conductive part and the second conductive part (step S21: conductive part selection step).

Next, the conductive portion selection unit 21 searches for the third conductive portion and the fourth conductive portion that satisfy the first condition, which is different from the new first conductive portion and the second conductive portion, and the second condition. The shortest conductive path from the three conductive parts to the first conductive part and the shortest conductive path from the fourth conductive part to the second conductive part do not overlap with the current path flowing through the metal plate MP.

Here, in order to simplify the description, a row of conductive parts PA1 to PF1 is formed on the substrate surface BS1 of the substrate WB1 so that there is no conductive part to which the probe Pr contacts except the conductive parts PA1 to PF1 Take an example to illustrate. In addition, the resistance measuring device 1 cannot be placed between the conductive portion of the substrate surface BS1 of the substrate WB1 to which the probes Pr of the measurement portion 121 are in contact and the conductive portion of the substrate surface BS1 of the substrate WB2 to which the probes Pr of the measurement portion 122 are in contact. The case where a current is passed or the voltage between the conductive portions on both surfaces is measured will be described as an example.

In this case, there is no conductive portion satisfying the first condition and the second condition (step S22 ). In the case where the configuration including the voltage detection unit VM1 and the voltage detection unit VM2 does not have a conductive portion that satisfies the first condition and the second condition, it means that the conductive portion is set to satisfy the first condition and the second condition. In the case of the third conductive portion, there is no conductive portion that can contact the probe Pr and measure the voltage between the first conductive portion and the third conductive portion by the first voltage detection portion, and the conductive portion is set as In the case of the fourth conductive portion, there is no conductive portion that can contact the probe Pr and measure the voltage between the first conductive portion and the fourth conductive portion by the second voltage detection portion. The case where there is no conductive portion satisfying the first condition and the second condition in the configuration without the voltage detection portion VM2 means that the conductive portion is the third conductive portion when the first condition and the second condition are satisfied. In the case of , there is no conductive portion that can contact the probe Pr and measure the voltage between the first conductive portion and the third conductive portion by the first voltage detection portion.

Only when there is no conductive portion that satisfies the first condition and the second condition, the conductive portion selection portion 21 selects the conductive portion PB1 and the conductive portion PE1 that satisfy the first condition and do not satisfy the second condition as the new third conductive portion. part, the fourth conductive part (step S23 : the conductive part selection step). Furthermore, in step S23, when there is only one conductive portion that satisfies the first condition and the second condition, the conductive portion selection portion 21 can select the conductive portion that satisfies the first condition and the second condition as a new conductive portion. Either one of the third conductive portion and the fourth conductive portion of the .

Next, the conductive portion selection portion 21 connects the current detection portion AM to the conductive portion PA1 (first conductive portion) via the scanning portion 31 and connects the current supply portion CS to the conductive portion PF1 (second conductive portion), The supply portion CS supplies the current I between the conductive portion PA1 (first conductive portion) and the conductive portion PF1 (second conductive portion) (step S24 : current supply step), and the current of the current I is measured by the current detection portion AM value Ic (step S25 ) (see FIG. 9 ).

Next, the conductive portion selection portion 21 connects one terminal of the voltage detection portion VM1 to the conductive portion PA1 (first conductive portion) via the scanning portion 31 , and connects the other terminal of the voltage detection portion VM1 to the conductive portion PB1 (third conductive portion). The conductive part) is connected, and the voltage V1 between the conductive part PA1 (first conductive part) and the conductive part PB1 (third conductive part) is measured by the voltage detection part VM1 (step S26 : the first voltage detection step) (refer to FIG. 9).

Next, the conductive portion selection portion 21 connects one terminal of the voltage detection portion VM2 to the conductive portion PF1 (second conductive portion) via the scanning portion 31, and connects the other terminal of the voltage detection portion VM2 to the conductive portion PE1 (fourth conductive portion). The conductive part) is connected, and the voltage V2 between the conductive part PF1 (the second conductive part) and the conductive part PE1 (the fourth conductive part) is measured by the voltage detection part VM2 (step S27 : the second voltage detection step) (refer to FIG. 9).

The conductive portion PB1 (third conductive portion) is a conductive portion different from the conductive portion PA1 (first conductive portion) and the conductive portion PF1 (second conductive portion), and therefore satisfies the first condition. As shown in FIG. 9 , the shortest conductive path from the conductive portion PB1 (third conductive portion) to the conductive portion PA1 (first conductive portion) is the conductive path X from the conductive portion PB1 via the connecting portion RB, the metal plate MP, and the connecting portion. RA to reach the path of the conductive part PA1. The conductive path X overlaps with the current path through which the current I flowing between the conductive portion PA1 (first conductive portion) and the conductive portion PF1 (second conductive portion) flows through the metal plate MP. Therefore, the conductive portion PB1 (third conductive portion), the conductive portion PA1 (first conductive portion), and the conductive portion PF1 (second conductive portion) do not satisfy the second condition.

The conductive portion PE1 (fourth conductive portion) is a conductive portion different from the conductive portion PA1 (first conductive portion) and the conductive portion PF1 (second conductive portion), and therefore satisfies the first condition. The shortest conductive path from the conductive portion PE1 (fourth conductive portion) to the conductive portion PF1 (second conductive portion) is, as shown in FIG. 9 , the conductive path Y from the conductive portion PE1 via the connection portion RE, the metal plate MP, and the connection portion RF reaches the path of the conductive portion PF1. The conductive path Y overlaps with the current path through which the current I flowing between the conductive portion PA1 (first conductive portion) and the conductive portion PF1 (second conductive portion) flows through the metal plate MP. Therefore, the conductive portion PA1 (the first conductive portion), the conductive portion PF1 (the second conductive portion), and the conductive portion PE1 (the fourth conductive portion) do not satisfy the second condition.

Next, the resistance value Ra of the connection portion RA and the resistance value Rf of the connection portion RF are calculated by the resistance calculation unit 22 based on the following equations (5) and (6) (step S28 : resistance calculation step). Ra=V1/Ic (5) Rf=V2/Ic (6)

Thereby, the resistance values of the connection part RA and the connection part RF can be measured separately. In the case where the second condition is not satisfied, the voltage V1 and the voltage V2 measured in steps S26 and S27 include the voltage generated by the current I flowing through the conductive path X and the conductive path Y of the metal plate MP as described above. Therefore, The resistance value Ra and the resistance value Rf calculated by the equations (5) and (6) include the resistance value Rx and the resistance value Rf as errors. However, as described above, the resistance value Rx and the resistance value Ry are so small that they can be substantially ignored.

As described above, according to the processes of steps S1 to S28, the resistance value Ra to the resistance value Rf of the connection portion RA to the connection portion RF of the substrate to be measured, such as the intermediate substrate B, which has a planar spread, can be measured, respectively. A planar conductor such as a conductive intermediate substrate B; a substrate surface BS1 facing the planar conductor; and a pair of conductive parts PA1 to PF1 provided on the substrate surface BS1 and conductive parts PA1 to PF1 The connecting portion RA to the connecting portion RF in which the portion PF1 is electrically connected to the planar conductor.

Furthermore, one conductive portion serves as the third conductive portion and the fourth conductive portion, that is, the third conductive portion and the fourth conductive portion may be the same conductive portion. The conductive portion selection unit 21 can select a conductive portion that satisfies the first condition and the second condition for the third conductive portion and satisfies the first condition and the second condition for the fourth conductive portion as the third conductive portion and the fourth conductive portion. the conductive part.

10 is an explanatory diagram for explaining the operation of the resistance measurement device when the third conductive portion and the fourth conductive portion are the same conductive portion. In the example shown in FIG. 10 , the conductive portion PA1 is the first conductive portion, the conductive portion PC1 is the second conductive portion, and the conductive portion PB1 serves as the third conductive portion and the fourth conductive portion. That is, the third conductive portion and the fourth conductive portion are the same conductive portion PB1.

In this case, the voltage detection part VM1 measures the voltage between the conductive part PA1 (first conductive part) and the conductive part PB1 (third conductive part, fourth conductive part) as the voltage V1. The voltage detection portion VM2 measures the voltage between the conductive portion PB1 (third conductive portion, fourth conductive portion) and the conductive portion PC1 (second conductive portion) as a voltage V2.

The resistance calculation unit 22 calculates the resistance value Ra of the connection part RA and the resistance value Rc of the connection part RC based on the following equations (7) and (8) (resistance calculation step). Ra=V1/Ic (7) Rc=V2/Ic (8)

Even in this case, since the current I does not flow through the connection part RB, the resistance calculation part 22 can calculate the resistance value Ra of the connection part RA and the resistance value Rc of the connection part RC, respectively.

In addition, an example in which a plurality of probes Pr are arranged so as to correspond to the arrangement of the conductive portions of the substrate to be inspected has been shown, but it may be configured as follows: The current supply part CS, the current detection part AM, the voltage detection part VM1, and the voltage detection part VM2 are electrically connected to the conductive part. In addition, the resistance measurement apparatus 1 does not have the voltage detection part VM2, and the conductive part selection part 21 may be set as the structure which does not select a 4th conductive part. In addition, the conductive portion selection unit 21 may select the first conductive portion, the second conductive portion, the third conductive portion, and the fourth conductive portion regardless of whether the second condition is satisfied. In addition, when the conductive portion selection unit 21 selects the new third conductive portion and the fourth conductive portion, it is only necessary to select a conductive portion that satisfies the first condition that is different from the new first conductive portion and the second conductive portion. The same conductive parts as the current third and fourth conductive parts are selected as the new third and fourth conductive parts. In addition, the resistance measurement device 1 does not include the conductive portion selection portion 21, and the first conductive portion, the second conductive portion, the third conductive portion, and the fourth conductive portion may be appropriately set.

1: Resistance measuring device 4U, 4L: Measuring fixture 20: Control Department 21: Conductive part selection part 22: Resistance calculation department 31: Scanning Department 110: Substrate fixing device 112: Frame 121, 122: Measurement Department 125: Measuring part moving mechanism AM: Current detection section B: Intermediate substrate (substrate to be measured) BS, BS1: Substrate surface BS2: Contact Surface CS: Current supply part +F, -F: Current terminals I: current Ic: current value IP: Inner layer pattern (planar conductor) MP: Metal plate (planar conductor) PA, PB: Conductive part PA1～PF1, PA2～PF2: Conductive part Pr: probe RA to RF: Connection part Ra～Rf, Rx, Ry: Resistance value +S1, -S1, +S2, -S2: Voltage detection terminals S1~S8, S11~S17, S21~S28: Steps V1, V2: Voltage VM1: Voltage detection unit (first voltage detection unit) VM2: Voltage detection unit (second voltage detection unit) WB: Multilayer substrate (substrate to be measured) WB1, WB2: substrate X, Y: Conductive Path

FIG. 1 is a schematic diagram conceptually showing the configuration of a resistance measurement apparatus using a resistance measurement method according to an embodiment of the present invention. FIG. 2 is a block diagram showing an example of the electrical configuration of the measurement unit shown in FIG. 1 . FIG. 3 is a flowchart showing an example of the operation of the resistance measuring device shown in FIG. 1 . FIG. 4 is a flowchart showing an example of the operation of the resistance measuring device shown in FIG. 1 . FIG. 5 is a flowchart showing an example of the operation of the resistance measuring device shown in FIG. 1 . FIG. 6 is an explanatory diagram for explaining the operation of the resistance measurement device shown in FIG. 1 . FIG. 7 is an explanatory diagram for explaining the operation of the resistance measurement device shown in FIG. 1 . FIG. 8 is an explanatory diagram for explaining the operation of the resistance measurement device shown in FIG. 1 . FIG. 9 is an explanatory diagram for explaining the operation of the resistance measuring device shown in FIG. 1 . 10 is an explanatory diagram for explaining the operation of the resistance measurement device when the third conductive portion and the fourth conductive portion are the same conductive portion. 11 is a conceptual schematic diagram showing a multilayer substrate as an example of a substrate having a planar inner layer pattern in the inner layer of the substrate. FIG. 12 is a conceptual schematic diagram showing an example of an intermediate substrate. FIG. 13 is an explanatory diagram for explaining a measurement method for measuring the resistance value of the intermediate substrate shown in FIG. 12 .

AM: Current detection section

B: Intermediate substrate (substrate to be measured)

BS1: Substrate Surface

CS: Current supply part

I: current

MP: Metal plate (planar conductor)

PA1~PF1, PA2~PF2: Conductive part

Pr: probe

RA~RF: Connection part

VM1: Voltage detection unit (first voltage detection unit)

VM2: Voltage detection unit (second voltage detection unit)

WB1, WB2: substrate

X, Y: Conductive Path

Claims (4)

A resistance measuring device for measuring the resistance of a connection portion of a substrate to be measured, the substrate to be measured having: a conductive planar conductor extending in a planar shape; a substrate surface facing the planar conductor; A pair of conductive parts provided on the surface of the substrate and the connection parts electrically connecting the conductive parts and the planar conductor, and three or more of the pairs are provided, and the resistance measurement device is provided with : a current supplying portion connected to a first conductive portion that is one of the three or more conductive portions of the pair and a second conductive portion that is a conductive portion different from the first conductive portion via the planar conductor A current flows between the conductive parts; a first voltage detection unit that detects a voltage between a third conductive part, which is a conductive part different from the first conductive part and the second conductive part in each of the conductive parts, and the first conductive part ; A resistance calculation unit that calculates a resistance value of the connection part paired with the first conductive part based on the current flowing through the current supply part and the voltage detected by the first voltage detection part ; A second voltage detection unit detects a voltage between a fourth conductive part and the second conductive part, which are conductive parts different from the first conductive part and the second conductive part in each of the conductive parts and the resistance calculation unit further calculates the connection portion paired with the second conductive portion based on the current flowing through the current supply portion and the voltage detected by the second voltage detection portion the resistance value of ; and A conductive portion selection unit that selects, among the conductive portions, a conductive portion paired with a connection portion different from the connection portion for which the resistance value is calculated, as a new first conductive portion part and a new second conductive part, and selected so as to satisfy the first condition and the second condition which are different from the new first conductive part and the new second conductive part in each of the conductive parts A new third conductive part and a new fourth conductive part, the second condition is the shortest conductive path from the new third conductive part to the new first conductive part and the shortest conductive path from the new third conductive part The shortest conductive path from the four conductive parts to the new second conductive part and the current flowing between the new first conductive part and the new second conductive part by the current supply part The current paths through the planar conductors do not overlap, The current supply portion further flows current between the new first conductive portion and the new second conductive portion via the planar conductor, The first voltage detection part further detects the voltage between the new third conductive part and the new first conductive part, The second voltage detection part further detects the voltage between the new fourth conductive part and the new second conductive part, The resistance calculation unit further calculates the relationship between the new first voltage and the first voltage based on the current flowing through the current supply unit and the voltage detected by the first voltage detection unit and the second voltage detection unit. the resistance value of the paired connection part of the conductive part and the resistance value of the connection part paired with the new second conductive part, Regarding the conductive portion selection portion, when there are no two or more conductive portions that satisfy the first condition and the second condition, select the conductive portion that satisfies the first condition and does not satisfy the second condition The conductive portion is used as at least one of the new second conductive portion and the new third conductive portion. The resistance measurement device of claim 1, wherein the fourth conductive portion is the same conductive portion as the third conductive portion. A resistance measurement method for measuring the resistance of a connection portion of a substrate to be measured, the substrate to be measured having: a conductive planar conductor extending in a planar shape; a substrate surface facing the planar conductor; A pair of conductive parts provided on the substrate surface and the connection parts electrically connecting the conductive parts and the planar conductor, and having three or more of the pairs, and the resistance measurement method includes: : a current supply step of flowing a current between a first conductive portion that is one of the conductive portions and a second conductive portion that is a conductive portion different from the first conductive portion; a first voltage detection step of detecting a voltage between a third conductive part, which is a conductive part different from the first conductive part and the second conductive part in each of the conductive parts, and the first conductive part ;as well as A resistance calculation step of calculating a resistance value of the connection portion paired with the first conductive portion based on the current flowing in the current supply step and the voltage detected in the first voltage detection step ; In a second voltage detection step, a voltage between a fourth conductive portion and the second conductive portion, which is a conductive portion different from the first conductive portion and the second conductive portion in each of the conductive portions, is detected , calculating the resistance value of the connecting portion paired with the second conductive portion based on the current flowing in the current supplying step and the voltage detected in the second voltage detecting step; and In the conductive part selection step, among each of the conductive parts, a conductive part paired with a connection part different from the connection part for which the resistance value is calculated is selected as a new first conductive part and a new second conductive part part, and select a new third conductive part and a new third conductive part so as to satisfy the first condition and the second condition which are different from the new first conductive part and the new second conductive part in each of the conductive parts A new fourth conductive portion, the second condition being the shortest conductive path from the new third conductive portion to the new first conductive portion and from the new fourth conductive portion to the new conductive portion The shortest conductive path of the second conductive portion and the current flowing between the new first conductive portion and the new second conductive portion by the current supply step flows through the planar conductor. current paths do not overlap, In the current supplying step, including passing a current between the new first conductive portion and the new second conductive portion, In the first voltage detection step, including detecting the voltage between the new third conductive part and the new first conductive part, In the second voltage detection step, including detecting the voltage between the new second conductive part and the new fourth conductive part, In the resistance calculation step, based on the current flowing in the current supply step and the voltage detected in the first voltage detection step and the second voltage detection step, calculation the resistance value of the connection part paired with the new first conductive part and the resistance value of the connection part paired with the new second conductive part, In the conductive portion selection step, when there are no two or more conductive portions satisfying the first condition and the second condition, selecting the conductive portion that satisfies the first condition and does not satisfy the second condition The conductive portion of the second condition is used as at least one of the new second conductive portion and the new third conductive portion. The resistance measurement method of claim 3, wherein the fourth conductive portion is the same conductive portion as the third conductive portion.

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