CN103889166A - Mechanical controlled deep blind hole processing technology - Google Patents
Mechanical controlled deep blind hole processing technology Download PDFInfo
- Publication number
- CN103889166A CN103889166A CN201210553616.2A CN201210553616A CN103889166A CN 103889166 A CN103889166 A CN 103889166A CN 201210553616 A CN201210553616 A CN 201210553616A CN 103889166 A CN103889166 A CN 103889166A
- Authority
- CN
- China
- Prior art keywords
- blind hole
- layer
- depth
- processing technology
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention is applicable to the field of PCB plate manufacture and provides mechanical controlled deep blind hole processing technology used for drilling a blind hole on a PCB. A blind hole with specified depth and stair hierarchy is drilled on the PCB by at least two times. The diameter of the blind hole is reduced by layers along the depth direction. The blind hole is drilled to be a blind hole with stair hierarchy, and the diameter of the blind hole is reduced by layers along the depth direction. In the process of electroplating, the diameter of a superficial layer is larger than the diameter of a deep layer of the blind hole along the depth direction, thus more electroplating solution is filled, the circulation and exchange areas of the deep layer with the outside electroplating solution are increased at the same time, the circulation and exchange of the electroplating solution in the blind hole with the outside electroplating solution are easier, the circulation and exchange rates of the electroplating solution are raised, the electroplating solution has enough metal positive ion plated in the blind hole, the depth requirement of a conductive layer is satisfied, and the quality and reliability of the PCB are ensured.
Description
Technical field
The invention belongs to pcb board and make field, the machinery that relates in particular to drilling blind hole on a kind of pcb board is controlled dark blind hole processing technology.
Background technology
Pcb board is multiple circuit layers and dielectric layer to be stacked gradually to pressing form, and on pcb board thickness direction, multiple circuit layers interval is arranged, and clamp one deck dielectric layer between adjacent two circuit layers.In the manufacture process of pcb board, different circuit layers in pcb board need to be electrically connected, or specified circuit layer is electrically connected with the components and parts that are installed on pcb board, at this moment just need to first get out the blind hole of designated depth, each layer that makes to be electrically connected is first in communication with the outside, then electroplate and in the blind hole that makes to get out, plate one deck conductive layer, thereby realize the electrical connection of different circuit layers.
When pcb board is carried out to drilling blind hole, the main mechanical drilling method that uses gets out the dark blind hole of control needing at present.As illustrated in figs. 1 and 2 showing, for separating by insulating medium layer (X, Z) between the different circuit layers of pcb board (L, N, M), along boring direction, in this pcb board, each layer is followed successively by: circuit layer L, dielectric layer X, circuit layer N, dielectric layer Z and circuit layer M.Get out connection circuit layer N and circuit layer M and extraneous blind hole 20, the technique using is directly to carry out machinery control gun drilling, once get out the blind hole 20 that arrives circuit layer M, can be communicated with the circuit layer N above it simultaneously, this blind hole 20 is consistent along aperture d2 on its depth direction, and then carries out electroplating technology.And in the time of electroplating technology, need in this blind hole, to be full of electroplate liquid, so that the metal cation in electroplate liquid separates out, and be plated in blind hole.For meeting circuit layer conduction needs in pcb board, and guarantee conduction reliability, need to be plated in conductive layer thickness in described blind hole 20 is 12-25um, and it is limited to be packed in the electroplate liquid in blind hole 20 metal cation concentration, thereby need electroplate liquid in extraneous electroplate liquid and blind hole 20 constantly to flow, exchange, guarantee enters into the electroplate liquid conductivity of blind hole 20 and has enough metal cations to separate out, and forms the conductive layer of described thickness.
But this blind hole 20, due to aperture, d2 is consistent, in the time that blind hole radius-thickness ratio (that is: the ratio of blind hole depth h2 and blind hole diameter d2) is larger, the electroplate liquid in liquid blind hole 20 is difficult to electroplate and circulate, exchange with the external world, thereby causes the conductive layer of electroplating to be difficult to meet the demands.
Summary of the invention
The object of the embodiment of the present invention is to provide a kind of machinery control dark blind hole processing technology, is intended to solve blind hole that the dark blind hole processing technology of current machinery control processes in the time electroplating, and is difficult to meet the problem of conductive layer thickness requirement.
The present invention is achieved in that the dark blind hole processing technology of a kind of machinery control, for pcb board is carried out to drilling blind hole, at least at twice described pcb board is got out to designated depth and is the blind hole of ladder level, and the aperture of described blind hole successively reduces along its depth direction.
Further, described in adjacent ladder two leafing of described blind hole, the ratio of the degree of depth middle-shallow layer on blind hole top and the degree of depth of deep layer is 0.25～0.85.
Preferably, described in adjacent ladder two leafing of described blind hole, the ratio of the degree of depth middle-shallow layer on blind hole top and the degree of depth of deep layer is 0.8.
Particularly, the adjacent ladder of described blind hole is two-layer is 1.15～2 along its depth direction middle-shallow layer with the ratio in the aperture of deep layer.
Particularly, the adjacent ladder of described blind hole two-layer along its depth direction middle-shallow layer than the large 0.15～0.2mm in the aperture of deep layer.
Particularly, described blind hole bottommost layer is 0.4～1.6 from the degree of depth on described blind hole top with its diameter ratio.
More specifically, described blind hole bottommost layer aperture is 0.2～2mm.
Particularly, described blind hole bottommost layer is greater than 1 from the degree of depth on described blind hole top with its diameter ratio.
Further, get out for the first time the shallow-layer of described blind hole mesoporous maximum, reduce successively afterwards aperture and to deep layer drill, until to designated depth.
Preferably, get out at twice described blind hole.
The present invention is drilled to blind hole the blind hole that is ladder level, and aperture successively reduces along its depth direction.In the time electroplating, this blind hole is along on its depth direction that Open Side Down, the relative deep layer in aperture of shallow-layer is large, thereby be filled with more electroplate liquid, increased the area that deep layer and extraneous electroplate liquid circulate, exchange simultaneously, make electroplate liquid and extraneous electroplate liquid in blind hole more easily circulate, exchange, improve electroplate liquid circulation, exchange rate, thereby making has enough metal cations to be plated in blind hole in electroplate liquid, thereby reaches conductive layer thickness requirement, ensure quality and the reliability of pcb board.
Brief description of the drawings
Fig. 1 is pcb board structural representation.
Fig. 2 is the structural representation that the machinery that pcb board in Fig. 1 is got out that prior art provides is controlled dark blind hole.
Fig. 3 is the structural representation that the machinery that pcb board in Fig. 1 is got out for the first time that the embodiment of the present invention provides is controlled dark blind hole.
Fig. 4 is the structural representation that machinery that pcb board in Fig. 3 is got out is for the second time controlled dark blind hole.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to Fig. 1, for separating by insulating medium layer (X, Z) between the different circuit layers of a pcb board (L, N, M), along boring direction, in this pcb board, each layer is followed successively by: circuit layer L, dielectric layer X, circuit layer N, dielectric layer Z and circuit layer M.Get out and be communicated with M circuit layer and extraneous blind hole.
See also Fig. 3 and Fig. 4, the present embodiment discloses the dark blind hole processing technology of a kind of machinery control, for pcb board is carried out to drilling blind hole, at least at twice described pcb board is got out to designated depth and be the blind hole 10 of ladder level, the aperture of described blind hole 10 successively reduces along its depth direction.
Blind hole is drilled to the blind hole 10 that is ladder level, and aperture successively reduces along its depth direction.In the time electroplating, this blind hole 10 is along on its depth direction, the relative deep layer 12 aperture d of aperture D of shallow-layer 11 are large, thereby be filled with more electroplate liquid, increased deep layer 12 and the area that extraneous electroplate liquid circulates, exchanges simultaneously, make electroplate liquid and extraneous electroplate liquid in blind hole 10 more easily circulate, exchange, improve electroplate liquid circulation, exchange rate, thereby making has enough metal cations to be plated in blind hole 10 in electroplate liquid, thereby reaches conductive layer thickness requirement, ensure quality and the reliability of pcb board.
Further, the adjacent ladder of described blind hole 10 two-layer (11,12) is 0.25～0.85 from degree of depth middle-shallow layer 11 depth H on described blind hole 10 tops with the ratio of deep layer 12 degree of depth h.
By determining adjacent ladder two-layer (11 in blind hole 10,12) depth ratio, electroplate liquid is flowed better in blind hole 10, to control in each layer of blind hole 10 concentration of metal cation in electroplate liquid, make more all even thickness roughly requiring of guaranteeing conductive layer of conductive layer of electroplating out, ensure pcb board reliability.The depths of blind hole 10, the electroplate liquid that is deep layer 12 need to be by shallow-layer 11 and extraneous exchange, shallow-layer 11 depth H are larger with the ratio of deep layer 12 degree of depth h, deep layer 12 need to carry out the volume of electroplate liquid exchange just less with shallow-layer 11, and electroplate liquid exchange is faster, and electroplating time is shorter, but ratio is excessive, for same blind hole, the ladder level of the brill needing is just more, the decrease in efficiency of boring; Shallow-layer 11 depth H are less with the ratio of deep layer 12 degree of depth h, and electroplate liquid exchange is slower, and electroplating time is just longer, can affect equally pcb board working (machining) efficiency.The comprehensive drilling time of the present invention and electroplate the time efficiency needing, determines the rational scope of ratio of shallow-layer 11 depth H and deep layer 12 degree of depth h: 0.25～0.85.Preferably, the adjacent ladder of described blind hole 10 two-layer (11,12) is 0.8 from degree of depth middle-shallow layer 11 depth H on described blind hole 10 tops with the ratio of deep layer 12 degree of depth h.Particularly, the adjacent ladder of described blind hole 10 two-layer (11,12) is 1.15～2 along its depth direction middle-shallow layer 11 aperture D with the ratio of deep layer 12 aperture d.By controlling the adjacent ladder two-layer (11 of blind hole 10,12) aperture (D, d), thereby can specify the final size of blind hole 10, while being convenient to design, leave in advance the position and the area that bore described blind hole 10, can control the aperture between blind hole 10 different layers simultaneously, control electroplate liquid wherein and extraneous exchange, to control metal cation concentration in each layer of place's electroplate liquid, make more all even thickness roughly requiring of guaranteeing conductive layer of the conductive layer electroplated out, ensure pcb board reliability.
Particularly, the adjacent ladder of described blind hole 10 two-layer (11,12) along its depth direction middle-shallow layer 11 aperture D than the large 0.15～0.2mm of deep layer 12 aperture d.Due to, according to the pore size of each layer of Proportionality design blind hole 10, for the more blind hole of level, amount of calculation is larger, and meanwhile, the numerical value that will note in the time of design is more.And the aperture of the dark blind hole 10 of machinery control is less on pcb board, therefore designing and adding man-hour, the adjacent ladder of blind hole 10 two-layer (11 of processing, 12) middle-shallow layer 11 aperture D are than the large 0.15～0.2mm of deep layer 12 aperture d, can make to electroplate time, conductive layer thickness reaches requirement, thereby simplified design and processing are increased work efficiency.If shallow-layer 11 aperture D are more too many greatly than deep layer 12 aperture d, the aperture D of shallow-layer 12 can excessive (being greater than 0.2mm), and the volume that takies pcb board is too much, affects the integrated level of pcb board, simultaneously, between deep layer 12 and shallow-layer 11, the area of electroplate liquid exchange is excessive, also can obviously not improve electroplating efficiency, contrary, excessive exchange area, can increase the area that needs plating in blind hole 10, the electroplate liquid needing increases, and can affect on the contrary electroplating efficiency; And shallow-layer 11 aperture D than deep layer 12 aperture d large (be less than 0.15mm) very little, can cause the area of the exchange of electroplate liquid between deep layer 12 and shallow-layer 11 too little, affect electroplating efficiency.
Particularly, described blind hole 10 bottommost layers 12 are 0.4～1.6 from the degree of depth h on described blind hole 10 tops with its diameter d ratio.On pcb board, the aperture of the dark blind hole 10 of machinery control is less, and its bottommost layer 12 aperture h are 0.2～2mm; By confirm the degree of depth h of bottommost layer 12 with diameter d than (being radius-thickness ratio), to determine the level of the dark blind hole 10 of machinery control, thereby determine the number of drills of blind hole 10, and the size of definite blind hole 10.
The dark blind hole radius-thickness ratio of existing machinery control is generally 0.4～0.5, seldom have and be greater than 1, and in the time that blind hole is dark, just need to expand its aperture, but that this mode must not be in circuit is integrated.And by blind hole being processed into flight 10, when described blind hole 10 bottommost layers 12 are greater than 1 from the degree of depth h on described blind hole 10 tops with its diameter d ratio, also can make to electroplate better in blind hole 10 conductive layer of required thickness, can make pcb board integrated level higher.
Further, get out for the first time the shallow-layer 11 of described blind hole mesoporous maximum, reduce successively afterwards aperture and to deep layer drill, until to designated depth.By this bore mode that reduces gradually aperture, reduce the area of accumulation boring, to reduce the time of drilling blind hole, increase work efficiency.Certainly, also can in no particular order, according to drill bit size, get into the degree of depth of designated layer, because in blind hole 10, the aperture D of shallow-layer 11 is large relatively, in the time that drill bit is larger, get into the depth H of appointment, must be shallow-layer 11; Therefore can use the drill bits of multiple different sizes, many gradation, get out the blind hole of corresponding level.Existing pcb board is generally thinner, and the blind hole depth needing is more shallow comparatively speaking, and the blind hole 10 getting out at twice can meet the demands, thereby reduces machining process, raises the efficiency.For the thicker pcb board of special type, when the blind hole depth of requirement is darker, the number of times that can increase boring gets out the blind hole 10 of sandwich construction.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. the dark blind hole processing technology of machinery control, for pcb board is carried out to drilling blind hole, is characterized in that: at least at twice described pcb board is got out to designated depth and be the blind hole of ladder level, the aperture of described blind hole successively reduces along its depth direction.
2. the dark blind hole processing technology of machinery control as claimed in claim 1, is characterized in that: described in adjacent ladder two leafing of described blind hole, the ratio of the degree of depth middle-shallow layer on blind hole top and the degree of depth of deep layer is 0.25～0.85.
3. the dark blind hole processing technology of machinery control as claimed in claim 2, is characterized in that: described in adjacent ladder two leafing of described blind hole, the ratio of the degree of depth middle-shallow layer on blind hole top and the degree of depth of deep layer is 0.8.
4. the machinery as described in claim 1-3 any one is controlled dark blind hole processing technology, it is characterized in that: the adjacent ladder of described blind hole is two-layer is 1.15～2 along its depth direction middle-shallow layer with the ratio in the aperture of deep layer.
5. the machinery as described in claim 1-3 any one is controlled dark blind hole processing technology, it is characterized in that: the adjacent ladder of described blind hole two-layer along its depth direction middle-shallow layer than the large 0.15～0.2mm in the aperture of deep layer.
6. the machinery as described in claim 1-3 any one is controlled dark blind hole processing technology, it is characterized in that: described blind hole bottommost layer is 0.4～1.6 from the degree of depth and its aperture ratio on described blind hole top.
7. the dark blind hole processing technology of machinery control as claimed in claim 6, is characterized in that: described blind hole bottommost layer aperture is 0.2～2mm.
8. the machinery as described in claim 1-3 any one is controlled dark blind hole processing technology, it is characterized in that: described blind hole bottommost layer is greater than 1 from the degree of depth on described blind hole top with its diameter ratio.
9. the machinery as described in claim 1-3 any one is controlled dark blind hole processing technology, it is characterized in that: get out for the first time the shallow-layer of described blind hole mesoporous maximum, reduce successively afterwards aperture and to deep layer drill, until to designated depth.
10. the machinery as described in claim 1-3 any one is controlled dark blind hole processing technology, it is characterized in that: get out at twice described blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210553616.2A CN103889166A (en) | 2012-12-19 | 2012-12-19 | Mechanical controlled deep blind hole processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210553616.2A CN103889166A (en) | 2012-12-19 | 2012-12-19 | Mechanical controlled deep blind hole processing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103889166A true CN103889166A (en) | 2014-06-25 |
Family
ID=50957824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210553616.2A Pending CN103889166A (en) | 2012-12-19 | 2012-12-19 | Mechanical controlled deep blind hole processing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103889166A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101619A (en) * | 2015-08-11 | 2015-11-25 | 沪士电子股份有限公司 | PCB (printed circuit board) and depth milling and routing method thereof |
| CN106484161A (en) * | 2015-08-28 | 2017-03-08 | 深圳欧菲光科技股份有限公司 | A kind of face glass and the terminal with this face glass |
| CN106851986A (en) * | 2017-02-07 | 2017-06-13 | 沪士电子股份有限公司 | A kind of method that printed circuit board (PCB) and its depth milling are dragged for |
| CN111716444A (en) * | 2020-06-24 | 2020-09-29 | 江西景旺精密电路有限公司 | PCB drilling method |
| CN112969286A (en) * | 2021-01-05 | 2021-06-15 | 东莞市朝行天下通信科技有限公司 | 5G antenna PCB module blind hole processing equipment and blind hole processing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101080146A (en) * | 2006-05-24 | 2007-11-28 | 富葵精密组件(深圳)有限公司 | A method for making L2 blind hole of high-density interconnection circuit board |
| CN101287332A (en) * | 2008-05-27 | 2008-10-15 | 艾默生网络能源有限公司 | Circuit board and method of processing the same |
| CN101841968A (en) * | 2010-04-30 | 2010-09-22 | 深圳崇达多层线路板有限公司 | Circuit board with step-shaped blind hole and manufacturing method |
| CN102159033A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for making flared hole on circuit board |
-
2012
- 2012-12-19 CN CN201210553616.2A patent/CN103889166A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101080146A (en) * | 2006-05-24 | 2007-11-28 | 富葵精密组件(深圳)有限公司 | A method for making L2 blind hole of high-density interconnection circuit board |
| CN101287332A (en) * | 2008-05-27 | 2008-10-15 | 艾默生网络能源有限公司 | Circuit board and method of processing the same |
| CN101841968A (en) * | 2010-04-30 | 2010-09-22 | 深圳崇达多层线路板有限公司 | Circuit board with step-shaped blind hole and manufacturing method |
| CN102159033A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for making flared hole on circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101619A (en) * | 2015-08-11 | 2015-11-25 | 沪士电子股份有限公司 | PCB (printed circuit board) and depth milling and routing method thereof |
| CN105101619B (en) * | 2015-08-11 | 2018-06-12 | 沪士电子股份有限公司 | A kind of pcb board and its depth milling fishing method |
| CN106484161A (en) * | 2015-08-28 | 2017-03-08 | 深圳欧菲光科技股份有限公司 | A kind of face glass and the terminal with this face glass |
| CN106851986A (en) * | 2017-02-07 | 2017-06-13 | 沪士电子股份有限公司 | A kind of method that printed circuit board (PCB) and its depth milling are dragged for |
| CN111716444A (en) * | 2020-06-24 | 2020-09-29 | 江西景旺精密电路有限公司 | PCB drilling method |
| CN112969286A (en) * | 2021-01-05 | 2021-06-15 | 东莞市朝行天下通信科技有限公司 | 5G antenna PCB module blind hole processing equipment and blind hole processing method |
| CN112969286B (en) * | 2021-01-05 | 2022-06-28 | 深圳市金雷曼科技有限公司 | 5G antenna PCB module blind hole processing equipment and blind hole processing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103889166A (en) | Mechanical controlled deep blind hole processing technology | |
| CN103687338B (en) | The method of wiring board high precision control gun drilling | |
| CN101861055B (en) | Method of PCB board processing technology | |
| CN103402332B (en) | Possesses pcb board of high density interconnect designs and radiator structure and preparation method thereof | |
| CN101861058B (en) | Method of PCB board processing technology | |
| CN107231752A (en) | It is a kind of to reduce the pcb board boring method for electroplating copper thickness below | |
| CN102781177B (en) | Method for drilling printed circuit board, printed circuit board and communication equipment | |
| CN102740584B (en) | Printed circuit board and processing method thereof | |
| CN107960019A (en) | A kind of PCB production methods for realizing zero stub and PCB | |
| CN105722302A (en) | Circuit board with embedded boss metal base, and machining method for circuit board | |
| CN105101678A (en) | Circuit board conducting hole processing method and circuit board | |
| CN102958288B (en) | Printed circuit board drilling method | |
| CN107072067A (en) | A kind of manufacture method of the circuit board of groove at side surface | |
| CN110557890A (en) | method for processing semi-metal blind hole with aspect ratio larger than one | |
| CN103974561A (en) | Manufacturing method for ball grid array (BGA) of super-thick copper circuit board | |
| CN103517581B (en) | A kind of multi-layer PCB board manufacture method and multi-layer PCB board | |
| CN108124381A (en) | A kind of pcb board and its processing method of special blind hole | |
| CN104135822A (en) | Preparation technology of high-density interconnecting printed circuit board | |
| CN103225094B (en) | The guard method of a kind of blind hole plate plating single-sided current | |
| CN105472909B (en) | A kind of processing method of stepped groove circuit board | |
| CN104284528B (en) | The processing method of printed circuit board (PCB) back drill | |
| CN102215628B (en) | Super-thick circuit board | |
| CN104703391A (en) | Circuit board and production method thereof | |
| CN103402333A (en) | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof | |
| CN106993382A (en) | A kind of preparation method of the circuit board with blind hole |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140625 |
|
| RJ01 | Rejection of invention patent application after publication |