CN109600905A - The electronic device of printed circuit board and the application printed circuit board - Google Patents
The electronic device of printed circuit board and the application printed circuit board Download PDFInfo
- Publication number
- CN109600905A CN109600905A CN201710915449.4A CN201710915449A CN109600905A CN 109600905 A CN109600905 A CN 109600905A CN 201710915449 A CN201710915449 A CN 201710915449A CN 109600905 A CN109600905 A CN 109600905A
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- printed circuit
- medium
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A kind of printed circuit board includes a top layer, a bottom, a first medium layer, a second dielectric layer and a passive element, the passive element is set on the first medium layer, the first medium layer is set between the second dielectric layer and the bottom, the second dielectric layer is set between the top layer and the first medium layer and is superimposed on the first medium layer, a cavity is offered around the passive element, the cavity is formed and hollowing out the local medium of the second dielectric layer.The present invention also provides a kind of electronic devices using the printed circuit board.The electronic device of printed circuit board of the present invention and the application printed circuit board can make signal only pass through air when passing through the cavity, and loss of signal caused by air is almost nil, therefore the dielectric loss that will can considerably reduce signal.
Description
Technical field
The present invention relates to the electronic devices of a kind of printed circuit board and the application printed circuit board.
Background technique
Printed circuit board (printed circuit board, PCB) generally comprises signals layer and upper and lower two reference layers,
And the dielectric between two reference layers will also generate certain dielectric loss.
Usual dielectric loss is higher, and the electric property of the element in printed circuit board is lower.And also by limitation carrying letter
Number bandwidth promoted.
Summary of the invention
In view of above content, it is necessary to provide a kind of printed circuit board and the electronic device using the printed circuit board.
A kind of printed circuit board is applied in an electronic device, and the printed circuit board includes a top layer, a bottom, one
First medium layer, a second dielectric layer and a passive element, the passive element are set on the first medium layer, and described
One dielectric layer is set between the second dielectric layer and the bottom, and the second dielectric layer is set to the top layer and described first
Between dielectric layer and it is superimposed on the first medium layer, a cavity is offered around the passive element, the cavity passes through
It hollows out the local medium of the second dielectric layer and is formed.
Further, the cavity opened up around the passive element is also situated between by hollowing out the part of the second dielectric layer
The local medium of matter and the first medium layer and formed.
Further, the cavity makes the first medium layer be divided into the two parts not connected each other to be formed
One separating layer, the passive element are set in the separating layer.
Further, the top layer is a bus plane, and the bottom is a ground plane.
Further, the top layer is a dielectric layer, and the bottom is a ground plane.
Further, the printed circuit board further includes a third dielectric layer, and the third dielectric layer is set to the top layer
Between the second dielectric layer and it is superimposed on the second dielectric layer.
Further, the cavity is process by techniques such as physics cutting or chemical etchings.
A kind of electronic device, including a printed circuit board, the printed circuit board include a top layer, a bottom, one first
Dielectric layer, a second dielectric layer and a passive element, the passive element are set on the first medium layer, and described first is situated between
Matter layer is set between the second dielectric layer and the bottom, and the second dielectric layer is set to the top layer and the first medium
Between layer and it is superimposed on the first medium layer, a cavity is offered around the passive element, the cavity is by hollowing out
The local medium of the second dielectric layer and formed.
Further, the cavity opened up around the passive element is also situated between by hollowing out the part of the second dielectric layer
The local medium of matter and the first medium layer and formed, the cavity is divided into the first medium layer not have each other
There are two parts of connection to form a separating layer, the passive element is set in the separating layer.
Further, the printed circuit board further includes a third dielectric layer, and the third dielectric layer is set to the top layer
Between the second dielectric layer and it is superimposed on the second dielectric layer.
The electronic device of above-mentioned printed circuit board and the application printed circuit board passes through around the passive element
The cavity opened up, so that signal only passes through air when passing through the cavity, and loss of signal caused by air is almost
It is zero, therefore the dielectric loss that will can considerably reduce signal.
Detailed description of the invention
Combining better embodiment with reference to the accompanying drawings, present invention is further described in detail:
Fig. 1 is the schematic diagram of the better embodiment of electronic device of the present invention.
Fig. 2 is the side view of the first better embodiment of printed circuit board in Fig. 1.
Fig. 3 is the side view of the second better embodiment of printed circuit board in Fig. 1.
Fig. 4 is the side view of the third better embodiment of printed circuit board in Fig. 1.
Main element symbol description
Printed circuit board 100
Top layer 110
First medium layer 120
Second dielectric layer 130
Bottom 140
Passive element 150
Cavity 160
Separating layer 170
Third dielectric layer 180
Electronic device 200
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
The objectives, technical solutions, and advantages of the present invention are more clearly understood, below with reference to drawings and the embodiments,
The electronic device of printed circuit board and the application printed circuit board in the present invention is described in further detail and is mutually spoken on somebody's behalf
It is bright.
Referring to FIG. 1, better embodiment of the present invention provides a kind of printed circuit board 100, the printed circuit board 100 is answered
For in an electronic device 200.
In a specific embodiment, the printed circuit board 100 is a computer main board, and the electronic device 200 is one
Laptop or a desktop computer.
In a specific embodiment, the printed circuit board 100 can also be encapsulation or integrated circuit (integrated
Circuit, IC).
The electronic device 200 further includes other structures and element, due to unrelated with improvement of the invention, therefore do not add and retouches
It states.
Referring to FIG. 2, the printed circuit board 100 includes a top layer 110, a bottom 140, a first medium layer 120, one
Second dielectric layer 130 and a passive element 150.
Wherein, the first medium layer 120 is set between the second dielectric layer 130 and the bottom 140, and described second
Dielectric layer 130 is set between the top layer 110 and the first medium layer 120 and is superimposed on the first medium layer 120.
The passive element 150 is set on the first medium layer 120, is offered around the passive element 150
One cavity 160, the cavity 160 are formed and hollowing out the local medium of the second dielectric layer 130, specifically can be by physics
The techniques such as cutting or chemical etching are process.
It is understood that in the present embodiment, on the first medium layer 120 only with a passive element 150 into
Row explanation, in other embodiments in, multiple passive elements 150 are also set up on the first medium layer 120, and in multiple nothings
The cavity 160 is opened up around source element 150, can be specifically adjusted according to actual needs.
In a specific embodiment, the top layer 110 is a bus plane, and the bottom 140 is a ground plane.At other
In embodiment, the top layer 110 can also be a dielectric layer.
It is understood that due to offering the cavity 160 around the passive element 150, so that signal is logical
Only pass through air when crossing cavity, loss of signal caused by air is almost nil, therefore will can considerably reduce signal
Dielectric loss.
Referring to FIG. 3, Fig. 3 is the schematic diagram of the second better embodiment of the printed circuit board 100.With above-mentioned first
Unlike embodiment, the cavity 160 that 150 surrounding of passive element is opened up is by hollowing out the second dielectric layer
The local medium of 130 local medium and the first medium layer 120 and formed.
The cavity 160 will make the first medium layer 120 be divided into the two parts not connected each other to be formed
One separating layer 170, and the passive element 150 is set in the separating layer 170.
In a specific embodiment, the top layer 110 is a bus plane, and the bottom 140 is a ground plane.At other
In embodiment, the top layer 110 can also be a dielectric layer.
With continued reference to FIG. 4, wherein Fig. 4 is the schematic diagram of the third better embodiment of the printed circuit board 100, with
Unlike first embodiment, the printed circuit board 100 further includes a third dielectric layer 180.
The first medium layer 120 is set between the second dielectric layer 130 and the bottom 140, the second medium
Layer 130 is set between the third dielectric layer 180 and the first medium layer 120 and is superimposed on the first medium layer 120.Institute
Third dielectric layer 180 is stated to be set between the top layer 110 and the second dielectric layer 130 and and be superimposed on the second dielectric layer
130。
The passive element 150 is set on the first medium layer 120, is opened up around the passive element 150
Cavity 160 formed and hollowing out the local medium of the second dielectric layer 130.
The printed circuit board 100 may further include other layers, such as signals layer, since the present invention is not related to other layers
Structure, therefore other layers are not specifically described herein.
The electronic device 200 of above-mentioned printed circuit board 100 and the application printed circuit board 100 can be by described passive
The cavity 160 opened up around element 150, so that signal only passes through air, and air institute when passing through the cavity 160
The loss of signal of generation is almost nil, therefore the dielectric loss that will can considerably reduce signal.
Finally it should be noted that the above examples are only used to illustrate the technical scheme of the present invention and are not limiting.This field
It is to be appreciated by one skilled in the art that can modify to technical solution of the present invention or equivalent replacement, without departing from the present invention
The spirit and scope of technical solution.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creativeness
Every other embodiment obtained, will all belong to the scope of protection of the invention under the premise of labour.
Claims (10)
1. a kind of printed circuit board, be applied in an electronic device, which is characterized in that the printed circuit board include a top layer,
One bottom, a first medium layer, a second dielectric layer and a passive element, the passive element are set to the first medium layer
On, the first medium layer is set between the second dielectric layer and the bottom, and the second dielectric layer is set to the top layer
Between the first medium layer and it is superimposed on the first medium layer, a cavity, institute are offered around the passive element
Cavity is stated to be formed and hollowing out the local medium of the second dielectric layer.
2. printed circuit board as described in claim 1, which is characterized in that the cavity opened up around the passive element is also logical
It crosses the local medium of the local medium for hollowing out the second dielectric layer and the first medium layer and is formed.
3. printed circuit board as claimed in claim 2, which is characterized in that the cavity is divided the first medium layer
At the two parts not connected each other to form a separating layer, the passive element is set in the separating layer.
4. printed circuit board as described in claim 1, which is characterized in that the top layer is a bus plane, and the bottom is one
Ground plane.
5. printed circuit board as described in claim 1, which is characterized in that the top layer is a dielectric layer, and the bottom is one
Ground plane.
6. printed circuit board as described in claim 1, which is characterized in that the printed circuit board further includes a third medium
Layer, the third dielectric layer are set between the top layer and the second dielectric layer and are superimposed on the second dielectric layer.
7. printed circuit board as claimed in claim 2, which is characterized in that the cavity is by works such as physics cutting or chemical etchings
Skill is process.
8. a kind of electronic device, including a printed circuit board, which is characterized in that the printed circuit board includes a top layer, a bottom
Layer, a first medium layer, a second dielectric layer and a passive element, the passive element are set on the first medium layer,
The first medium layer is set between the second dielectric layer and the bottom, and the second dielectric layer is set to the top layer and institute
The first medium layer is stated between first medium layer and be superimposed on, a cavity, the sky are offered around the passive element
Chamber is formed and hollowing out the local medium of the second dielectric layer.
9. electronic device as claimed in claim 8, which is characterized in that the cavity opened up around the passive element also passes through
It hollows out the local medium of the second dielectric layer and the local medium of the first medium layer and is formed, the cavity makes institute
It states first medium layer and is divided into the two parts not connected each other to form a separating layer, the passive element is set to described
In separating layer.
10. electronic device as claimed in claim 8, which is characterized in that the printed circuit board further includes a third dielectric layer,
The third dielectric layer is set between the top layer and the second dielectric layer and is superimposed on the second dielectric layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710915449.4A CN109600905A (en) | 2017-09-30 | 2017-09-30 | The electronic device of printed circuit board and the application printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710915449.4A CN109600905A (en) | 2017-09-30 | 2017-09-30 | The electronic device of printed circuit board and the application printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109600905A true CN109600905A (en) | 2019-04-09 |
Family
ID=65955482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710915449.4A Pending CN109600905A (en) | 2017-09-30 | 2017-09-30 | The electronic device of printed circuit board and the application printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109600905A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747654A (en) * | 2020-05-27 | 2021-12-03 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board and manufacturing method thereof |
| TWI757979B (en) * | 2020-09-26 | 2022-03-11 | 宏達國際電子股份有限公司 | Circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101778531A (en) * | 2010-02-23 | 2010-07-14 | 华为技术有限公司 | Integrated printed circuit board |
| CN101998753A (en) * | 2009-08-24 | 2011-03-30 | 欣兴电子股份有限公司 | Circuit board and manufacturing method thereof |
| US20160156333A1 (en) * | 2014-12-02 | 2016-06-02 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
| US20170188451A1 (en) * | 2015-12-28 | 2017-06-29 | Fukui Precision Component (Shenzhen) Co., Ltd. | Flexible circuit board and method for manufacturing same |
-
2017
- 2017-09-30 CN CN201710915449.4A patent/CN109600905A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101998753A (en) * | 2009-08-24 | 2011-03-30 | 欣兴电子股份有限公司 | Circuit board and manufacturing method thereof |
| CN101778531A (en) * | 2010-02-23 | 2010-07-14 | 华为技术有限公司 | Integrated printed circuit board |
| US20160156333A1 (en) * | 2014-12-02 | 2016-06-02 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
| US20170188451A1 (en) * | 2015-12-28 | 2017-06-29 | Fukui Precision Component (Shenzhen) Co., Ltd. | Flexible circuit board and method for manufacturing same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747654A (en) * | 2020-05-27 | 2021-12-03 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board and manufacturing method thereof |
| TWI757979B (en) * | 2020-09-26 | 2022-03-11 | 宏達國際電子股份有限公司 | Circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190409 |
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| WD01 | Invention patent application deemed withdrawn after publication |