CN101998753A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN101998753A CN101998753A CN2009101675573A CN200910167557A CN101998753A CN 101998753 A CN101998753 A CN 101998753A CN 2009101675573 A CN2009101675573 A CN 2009101675573A CN 200910167557 A CN200910167557 A CN 200910167557A CN 101998753 A CN101998753 A CN 101998753A
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Abstract
The invention relates to a circuit board and a manufacturing method thereof. The circuit board comprises an insulating layer, a cavity shell and at least one circuit layer, wherein the insulating layer is provided with an outer surface and a plurality of holes on the outer surface; the cavity shell is buried in the insulating layer and surrounds a chamber; the cavity shell is provided with a plurality of openings which are communicated with the chamber; the openings are directly communicated with the holes respectively; and the circuit board is arranged on the outer surface.
Description
Technical field
The present invention relates to a kind of wiring board and manufacture method thereof, particularly relate to a kind of wiring board and manufacture method thereof with chamber (chamber).
Background technology
Along with the progress of science and technology, the appearance of mobile phone allows and can converse easily between men, makes the modern can enjoy the facility life of communication at any time, and therefore, mobile phone has become the indispensable important tool of modern.
Mobile phone generally includes a wiring board and a loud speaker (Speaker claims loudspeaker again).Wiring board has upper surface respect to one another and lower surface, and loud speaker is installed in upper surface.When mobile phone passed through loudspeaker plays incoming ring tone or music, loud speaker can be sounded towards the direction away from wiring board.
Hence one can see that, and the sound of loud speaker is directly to send from upper surface, but not directly sends from lower surface.Therefore, the sound of loud speaker need come indirect transfer to arrive lower surface by reflection usually.
This shows that above-mentioned existing wiring board obviously still has inconvenience and defective, and demands urgently further being improved in product structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product and method do not have appropriate structure and method to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of new wiring board and manufacture method thereof, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
The objective of the invention is to, overcome the defective that existing wiring board exists, and a kind of new wiring board is provided, technical problem to be solved is to make it have the chamber that can be used for transmitting sound, is very suitable for practicality.
Another object of the present invention is to, overcome the defective that existing wiring board exists, and a kind of new wiring board, technical problem to be solved are provided is to make its can be applied to have electroacoustic transducer electronic installation of (electro-acoustic transducers), thereby is suitable for practicality more.
A further object of the present invention is, a kind of manufacture method of new wiring board is provided, and it is used for making above-mentioned wiring board.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of wiring board that the present invention proposes, it comprises: an insulating barrier has an outer surface and a plurality of hole that is positioned at this outer surface; One chamber shell is embedded in this insulating barrier, and surrounds a chamber, and this chamber shell has a plurality of openings that are communicated with this chamber, and wherein said opening directly is communicated with described hole respectively; And at least one line layer, be disposed at this outer surface.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid wiring board, wherein said outer surface comprise that a upper surface, a lower surface and with respect to this upper surface are connected in the side surface between this upper surface and this lower surface, and one of them hole is positioned at this upper surface.
Aforesaid wiring board, wherein at least two holes are positioned at this upper surface.
Aforesaid wiring board, wherein another hole is positioned at this lower surface.
Aforesaid wiring board, wherein at least one hole has the hole of this chamber shell of an expose portion.
Aforesaid wiring board, wherein said hole be this insulating barrier of expose portion more.
Aforesaid wiring board, the material of wherein said chamber shell is metal, pottery, plastic cement or rubber, described chamber shell be shaped as tubular body.
Aforesaid wiring board, wherein said insulating barrier comprise one first insulation material layer and one second insulation material layer, and this chamber shell is located between this first insulation material layer and this second insulation material layer.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to a kind of wiring board that the present invention proposes, it comprises: an insulating barrier has an outer surface and at least one hole that is positioned at this outer surface; One chamber shell is embedded in this insulating barrier, and surrounds a chamber, and this chamber shell has a plurality of openings that are communicated with this chamber, and one of them opening directly is communicated with this hole, and another opening is positioned at this outer surface; And at least one line layer, be disposed at this outer surface.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid wiring board, wherein said outer surface comprise that a upper surface, a lower surface and with respect to this upper surface are connected in the side surface between this upper surface and this lower surface, and this hole is positioned at this upper surface.
Aforesaid wiring board, the opening of wherein said outer surface are to be positioned at this side surface.
Aforesaid wiring board, the quantity of wherein said hole are a plurality of, and described hole all is positioned at this outer surface, and one of them hole is positioned at this upper surface, and another hole is positioned at this lower surface.
Aforesaid wiring board, the quantity of wherein said hole are a plurality of, and described hole all is positioned at this outer surface, and wherein at least two holes are positioned at this upper surface.
Aforesaid wiring board, wherein hole has the hole of this chamber shell of an expose portion.
Aforesaid wiring board, wherein said hole be this insulating barrier of expose portion more.
Aforesaid wiring board, the material of wherein said chamber shell is metal, pottery, plastic cement or rubber, described chamber shell be shaped as tubular body.
Aforesaid wiring board, wherein said insulating barrier comprise one first insulation material layer and one second insulation material layer, and this chamber shell is located between this first insulation material layer and this second insulation material layer.
The object of the invention to solve the technical problems realizes in addition more by the following technical solutions.The manufacture method of a kind of wiring board that proposes according to the present invention, it may further comprise the steps: a substrate is provided, and wherein this substrate comprises that one first conductor layer and is positioned at first insulation material layer on this first conductor layer; Dispose a chamber shell on this first insulation material layer, wherein this chamber shell surrounds a chamber; Form one second insulation material layer, wherein this second insulation material layer covers this cavity and this first insulation material layer, and this first insulation material layer and this second insulation material layer form an insulating barrier; This first conductor layer of patterning (patterning); And after this first conductor layer of patterning, form the outer surface of at least one hole in this insulating barrier, wherein this hole is communicated with this chamber.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The manufacture method of aforesaid wiring board wherein before this chamber shell of configuration, more is included in and forms a depressed area (recess) on first insulation material layer, and wherein this chamber shell is disposed in this depressed area.
The manufacture method of aforesaid wiring board, wherein said depressed area are to utilize laser ablation or mill to cut (routing) and form.
The manufacture method of aforesaid wiring board, wherein said first insulation material layer are blank core layer (blank core), and described second insulation material layer is semi-solid preparation film (prepreg).
The manufacture method of aforesaid wiring board wherein after this first conductor layer of patterning, more comprises this insulating barrier of cutting and this chamber shell, to expose this chamber.
The manufacture method of aforesaid wiring board, wherein said hole are that (Non-Plate Through Hole, NPTH), and the method that forms this electroless coating through hole comprises machine drilling or laser drill to an electroless coating through hole.。
The manufacture method of aforesaid wiring board, wherein said outer surface comprise a upper surface and a lower surface with respect to this upper surface, and before forming this hole, form two protective layers respectively at this upper surface and this lower surface.
The manufacture method of aforesaid wiring board, wherein said protective layer are two welding resisting layers, and described welding resisting layer is to utilize printing and form.
By technique scheme, wiring board of the present invention and manufacture method thereof have following advantage and beneficial effect at least: the present invention is owing to a plurality of holes of insulating barrier can communicate with each other by chamber, extraneous air can be flowed in these holes and chamber, therefore these holes and chamber can transmit sound, and wiring board of the present invention can be applicable to have the electronic installation of electroacoustic transducer.
In sum, a kind of wiring board of the present invention and manufacture method thereof, this wiring board comprises an insulating barrier, a chamber shell and at least one line layer.Insulating barrier has an outer surface and a plurality of hole that is positioned at outer surface.The chamber shell is embedded in the insulating barrier, and surrounds a chamber.The chamber shell has a plurality of openings that are communicated with chamber, and these openings directly are communicated with these holes respectively.Line layer is disposed at outer surface.The present invention has obvious improvement technically, and has tangible good effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Figure 1A illustrates the generalized section of the wiring board of one embodiment of the invention.
Figure 1B illustrates the schematic top plan view of wiring board among Figure 1A.
Fig. 1 C illustrates the schematic top plan view of the wiring board of another embodiment of the present invention.
Fig. 2 A to Fig. 2 F illustrates the flow process generalized section of the manufacture method of wiring board among the figure lA.
Fig. 3 illustrates the generalized section of the wiring board of another embodiment of the present invention.
Fig. 4 A to Fig. 4 B illustrates the flow process generalized section of the manufacture method of wiring board among Fig. 3.
10: electroacoustic transducer 12: the transducing face
14: shade 100,200: wiring board
102: substrate 110: insulating barrier
110a: outer surface 112a: first insulation material layer
112b: second insulation material layer 120,220: chamber shell
120a, 220a, 220b: opening 130: line layer
132a: the first conductor layer 132b: second conductor layer
C1, C2: chamber D, D ': aperture
H1, H1 ', H2: hole R1: depressed area
S1: upper surface S2: lower surface
S3: side surface T1, T1 ', T2: hole
W: width
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to wiring board and its embodiment of manufacture method, structure, method, step, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present invention can be known to present in the following detailed description that cooperates with reference to graphic preferred embodiment.By the explanation of embodiment, when can being to reach technological means that predetermined purpose takes and effect to get one more deeply and concrete understanding to the present invention, yet appended graphic only provide with reference to the usefulness of explanation, be not to be used for the present invention is limited.
See also shown in Figure 1A, illustrate the generalized section of the wiring board of one embodiment of the invention.Wiring board 100 can be installed in mobile phone, personal digital aid (PDA) (Personal Digital Assistant, PDA), digit news player (Digital Audio Player, DAP, it for example is the MP3 player), (Ultra-Mobile PC UMPC) waits and has in the electronic installation of electroacoustic transducer for hand held Game device (handheld game console), notebook computer (laptop) or super removable computer.
Above-mentioned electroacoustic transducer general reference can convert electric energy to acoustic energy, or converts acoustic energy the transducer (transducers) of electric energy to, and electroacoustic transducer for example is loud speaker (claiming loudspeaker) or microphone (microphone claims microphone again).
The outer surface 110a of insulating barrier 110 comprises a upper surface S1, a lower surface S2 and a side surface S3, and wherein lower surface S2 is with respect to upper surface S1, and side surface S3 is connected between upper surface S1 and the lower surface S2.In the embodiment shown in Figure 1A, the quantity of line layer 130 is two layers, and these line layers 130 lay respectively at upper surface S1 and lower surface S2, so the wiring board 100 shown in Figure 1A is a kind of double-sided wiring board (double-side wiring board).
But, mandatory declaration is that in the embodiment that other do not illustrate, the quantity of line layer 130 can have only one deck, or more than three layers.That is to say that wiring board 100 can be single face wiring board (single-side wiring board) or multilayer circuit board (multi-layer wiring board).Therefore, the quantity of the line layer 130 shown in Figure 1A and kind only supply to illustrate, and unrestricted technical characterictic of the present invention.
The two aperture of hole H1, H2 can be identical in fact, and in the embodiment shown in Figure 1A, hole H1, H2 total quantity are four, and wherein two hole H1 are positioned at upper surface S1, and two hole H2 are positioned at lower surface S2.That is to say that relative two surfaces of insulating barrier 110 (being upper surface S1 and lower surface S2) all has hole H1, H2.
In the embodiment that other do not illustrate, the two total quantity of hole H1, H2 that insulating barrier 110 is had is at least two.For instance, insulating barrier 110 can only have two hole H1 or hole H2 that are positioned at same surface (being upper surface S1 or lower surface S2); Perhaps, upper surface S1 and lower surface S2 also can only have a hole H1 and a hole H2 respectively.
Hold above-mentionedly, certainly, the two total quantity of hole H1, H2 also can be three or above four.In addition, in the embodiment that other do not illustrate, insulating barrier 110 also can have at least one hole that is positioned at side surface S3 and is communicated with chamber C1.Therefore, the quantity of hole H1, the H2 shown in Figure 1A and distribution only supply to illustrate, and unrestricted technical characterictic of the present invention.
The material of chamber shell 120 can be metal, pottery, plastic cement or rubber, and the shape of chamber shell 120 can be tubular body (tube), and its lumen shell 120 more can be not crooked in fact and the tubular body of shape linearly, shown in Figure 1A.Certainly, chamber shell 120 also can be bent, the tubular body of shape such as for example in the embodiment that other do not illustrate, that the shape of chamber shell 120 can be is L shaped, U-shaped, waveform or zigzag.
Insulating barrier 110 can comprise one first insulation material layer 112a and one second insulation material layer 112b, and chamber shell 120 is located between the first insulation material layer 112a and the second insulation material layer 112b.The first insulation material layer 112a and second the two material of insulation material layer 112b can be insulating material such as resin, for example the first insulation material layer 112a and the second insulation material layer 112b all can be resin bed, and wherein this resin bed for example is semi-solid preparation film or blank core layer.
The two can be the resin bed of same material for the first insulation material layer 112a and the second insulation material layer 112b, for example the first insulation material layer 112a and the second insulation material layer 112b the two be all the semi-solid preparation film.Certainly, the two also can be the resin bed of different materials for the first insulation material layer 112a and the second insulation material layer 112b, and for example the first insulation material layer 112a is blank core layer, and the second insulation material layer 112b is the semi-solid preparation film.
In sum, because these openings 120a is communicated with chamber C1 and these holes H1, H2, therefore all hole H1, H2 can both communicate with each other by cavity C 1, extraneous air can be flowed in these holes H1, H2 and cavity C 1, and then in these holes H1, H2 and cavity C 1, form many paths that can transmit sound.
Specifically, at least one electroacoustic transducer 10 can be assembled on the line layer 130 of wiring board 100, and hole H1 place therein, position, wherein electroacoustic transducer 10 has a transducing face (transduction surface) 12 that can receive or sound, and electroacoustic transducer 10 can be assembled in wiring board 100 by the mode of jack, shell fragment (spring), welding (soldering).
When electroacoustic transducer 10 is loud speaker, transducing face 12 is a sounding face, and can sound towards hole H1, wherein this loud speaker for example is MEMS (micro electro mechanical system) loud speaker (Microelectromechanical Systems Speaker, and this sound can send from these holes H2 and other holes H1 via cavity C 1 MEMS Speaker).
So, the sound of electroacoustic transducer 10 not only can directly send from upper surface S1, also can directly send from lower surface S2 with hole H2 via cavity C 1.In addition, in the present embodiment, electroacoustic transducer 10 can more comprise one with respect to transducing face 12 and the shade 14 of configuration, but and shade 14 enable voices are concentrated and to be transmitted towards hole H1.
In addition, in the embodiment that other do not illustrate, when electroacoustic transducer 10 was microphone, the hole H1 of corresponding transducing face 12 can pass through cavity C 1, only is communicated with another hole H1 or H2.Therefore, the electroacoustic transducer 10 of microphone type can be only receives sound from two holes (be these holes H1, H2 wherein wantonly two) with cavity C 1 formed single path of transmitting sound, to promote the quality of the sound that electroacoustic transducer 10 write down.
What deserves to be mentioned is that in the embodiment that other do not illustrate, the quantity of electroacoustic transducer 10 can be a plurality of, and these electroacoustic transducers 10 can be configured in these holes H1, H2 place respectively, wherein the kind of these electroacoustic transducers 10 is not necessarily identical.
For instance, these electroacoustic transducers 10 can be loudspeaker and bass horn, and pass through hole H1, H2 and the cavity C 1 of wiring board 100, and these electroacoustic transducers 10 can produce the auditory effect of surround sound, and the user is provided better hearing enjoying.In addition, these electroacoustic transducers 10 also can be loud speaker and microphone, and promptly loud speaker and microphone all can be assembled in same wiring board 100.
See also shown in Figure 1A and Figure 1B, Figure 1B illustrates the schematic top plan view of wiring board among Figure 1A.Each hole H1 has a hole T1, the hole T1 of at least one hole H1 expose portion chamber shell 120 not only wherein, and expose portion insulating barrier 110 more.For example, the aperture D of hole H1 is greater than the width W of chamber shell 120, to such an extent as to hole T1 more exposes partial insulative layer 110.
But, in other embodiments, hole T1 is expose portion chamber shell 120 only also, and does not expose insulating barrier 110.For example, see also shown in Fig. 1 C, it illustrates the schematic top plan view of the wiring board of another embodiment of the present invention.In the embodiment shown in Fig. 1 C, the aperture D ' of hole H1 ' is less than the width W of chamber shell 120, so the hole T1 ' of hole H1 ' expose portion chamber shell 120, does not expose insulating barrier 110.
What must illustrate is, each hole H2 equally also has a hole T2, and the two aperture of hole H1 (or H1 ') and hole H2 can be identical in fact, and wherein the hole T2 of at least one hole H2 can expose portion chamber shell 120 and partial insulative layer 110 (the hole T1 shown in Figure 1B).Perhaps, hole T2 is expose portion chamber shell 120 only, and does not expose insulating barrier 110 (the hole T1 ' shown in Fig. 1 C).
See also shown in Fig. 2 A, Fig. 2 A to Fig. 2 F illustrates the flow process generalized section of the manufacture method of wiring board among Figure 1A.About the manufacture method of wiring board 100, at first, provide a substrate 102, wherein substrate 102 comprises the one first conductor layer 132a and the first insulation material layer 112a.The first insulation material layer 112a is positioned on the first conductor layer 132a, and the first conductor layer 132a can be a metal level, and it for example is a Copper Foil.
See also shown in Fig. 2 A and Fig. 2 B, then, on the first insulation material layer 112a, form a depressed area R1.Particularly, the first insulation material layer 112a can be the harder insulating material of quality, for example blank core layer, and depressed area R1 can utilize laser ablation or mill and cut and form.
See also shown in Fig. 2 C, after forming depressed area R1, configure cavities shell 120 is on the first insulation material layer 112a, and its lumen shell 120 surrounds cavity C 1, and is disposed in the R1 of depressed area.Depressed area R1 can limit to chamber shell 120, to reduce moving and wiring board 100 heavy industrys (rework) that cause or the probability of scrapping because of chamber shell 120.
Mandatory declaration be that in the embodiment that other do not illustrate, chamber shell 120 can also be configured on the first insulation material layer 112a with depressed area R1.Specifically, the first insulation material layer 112a also can be the softer insulating material of quality, semi-solid preparation film for example, and chamber shell 120 can directly be configured on the first insulation material layer 112a.Therefore, present embodiment is not the flow process that must form depressed area R1, i.e. the formation of depressed area R1 is not necessary technology means of the present invention.
See also shown in Fig. 2 D, then, form the second insulation material layer 112b, wherein the second insulation material layer 112b covers the cavity 120 and the first insulation material layer 112a, and the second insulation material layer 112b covers the cavity 120 and the first insulation material layer 112a comprehensively.In addition, the first insulation material layer 112a and the second insulation material layer 112b can form insulating barrier 110.
Specifically, the second insulation material layer 112b can be the semi-solid preparation film, and can form by the mode of pressing, wherein the process of this pressing can arrange in pairs or groups the heating mode carry out.That is to say that the second insulation material layer 112b can be formed at via the mode of hot pressing on the cavity 120 and the first insulation material layer 112a.Therefore, the second insulation material layer 112b is sticked together the cavity 120 and the first insulation material layer 112a, and the first insulation material layer 112a and the second insulation material layer 112b can in conjunction with and form insulating barrier 110.
When forming the second insulation material layer 112b, more can form one second conductor layer 132b on the second insulation material layer 112b, wherein the two material of the second conductor layer 132b and the first conductor layer 132a can be identical.That is to say that the second conductor layer 132b can be a metal level, it for example is a Copper Foil.
See also shown in Fig. 2 D and Fig. 2 E, then, the patterning first conductor layer 132a and the second conductor layer 132b are to form two layers of line layer 130 of local exposed upper surface S1 and lower surface S2.The first conductor layer 132a and the second conductor layer 132b can carry out patterning synchronously.That is to say, when the patterning first conductor layer 132a, also carry out the patterning second conductor layer 132b.In addition, the method for above-mentioned patterning can adopt little shadow and etching technique (lithography and etching).
See also shown in Fig. 2 E and Fig. 2 F, after forming these line layers 130, form a plurality of hole H1, the H2 outer surface 110a in insulating barrier 110, wherein these holes H1, H2 all are communicated with cavity C 1.So far, wiring board 100 has been made basically and has been finished.
These holes H1, H2 can be non-electroplating ventilating holes, and the method for formation electroless coating through hole comprises machine drilling or laser drill.In other words, hole H1, H2 form via machine drilling or laser drill.In addition, these holes H1, H2 can be formed at upper surface S1 and lower surface S2 respectively.In addition, in the embodiment that other do not illustrate, also can form at least one hole in side surface S3.
In addition, in the embodiment that does not illustrate, before forming hole H1, H2, can also form two layers of protective layer respectively at upper surface S1 and lower surface S2, wherein these protective layers can cover these line layers 130, to protect these line layers 130.Above-mentioned two protective layers can be two layers of welding resisting layer (soldermask), and welding resisting layer can utilize the printing and form.Therefore owing to welding resisting layer formed before hole H1, H2 form, in the process of printing, can avoid anti-welding material such as anti-solder ink to splash in the cavity C 1, and then prevent that cavity C 1 from damaging.
See also shown in Figure 3ly, Fig. 3 illustrates the generalized section of the wiring board of another embodiment of the present invention.Wiring board 200 comprises insulating barrier 110, chamber shell 220 and multilayer line layer 130.Chamber shell 220 is embedded in the insulating barrier 110, and surrounds a cavity C 2, and these line layers 130 are disposed at the outer surface 110a of insulating barrier 110, and all the chamber shell 120 with previous embodiment is identical with material for the shape of its lumen shell 220, so repeat no more.
The wiring board 200 of present embodiment is similar to the wiring board 100 of previous embodiment, and the two main difference structurally is: chamber shell 220 has an opening 220b who is positioned at outer surface 110a.
Specifically, chamber shell 220 has a plurality of opening 220a, 220b that are communicated with cavity C 2, and wherein each opening 220a directly is communicated in hole H1 or H2, and opening 220b is positioned at outer surface 110a.Therefore, outer surface 110a can directly expose cavity C 2 and part chamber shell 220 from opening 220b.In addition, in the embodiment shown in fig. 3, outer surface 110a comprises upper surface S1, lower surface S2 and side surface S3, and opening 220b then is positioned at side surface S3.
When electroacoustic transducer 10 was loud speaker, transducing face 12 can be sounded towards hole H1.This sound can send by the opening 220b from other holes H1, H2 and chamber shell 220 via cavity C 2.Therefore, the sound that sent of electroacoustic transducer 10 can directly send from upper surface S1, lower surface S2 and side surface S3.
In addition, in the embodiment that other do not illustrate, when electroacoustic transducer 10 was microphone, the hole H1 of corresponding transducing face 12 can pass through cavity C 2, only is communicated with opening 220b.That is to say that the electroacoustic transducer 10 of microphone type can only receive sound from opening 220b, to promote the quality of the sound that electroacoustic transducer 10 write down.
What must illustrate is that in the embodiment that other do not illustrate, the quantity of electroacoustic transducer 10 can be a plurality of, and these electroacoustic transducers 10 can be configured in these holes H1, H2 place respectively.For instance, these electroacoustic transducers 10 can be loudspeaker and bass horn.By hole H1, H2 and the cavity C 2 of wiring board 200, these electroacoustic transducers 10 can produce the auditory effect of surround sound.In addition, these electroacoustic transducers 10 also can be loud speaker and microphone.
In the embodiment that other do not illustrate, the quantity of the line layer 130 that wiring board 200 is included can have only one deck, or more than three layers, promptly wiring board 200 can be single face wiring board or multilayer circuit board.Moreover the two total quantity of hole H1, H2 that insulating barrier 110 is had can have only one, more than two or three.Therefore, wiring board 200 shown in Figure 3 for illustrating, is not to be used for limiting technical characterictic of the present invention only.
What deserves to be mentioned is that hole H1 and hole H2 have hole T1 and hole T2 respectively, hole T1 and hole T2 expose portion chamber shell 220 not only wherein, expose portion insulating barrier 110 (the hole T1 shown in Figure 1B) more simultaneously.Certainly, the two hole T1 ' shown in also can image pattern 1C of hole T1 and hole T2, an expose portion chamber shell 220, and do not expose insulating barrier 110.
The manufacture method of the wiring board 200 of present embodiment is similar to the manufacture method of the wiring board 100 of previous embodiment, and following Fig. 4 A and Fig. 4 B of will cooperating, and introduces the manufacture method of wiring board 200.
Fig. 4 A to Fig. 4 B illustrates the flow process generalized section of the manufacture method of wiring board among Fig. 3.See also shown in Fig. 4 A and Fig. 4 B, after the first insulation material layer 112a, the second insulation material layer 112b and 130 formation of these line layers, cutting insulating barrier 110 and chamber shell 220 are to expose cavity C 2.So far, wiring board 200 has been made basically and has been finished.
Cutting insulating barrier 110 can be undertaken by physical refining processes with the method for chamber shell 220, and the method that this physical refining processes general reference is separated object with physics mode, it for example is the V-type cutting, mills and cut or stamp mechanical processing techniques such as (punch).Therefore, cutting insulating barrier 110 can comprise the V-type cutting with the method for chamber shell 220, mill and cut or mechanical processing technique such as stamp.So, it is cut that partial insulative layer 110 and part chamber shell 220 are able to, and exposing cavity C 2, and forms opening 220b.In addition, in the present embodiment, the first insulation material layer 112a, the second insulation material layer 112b are all identical with previous embodiment with the formation method of line layer 130, so repeat no more.
In sum, because the hole of insulating barrier can communicate with each other by chamber, extraneous air can be flowed in these holes and chamber, and then form one or more path that can transmit sound, therefore the sound that electroacoustic transducer sent can send from the arbitrary of insulating barrier outer surface by hole and chamber; Perhaps electroacoustic transducer also can receive sound from hole and chamber.
Secondly, wiring board of the present invention can be installed loudspeaker and bass horn simultaneously, and the two sound that is sent of loudspeaker and bass horn can send from these holes and chamber, with the auditory effect of generation surround sound, and then provides the user better hearing enjoying.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (25)
1. wiring board is characterized in that it comprises:
One insulating barrier has an outer surface and a plurality of hole that is positioned at this outer surface;
One chamber shell is embedded in this insulating barrier, and surrounds a chamber, and this chamber shell has a plurality of openings that are communicated with this chamber, and wherein said opening directly is communicated with described hole respectively; And
At least one line layer is disposed at this outer surface.
2. wiring board according to claim 1, it is characterized in that wherein said outer surface comprises that a upper surface, a lower surface and with respect to this upper surface are connected in the side surface between this upper surface and this lower surface, one of them hole is positioned at this upper surface.
3. wiring board according to claim 2 is characterized in that wherein at least two holes are positioned at this upper surface.
4. wiring board according to claim 2 is characterized in that wherein another hole is positioned at this lower surface.
5. wiring board according to claim 1 is characterized in that at least one hole wherein has the hole of this chamber shell of an expose portion.
6. wiring board according to claim 5 is characterized in that more this insulating barrier of expose portion of wherein said hole.
7. wiring board according to claim 1, the material that it is characterized in that wherein said chamber shell is metal, pottery, plastic cement or rubber, described chamber shell be shaped as tubular body.
8. wiring board according to claim 1 it is characterized in that wherein said insulating barrier comprises one first insulation material layer and one second insulation material layer, and this chamber shell is located between this first insulation material layer and this second insulation material layer.
9. wiring board is characterized in that it comprises:
One insulating barrier has an outer surface and at least one hole that is positioned at this outer surface;
One chamber shell is embedded in this insulating barrier, and surrounds a chamber, and this chamber shell has a plurality of openings that are communicated with this chamber, and one of them opening directly is communicated with this hole, and another opening is positioned at this outer surface; And
At least one line layer is disposed at this outer surface.
10. wiring board according to claim 9 is characterized in that wherein said outer surface comprises that a upper surface, a lower surface and with respect to this upper surface are connected in the side surface between this upper surface and this lower surface, and this hole is positioned at this upper surface.
11. wiring board according to claim 10, the opening that it is characterized in that wherein being positioned at this outer surface is to be positioned at this side surface.
12. wiring board according to claim 11, the quantity that it is characterized in that wherein said hole is a plurality of, and described hole all is positioned at this outer surface, and one of them hole is positioned at this upper surface, and another hole is positioned at this lower surface.
13. wiring board according to claim 11, the quantity that it is characterized in that wherein said hole is a plurality of, and described hole all is positioned at this outer surface, and wherein at least two holes are positioned at this upper surface.
14. wiring board according to claim 9 is characterized in that wherein said hole has the hole of this chamber shell of an expose portion.
15. wiring board according to claim 14 is characterized in that more this insulating barrier of expose portion of wherein said hole.
16. wiring board according to claim 9, the material that it is characterized in that wherein said chamber shell is metal, pottery, plastic cement or rubber, described chamber shell be shaped as tubular body.
17. wiring board according to claim 9 it is characterized in that wherein said insulating barrier comprises one first insulation material layer and one second insulation material layer, and this chamber shell is located between this first insulation material layer and this second insulation material layer.
18. the manufacture method of a wiring board is characterized in that it may further comprise the steps:
One substrate is provided, and wherein this substrate comprises that one first conductor layer and is positioned at first insulation material layer on this first conductor layer;
Dispose a chamber shell on this first insulation material layer, wherein this chamber shell surrounds a chamber;
Form one second insulation material layer, wherein this second insulation material layer covers this cavity and this first insulation material layer, and this first insulation material layer and this second insulation material layer form an insulating barrier;
This first conductor layer of patterning; And
After this first conductor layer of patterning, form the outer surface of at least one hole in this insulating barrier, wherein this hole is communicated with this chamber.
19. the manufacture method of wiring board according to claim 18 is characterized in that wherein before this chamber shell of configuration, more was included in and formed a depressed area on first insulation material layer, wherein this chamber shell is disposed in this depressed area.
20. the manufacture method of wiring board according to claim 19 is characterized in that wherein said depressed area is to utilize laser ablation or mill to cut and form.
21. the manufacture method of wiring board according to claim 18 it is characterized in that wherein said first insulation material layer is blank core layer, and described second insulation material layer is the semi-solid preparation film.
22. the manufacture method of wiring board according to claim 18 is characterized in that wherein after this first conductor layer of patterning, more comprises this insulating barrier of cutting and this chamber shell, to expose this chamber.
23. the manufacture method of wiring board according to claim 18 is characterized in that wherein said hole is an electroless coating through hole, and the method that forms this electroless coating through hole comprises machine drilling or laser drill.
24. the manufacture method of wiring board according to claim 18; it is characterized in that wherein said outer surface comprises a upper surface and a lower surface with respect to this upper surface; and before forming this hole, form two protective layers respectively at this upper surface and this lower surface.
25. the manufacture method of wiring board according to claim 24 is characterized in that wherein said protective layer is two welding resisting layers, and described welding resisting layer is to utilize printing and form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910167557 CN101998753B (en) | 2009-08-24 | 2009-08-24 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910167557 CN101998753B (en) | 2009-08-24 | 2009-08-24 | Circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101998753A true CN101998753A (en) | 2011-03-30 |
| CN101998753B CN101998753B (en) | 2012-12-12 |
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| CN 200910167557 Active CN101998753B (en) | 2009-08-24 | 2009-08-24 | Circuit board and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600905A (en) * | 2017-09-30 | 2019-04-09 | 鸿富锦精密工业(武汉)有限公司 | The electronic device of printed circuit board and the application printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201226592Y (en) * | 2008-06-23 | 2009-04-22 | 东莞泉声电子有限公司 | Silicon microphone packaged by flexible circuit board |
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2009
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600905A (en) * | 2017-09-30 | 2019-04-09 | 鸿富锦精密工业(武汉)有限公司 | The electronic device of printed circuit board and the application printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101998753B (en) | 2012-12-12 |
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