US20180168045A1 - Electronic Module - Google Patents

Electronic Module Download PDF

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Publication number
US20180168045A1
US20180168045A1 US15/836,860 US201715836860A US2018168045A1 US 20180168045 A1 US20180168045 A1 US 20180168045A1 US 201715836860 A US201715836860 A US 201715836860A US 2018168045 A1 US2018168045 A1 US 2018168045A1
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United States
Prior art keywords
board
contact points
module
electronic devices
electronic
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Abandoned
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US15/836,860
Inventor
Bau-Ru Lu
Chun Hsien Lu
Da-Jung Chen
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Cyntec Co Ltd
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Cyntec Co Ltd
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Publication date
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Priority to US15/836,860 priority Critical patent/US20180168045A1/en
Assigned to CYNTEC CO., LTD. reassignment CYNTEC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, DA-JUNG, LU, BAU-RU, LU, CHUN HSIEN
Publication of US20180168045A1 publication Critical patent/US20180168045A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2823—Wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/306—Fastening or mounting coils or windings on core, casing or other support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/40—Structural association with built-in electric component, e.g. fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB

Definitions

  • the present invention relates to an electronic module, and more particularly to an electronic module having electronic devices disposed on both sides of a module board.
  • One objective of the present invention is to allow any size of the electronic devices to be disposed on the top and the bottom surface of the module board to increase design flexibility, wherein the main circuit module can be designed first, and then the connection board can be designed for connecting with the module board so that pads on the bottom surface of the connection board can be used to connect with an external circuit.
  • an electronic module comprising: a module board, wherein a plurality of first electronic devices are disposed over a top surface of the module board, and a plurality of second electronic devices are disposed on a bottom surface of the module board, wherein a plurality of first contact points are disposed on the bottom surface of the module board and electrically connected to the module board; and a connection board, wherein a plurality of second contact points are on a top surface of the connection board, and a plurality of third contact points are on a bottom surface of the connection board, wherein the connection board are disposed under the module board, wherein each of the plurality of first contact points is electrically connected to a corresponding contact point of the plurality of second contact points, and the plurality of third contact points are electrically connected to the plurality of second contact points for connecting with an external circuit.
  • connection board is in an open ring shape with a through opening surrounded by the open ring, wherein the plurality of second electronic devices are disposed in the through opening.
  • connection board is in a closed ring shape with a through opening surrounded by the closed ring, wherein the plurality of second electronic devices are disposed in the through opening.
  • connection board comprises a first part and a second part, wherein the first part and the second part are disposed along two opposite edge of the module board, and the plurality of second electronic devices are disposed between the first part and the second part.
  • connection board comprises a first part and a second part, wherein the first part and the second part are disposed along two opposite edge of the module board, and the plurality of second electronic devices are disposed between the first part and the second part.
  • each of the plurality of third contact points is electrically connected to a corresponding one of the plurality of second contact points through a via disposed in the connection board.
  • connection board is a multi-layer board comprising a routing trace to electrically connect a contact point of the plurality of second contact points to a corresponding contact point of the plurality of third contact points, wherein said corresponding contact point of the plurality of third contact points is not directly under said contact point of the plurality of second contact points.
  • connection board is a multi-layer board comprising a routing trace to electrically connect two contact points of the plurality of second contact points.
  • the module board is a multi-layer module board.
  • the module board is a multi-layer PCB board.
  • the module board comprises a metallic substrate.
  • the module board comprises a ceramic substrate.
  • the module board comprises a ceramic substrate.
  • each of the plurality of first contact points is a SMT pad.
  • each of the plurality of third contact points is a SMT pad.
  • the plurality of first electronic devices comprises an active device and a passive device.
  • the plurality of second electronic devices comprises an active device and a passive device.
  • each of the plurality of first electronic devices is a SMT device.
  • each of the plurality of second electronic devices is a SMT device.
  • FIG. 1A illustrates a schematic cross-sectional view of an electronic module in one embodiment of the present invention.
  • FIG. 1B illustrates a top view of the connection board in FIG. 1A .
  • FIG. 1A illustrates a schematic cross-sectional view of an electronic module 100 A in one embodiment of the present invention.
  • the electronic module 100 A comprises a module board 101 comprising conductive patterns, wherein a plurality of first electronic devices 102 are disposed over a top surface of the module board 101 and electrically connected to the module board 101 , and a plurality of second electronic devices 103 are disposed on a bottom surface of the module board 101 and electrically connected to the module board 101 , wherein the plurality of first electronic devices 102 and the plurality of second electronic devices 103 form a first circuit through the module board 101 , wherein a plurality of first contact points 104 are disposed on the bottom surface of the module board 101 and electrically connected to the module board 101 , wherein each of the plurality of first contact points 104 is respectively located higher than the bottom surface of each of at least one of second electronic devices 103 ; and a connection board 150 , wherein a plurality of second contact points 151 are on a top surface of the connection board 150 ,
  • each of the plurality of third contact points 152 of the connection board 150 is electrically connected to a corresponding one of the plurality of second contact points 151 of the connection board 150 through a via 153 disposed in the connection board.
  • the module board 101 comprises a circuit board, wherein the circuit board can be a PCB (Printed Circuit Board), a multi-layer PCB, or the circuit board can be made of a metallic substrate or a ceramic substrate or a lead frame or any other suitable way.
  • the module board 101 comprises conductive patterns or conductive layers for electrically connecting the first electronic devices 102 and the second electronic devices 103 .
  • the connection board 150 comprises a through opening 155 so that the second electronic devices 103 can be disposed in the through opening 155 .
  • the module board is a multi-layer module board.
  • the module board is a multi-layer PCB board.
  • the module board comprises a metallic substrate.
  • the module board comprises a ceramic substrate.
  • the module board comprises a ceramic substrate.
  • each of the plurality of first contact points is a SMT pad.
  • each of the plurality of third contact points is a SMT pad.
  • the plurality of first electronic devices comprises an active device such as an IC and a passive device such as an inductor or a choke. In one embodiment, the plurality of first electronic devices comprises a sub-module with electronic devices on a smaller circuit board that can be disposed on the module board 101 .
  • the plurality of second electronic devices comprises an active device and a passive device.
  • each of the plurality of first electronic devices is a SMT device.
  • each of the plurality of second electronic devices is a SMT device.
  • FIG. 1B illustrates a schematic top view 100 B of the connection board 150 , please refer to FIG. 1 and FIG. 1B , a plurality of second contact points 151 are on a top surface of the connection board 150 .
  • the connection board 150 comprises a through opening 155 so that the second electronic devices 103 can be disposed in the through opening 155 .
  • the connection board 150 comprises at least one through opening 155 so that the second electronic devices 103 can be disposed in the at least one through opening 155 .
  • connection board 150 comprises a recess (not shown) so that the second electronic devices 103 can be disposed in the recess (not shown), which means there is a portion of the bottom surface of the connection board 150 being disposed under the second electronic devices 103 .
  • connection board is in an open ring shape with a through opening surrounded by the open ring, wherein the plurality of second electronic devices are disposed in the through opening.
  • the open ring shape can be disposed along the edges of the module board, and the shape of the open ring shape can be any shape that forms a through opening 155 therein. For example, it can be a square or a circular or any other suitable form.
  • the connection board 150 can also contains conductive layers for routing the plurality of first contact points 104 or re-position the plurality of first contact points 104 to different positions of the plurality of third contact points 152 when mounting the electronic module 100 A to a mother board.
  • connection board 150 is in a closed ring shape with a through opening surrounded by the closed ring, wherein the plurality of second electronic devices are disposed in the through opening.
  • the closed ring shape can be disposed along the edges of the module board, and the shape of the closed ring shape can be any shape that forms a through opening 155 therein. For example, it can be a square or a circular or any other suitable form.
  • the connection board 150 can also contains conductive layers for routing the plurality of first contact points 104 or re-position the plurality of first contact points 104 to different positions of the plurality of third contact points 152 when mounting the electronic module 100 A to a mother board.
  • connection board comprises a first part and a second part, wherein the first part and the second part are disposed along two opposite edge of the module board, and the plurality of second electronic devices are disposed between the first part and the second part.
  • connection board comprises a first part and a second part, wherein the first part and the second part are disposed along two opposite edge of the module board, and the plurality of second electronic devices are disposed between the first part and the second part.
  • the each of the plurality of third contact points is electrically connected to a corresponding one of the plurality of second contact points through a via disposed in the connection board.
  • connection board is a multi-layer board comprising a routing trace to electrically connect a contact point of the plurality of second contact points to a corresponding contact point of the plurality of third contact points, wherein said corresponding contact point of the plurality of third contact points is not directly under said contact point of the plurality of second contact points.
  • connection board is a multi-layer board comprising a routing trace to electrically connect two contact points of the plurality of second contact points.
  • the present invention offers many advantages including: (a) can put any size of the electronic devices on the bottom surface of the module board to increase design flexibility; (b) the main circuit module can be designed first, and then the connection board can be design to create SMT pads for connecting with a particular motherboard; (c) increase the scalability when multiple module boards are stacked in a vertically direction.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

An electronic module is disclosed, wherein the electronic module comprises: a module board and a connection board, wherein a plurality of first electronic devices are disposed over a top surface of the module board, and a plurality of second electronic devices are disposed on a bottom surface of the module board, wherein a plurality of first contact points are disposed on the bottom surface of the module board and electrically connected to a plurality of second contact points on a top surface of the connection board, wherein a plurality of third contact points are on a bottom surface of the connection board for connecting with an external circuit.

Description

    CROSS-REFERENCE TO RELATED APPLICATION
  • This application claims the benefit of U.S. provisional patent application No. 62/431,838, filed on Dec. 9, 2016, which is hereby incorporated herein by reference.
    • BACKGROUND OF THE INVENTION 1. Field of the Invention
  • The present invention relates to an electronic module, and more particularly to an electronic module having electronic devices disposed on both sides of a module board.
    • 2. Description of Related Art
  • In order to put more electronic devices on a module board or a circuit board of a conventional electronic module, electronic devices are disposed on both sides of the module board. When the conventional electronic module needs to connect with a mother board, connectors or cables are used to connect the module board to the mother board, which will not only decrease the electrically performance, but also limit the scalability when stacking multiple module boards. Accordingly, a new solution is needed to resolve the above issues.
    • SUMMARY OF THE INVENTION
  • One objective of the present invention is to allow any size of the electronic devices to be disposed on the top and the bottom surface of the module board to increase design flexibility, wherein the main circuit module can be designed first, and then the connection board can be designed for connecting with the module board so that pads on the bottom surface of the connection board can be used to connect with an external circuit.
  • In one embodiment, an electronic module is disclosed, wherein the electronic module comprises: a module board, wherein a plurality of first electronic devices are disposed over a top surface of the module board, and a plurality of second electronic devices are disposed on a bottom surface of the module board, wherein a plurality of first contact points are disposed on the bottom surface of the module board and electrically connected to the module board; and a connection board, wherein a plurality of second contact points are on a top surface of the connection board, and a plurality of third contact points are on a bottom surface of the connection board, wherein the connection board are disposed under the module board, wherein each of the plurality of first contact points is electrically connected to a corresponding contact point of the plurality of second contact points, and the plurality of third contact points are electrically connected to the plurality of second contact points for connecting with an external circuit.
  • In one embodiment, the connection board is in an open ring shape with a through opening surrounded by the open ring, wherein the plurality of second electronic devices are disposed in the through opening.
  • In one embodiment, the connection board is in a closed ring shape with a through opening surrounded by the closed ring, wherein the plurality of second electronic devices are disposed in the through opening.
  • In one embodiment, the connection board comprises a first part and a second part, wherein the first part and the second part are disposed along two opposite edge of the module board, and the plurality of second electronic devices are disposed between the first part and the second part.
  • In one embodiment, the connection board comprises a first part and a second part, wherein the first part and the second part are disposed along two opposite edge of the module board, and the plurality of second electronic devices are disposed between the first part and the second part.
  • In one embodiment, each of the plurality of third contact points is electrically connected to a corresponding one of the plurality of second contact points through a via disposed in the connection board.
  • In one embodiment, the connection board is a multi-layer board comprising a routing trace to electrically connect a contact point of the plurality of second contact points to a corresponding contact point of the plurality of third contact points, wherein said corresponding contact point of the plurality of third contact points is not directly under said contact point of the plurality of second contact points.
  • In one embodiment, the connection board is a multi-layer board comprising a routing trace to electrically connect two contact points of the plurality of second contact points.
  • In one embodiment, the module board is a multi-layer module board.
  • In one embodiment, the module board is a multi-layer PCB board.
  • In one embodiment, the module board comprises a metallic substrate.
  • In one embodiment, the module board comprises a ceramic substrate.
  • In one embodiment, the module board comprises a ceramic substrate.
  • In one embodiment, each of the plurality of first contact points is a SMT pad.
  • In one embodiment, each of the plurality of third contact points is a SMT pad.
  • In one embodiment, the plurality of first electronic devices comprises an active device and a passive device.
  • In one embodiment, the plurality of second electronic devices comprises an active device and a passive device.
  • In one embodiment, each of the plurality of first electronic devices is a SMT device.
  • In one embodiment, each of the plurality of second electronic devices is a SMT device.
  • The detailed technology and above preferred embodiments implemented for the present invention are described in the following paragraphs accompanying the appended drawings for people skilled in this field to well appreciate the features of the claimed invention.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The foregoing aspects and many of the accompanying advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description when taken in conjunction with the accompanying drawings, wherein:
  • FIG. 1A illustrates a schematic cross-sectional view of an electronic module in one embodiment of the present invention; and
  • FIG. 1B illustrates a top view of the connection board in FIG. 1A.
    •  DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS
  • The detailed explanation of the present invention is described as following. The described preferred embodiments are presented for purposes of illustrations and description and they are not intended to limit the scope of the present invention.
  • FIG. 1A illustrates a schematic cross-sectional view of an electronic module 100A in one embodiment of the present invention. The electronic module 100A comprises a module board 101 comprising conductive patterns, wherein a plurality of first electronic devices 102 are disposed over a top surface of the module board 101 and electrically connected to the module board 101, and a plurality of second electronic devices 103 are disposed on a bottom surface of the module board 101 and electrically connected to the module board 101, wherein the plurality of first electronic devices 102 and the plurality of second electronic devices 103 form a first circuit through the module board 101, wherein a plurality of first contact points 104 are disposed on the bottom surface of the module board 101 and electrically connected to the module board 101, wherein each of the plurality of first contact points 104 is respectively located higher than the bottom surface of each of at least one of second electronic devices 103; and a connection board 150, wherein a plurality of second contact points 151 are on a top surface of the connection board 150, and a plurality of third contact points 152 are on a bottom surface of the connection board 150, wherein the connection board 150 are disposed under the module board 101, wherein each of the plurality of first contact points 104 is electrically connected to a corresponding contact point of the plurality of second contact points 151, and the plurality of third contact points 152 are electrically connected to the plurality of second contact points 151 for connecting with an external circuit.
  • In one embodiment, each of the plurality of third contact points 152 of the connection board 150 is electrically connected to a corresponding one of the plurality of second contact points 151 of the connection board 150 through a via 153 disposed in the connection board. In one embodiment, the module board 101 comprises a circuit board, wherein the circuit board can be a PCB (Printed Circuit Board), a multi-layer PCB, or the circuit board can be made of a metallic substrate or a ceramic substrate or a lead frame or any other suitable way.
  • In one embodiment, the module board 101 comprises conductive patterns or conductive layers for electrically connecting the first electronic devices 102 and the second electronic devices 103. The connection board 150 comprises a through opening 155 so that the second electronic devices 103 can be disposed in the through opening 155.
  • In one embodiment, the module board is a multi-layer module board.
  • In one embodiment, the module board is a multi-layer PCB board.
  • In one embodiment, the module board comprises a metallic substrate.
  • In one embodiment, the module board comprises a ceramic substrate.
  • In one embodiment, the module board comprises a ceramic substrate.
  • In one embodiment, each of the plurality of first contact points is a SMT pad.
  • In one embodiment, each of the plurality of third contact points is a SMT pad.
  • In one embodiment, the plurality of first electronic devices comprises an active device such as an IC and a passive device such as an inductor or a choke. In one embodiment, the plurality of first electronic devices comprises a sub-module with electronic devices on a smaller circuit board that can be disposed on the module board 101.
  • In one embodiment, the plurality of second electronic devices comprises an active device and a passive device.
  • In one embodiment, each of the plurality of first electronic devices is a SMT device.
  • In one embodiment, each of the plurality of second electronic devices is a SMT device.
  • FIG. 1B illustrates a schematic top view 100B of the connection board 150, please refer to FIG. 1 and FIG. 1B, a plurality of second contact points 151 are on a top surface of the connection board 150. The connection board 150 comprises a through opening 155 so that the second electronic devices 103 can be disposed in the through opening 155. In one embodiment, the connection board 150 comprises at least one through opening 155 so that the second electronic devices 103 can be disposed in the at least one through opening 155. In one embodiment, the connection board 150 comprises a recess (not shown) so that the second electronic devices 103 can be disposed in the recess (not shown), which means there is a portion of the bottom surface of the connection board 150 being disposed under the second electronic devices 103.
  • In one embodiment, the connection board is in an open ring shape with a through opening surrounded by the open ring, wherein the plurality of second electronic devices are disposed in the through opening. The open ring shape can be disposed along the edges of the module board, and the shape of the open ring shape can be any shape that forms a through opening 155 therein. For example, it can be a square or a circular or any other suitable form. The connection board 150 can also contains conductive layers for routing the plurality of first contact points 104 or re-position the plurality of first contact points 104 to different positions of the plurality of third contact points 152 when mounting the electronic module 100A to a mother board.
  • In one embodiment, the connection board 150 is in a closed ring shape with a through opening surrounded by the closed ring, wherein the plurality of second electronic devices are disposed in the through opening. The closed ring shape can be disposed along the edges of the module board, and the shape of the closed ring shape can be any shape that forms a through opening 155 therein. For example, it can be a square or a circular or any other suitable form. The connection board 150 can also contains conductive layers for routing the plurality of first contact points 104 or re-position the plurality of first contact points 104 to different positions of the plurality of third contact points 152 when mounting the electronic module 100A to a mother board.
  • In one embodiment, the connection board comprises a first part and a second part, wherein the first part and the second part are disposed along two opposite edge of the module board, and the plurality of second electronic devices are disposed between the first part and the second part.
  • In one embodiment, the connection board comprises a first part and a second part, wherein the first part and the second part are disposed along two opposite edge of the module board, and the plurality of second electronic devices are disposed between the first part and the second part.
  • In one embodiment, the each of the plurality of third contact points is electrically connected to a corresponding one of the plurality of second contact points through a via disposed in the connection board.
  • In one embodiment, the connection board is a multi-layer board comprising a routing trace to electrically connect a contact point of the plurality of second contact points to a corresponding contact point of the plurality of third contact points, wherein said corresponding contact point of the plurality of third contact points is not directly under said contact point of the plurality of second contact points.
  • In one embodiment, the connection board is a multi-layer board comprising a routing trace to electrically connect two contact points of the plurality of second contact points.
  • The present invention offers many advantages including: (a) can put any size of the electronic devices on the bottom surface of the module board to increase design flexibility; (b) the main circuit module can be designed first, and then the connection board can be design to create SMT pads for connecting with a particular motherboard; (c) increase the scalability when multiple module boards are stacked in a vertically direction.
  • The above disclosure is related to the detailed technical contents and inventive features thereof. People skilled in this field may proceed with a variety of modifications and replacements based on the disclosures and suggestions of the invention as described without departing from the characteristics thereof. Nevertheless, although such modifications and replacements are not fully disclosed in the above descriptions, they have substantially been covered in the following claims as appended.

Claims (16)

What is claimed is:
1. An electronic module, comprising:
a module board, wherein a plurality of first electronic devices are disposed over a top surface of the module board and electrically connected to the module board, and a plurality of second electronic devices are disposed on a bottom surface of the module board and electrically connected to the module board, wherein a plurality of first contact points are disposed on the bottom surface of the module board and electrically connected to the module board; and
a connection board, wherein a plurality of second contact points are on a top surface of the connection board, and a plurality of third contact points are on a bottom surface of the connection board, wherein the connection board are disposed under the module board, wherein each of the plurality of first contact points is electrically connected to a corresponding contact point of the plurality of second contact points, and the plurality of third contact points are electrically connected to the plurality of second contact points for connecting with an external circuit.
2. The electronic module according to claim 1, wherein the connection board is in an open ring shape with at least one through opening surrounded by the open ring, wherein the plurality of second electronic devices are disposed in the at least one through opening.
3. The electronic module according to claim 1, wherein the connection board is in a closed ring shape with at least one through opening surrounded by the closed ring, wherein the plurality of second electronic devices are disposed in the at least one through opening.
4. The electronic module according to claim 1, wherein each of the plurality of third contact points is electrically connected to a corresponding one of the plurality of second contact points through a via disposed in the connection board.
5. The electronic module according to claim 1, wherein the connection board is a multi-layer board comprising a routing trace to electrically connect a contact point of the plurality of second contact points to a corresponding contact point of the plurality of third contact points, wherein said corresponding contact point of the plurality of third contact points is not directly under said contact point of the plurality of second contact points.
6. The electronic module according to claim 1, wherein the connection board is a multi-layer board comprising a routing trace to electrically connect two contact points of the plurality of second contact points.
7. The electronic module according to claim 1, wherein the module board is a multi-layer circuit board.
8. The electronic module according to claim 1, wherein the module board is a multi-layer PCB.
9. The electronic module according to claim 1, wherein the module board comprises a metallic substrate.
10. The electronic module according to claim 1, wherein the module board comprises a ceramic substrate.
11. The electronic module according to claim 1, wherein each of the plurality of first contact points is a SMT pad.
12. The electronic module according to claim 1, wherein each of the plurality of third contact points is a SMT pad.
13. The electronic module according to claim 1, wherein the plurality of first electronic devices comprises an active device and a passive device.
14. The electronic module according to claim 1, wherein the plurality of second electronic devices comprises an active device and a passive device.
15. The electronic module according to claim 1, wherein each of the plurality of first electronic devices is a SMT device.
16. The electronic module according to claim 1, wherein each of the plurality of second electronic devices is a SMT device.
US15/836,860 2016-12-09 2017-12-09 Electronic Module Abandoned US20180168045A1 (en)

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CN114743756A (en) 2022-07-12
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CN108231755A (en) 2018-06-29
US11017934B2 (en) 2021-05-25
US20180166200A1 (en) 2018-06-14
CN108231337A (en) 2018-06-29
TW201822224A (en) 2018-06-16

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