CN103377794A - Power inductance structure free of use of lead frame and manufacturing method thereof - Google Patents
Power inductance structure free of use of lead frame and manufacturing method thereof Download PDFInfo
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- CN103377794A CN103377794A CN2012101241699A CN201210124169A CN103377794A CN 103377794 A CN103377794 A CN 103377794A CN 2012101241699 A CN2012101241699 A CN 2012101241699A CN 201210124169 A CN201210124169 A CN 201210124169A CN 103377794 A CN103377794 A CN 103377794A
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Abstract
Provided are a power inductance structure and a manufacturing method thereof. The power inductance structure comprises a lower substrate, a coil arranged on the lower substrate and an intermediate layer covering the coil. The lower substrate is a soft-magnetism magnet having magnetism or a carrier without magnetism, the coil is a wire with the surface provided with an insulating layer, and the intermediate layer is a colloid containing magnetic powder. The manufacturing method comprises the steps of enabling the coil which is an enameled wire, is made of a copper wire or other conductors and has the surface provided with the insulating layer to be fixed on the upper surface of the lower substrate, enabling the coil to be coated with the colloid internally containing the magnetic powder, cutting the substrate into grains, and performing forming in sequence. According to fixing of the coil, first a layer of graphical second conductor connected with conductor metal of the coil is formed above the substrate, the second conductor can lead electrical property of the coil out to an end electrode, and use of a lead frame is omitted simultaneously.
Description
Technical field
The present invention is relevant a kind of power inductor structure and manufacture method thereof without lead frame, refer to especially to utilize full wafer production to replace existing single mode of production, the throughput rate of power inductance is promoted, cost, the power inductance of production have higher electric connection reliability person when being connected with external electrode.
Background technology
Existing power inductance, such as the U.S. the 6th, 204, No. 1 patent of 744B discloses, shown in 1A, 1B, 1C and 1D figure, coil 10 is for being attached at a circuit board 12, and it comprises a housing 14, extend the first wire 16 and the second wire 18 from housing 14, and respectively with circuit board on pad 20,22 weld mutually.This coil 10 is to utilize a cross section to form a winding body 24 for the upright flat conductor of square, coil becomes helical form, have a plurality of coils, and comprise that medial extremity 26 and an outboard end 28, one lead frames 32 namely are welded into one with medial extremity 26 and the outboard end 28 of winding body 24 respectively with two end 34,38.Then, be welded with wire 16,18 winding body 24 is placed in the mold, and in mold, inject and be preferably gluey said magnetic powder material, become block after this said magnetic powder material drying, after the demoulding, the part of lead frame 32 is cut off, namely got the Inductive component of this United States Patent (USP) case.
Yet, this U.S. the 6th, 204, there is following disappearance in No. 1 patent of 744B:
1. when it was made, if coil block is entwined with flat conductor, if then the winding of flat conductor considers that coil two free ends draw the end all will be positioned at coil outside the time, the coiling process was namely comparatively complicated.
2. shown in Fig. 1 D, if coil block 10 is entwined with round conductor, the multilayer of round conductor consists of and is difficult to meet light, thin, short, the little requirement of present electronic building brick, and its cost also improves relatively.
3. when making inductance, coil block is first welding lead, it is placed in the mold again, then inserts said magnetic powder material in mold, so, the magnetic material that produces coil block and its coating is difficult for the problem of complete driving fit.
4. because the wire of coil twines overlapping number of turns height up and down, so the situation of electromagnetic interference between the multi-layer conductor leads, the loss of inductance value is also larger with making.
5. in addition, still need to produce for unit take one one owing to produce at present above-mentioned power inductance product, therefore expended sizable manpower and considerable time, make the production efficiency reduction.Again the two ends of its coil systems first respectively with two legs welding of a lead frame, again with the online housing excision of lead frame, with the mode of coil contact, also cause the loss of material, this is to maintain an expensive reason for it.
6. have power inductance now, the mode that its coil and outer electrode link is point to point connect, so, the equipment of using when power inductance exists temperature that violent change is arranged or need apply electric current for a long time the time, coil just separates easily with outer electrode, cause open circuit, will cause when serious that product is whole to be burnt.
Because existing power inductance has above-mentioned disappearance, the inventor improves for these disappearance researchs, proposes power inductance of the present invention and manufacture method.
Summary of the invention
Therefore, the present invention namely aims to provide a kind of power inductance and manufacture method thereof, is to utilize to form first conductor layer on a bottom substrate, secondly the line bag is set between conductor, wrap online again the colloid that Magnaglo is contained in coating inside, then cut granulating, again moulding person sequentially.
According to this kind power inductance of the present invention and manufacture method thereof, provide the power inductance can disposable a large amount of productions, the production efficiency of product is greatly promoted, this is another purpose of the present invention.
According to another power inductance of the present invention and manufacture method thereof, the lead-out wires of coil end of its inductance unit need not to be welded in first the leg of a lead frame to form the electrode terminal of power inductance unit, so can exempt the processing procedure of preparation lead frame and welding lead-out wires of coil end, the cost of its power inductance greatly reduces, and this is another object of the present invention.
According to this kind power inductance of the present invention and manufacture method thereof, owing to need not to adopt lead frame in its manufacture process, not only without the cost for preparing lead frame, after can not producing the leg that coil is welded in lead frame yet, the processing procedure cost that the housing of lead frame need be excised and the cost of outer frame material, this is a further object of the present invention.
According to this kind power inductance of the present invention and manufacture method thereof, via the prepared power inductance of this manufacture method, not only can meet light, thin, short, the little requirement of present electronic building brick, coil and outer electrode are combined closely and are formed in the cell body of Inductive component simultaneously, not having existing Inductive component coil separates with pin, the situation that causes electronic installation to damage, this is a more purpose of the present invention.
As for detailed structure of the present invention, application principle, effect and effect, then please refer to the explanation that following adjoint does can be understood fully.
Description of drawings
Figure 1A～Fig. 1 D is United States Patent (USP) the 6th, 204, the embodiment schematic diagram of No. 1 case of 744B.
Fig. 2 is the schematic perspective view of power inductance body of the present invention.
Fig. 3 is the present invention forms termination electrode in power inductance body both sides schematic perspective view.
Fig. 4-1～4-10 is the manufacturing process floor map of the first embodiment of the present invention.
Fig. 5 A-5J is the manufacturing process floor map of the second embodiment of the present invention.
The primary clustering symbol description:
10: coil
12: circuit board
14: body
16: the first wires
18: the second wires
20,22: pad
24: winding body
26: medial extremity
28: outboard end
32: lead frame
34,38: end
100: lower basal plate
200: coil
300: conductive metal layer
400: the intermediate layer
500,600: termination electrode
3A: column
201,301: lower basal plate
202a, 202b, 202c, 302: conductive metal layer
203a, 203b: coil unit
203a1,203a2,203b1,203b2: lead-out wire
203,303: the line bag
204,304: colloid
205,305: upper substrate
206,306: conductor layer
207,307: conductive layer
2000,3000: granular element
Embodiment
This kind power inductance of the present invention, its body as shown in Figure 2, it comprises that a bottom substrate 100, is located at conductive metal layer 300, on the lower basal plate and is arranged at the coating 400 that coil 200 and on the lower basal plate coats coil 200; Wherein, this lower basal plate 100 can be the magnetic soft magnetism magnet of tool or the magnetic carrier of tool not, this coil 200 is the wire rod of surperficial tool insulating barrier, this conductive metal layer 300 can be silver (Ag), tin (Sn), copper (Cu), aluminium (Al), nickel (Ni) but or other conductive material layer, conductive metal layer 300 is electrically connected with coil 200, and 400 of this coatings are the colloid that contains Magnaglo.
In addition, as shown in Figure 3, at the both sides end face of inductance body formation conductive metal layer 300, can form the termination electrode 500,600 of the upper and lower side end face of coating body, use to be suitable for surface mount.
Power inductance of the present invention, its manufacture method have a plurality of embodiment as described below:
[embodiment one]
1. prepare a bottom substrate 201, this lower basal plate 201 can be the magnetic soft magnetism carrier of tool or the magnetic carrier of tool not, such as iron oxide substrate or aluminum oxide substrate or PET (shown in Fig. 4-1);
2. on lower basal plate 201, form conductive metal layer 202a, 202b, the 202c... that multiple tracks is separated, this conductive metal layer 202a, 202b, 202c... can be copper, silver, aluminium, tin, nickel or other electric conducting material, or its mutual alloy phase mutual respect repeatedly forms (shown in Fig. 4-2).
3. use a line bag 203 to be located at the upper surface of lower basal plate 201, a plurality of coil unit 203a, 203b... that line bag 203 is arranged for being matrix, lead-out wire 203a1,203a2,203b1,203b2... by coil unit 203a, 203b between two adjacent coil unit 203a, the 203b... are consisted of, and adjacent lead-out wire 203a2, the 203b1 of two adjacent coil units can be same.The material of this line bag 203 can be copper cash or other conductor, and this copper cash can be the enamelled wire (shown in Fig. 4-3) that the surface has insulating barrier;
4. utilize welding processing procedure or hot pressing processing procedure, lead-out wire 203a1,203a2,203b1,203b2... and conductive metal layer 202a, the 202b... of coil unit 203a, the 203b... of line bag 203 made electrically connect; So, make coil unit 203a, 203b... be positioned at conductive metal layer 202a, 202b that twice are separated ... between (shown in Fig. 4-4).
5. use an inside to contain the colloid 204 of Magnaglo, coat on the line bag 203, the magnetic that this colloid 204 includes can be Ferrite or iron with and alloy powder (shown in Fig. 4-5); And because the Magnaglo colloid is coating rather than molding, so stress can significantly reduce, and is difficult for splitting, and can be fit to make the slimming product.
6. cover a upper substrate 205 with as fixed bed (shown in Fig. 4-6) in the upper surface of colloid 204, this upper substrate 205 and lower basal plate 201 can be same material, recycle about 200 ℃ of bakings, can and make it to cohere with upper substrate 205 with above-mentioned colloid 204 curing; (, it should be noted that upper substrate 205 can not arrange yet herein).
7. the substrate that utilizes the cutting processing procedure that this sheet has been toasted is divided into granular element 2000 (shown in Fig. 4-7 and Fig. 4-8);
8. the granular element finished of cutting is again through printing process, chemical plating processing procedure or sputter process, assembly subtend side wire is exposed layer cover the electrical conductor layer 206 of one deck, this electrical conductor layer 206 can be the electric conducting materials (shown in Fig. 4-9) such as silver, copper, indium, aluminium, nickel, and the thickness of this electrical conductor layer 206 can be 0.1～100um;
9. utilize the chemical plating processing procedure to plate a conductive layer 207 (shown in Fig. 4-10), this conductive layer 207 sequentially can be silver/nickel/tin (/Ag/Ni/Sn), copper/nickel/tin (Cu/Ni/Sn) or copper/tin (Cu/Sn), make assembly become the SMD LED surface-mount device LED assembly.
[embodiment two]
1. prepare a bottom substrate 301, this lower basal plate 301 can be the magnetic soft magnetism magnet of tool or the magnetic carrier of tool not, such as iron oxide substrate or aluminum oxide substrate or PET (shown in Fig. 5 A);
2. form the conductive metal layer 302 that multiple tracks is separated on lower basal plate 301, this conductive metal layer 302 can be copper, silver, aluminium, tin, nickel or other electric conducting material, or its mutual alloy overlapping forms (shown in Fig. 5 B);
3. use a line bag 303 to be located at the upper surface of lower basal plate 301, a plurality of coil units that line bag 303 is arranged for being matrix, be that lead-out wire by coil unit is consisted of between the two adjacent coil units, and the adjacent lead-out wire of two adjacent coil units can be same.The material of this line bag 303 can be copper cash or other conductor, and this copper cash can be the enamelled wire that the surface has insulating barrier, and utilizes instrument to be fixed on the both sides (shown in Fig. 5 C) of substrate this line bag; Utilize welding processing procedure or hot pressing processing procedure, lead-out wire and the conductive metal layer of the coil unit of line bag 303 is electrically connected; So, make coil unit between the conductive metal layer that twice are separated;
4. insert a column 3A among wrapping online each coil of 303, this column 3A is clava, and it can be magnetic material or nonmagnetic substance, and for example iron (Fe) and associated alloys or oxide are to be used for the electrical characteristic of Modulating Power inductance; (shown in Fig. 5 D);
When column 3A is magnetic material, can change via magnetic capacity inductance value and the saturation current of coil.For example, use the iron oxide material center pillar of manganese-zinc-iron oxide or nickel-zinc-iron oxide, can make coil that higher inductance value is arranged, but saturation current can be lower; Use iron-silicon, the ferrous material center pillar of iron-nickel then can make coil that higher saturation current is arranged, but inductance value is lower; Perhaps, also can come via the position that changes the column setting electrical characteristic of Modulating Power inductance;
5. use an inside to contain the colloid 304 of Magnaglo, coat on the line bag 303, the magnetic that this colloid 304 includes can be Ferrite or iron with and alloy powder (shown in Fig. 5 E); And because the Magnaglo colloid is coating rather than molding, so stress can significantly reduce, and is difficult for splitting, and can be fit to make the slimming product.
6. cover a upper substrate 305 with as fixed bed (shown in Fig. 5 F) in the upper surface of colloid 304, this upper substrate 305 can be identical material with lower basal plate 301, recycle about 200 ℃ of bakings, can and make it to cohere with upper substrate 305 with above-mentioned colloid 304 curing; (upper substrate 305 can not arrange yet)
7. the substrate that utilizes the cutting processing procedure that this sheet has been toasted is divided into granular element 3000 (shown in Fig. 5 G, 5H);
8. the granular element finished of cutting is again through printing process, chemical plating processing procedure or sputter process, assembly subtend side wire extending part is plated the electrical conductor layer 306 of one deck, this electrical conductor layer 306 can be the electric conducting materials (shown in Fig. 5 I) such as silver, copper, indium, aluminium, nickel, and electrically the thickness of conductor layer 306 can be 0.1～100um;
9. utilize the chemical plating processing procedure to plate a conductive layer 307 (shown in Fig. 5 J), this conductive layer 307 sequentially can be silver/nickel/tin (/Ag/Ni/Sn), copper/nickel/tin (Cu/Ni/Sn) or copper/tin (Cu/Sn), make assembly become the SMD LED surface-mount device LED assembly.
In the step 2 of above-described embodiment two, its conductive metal layer 302 also can be copper, silver, aluminium, tin, nickel or other melting temperature between 200～600 ℃ electric conducting material, or its mutual alloy overlaps and forms.So, it can be fused when crossing the condition of high temperature, and power inductance of the present invention is had and the similar defencive function of fuse.
In the step 6 of above-described embodiment two, only as implementing example, be not to limit its baking temperature take 200 ℃ of bakings.
From the foregoing, power inductor structure and manufacture method thereof without lead frame of the present invention, via the prepared power inductance of this manufacture method, really it is more simple to have structure, it is more easy to make, safer effect during operation, and these effects can be improved the defective of existing power inductance.
The above is only for the better specific embodiment of the present invention, every change of doing according to conception of the present invention, or be revised as the equivalent embodiment of equivalent variations, and when not exceeding yet spiritual that specification and diagram contain, all should be in protection scope of the present invention.
Claims (21)
1. manufacture method without the power inductance of lead frame, its step comprises:
Prepare a bottom substrate;
On lower basal plate, form the conductive metal layer that most roads separate;
Be the most individual coil unit of matrix arrangement and the line bag that insulating barrier is established on the coil unit surface with one, place the upper surface of above-mentioned lower basal plate, each coil unit is each positioned between two conductive metal layers, and the lead-out wire between coil unit and the coil unit also is connected and fixed with conductive metal layer;
One colloid that contains Magnaglo is coated on the above-mentioned line bag;
Utilize the cutting processing procedure that substrate is divided into a plurality of granular elements, the granular element of after cutting apart each, all there is conductive metal layer its upper surface both sides, coil unit is all arranged between two conductive metal layers, coil unit is connected with lead-out wire with conductive metal layer, and conductive metal layer, coil unit and lead-out wire are all covered by colloid;
In the wire extending part of granular element subtend side, plate the electrical conductor layer of one deck again;
Form a conductive layer in granular elements on either side, making becomes the SMD LED surface-mount device LED assembly.
2. manufacture method without the power inductance of lead frame, its step comprises:
Prepare a bottom substrate;
On lower basal plate, form the conductive metal layer that most roads separate;
Be the most individual coil unit of matrix arrangement and the line bag that insulating barrier is established on the coil unit surface with one, place the upper surface of above-mentioned lower basal plate, each coil unit is each positioned between two conductive metal layers, and the lead-out wire between coil unit and the coil unit also is connected and fixed with conductive metal layer;
Insert a column that can be used to the electrical characteristic of Modulating Power inductance among each coil of online bag;
One colloid that contains Magnaglo is coated on the above-mentioned line bag;
Utilize the cutting processing procedure that substrate is divided into most granular elements, the granular element of after cutting apart each, all there is conductive metal layer its upper surface both sides, coil unit is all arranged between two conductive metal layers, coil unit is connected with lead-out wire with conductive metal layer, and conductive metal layer, coil unit and lead-out wire are all covered by colloid;
In the wire extending part of granular element subtend side, plate the electrical conductor layer of one deck again;
Form a conductive layer in granular elements on either side, making becomes the SMD LED surface-mount device LED assembly.
3. manufacture method as claimed in claim 1 or 2, the upper surface of wherein said colloid covers a upper substrate in addition as fixed bed.
4. manufacture method as claimed in claim 3, the material of wherein said lower basal plate or upper substrate are the magnetic soft magnetism magnet of tool or the magnetic carrier of tool not.
5. manufacture method as claimed in claim 1 or 2, the thickness of wherein said electrical conductor layer is 0.1～100 μ m.
6. manufacture method as claimed in claim 1 or 2, wherein said line bag are to be selected to the enamel-cover wire rod that copper cash or other conductive surface are established insulating barrier, and the subtend exit of line bag also utilizes welding or mode of heating to be fixed in conductive metal layer.
7. manufacture method as claimed in claim 1 or 2, contained Magnaglo is Ferrite or iron and alloy powder thereof in the wherein said colloid.
8. manufacture method as claimed in claim 1 or 2, wherein said conductive metal layer can be silver/nickel/tin (Ag/Ni/Sn), copper/nickel/tin (Cu/Ni/Sn) or copper/tin (Cu/Sn).
9. manufacture method as claimed in claim 2, wherein said column material is the material with soft magnetism.
10. manufacture method as claimed in claim 9, wherein said column and lower basal plate binding.
11. manufacture method as claimed in claim 9, wherein said column and bottom and upper substrate link mutually.
12. a power inductance comprises: a bottom substrate; Two are formed at respectively the conductive metal layer of lower basal plate upper surface both sides; One is located at the coil between two conductive metal layers, and coil and conductive metal layer are connected and fixed with a lead-out wire; One contains the colloid of Magnaglo, coats this conductive metal layer, coil and lead-out wire.
13. being solder joint or crimping, power inductance as claimed in claim 12, wherein said coil and conductive metal layer link.
14. power inductance as claimed in claim 12, wherein said coil are by insulating layer coating in copper line surface.
15. power inductance as claimed in claim 12, the Magnaglo of wherein said colloid be Ferrite or iron with and alloy powder.
16. power inductance as claimed in claim 12 wherein is provided with again a upper substrate, this upper substrate and colloid cohere.
17. power inductance as claimed in claim 12, the inside of wherein said coil is provided with a column, column in coil the position and material behavior in order to the electrical characteristic of Modulating Power inductance.
18. power inductance as claimed in claim 12, wherein said upper substrate or lower basal plate are the magnetic soft magnetism magnet of tool or the magnetic carrier of tool not.
19. power inductance as claimed in claim 12, wherein said inductance body assembly surface is except the face with electrical conductor layer, the equal coating one deck of other each face insulation material layer.
20. power inductance as claimed in claim 12, the conductive metal layer of wherein said lower basal plate upper surface both sides is by being consisted of with metal or its alloy of fusing point between 200 to 600 degree.
21. power inductance as claimed in claim 20, wherein said conductive metal layer can shrink when temperature is higher than its fusing point and separates with lead-out wire.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101241699A CN103377794A (en) | 2012-04-25 | 2012-04-25 | Power inductance structure free of use of lead frame and manufacturing method thereof |
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| CN2012101241699A CN103377794A (en) | 2012-04-25 | 2012-04-25 | Power inductance structure free of use of lead frame and manufacturing method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104733153A (en) * | 2015-03-30 | 2015-06-24 | 昆山龙腾光电有限公司 | Laminated sheet type magnetic bead |
| CN105225792A (en) * | 2014-06-09 | 2016-01-06 | 美磊科技股份有限公司 | Magnetic component |
| CN105762140A (en) * | 2014-12-15 | 2016-07-13 | 佳邦科技股份有限公司 | Particle-type inductance element and package manufacturing method thereof |
| CN105762140B (en) * | 2014-12-15 | 2018-08-31 | 佳邦科技股份有限公司 | Particle type inductance element and its encapsulation making method |
| CN113923566A (en) * | 2021-11-25 | 2022-01-11 | 深圳市昕通用电子材料有限公司 | Voice coil preparation method, voice coil and loudspeaker |
| CN114743756A (en) * | 2016-12-09 | 2022-07-12 | 乾坤科技股份有限公司 | Electronic module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114743756A (en) * | 2016-12-09 | 2022-07-12 | 乾坤科技股份有限公司 | Electronic module |
| CN113923566A (en) * | 2021-11-25 | 2022-01-11 | 深圳市昕通用电子材料有限公司 | Voice coil preparation method, voice coil and loudspeaker |
| CN113923566B (en) * | 2021-11-25 | 2024-05-17 | 深圳市昕通用电子材料有限公司 | Voice coil preparation method, voice coil and loudspeaker |
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Application publication date: 20131030 |