CN105762140A - Particle-type inductance element and package manufacturing method thereof - Google Patents
Particle-type inductance element and package manufacturing method thereof Download PDFInfo
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- CN105762140A CN105762140A CN201410775579.9A CN201410775579A CN105762140A CN 105762140 A CN105762140 A CN 105762140A CN 201410775579 A CN201410775579 A CN 201410775579A CN 105762140 A CN105762140 A CN 105762140A
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- inductance element
- making method
- copper foil
- inductance
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Abstract
The invention provides a particle-type inductance element and a package manufacturing method. The particle-type inductance element comprises a spiral coil, a packaging layer wrapped outside the spiral coil and copper foil metal sheets connected with wires at the two ends of the spiral coil respectively, wherein the packaging layer is formed by coating of wet-type ferroalloy glue. The inductance elements are arrayed in a rectangular array manner, and then, are subjected to synchronous packaging and cutting and pressing, so that production efficiency is improved and manufacture cost is reduced.
Description
Technical field
The present invention is relevant a kind of particle type inductance element and encapsulation making method thereof, particularly relate to produce in the form of an array inductance element, not only make inductance element can reach microminaturization demand, and quick productive target can be reached, improving production efficiency, and reduce manufacturing cost.
Background technology
Prior art inductance coil, as shown in Figure 1A to Fig. 1 D, the coil 10 of screw winding is attached on the circuit board 12, this coil 10 be provided externally with housing 14, coil 10 extends outward one first wire 16 and one second wire 18 from housing 14 again, and this first wire 16 is connected with first pad the 20, second pad 22 on circuit board respectively with the second wire 18.
The prior art coil 10, can be the first helical form winding body 24 that square flat conductor is coiled into for such as cross section shown in Figure 1B, 1C, or cross section is the second helical form winding body 40 that round conductor is coiled into as shown in figure ip.Wherein, the first helical form winding body 24 is provided with medial extremity 26 and outboard end 28, and the second helical form winding body 40 is then provided with first wire the 41, second wire 42 of pull-out.Before mold, first by the medial extremity 26 of the first helical form winding body 24, outboard end 28, or second first wire the 41, second wire 42 of helical form winding body 40, after linking into an integrated entity with first end the 34, second end 38 of lead frame 32, again first helical form winding body the 24, second helical form winding body 40 is put in mould, insert solid fraction powder and carry out casting film operation.Lead frame 32 is cut off separation after completing by casting film again, thus makes single inductance coil.
Owing to the prior art inductance coil was both needed to carry out one by one injection-molding operation before moldings formed therefrom, how to produce in the way of arranging shape in the industry, namely on lead frame in a row-shaped, several inductance coils are welded at interval, then are put into by several inductance coils and carry out indivedual injection-molding operation among die cavity.But, owing to the interval between each row's inductance coil is bigger, it is necessary to bigger place and board produce；And the inductance coil once can only being produced in limited quantities, production efficiency is poor；The use of lead frame is also the factor causing manufacturing cost to reduce.
Because the manufacture method of prior art inductance coil exists above-mentioned disappearance, the present inventor is that when long, research has the present invention to produce eventually for those disappearance Improvements.
Summary of the invention
Therefore, it is desirable to provide a kind of particle type inductance element and encapsulation making method thereof, make inductance coil not need to use conventional pilot coil holder and can manufacturing person in a large number.
To achieve these goals, the present invention provides following technical scheme:
A kind of encapsulation making method of particle type inductance element, its manufacturing step includes:
Bottom preparation process: make and be available for the bottom that several inductance elements are laid；
Step built by inductance element cloth: several have the inductance element of two outside lead-out wires, and with the array pattern that rectangle or other patterns arrange, cloth is built in the overhead surface of above-mentioned bottom；
Coating step: coat the top of above-mentioned bottom with liquid glue, make liquid glue be coated with completely by several inductance elements, and penetrate into the inside of each inductance element；
Die cut step: after liquid glue is solid, by each inductance element cutting and separating, to make single particulate inductance element.
Preferably, wherein said bottom can be Copper Foil metal level.
Preferably, wherein said bottom, after completing coating step, needs first it to be removed from the bottom of several inductance elements, attaches one layer of Copper Foil metal level then at the bottom of several inductance elements.
Preferably, when wherein said bottom is Copper Foil metal level, if after laying individual inductance element, need first to be connected on Copper Foil metal level by the two of each inductance element wires, then carry out coating step.
Preferably, the surface of wherein said Copper Foil metal level is provided with several guide holes, and this guide hole lays respectively at the both sides of inductance element, for being connected with the wire of inductance element.
Preferably, the guide hole of wherein said Copper Foil metal level can be connected for spot welding with the wire linked vector graph of inductance element, welds, grind connection or the connection of matel coated glue.
Preferably, wherein said liquid glue is ferroalloy glue.
A kind of particle type inductance element, this particle type inductance element is via made by the encapsulation making method described in any of the above-described item.
Particle type inductance element under this invention and encapsulation making method thereof, inductance element is produced with array pattern, this array pattern can be rectangle, circle or other patterns, can once produce more than 400 inductance coils, several or dozens of inductance coil once can only be produced compared to prior art, the production efficiency of the present invention can improve several times, for another object of the present invention.
Particle type inductance element under this invention and encapsulation making method thereof, owing to being produce inductance element with array pattern, only need less place can manufacture production, for another object of the present invention.
Particle type inductance element under this invention and encapsulation making method thereof, can simplify processing procedure, and can reduce the cost of lead frame, for a further object of the present invention.
Particle type inductance element under this invention and encapsulation making method thereof, use liquid glue as encapsulating material, liquid glue can complete the inductance coil encapsulation of matrix arrangement in one-step print operation, liquid glue can also penetrate into coil inside and fill out, to improve prior art pressed powder pressure, the disappearance easily having space to produce, for a further object of the present invention.
As for the detailed configuration of the present invention, application principle, effect and effect, then refer to following adjoint description can be understood completely.
Accompanying drawing explanation
Figure 1A～1D is the embodiment schematic diagram of prior art power inductance.
Fig. 2 is the generalized section of the particle type inductance element of the present invention.
Fig. 3 is the process block diagram of the encapsulation making method of the particle type inductance element of the present invention.
Fig. 4 A～4F is the Making programme schematic diagram of the encapsulation making method of the particle type inductance element of the present invention
Accompanying drawing labelling:
10: coil
12: circuit board
14: housing
16: the first wires
18: the second wires
20: the first pads
22: the second pads
24: the first helical form winding bodies
26: medial extremity
28: outboard end
32: lead frame
34: the first lead frame ends
38: the second lead frame ends
40: the second helical form winding bodies
41: the first wires
42: the second wires
100: particle type inductance element
101: spiral winding
102: encapsulated layer
103: the first Copper Foil sheet metals
104: the second Copper Foil sheet metals
100a: bottom preparation process
100b: step built by inductance element cloth
100c: glue material is coated to step
100d: die cut step
200: adhesive tape layer
201 coil units
2: spiral winding body
2A: the first lead-out wire
2B: the second lead-out wire
300: ferroalloy glue
400: Copper Foil metallic plate
401: guide hole
Detailed description of the invention
The particle type inductance element of the present invention, as in figure 2 it is shown, this particle type inductance element 100 includes spiral winding 101, the encapsulated layer 102 that is coated on this outside spiral winding 101 and and first Copper Foil sheet metal the 103, second Copper Foil sheet metal 104 of connecting of the two ends wire of spiral winding 101.Wherein, this encapsulated layer 102 is formed through high pressure pressure with wet type ferroalloy glue.
The particle type inductance element of the present invention, as it is shown on figure 3, its encapsulation making method includes following steps:
Bottom preparation process 100a: make and be available for the bottom that several inductance elements are laid；
Step 100b built by inductance element cloth: majority has the inductance element of two wires that stretch out, and with the array pattern that rectangle or other patterns arrange, cloth is built in the overhead surface of above-mentioned bottom；
Glue material is coated to step 100c: coat the top of above-mentioned bottom with liquid glue, makes liquid glue be coated with completely by several inductance elements arranged in array, and penetrates into the inside of each inductance element；
Die cut step 100d: after liquid glue is dry, by each inductance element cutting and separating, to make the microgranular inductance element of single.
The encapsulation making method of particle type inductance element for the present invention, coordinates graphic explanation with the following example, and its manufacturing process is:
1. being provided as the adhesive tape layer 200 of bottom, the upper surface of this adhesive tape layer 200 has stickiness；(as shown in Figure 4 A)
Overhead surface at adhesive tape layer 200 arranges several coil units 201 of rectangular array arrangement, and this coil unit 201 includes spiral winding body 2 and the first lead-out wire 2A, the second lead-out wire 2B that extend from the two ends of spiral winding body 2.(as shown in Figure 4 B)
2. in the outside of above-mentioned coil unit 201 with ferroalloy glue 300 coating cladding, this ferroalloy glue 300 is liquid state, when it is coated on coil unit 201, it is possible not only to be coated with each coil unit 201 comprehensively, and filling can penetrate into the inside of each coil unit 201.It is, whether each coil unit 201 each other, or the inner space of each coil unit 201, all can be filled up cladding by ferroalloy glue 300.(as shown in Figure 4 C)
3. after ferroalloy glue 300 is dry, being torn off from the lower section of coil unit 201 by above-mentioned adhesive tape 200, make each coil unit 201 only outside cladding ferroalloy glue 300, its lower surface then remains the stickiness after adhesive tape tears off.(as shown in Figure 4 D)
4. preparing Copper Foil metallic plate 400, the plating nickel on surface of this Copper Foil metallic plate 400 and tin plating, on plate face and form several guide holes 401 of rectangular array, the position of these several guide holes 401 is relative with the position of each coil unit 201.(as shown in Figure 4 E)
5. the Copper Foil metallic plate 400 of above-mentioned preparation is adhered to the lower end of each coil unit 201 above-mentioned, makes each coil unit 201 be placed exactly between each guide hole 401 of Copper Foil metallic plate 400.(as illustrated in figure 4f)
6. with spot welding, welding, grinding, matel coated glue ... etc. mode, the first lead-out wire 2A of each coil unit 201, the second lead-out wire 2B are fixed on the different guide holes 401 of Copper Foil metallic plate 400.
7. again with press from top to down to the ferroalloy glue 300 high-pressure power being coated with each coil unit 201, make ferroalloy glue 300 and each coil unit 201 more touch and be combined into entirety；Each coil unit 201 is cut separation simultaneously.With this each coil monomer prepared, the encapsulated layer 102 all there is spiral winding 101, being coated on this spiral winding 101 outside and and first Copper Foil sheet metal 103, the second Copper Foil sheet metal 104 of two ends wire connection of spiral winding 101.(as shown in Figure 2)
The particle type inductance element of the present invention and encapsulation making method thereof, above-mentioned steps is only a kind of embodiment therein, can also be, at the very start, several inductance coils of rectangular (circular, oval or other patterns) array arrangement are placed directly into the upper surface of Copper Foil metallic plate during enforcement, then it is coated on the outside of most inductance coil again with liquid glue, after waiting liquid glue solid, carries out die cut detached job again.And ferroalloy glue is the materials application of a kind of encapsulated layer, encapsulation glue-line is not limited with this material.
Known in sum, the particle type inductance element of the present invention and encapsulation making method thereof, really there is structure more simple, it is more easy to manufacture, implement more elastic, and effect that cost more reduces, such effect can improve the drawback of prior art inductance element, and itself and unexposed use, meet the regulation of Patent Law.
The above is the present invention preferably specific embodiment, if the change that conception under this invention is made, the function of its generation, still without departing from description with diagram contain spiritual time, all should within the scope of the invention, be stated.
Claims (8)
1. the encapsulation making method of a particle type inductance element, it is characterised in that its manufacturing step includes:
Bottom preparation process: make and be available for the bottom that several inductance elements are laid；
Step built by inductance element cloth: several have the inductance element of two outside lead-out wires, and with the array pattern that rectangle or other patterns arrange, cloth is built in the overhead surface of above-mentioned bottom；
Coating step: coat the top of above-mentioned bottom with liquid glue, make liquid glue be coated with completely by several inductance elements, and penetrate into the inside of each inductance element；
Die cut step: after liquid glue is solid, by each inductance element cutting and separating, to make single particulate inductance element.
2. encapsulation making method according to claim 1, it is characterised in that wherein said bottom can be Copper Foil metal level.
3. encapsulation making method according to claim 2, it is characterised in that wherein said bottom, after completing coating step, needs first it to be removed from the bottom of several inductance elements, attaches one layer of Copper Foil metal level then at the bottom of several inductance elements.
4. encapsulation making method according to claim 2, it is characterised in that when wherein said bottom is Copper Foil metal level, if after laying individual inductance element, needs first to be connected on Copper Foil metal level by the two of each inductance element wires, then carries out coating step.
5. the encapsulation making method according to any one of claim 2 to 4, it is characterised in that the surface of wherein said Copper Foil metal level is provided with several guide holes, this guide hole lays respectively at the both sides of inductance element, for being connected with the wire of inductance element.
6. encapsulation making method according to claim 5, it is characterised in that the guide hole of wherein said Copper Foil metal level can be connected for spot welding with the wire linked vector graph of inductance element, welds, grind connection or the connection of matel coated glue.
7. encapsulation making method according to claim 1, it is characterised in that wherein said liquid glue is ferroalloy glue.
8. a particle type inductance element, it is characterised in that this particle type inductance element is via made by the encapsulation making method according to any one of claim 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410775579.9A CN105762140B (en) | 2014-12-15 | Particle type inductance element and its encapsulation making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410775579.9A CN105762140B (en) | 2014-12-15 | Particle type inductance element and its encapsulation making method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105762140A true CN105762140A (en) | 2016-07-13 |
| CN105762140B CN105762140B (en) | 2018-08-31 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW498443B (en) * | 2001-06-21 | 2002-08-11 | Advanced Semiconductor Eng | Singulation method for manufacturing multiple lead-free semiconductor packages |
| CN103377794A (en) * | 2012-04-25 | 2013-10-30 | 佳邦科技股份有限公司 | Power inductance structure free of use of lead frame and manufacturing method thereof |
| US20140292462A1 (en) * | 2013-03-28 | 2014-10-02 | Inpaq Technology Co., Ltd. | Power inductor and method for fabricating the same |
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW498443B (en) * | 2001-06-21 | 2002-08-11 | Advanced Semiconductor Eng | Singulation method for manufacturing multiple lead-free semiconductor packages |
| CN103377794A (en) * | 2012-04-25 | 2013-10-30 | 佳邦科技股份有限公司 | Power inductance structure free of use of lead frame and manufacturing method thereof |
| US20140292462A1 (en) * | 2013-03-28 | 2014-10-02 | Inpaq Technology Co., Ltd. | Power inductor and method for fabricating the same |
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