CN103943598B - A kind of general pre-packaged board structure, encapsulating structure and method for packing - Google Patents
A kind of general pre-packaged board structure, encapsulating structure and method for packing Download PDFInfo
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- CN103943598B CN103943598B CN201410123503.8A CN201410123503A CN103943598B CN 103943598 B CN103943598 B CN 103943598B CN 201410123503 A CN201410123503 A CN 201410123503A CN 103943598 B CN103943598 B CN 103943598B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention discloses a kind of general pre-packaged board structure, encapsulating structure and method for packing, use the golden finger extended to the periphery, after wafer mounts, the scope covering golden finger according to wafer carries out routing, be thus able to adapt to coverage without departing from the wafer specification of golden finger overhanging end, there is good versatility, thus reduce development cost and the cycle of mould, realize quickly encapsulating checking, and then reduce reduction packaging cost and market periods.
Description
Technical field
The present invention relates to a kind of board structure, encapsulating structure and method for packing.
Background technology
Flourish along with electronic industry, electronics technology constantly evolution, electronic product it is also proposed higher requirement to listing required time.How to be rapidly performed by wafer package, it is achieved product electric performance test, to shorten time to market (TTM), increasingly become product design company concern.
Generally speaking, in known wafer package technology, common encapsulating structure as shown in Figure 1A and Figure 1B commonly use substrate, for the coordinate difference of solder joint on different product wafer size difference, wafer, specialized designs processes the substrate matched, and then determine golden finger solder joint and external terminal on substrate according to wafer size and upper solder joint coordinate thereof, then on this substrate, encapsulate wafer package after gold thread welding.
See Figure of description 1A, for known a kind of chip package structure, it mainly comprises a substrate 8a and the wafer 3a mounted in this substrate side, then by a plurality of bonding wire 10a for wafer and the connection of substrate circuit, and a plurality of external terminal 9a connection for substrate circuit Yu external circuit is set on substrate, the circuit on substrate two sides realizes by having the via 5a of Electric connection characteristic, and whole wafer is encapsulated by encapsulated member 1a.
In said structure, wafer is with routing combination technology (Wire
Bonding) electrical connection of the golden finger 4a default with on substrate is realized.External terminal 9a is generally solder ball, for being externally connected to an external printed circuit board.This packaging structure additionally comprises an adhesive body 1a, to seal wafer and gold thread.This kind of design structure is excellent, becomes and uses the most universal chip package structure.But in this kind of structure, on the one hand, being required for different chips and carry out single substrate design, i.e. for various sizes of wafer, substrate versatility is poor；On the other hand, due to the demand of wafer encapsulating, as Figure 1A used 1a encapsulating material wafer is encapsulated, cause the wafer of different-thickness to need the encapsulating mold used different, and the fund of mould and time put into the biggest.
As shown in Figure 1B, the surrounding of the wafer 3b being mounted on substrate 8b is distributed bonding point 6b, and periphery at wafer 3b is distributed the distribution of golden finger 4b, golden finger 4b for being connected with bonding point 6b coupling and depends on the size of wafer further, thus there is independent adaptability.
As can be seen here, above-mentioned known wafer packing body structure and substrate do not have the demand of high universalizable, and affect the market periods of product, therefore, the feature fast for adapting to current chip update, it is necessary to improve further the versatility of encapsulating structure, reduces input cost, shorten product and come into the market the time.
Summary of the invention
Therefore, it is an object of the invention to provide a kind of universal good board structure, encapsulating structure and method for packing of based on pre-packaged technique, to reduce packaging cost and market periods.
The present invention is by the following technical solutions:
According to one aspect of the present invention, a kind of general pre-packaged board structure, including:
Substrate, has first and relative with first second, and first center constitutes wafer attachment benchmark；And the golden finger that radial is distributed on the basis of first center on the first face, and golden finger formation ribbon structure；Offer the via running through substrate in the region that golden finger covers or side, be connected for the circuit electrical with second.
Specifically, the structure of described golden finger is the pyramidal structure of two ends cavetto, and the one end away from substrate center is big end.
Specifically, the most preset external terminal, for the connection of substrate circuit Yu external circuit.
Specifically, all cause encapsulating materials at first are formed with the fence structure of predetermined altitude.
Specifically, the lateral surface of fence structure is concordant with the edge of substrate, and medial surface is frustum of a pyramid side structure.
According to another aspect of the present invention, a kind of general pre-package structure of substrate, including:
Substrate, has first and relative with first second, and first center constitutes wafer attachment benchmark, and is provided with a plurality of vias extending vertically through substrate on substrate；
Golden finger, this golden finger is ribbon structure, thus radial is distributed on the first face, and at least extends to the region at via place on substrate；
Wafer, mounts on the first face, and the golden finger part being positioned at outside pasting area by bonding line and corresponding side is electrically connected with；
Pre-packaged body, all around loads wafer on the first face.
Specifically, described pre-packaged body includes:
Fence structure, is formed at all cause encapsulating materials of first, and has predetermined altitude, and this predetermined altitude is higher than the thickness of mounted wafer；
Lid, device constitutes receiving chamber the suitable for reading of fence structure with fence structure.
Specifically, described substrate is the substrate with at least two-tier circuit wiring.
According to another aspect of the invention, a kind of general pre-packaged method of substrate,
One side at one piece of substrate defines a minimum attachment district and a maximum attachment district, arranges to the linearly extended one group of golden finger of surrounding with periphery, this minimum attachment district for starting point, and golden finger extends maximum attachment district；
Surrounding at substrate constructs the fence structure with predetermined altitude, and maximum attachment district is contained in the region enclosed, and described predetermined altitude is more than the maximum gauge of mounted wafer；
With above-mentioned two step basis of formation structures, thus when encapsulation checking, corresponding wafer is mounted on the basis of substrate center the described one side of substrate, then with the golden finger part routing not covered by this wafer；
Then fence structure is added a cover encapsulation.
Preferably, the step forming described base structure also has, and is electrically connected with by the circuit of wire with substrate another side by extending vertically through the via of substrate one to one with golden finger, and plants ball at substrate another side, to form external terminal.
The present invention uses the golden finger extended to the periphery, after wafer mounts, the scope covering golden finger according to wafer carries out routing, it is thus able to the wafer specification adapting to coverage without departing from golden finger overhanging end, there is good versatility, thus reduce development cost and the cycle of mould, it is achieved quickly encapsulate checking, and then reduce reduction packaging cost and market periods.
Accompanying drawing explanation
Figure 1A is existing conventional a kind of chip package structure schematic diagram.
Figure 1B is the substrate top surface schematic diagram of common substrate encapsulating structure.
Fig. 1 C is based on the general pre-packaged substrate encapsulation structure generalized section of one of the present invention.
Fig. 1 D is based on the end face schematic diagram of substrate in a kind of general pre-packaged substrate encapsulation structure of the present invention.
Detailed description of the invention
Known chip package structure as shown in Figure 1A, is required for concrete product independence die sinking, cycle length, costly, has a strong impact on the cycle that market is thrown in.
On substrate, shown in 1D, the universal pre-packaged substrate of one for according to the present invention:
In figure, substrate 8 is square structure, and has substrate circuit, about the adaptive concrete application of substrate circuit, such as wafer 3 or the chip architecture of stacking, is not related to the improvement of substrate circuit herein, does not repeats them here.Figure only illustrates golden finger and associated structure.
Substrate can mount by one side, it is also possible to two-sided attachment, mounts for one side in the drawings, and the face of attachment wafer 3 is first, it is common that upper surface, relative one side is second, it is common that lower surface.
Generally plant ball in the second face, usually stannum ball, such as the round dot external terminal 7 of black in Fig. 1 D, for the connection of substrate circuit Yu external circuit.
Under normal circumstances, substrate 8 is square structure, and wafer is square or rectangular configuration the most mostly, concentric boxes as shown in Figure 1 D, interior expression wafer 3, takes second place for wafer 3 ', third it is wafer "; figure is simple diagram, is not offered as the stacked structure of three wafer, be to express the function of golden finger and the structure of plan.
Concentric boxes indicates wafer mounting method on the substrate 8, is also not related to new mounting method at this, also repeats no more.After wafer attachment, the region that covered can affect routing, it is illustrated that concentric boxes be conducive to the adaptability reflecting longer golden finger of contrast.
Generally on substrate, correct position arranges via 5, electric connection between multilager base plate circuit, or for the connection of first and second upper device, being shown that golden finger and the connection of external terminal 7 on another side in figure, not shown structure those skilled in the art is the most easy to understand.
The number of via 5 can according on wafer bonding point number carry out quantity Matching, it is also possible to reserved relatively large number of via 5, to meet the adaptability to multiple wafer.
Make large-size bonding wire golden finger on the substrate 8, " bigger " therein shows the length in the direction of extension of golden finger, carry out gold thread welding (routing) adapting to various sizes of wafer, avoid carrying out time and the fund input of substrate customization for different size wafer, improve substrate versatility, as shown in figure ip, golden finger extends to the edge of substrate 8 from wafer 3 periphery.
Fig. 1 C then can clearer reflection encapsulating structure:
In fig. 1 c, substrate 8c makes pre-packaged enclosure wall, fence structure 1c the most as is shown in fig. 1 c, thus on substrate, square cavity is formed by this fence structure 1c, such that it is able in cavity after paster, welding gold thread, for testing after adding lid, lid 11c as shown in Fig. 1 C top, avoid the mould carrying out encapsulating for different product substrate to put into, shorten product and put goods on the market the time, reduce product packaging cost.
Simultaneously, it is to be understood that, for this universal board structure, equally individually die sinking, produce universal encapsulating mould, thus, existing packaged type is the most equally applicable, thus the structure of fence structure 1c cooperation lid 11c is as the preferred mode of one, rather than unique packaged type.
By technological means and effect that the present invention by reach predetermined goal of the invention taked is expanded on further, below in conjunction with accompanying drawing preferred embodiment, to its detailed description of the invention of universal pre-packaged substrate, structure, feature and effect thereof according to the present invention, after describing in detail such as.
According to a preferred embodiment of the present invention, disclosing a kind of universal type basal plate and encapsulating structure thereof, Fig. 1 C is this universal type basal plate and encapsulating structure profile thereof, and Fig. 1 D is the end face schematic diagram for this universal type basal plate.
Referring initially to shown in accompanying drawing 1C, this common substrate encapsulating structure, what it was illustrated as the present invention preferably implements structure, the general pre-packaged substrate package body of the present invention, mainly comprise a substrate 8c, the wafer 3c being mounted on this substrate 8c, the most several external terminal solder ball 9c, this solder ball 9c is for being externally bound to external printed circuit board.
Substrate 8c meets the general concept of wiring board, and as is generally understood, it has and only two faces, and one side carries out the attachment of wafer 3c and welds with gold thread, additionally simultaneously carries out putting of external terminal solder ball and plants.Whole encapsulating structure is from the point of view of signal of telecommunication conduction mode, identical with encapsulating structure shown in tradition Figure 1A, realize chip electrode by gold thread to be connected with the electric attribute of substrate gold finger, by via on substrate, electrical properties is conducted to substrate another side, and is connected with external terminal solder ball.
The most in the present case, specific small size golden finger 4b traditional in golden finger not Figure 1B is welded on substrate, but to the large scale bonding wire golden finger extended around in Fig. 1 D, for convenience of describing, one golden finger is divided into inboard portion 4, mid portion 4 ' and outermost portion 4 ' ' totally three parts, should be appreciated that and in actual substrate, golden finger is an entirety.
If using the less wafer of size 3 in Fig. 1 D, then gold thread be can be used directly electrode on wafer (bonding point) is connected to golden finger inboard portion 4 on substrate；If bigger wafer 3 ' encapsulates, then need to be connected to golden finger mid portion 4 ' on substrate；In like manner, more large-sized wafer 3 ' ' then need to be welded in golden finger outermost portion 4 ' on substrate '.The golden finger of large-size, emitting shape is i.e. set, package requirements according to different size wafer and electrode position distribution on wafer, carry out gold thread welding nearby, make full use of the superiority of large scale golden finger, be greatly improved the suitability for various sizes of wafer package demand of this substrate.
In figure, inboard portion 4 width is less, mid portion ' width is relatively big, and outermost portion 4 " width maximum, generally pyramidal structure, two ends cavetto.In the case of satisfied arrangement spaces compact, resistance is relatively small.
In Fig. 1 D, golden finger directly covers via 5, to realize the electric signal connection of substrate two sides.
For improving packaging efficiency further, shorten wafer package and put goods on the market the time with product, before substrate paster encapsulates, carry out pre-packaged encapsulating process, then carry out wafer attachment, obtain encapsulating structure as shown in Figure 1 C.
On the end face of fence structure, it is coated with suitable organic glue, size appropriate lid is pasted to enclosure wall end face, the closed structure of internal cavities, wafer and gold thread in protection cavity can be formed.This capping process can be able to be realized by general chip mounter, according to the property requirements of glue, can add baking process after attachment, to promote that it bonds completely.And lid selects the unlike material such as metal, plastics, BT organic material also dependent on the real needs of different product.
In structure shown in Fig. 1 C, the medial surface of the fence structure 1c surrounded should be the side of positive truncated rectangular pyramids, it is possible to ensures that it has the structural strength that comparison is high.
There is clearer expression about this pre-package structure substrate used thereof 8c, Fig. 1 C, be the substrate 8c comprising and extending around golden finger 4c.Carrying out pre-packaged technique encapsulating on this substrate 8c, add fence structure 1c on substrate 8c, obtain on substrate is the cavity of surrounding enclosure wall, middle flat.In cavity, carry out wafer 3c attachment, after gold thread 10c welding, add a cover 11c on surrounding enclosure wall, form wafer, gold thread protection zone in cavity so that wafer and gold thread and extraneous physical isolation, plant and carry out electric performance test after adding external terminal solder ball.
About this encapsulated wafer, wafer thickness should be less than pre-packaged enclosure wall height, maybe should be ground to by wafer thickness less than carrying out wafer attachment after enclosure wall height.Wafer length and width size should be less than the cavity size that on this substrate, enclosure wall is formed, can complete wafer attachment process.
In said structure, by pre-packaged encapsulating process, not exclusively encapsulate on substrate before paster, therefore time of fully enclosed mould and fund input after the paster in traditional handicraft can be avoided, reduce cost, shorten the launch products time.
Therefore, the present embodiment enclosure wall that before utilizing paster, pre-packaged technique is formed, the lid added on enclosure wall after adding paster, replace encapsulated member 1a in Figure 1A, and then omit tradition encapsulating mold required time, fund input；Large scale shown in conjunction with, the bonding wire golden finger of transmitting shape, substantially increase substrate versatility.Can first make pre-packaged enclosure wall in substrate, form pre-packaged type common substrate, carry out the gold thread welding of golden finger different parts in conjunction with various sizes of wafer, encapsulation is completed after adding a cover, test, form universal substrate and universal encapsulating structure, it is achieved fast packing is verified.
Fence structure 1c does not encapsulate substrate 8c, and its peripheral structure is concordant with substrate 8c side, simple in construction, and has no effect on envelope survey, and overall structure is more brief.
The thought of said structure can be expressed as method for packing, and it is essentially characterized by:
One side at one piece of substrate defines a minimum attachment district and a maximum attachment district, region as shown in Fig. 1 D wafer 3, represent minimum attachment district, wafer 3 " region that represents; representing maximum attachment district; arrange to the linearly extended one group of golden finger of surrounding with periphery, this minimum attachment district for starting point, golden finger extends and maximum mounts district；
Surrounding at substrate constructs the fence structure with predetermined altitude, and maximum attachment district is contained in the region enclosed, and described predetermined altitude is more than the maximum gauge of mounted wafer；
With above-mentioned two step basis of formation structures, thus when encapsulation checking, corresponding wafer is mounted on the basis of substrate center the described one side of substrate, then with the golden finger part routing not covered by this wafer, nearby principle, considers in routing such as the routing difficulty of gold thread, the number of times of mainly gold thread bending and the angle of bending simultaneously, rationally selecting the contact on golden finger, those skilled in the art the most easily selects；
Then fence structure is added a cover encapsulation.
The step forming described base structure also has, and is electrically connected with by the circuit of wire with substrate another side by extending vertically through the via of substrate one to one with golden finger, and plants ball at substrate another side, to form external terminal.
The above, it it is only presently preferred embodiments of the present invention, not the present invention is done any pro forma restriction, although the present invention is disclosed above with preferred embodiment, but it is not limited to the present invention, any those skilled in the art, in the range of without departing from technical solution of the present invention, when the technology contents of available the disclosure above makes a little change or is modified to the Equivalent embodiments of equivalent variations, in every case it is the content without departing from technical solution of the present invention, the technical spirit of the foundation present invention is to any simple modification made for any of the above embodiments, equivalent variations and modification, all still fall within the range of technical solution of the present invention.
Claims (10)
1. a general pre-packaged board structure, it is characterised in that including:
Substrate (8), has first and relative with first second, and first center constitutes wafer attachment benchmark；And the golden finger that radial is distributed on the basis of first center on the first face, and golden finger formation ribbon structure；Offer the via (5) running through substrate in the region that golden finger covers or side, be connected for the circuit electrical with second.
General pre-packaged board structure the most according to claim 1, it is characterised in that the structure of described golden finger is the pyramidal structure of two ends cavetto, and be big end away from one end of substrate center.
General pre-packaged board structure the most according to claim 1 and 2, it is characterised in that the most preset external terminal, for the connection of substrate circuit Yu external circuit.
General pre-packaged board structure the most according to claim 1 and 2, it is characterised in that be formed with the fence structure (1) of predetermined altitude at all cause encapsulating materials of first.
General pre-packaged board structure the most according to claim 4, it is characterised in that the lateral surface of fence structure (1) is concordant with the edge of substrate (8), and medial surface is frustum of a pyramid side structure.
6. the general pre-package structure of substrate, it is characterised in that including:
Substrate (8c), has first and relative with first second, and first center constitutes wafer attachment benchmark, and is provided with a plurality of vias (5c) extending vertically through substrate on substrate (8c)；
Golden finger, this golden finger is ribbon structure, thus radial is distributed on the first face, and at least extends to the region at via (5c) place on substrate (8c)；
Wafer (3c), mounts on the first face, and the golden finger part being positioned at outside pasting area by bonding line and corresponding side is electrically connected with；
Pre-packaged body, all around loads wafer (3c) on the first face.
The general pre-package structure of substrate the most according to claim 6, it is characterised in that described pre-packaged body includes:
Fence structure (1c), is formed at all cause encapsulating materials of first, and has predetermined altitude, and this predetermined altitude is higher than the thickness of mounted wafer (3c)；
Lid (11c), device constitutes receiving chamber the suitable for reading of fence structure (1c) with fence structure (1c).
8. according to the general pre-package structure of the substrate described in claim 6 or 7, it is characterised in that described substrate is the substrate with at least two-tier circuit wiring.
9. the general pre-packaged method of substrate, it is characterised in that
One side at one piece of substrate defines a minimum attachment district and a maximum attachment district, arranges to the linearly extended one group of golden finger of surrounding with periphery, this minimum attachment district for starting point, and golden finger extends maximum attachment district；
Surrounding at substrate constructs the fence structure with predetermined altitude, and maximum attachment district is contained in the region enclosed, and described predetermined altitude is more than the maximum gauge of mounted wafer；
With above-mentioned two step basis of formation structures, thus when encapsulation checking, corresponding wafer is mounted on the basis of substrate center the described one side of substrate, then with the golden finger part routing not covered by this wafer；
Then fence structure is added a cover encapsulation.
The general pre-packaged method of substrate the most according to claim 9, it is characterized in that, the step forming described base structure also has, it is electrically connected with by the circuit of wire with substrate another side by extending vertically through the via of substrate one to one with golden finger, and plant ball at substrate another side, to form external terminal.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410123503.8A CN103943598B (en) | 2014-03-31 | 2014-03-31 | A kind of general pre-packaged board structure, encapsulating structure and method for packing |
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| CN201410123503.8A CN103943598B (en) | 2014-03-31 | 2014-03-31 | A kind of general pre-packaged board structure, encapsulating structure and method for packing |
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| CN103943598B true CN103943598B (en) | 2016-08-17 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106129037A (en) * | 2016-08-10 | 2016-11-16 | 武汉寻泉科技有限公司 | Multi-project wafer fast packing plate and preparation method thereof, method for packing |
| CN212064501U (en) * | 2020-03-13 | 2020-12-01 | 华为技术有限公司 | Circuit board structure and electronic equipment |
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|---|---|---|---|---|
| US5446080A (en) * | 1993-10-29 | 1995-08-29 | Tomoegawa Paper Co., Ltd. | Liquid adhesive for electronic parts and process for forming insulating adhesive layer using the same |
| WO1998012746A1 (en) * | 1996-09-21 | 1998-03-26 | Mci Computer Gmbh | Semiconductor component and its production method |
| CN201298121Y (en) * | 2008-10-31 | 2009-08-26 | 厦门赛特勒电子有限公司 | LCD module with improved drive chip package structure |
| CN201860510U (en) * | 2010-02-11 | 2011-06-08 | 上海天马微电子有限公司 | Connecting finger and circuit board with same |
| CN203760464U (en) * | 2014-03-31 | 2014-08-06 | 山东华芯半导体有限公司 | Universal pre-packaged substrate structure and package structure |
-
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- 2014-03-31 CN CN201410123503.8A patent/CN103943598B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5446080A (en) * | 1993-10-29 | 1995-08-29 | Tomoegawa Paper Co., Ltd. | Liquid adhesive for electronic parts and process for forming insulating adhesive layer using the same |
| WO1998012746A1 (en) * | 1996-09-21 | 1998-03-26 | Mci Computer Gmbh | Semiconductor component and its production method |
| CN201298121Y (en) * | 2008-10-31 | 2009-08-26 | 厦门赛特勒电子有限公司 | LCD module with improved drive chip package structure |
| CN201860510U (en) * | 2010-02-11 | 2011-06-08 | 上海天马微电子有限公司 | Connecting finger and circuit board with same |
| CN203760464U (en) * | 2014-03-31 | 2014-08-06 | 山东华芯半导体有限公司 | Universal pre-packaged substrate structure and package structure |
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