CN104766712A - Surface mount coil unit and application thereof - Google Patents

Surface mount coil unit and application thereof Download PDF

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Publication number
CN104766712A
CN104766712A CN201410006564.6A CN201410006564A CN104766712A CN 104766712 A CN104766712 A CN 104766712A CN 201410006564 A CN201410006564 A CN 201410006564A CN 104766712 A CN104766712 A CN 104766712A
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CN
China
Prior art keywords
coil unit
surface mount
substrate
magnetic material
mount coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410006564.6A
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Chinese (zh)
Inventor
李玮志
吴家钰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inpaq Technology Co Ltd
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Inpaq Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inpaq Technology Co Ltd filed Critical Inpaq Technology Co Ltd
Priority to CN201410006564.6A priority Critical patent/CN104766712A/en
Publication of CN104766712A publication Critical patent/CN104766712A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a surface mount coil unit and application thereof. The surface mount coil unit is provided with a base plate, wherein the base plate can be made of a magnetic material or a material without magnetism; the lower surface of the base plate is provided with a conductive pattern; two opposite ends of the base plate are provided with a via hole respectively; conductors are filled in the via holes; the conductors are communicated with the conductive pattern on the lower surface of the base plate; the upper surface of the base plate is also provided with a magnetic material layer; a conductor coil with an insulating layer on the surface is arranged on the upper side of the magnetic material layer; two outlet ends of the conductor coil are electrically connected with the conductors of the via holes; the external parts of the conductor coils are wrapped by the magnetic material layer; thus the surface mount coil unit is manufactured; the number of conductor coils is one or more than one which is laminated aiming at power inductance, filter or transformation effects and the like, and the integral package can be finished without using a wire rack.

Description

Surface mount coil unit and application thereof
Technical field
The present invention is relevant a kind of surface mount coil unit and application thereof, refer to especially and do not need to use lead frame to complete overall package, and the conductor coils be located on substrate can be one or more laminated pattern for effects such as power inductance, filtering or transformations.
Background technology
Existing inductance coil, as shown in Figure 1A to Fig. 1 C, that a coil 10 is attached on a circuit board 12, a housing 14 is established in the outside of this coil 10, one first wire 16 is extended outward and one second wire 18, first wire 16 is connected with the pad 20,22 on circuit board respectively with the second wire 18 from housing 14.
This coil 10, take cross section as the helically wound winding body 24 of upright flat wire of square, it is provided with medial extremity 26 and an outboard end 28, so that before by winding body 24 mold, be first connected in one with two ends 34,38 of a lead frame 32 and its medial extremity 26, outboard end 28; Winding body 24 is inserted in mold, and in mold, injects gluey said magnetic powder material, treat that said magnetic powder material drying becomes block, and after the demoulding, finally again lead frame 32 is cut off separation.
Existing inductance coil, owing to needing welding lead frame to implement during moldings formed therefrom, not only can affect production efficiency, also can increase manufacturing cost.And existing coil often only possesses simple function, need make individually coil monomer for the effect such as power inductance, filtering or transformation, be also one of its cost reason that cannot reduce.
In view of existing coil has above-mentioned disappearance in structure, the present inventor, for the method for these disappearance Improvements, through studying for a long time, has the present invention to produce eventually.
Summary of the invention
For solving foregoing problems and reaching object of the present invention, technological means of the present invention is achieved in that a kind of surface mount coil unit and application thereof, it is provided with a substrate, the lower surface of this substrate forms a conductive pattern, two opposite ends of this substrate are respectively provided with the via of a up/down perforation, fill up electric conductor in via, this electric conductor is communicated with the conductive pattern of base lower surface; The upper surface of this substrate forms a magnetic material layer, and the conductor coils of a surperficial tool insulating barrier is established in the top of this magnetic material layer, and the electric conductor electrically connect in two leading-out terminals of conductor coils and via, the outside magnetic material coating layer of conductor coils is coated.
Preferably, described surface mount coil unit, wherein substrate can by magnetic material or do not have magnetic material made by.
Preferably, surface mount coil unit as claimed in claim 3, the oxide material wherein based on iron is the iron oxide that with the addition of manganese, nickel, zinc ion, as manganese-zinc iron oxide or nickel-zinc iron oxide.
Preferably, surface mount coil unit as claimed in claim 3, the alloy material wherein based on iron is the ferroalloy that with the addition of silicon, chromium element, as iron-3.5 silicon-4.5 evanohm.
The application of described surface mount coil unit, it uses the surface mount coil unit any one of claim 1 to claim 5, the conductor coils of push-down stack on two groups is set at the upper surface of substrate, and be provided with two groups of vias, the leading-out terminal of two groups of conductor coils is electrically connected with the conductive pattern of the electric conductor in group via of two on substrate and base lower surface respectively, is embodied as the inductance coil assembly of inductance effect or transformer action with this.
The application of described surface mount coil unit, it uses the surface mount coil unit any one of claim 1 to claim 5, the conductor coils of push-down stack on many groups is set at the upper surface of substrate, and be provided with and organize via more, the leading-out terminal of many groups conductor coils is electrically connected with the conductive pattern of the electric conductor in the many groups via on substrate and base lower surface respectively, is embodied as the inductance coil assembly of inductance effect, filter action, transformer action or ground connection effect with this.
According to the enforcement of above-mentioned technological means, beneficial effect of the present invention and effect as follows:
The present invention does not need to use lead frame, directly completely coated through magnetic material on substrate, and is formed with surface mount and circuit board and electrically conduct.Therefore to have structure more simple in the present invention, and it is more easy to manufacture, and implements to have more elasticity, and the advantage that cost is lower.
As for detailed configuration of the present invention, application principle, effect and effect, then please refer to following adjoint description can be understood completely.
Accompanying drawing explanation
Figure 1A ~ Fig. 1 C is the embodiment schematic diagram of existing power inductance.
Fig. 2 is the generalized section of surface mount coil unit of the present invention.
Fig. 3 A is the schematic perspective view of surface mount coil unit of the present invention.
Fig. 3 B is the conductive pattern schematic diagram of surface mount coil unit of the present invention.
Fig. 4 A is the second embodiment schematic perspective view of surface mount coil unit of the present invention.
Fig. 4 B is the second embodiment floor map of surface mount coil unit of the present invention.
Fig. 4 C is the conductive pattern schematic diagram of the second embodiment of surface mount coil unit of the present invention.Fig. 5 A is the 3rd embodiment schematic perspective view of surface mount coil unit of the present invention.
Fig. 5 B is the 3rd embodiment floor map of surface mount coil unit of the present invention.
Fig. 5 C is the conductive pattern schematic diagram of the 3rd embodiment of surface mount coil unit of the present invention.
[symbol description]
10: coil
12: circuit board
14: housing
16: the first wires
18: the second wires
20,22: pad
24: winding body
26: medial extremity
28: outboard end
32: lead frame
34,38: end
100: surface mount coil unit
100A: substrate
101,102: via
101A, 102A: electric conductor
100B: upper surface
100C: conductive pattern
103: magnetic material layer
104: conductor coils
104A, 104B: leading-out terminal
105: magnetic material coating layer
200: substrate
200A: magnetic material layer
200B: conductive pattern
201: the first groups of conductor coils
201A, 201B: leading-out terminal
211A, 211B: first group of upper/lower electrode via
202: the second groups of conductor coils
202A, 202B: leading-out terminal
212A, 212B: second group of upper/lower electrode via
300: substrate
300A: magnetic material layer
300B: conductive pattern
301: the first groups of conductor coils
301A, 301B: leading-out terminal
311A, 311B: first group of upper/lower electrode via
302: the second groups of conductor coils
302A, 302B: leading-out terminal
312A, 312B: second group of upper/lower electrode via
303: the three groups of conductor coils
303A, 303B: leading-out terminal
313A, 313B: the 3rd group of upper/lower electrode via
Embodiment
Surface mount coil unit of the present invention, as Fig. 2, Fig. 3 A, shown in Fig. 3 B, this surface mount coil unit 100, a substrate 100A is established in bottom, this substrate 100A can made by magnetic material or by do not have magnetic material made by, the upper surface 100B of this substrate 100A establishes a magnetic material layer 103, the lower surface of this substrate 100A establishes a conductive pattern 100C, two opposite ends of this substrate 100A are respectively provided with the via 101 that makes upper/lower electrode conducting, 102, via 101, the electric conductor 101A of tool conductive characteristic is filled up in 102, 102A, this electric conductor 101A, 102A is connected with the conductive pattern 100C of substrate 100A lower surface.
As shown in the figure, the conductor coils 104 of a surperficial tool insulating barrier is provided with above the magnetic material layer 103 of substrate 100A, this conductor coils 104 has multi-layer helical coil, its two leading-out terminal 104A, 104B extend to via 101,102 respectively, via electric conductor 101A, 102A electrically connect in the methods such as welding and via 101,102, the outside of conductor coils 104 is coated by a magnetic material coating layer 105.
The above-mentioned magnetic material in order to make substrate 100A, or in order to the magnetic material layer of coating conductor coil 104, can be the oxide material based on iron or the alloy material based on iron.Oxide material wherein based on iron is the iron oxide that with the addition of manganese, nickel, zinc ion, as manganese-zinc iron oxide or nickel-zinc iron oxide; Alloy material based on iron can be the ferroalloy that with the addition of silicon, chromium element, as iron-3.5 silicon-4.5 evanohm.
As shown in the figure, surface mount coil unit of the present invention, because conductor coils 104 is the upper surfaces being located at substrate 100A, through magnetic material layer 103 and magnetic material coating layer 105 complete coated, then the conductive pattern 100C of electric conductor 101A, 102A in via 101,102 and substrate 100A lower surface is electrically connected conducting.Namely, without the need to using lead frame, integral coating can be completed, and surface mount uses in circuit board (not shown).
Cause is without the need to using lead frame, and not only can reduce the setup cost of lead frame, can simplify the program of manufacturing again, thus cost is minimized, production efficiency is promoted.
Surface mount coil unit of the present invention, during application implementation, can as shown in Fig. 4 A, Fig. 4 B, Fig. 4 C, with magnetic material or do not have magnetic material made by substrate 200 on, respectively form two groups of upper/lower electrode vias 211A, 211B, 212A, 212B in its position, two opposite ends, be equipped with electric conductor in these two groups of upper/lower electrode vias 211A, 211B, 212A, 212B and be connected with the conductive pattern 200B of substrate 200 lower surface.The upper surface of substrate 200 forms a magnetic material layer 200A, the top of this magnetic material layer 200A arranges the conductor coils 201,202 of two groups of surface tool insulating barriers, and these two groups of conductor coils 201,202 are the pattern (also can be and twine pattern mutually) that changes mutually up and down;
Wherein, two leading-out terminal 201A, 201B of first group of conductor coils 201 are connected to first group of upper/lower electrode via 211A, 211B of substrate 200, two leading-out terminal 202A, 202B of second group of conductor coils 202 are connected to second group of upper/lower electrode via 212A, 212B of substrate 200, finally again with magnetic material coating layer (not shown) by upper and lower two groups of conductor coils 201,202 coated.
This possesses the surface mount coil unit of two groups of conductor coils, when surface mount is implemented on circuit boards, can utilize the mutual induction of upper and lower two groups of conductor coils 201,202, and be inductance effect or transformer action.
Surface mount coil unit of the present invention, during application implementation, again can as shown in Fig. 5 A, 5B, one with magnetic material or do not have magnetic material made by substrate 300 on, respectively form three groups of upper/lower electrode vias 311A, 311B, 312A, 312B, 313A, 313B in its position, two opposite ends, be equipped with electric conductor in these three groups of upper/lower electrode vias 311A, 311B, 312A, 312B, 313A, 313B and be connected with the conductive pattern 300B of substrate 300 lower surface.The upper surface of substrate 300 forms a magnetic material layer 300A, and the top of this magnetic material layer 300A arranges the conductor coils 301,302,303 of three groups of surface tool insulating barriers, and these three groups of conductor coils 301,302,303 can be and change pattern up and down mutually or be wound around pattern.
Wherein, two leading-out terminal 301A, 301B of first group of conductor coils 301 are connected to first group of upper/lower electrode via 311A, 311B of substrate 300; Two leading-out terminal 302A, 302B of second group of conductor coils 302 are connected to second group of upper/lower electrode via 312A, 312B of substrate 300; Two leading-out terminal 303A, 303B of 3rd group of conductor coils 303 are connected to the 3rd group of upper/lower electrode via 313A, 313B of substrate 300, finally again with magnetic material coating layer (not shown) by three groups of conductor coils 301,302,303 coated.
This possesses the surface mount coil unit of three groups of conductor coils, when surface mount is implemented on circuit boards, can two groups of conductor coils be inductance effect or transformer action, and another group conductor coils is ground connection effect.
In sum, surface mount coil unit of the present invention and application thereof, have structure more simple really, and it is more easy to manufacture, and implements to have more elasticity, and cost is lower, and these effects can improve the drawback of existing power inductance.
The above is the better specific embodiment of the present invention, if the change done according to conception of the present invention, its function produced, do not exceed that specification and diagram contain yet spiritual time, all should be within the scope of the invention.

Claims (7)

1. a surface mount coil unit, is characterized in that, it is provided with a substrate, the lower surface of this substrate forms a conductive pattern, two opposite ends of this substrate are respectively provided with the via of a up/down perforation, fill up electric conductor in via, and this electric conductor is communicated with the conductive pattern of base lower surface; The upper surface of this substrate forms a magnetic material layer, and the conductor coils of a surperficial tool insulating barrier is established in the top of this magnetic material layer, and the electric conductor electrically connect in two leading-out terminals of conductor coils and via, the outside magnetic material coating layer of conductor coils is coated.
2. surface mount coil unit as claimed in claim 1, is characterized in that, wherein substrate can by magnetic material or do not have magnetic material made by.
3., as surface mount coil unit according to claim 1 or claim 2, it is characterized in that, wherein magnetic material or magnetic material coating layer, is the oxide material based on iron or the alloy material based on iron.
4. surface mount coil unit as claimed in claim 3, the oxide material wherein based on iron is manganese-zinc iron oxide or nickel-zinc iron oxide.
5. surface mount coil unit as claimed in claim 3, the alloy material wherein based on iron is iron-3.5 silicon-4.5 evanohm.
6. the application of a surface mount coil unit, it is characterized in that, it uses the surface mount coil unit any one of claim 1 to claim 5, the conductor coils of push-down stack on two groups is set at the upper surface of substrate, and be provided with two groups of vias, the leading-out terminal of two groups of conductor coils is electrically connected with the conductive pattern of the electric conductor in group via of two on substrate and base lower surface respectively, is embodied as the inductance coil assembly of inductance effect or transformer action with this.
7. the application of a surface mount coil unit, it is characterized in that, it uses the surface mount coil unit any one of claim 1 to claim 5, the conductor coils of push-down stack on many groups is set at the upper surface of substrate, and be provided with and organize via more, the leading-out terminal of many groups conductor coils is electrically connected with the conductive pattern of the electric conductor in the many groups via on substrate and base lower surface respectively, is embodied as the inductance coil assembly of inductance effect, filter action, transformer action or ground connection effect with this.
CN201410006564.6A 2014-01-07 2014-01-07 Surface mount coil unit and application thereof Pending CN104766712A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410006564.6A CN104766712A (en) 2014-01-07 2014-01-07 Surface mount coil unit and application thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410006564.6A CN104766712A (en) 2014-01-07 2014-01-07 Surface mount coil unit and application thereof

Publications (1)

Publication Number Publication Date
CN104766712A true CN104766712A (en) 2015-07-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410006564.6A Pending CN104766712A (en) 2014-01-07 2014-01-07 Surface mount coil unit and application thereof

Country Status (1)

Country Link
CN (1) CN104766712A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105810389A (en) * 2015-09-11 2016-07-27 广州成汉电子科技有限公司 Coil device
CN106298157A (en) * 2015-06-25 2017-01-04 威华微机电股份有限公司 Preform for magnetic core inductor and mass production method thereof
CN108257943A (en) * 2016-12-29 2018-07-06 今展科技股份有限公司 Inductor packaging structure and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106298157A (en) * 2015-06-25 2017-01-04 威华微机电股份有限公司 Preform for magnetic core inductor and mass production method thereof
CN106298157B (en) * 2015-06-25 2018-08-03 威华微机电股份有限公司 Preform for magnetic core inductor and mass production method thereof
CN105810389A (en) * 2015-09-11 2016-07-27 广州成汉电子科技有限公司 Coil device
CN105810389B (en) * 2015-09-11 2017-12-08 广州成汉电子科技有限公司 Coil device
CN108257943A (en) * 2016-12-29 2018-07-06 今展科技股份有限公司 Inductor packaging structure and preparation method thereof

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Application publication date: 20150708