CN109121293B - Printed circuit board assembly and electronic device - Google Patents
Printed circuit board assembly and electronic device Download PDFInfo
- Publication number
- CN109121293B CN109121293B CN201811154121.6A CN201811154121A CN109121293B CN 109121293 B CN109121293 B CN 109121293B CN 201811154121 A CN201811154121 A CN 201811154121A CN 109121293 B CN109121293 B CN 109121293B
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- Prior art keywords
- circuit board
- shielding
- printed circuit
- assembly
- areas
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The embodiment of the invention relates to the technical field of circuits, and discloses a printed circuit board assembly and electronic equipment. A printed circuit board assembly comprising: a first circuit board and a second circuit board; the first circuit board is electrically connected with the second circuit board; the first circuit board is provided with N device areas, wherein N is an integer greater than or equal to 1; a plurality of components are welded in the N component areas; the second circuit board is provided with N hollow areas, the second circuit board is covered on the first circuit board, and the hollow areas correspond to the device areas one by one; at least one component is connected to the second circuit board through the traces on the first circuit board, connected to the first circuit board through the traces on the second circuit board, and connected to another component through the traces on the first circuit board. According to the invention, the thickness of the printed circuit board assembly is reduced under the condition of ensuring sufficient wiring space of the first circuit board; meanwhile, compared with the prior art, the manufacturing cost is reduced.
Description
Technical Field
The embodiment of the invention relates to the technical field of circuits, in particular to a printed circuit board assembly and electronic equipment.
Background
At present, a single Board Printed Circuit Board (PCB) design method is to place various electronic components on a PCB, then connect lines between each planar layer on the surface and inside of the PCB, and connect pins of different components to realize signal transmission between the components.
In the design of a highly integrated single-board PCB, especially a mobile phone mainboard PCB, because the PCB is small in size, the components are densely arranged, and in addition, the number of through holes in the PCB is too large, the space is insufficient during the wiring of the PCB, and at the moment, the PCB with a double-layer or multi-layer structure can be formed by increasing the number of layers in the PCB so as to increase the wiring space.
The inventor finds that at least the following problems exist in the prior art: in the prior art, when the number of layers is increased in the PCB to form a double-layer or multi-layer structure to increase the wiring space of the PCB, the thickness of the PCB is increased, and meanwhile, the manufacturing cost of the whole PCB is obviously increased.
Disclosure of Invention
An object of embodiments of the present invention is to provide a printed circuit board assembly and an electronic device, which reduce the thickness of the printed circuit board assembly under the condition that the wiring space of a first circuit board is ensured to be sufficient; meanwhile, the manufacturing cost is not increased basically.
To solve the above technical problem, an embodiment of the present invention provides a printed circuit board assembly including: a first circuit board and a second circuit board; the first circuit board is electrically connected with the second circuit board; the first circuit board is provided with N device areas, wherein N is an integer greater than or equal to 1; a plurality of components are welded in the N component areas; the second circuit board is provided with N hollow areas, the second circuit board is covered on the first circuit board, and the hollow areas correspond to the device areas one by one; at least one component is connected to the second circuit board through the traces on the first circuit board, connected to the first circuit board through the traces on the second circuit board, and connected to another component through the traces on the first circuit board.
An embodiment of the present invention also provides an electronic device, including: at least one printed circuit board assembly is provided.
Compared with the prior art, the embodiment of the invention has the advantages that a plurality of components are welded in N component areas on the first circuit, N hollow-out areas on the second circuit board cover the second circuit board on the first circuit board, the N hollow-out areas on the second circuit board correspond to the N component areas on the first circuit board one by one respectively, so that the second circuit board can be attached to the first circuit board, at least one component is connected to the second circuit board through a wire on the first circuit board and connected to the first circuit board through a wire on the second circuit board and connected to another component through a wire on the first circuit board, the wiring space of the first circuit board is increased through the second circuit board, and the thickness of the printed circuit board assembly is reduced under the condition of ensuring sufficient wiring space of the first circuit board; meanwhile, compared with the prior art (a double-layer or multi-layer structure is formed by increasing the number of layers in the PCB), the manufacturing cost is reduced.
In addition, there is at least one shielding region in the N device regions; the printed circuit board assembly further comprises: at least one shielding member; the shielding pieces correspond to the shielding areas one by one; each shielding piece is fixed on the second circuit board and covers the shielding area corresponding to the shielding piece. In this embodiment, when at least one shielding region exists in the N device regions, the shielding member may cover the corresponding shielding region, so that interference may be shielded.
In addition, the second circuit board is a double-sided circuit board or a multilayer circuit board. In this embodiment, the second circuit board covering the first circuit board is a double-sided circuit board or a multilayer circuit board, thereby further increasing the wiring space of the first circuit board.
In addition, the thickness of the second circuit board is larger than the maximum height of the plurality of components. In this embodiment, the thickness of the second circuit board is greater than the maximum height of the plurality of components, so that the shielding member is convenient to set when at least one shielding region exists in the N device regions.
In addition, the shielding member is a shielding sheet. In the embodiment, the shielding piece is used as the shielding piece, so that the manufacturing is simple and the cost is low.
In addition, the first circuit board is electrically connected with the second circuit board through at least one welding disc; at least one welding disc is arranged at the signal connection position of the first circuit board and the second circuit board. This embodiment provides a specific implementation of the electrical connection of the first circuit board to the second circuit board.
In addition, the first circuit board is electrically connected with the second circuit board through at least one connector; the at least one connector is arranged at the signal connection position of the first circuit board and the second circuit board. This embodiment provides another specific implementation of the electrical connection of the first circuit board to the second circuit board.
In addition, the shielding sheet is a steel sheet.
In addition, the thickness of the shielding sheet is greater than or equal to 0.1 mm and less than or equal to 0.2 mm.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a plan view of a first circuit board according to a first embodiment of the present invention;
fig. 2 is a plan view of a second circuit board according to the first embodiment of the present invention;
fig. 3 is a top view of a printed circuit board assembly according to a first embodiment of the present invention;
fig. 4 is a cross-sectional view of a printed circuit board assembly according to a second embodiment of the invention, wherein the thickness of the second circuit board is greater than or equal to the maximum height of the plurality of components on the first circuit board;
fig. 5 is a cross-sectional view of a printed circuit board assembly according to a second embodiment of the invention, wherein the thickness of the second circuit board is less than the maximum height of the plurality of components on the first circuit board;
fig. 6 is a plan view of a printed circuit board assembly according to a third embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
A first embodiment of the present invention relates to a printed circuit board assembly applied to an electronic device, such as a mobile phone, a tablet computer, and the like. Referring to fig. 1 to 3, the printed circuit board assembly includes: a first circuit board 1 and a second circuit board 2; the first circuit board 1 is electrically connected to the second circuit board 2.
Referring to fig. 1, the first circuit board 1 has N device regions 11, and a plurality of components 3 are soldered in the N device regions 11, where N is an integer greater than or equal to 1, and a shape and a size of each device region 11 need to be set according to a size of the component 3 disposed therein. It should be noted that, in this embodiment and the following embodiments, N is equal to 2, that is, 2 device regions 11 are provided on the first circuit board 1, which is used as an example for description, however, the size of N is not limited, and the number of the device regions 11 on the first circuit board 1 may be set as required.
Referring to fig. 2 and fig. 3, the second circuit board 2 has N hollow areas 21, that is, the number of the hollow areas 21 on the second circuit board 2 is equal to the number of the device areas on the first circuit board 1, and the manufacturing method of the second circuit board 2 specifically includes: on a complete circuit board, according to the shape and size of the N device areas 11 on the first circuit board 1, hollowed-out areas 21 corresponding to the device areas 11 one by one are dug on the circuit board, and a second circuit board 2 with the N hollowed-out areas 21 is formed. Therefore, when the second circuit board 2 is covered on the first circuit board 1, the second circuit board 2 can be attached to the first circuit board 1.
In one example, the second circuit board 2 is a double-sided circuit board or a multilayer circuit board, so that multilayer wiring can be performed on the second circuit board 2, and the wiring space of the first circuit board 1 is further increased.
It should be noted that, in this embodiment, a device region may also be disposed on the second circuit board 2 for soldering a component, but this embodiment does not limit this.
In this embodiment, at least one component 3 on the first circuit board 1 is connected to the second circuit board 2 through a trace on the first circuit board 1, and then connected to the first circuit board 1 through a trace on the second circuit board 2, and connected to another component 3 through a trace on the first circuit board 1, so that the electrical connection between the component 3 on the first circuit board 1 and the another component 3 on the first circuit board 1 can be realized through the trace on the second circuit board 2, and the wiring space of the first circuit board 1 is increased by using the second circuit board 2.
Compared with the prior art, the printed circuit board assembly has the advantages that the multiple components are welded in the N component areas on the first circuit, the N hollow-out areas on the second circuit board cover the second circuit board on the first circuit board, the N hollow-out areas on the second circuit board correspond to the N component areas on the first circuit board one by one, so that the second circuit board can be attached to the first circuit board, at least one component is connected to the second circuit board through the routing on the first circuit board, connected to the first circuit board through the routing on the second circuit board, and connected to another component through the routing on the first circuit board, the routing space of the first circuit board is increased through the second circuit board, and the thickness of the printed circuit board assembly is reduced under the condition that the sufficient routing space of the first circuit board is ensured; meanwhile, compared with the prior art (a double-layer or multi-layer structure is formed by increasing the number of layers in the PCB), the manufacturing cost is reduced.
A second embodiment of the present invention relates to a printed circuit board assembly. The second embodiment is substantially the same as the first embodiment, and mainly differs therefrom in that: in this embodiment, please refer to fig. 4 and 5, the printed circuit board assembly further includes at least one shielding element 4.
In this embodiment, there is at least one shielding region in the N device regions 11 on the first circuit board 1, that is, the device 3 in the shielding region needs to shield other devices 3 or external electromagnetic interference, the shielding members 4 correspond to the shielding regions one to one, the size and the shape of the shielding member 4 correspond to the shielding region, the shielding member 4 is welded on the second circuit board 2, and the shielding region corresponding to the shielding member 4 is covered to shield the shielding region. The shielding member 4 may be made of steel, cupronickel, tinplate, or the like.
Referring to fig. 4, when the thickness of the second circuit board 2 is greater than or equal to the maximum height of the plurality of components 3 on the first circuit board 1, the shielding member 4 may be a shielding plate, such as a steel plate, and the thickness of the shielding plate 4 is greater than or equal to 0.1 mm and less than or equal to 0.2 mm. When the shielding sheet 4 is welded on the second circuit board 2, the shielding sheet covers the shielding area corresponding to the shielding sheet, the hollow-out area of the second circuit board 2 surrounds the components 3 in the shielding area, the shielding of the shielding area is realized through the combination of the shielding sheet 4 and the second circuit board 2, the components 3 in the shielding area are prevented from being interfered, and compared with the existing shielding cover, the shielding cover is simple to manufacture and low in cost; in addition, since the shape of the shield plate 4 corresponds to the shape of the shield region, the occupation of the wiring space on the second circuit board 2 can be minimized. It should be noted that, in this embodiment, it is only necessary to ensure that the thickness of the second circuit board 2 is greater than the maximum height of the component 3 in the shielding region.
Referring to fig. 5, when the thickness of the second circuit board 2 is smaller than the maximum height of the plurality of components 3 on the first circuit board 1, the shielding element 4 is a shielding cover, and when the shielding cover is welded on the second circuit board 2, the shielding cover covers the shielding area corresponding to the shielding element 4 to shield the shielding area.
It should be noted that, in the present embodiment, only the arrangement and the number of the components 3 on the first circuit board 1 are schematically given, and the routing of the components 3 on the first circuit board 1 and the second circuit board 2 is not shown in detail, and the specific routing needs to be arranged according to the actual connection condition of the components 3.
In this embodiment, a description is given by taking an example in which one shielding region exists in the N device regions 11 on the first circuit board 1, but this embodiment does not set any limit to the number of shielding regions existing in the N device regions 11 of the first circuit board 1.
In this embodiment, when at least one shielding region exists in the N device regions, the shielding region can be covered by the shielding member, so that interference can be shielded.
A third embodiment of the present invention relates to a printed circuit board assembly. The second embodiment is substantially the same as the first embodiment, and mainly differs therefrom in that: specific implementations of the electrical connection of the first circuit board 1 with the second circuit board 2 are provided.
In this embodiment, referring to fig. 6, the first circuit board 1 is electrically connected to the second circuit board 2 through at least one pad 5, and the at least one pad 5 is disposed at a signal connection position of the first circuit board 1 and the second circuit board 2, specifically, the pads 5 are respectively designed at positions on the first circuit board 1 and the second circuit board 2 where signal connection is required, and then the positions where the pads 5 are designed on the first circuit board 1 and the second circuit board 2 are soldered together, so that the first circuit board 1 and the second circuit board 2 can be electrically connected.
It should be noted that, in fig. 6, the first circuit board 1 and the second circuit board 2 are exemplified to be electrically connected through the at least one pad 5, but not limited thereto, the first circuit board 1 and the second circuit board 2 are also electrically connected through at least one connector, at this time, the at least one connector is disposed at a signal connection position of the first circuit board 1 and the second circuit board 2, specifically, a male connector of the connector is disposed on the first circuit board 1, a female connector of the connector is disposed on the second circuit board 2, and after the male connector is connected with the female connector, the first circuit board 1 and the second circuit board 2 can be electrically connected.
The present embodiment provides a specific implementation manner of electrically connecting the first circuit 1 and the second circuit board, compared to the first embodiment. The present embodiment can also be modified from the second embodiment to achieve the same technical effects.
A fourth embodiment of the present invention relates to an electronic device, such as a mobile phone, a tablet computer, and the like. The electronic device includes the printed circuit board assembly according to any one of the first to third embodiments, the printed circuit board assembly may be a main board of the electronic device, and the component on the printed circuit board assembly may be a processor, a memory, and the like inside the electronic device.
Compared with the prior art, the printed circuit board assembly has the advantages that the multiple components are welded in the N component areas on the first circuit, the N hollow-out areas on the second circuit board cover the second circuit board on the first circuit board, the N hollow-out areas on the second circuit board correspond to the N component areas on the first circuit board one by one, so that the second circuit board can be attached to the first circuit board, at least one component is connected to the second circuit board through the routing on the first circuit board, connected to the first circuit board through the routing on the second circuit board, and connected to another component through the routing on the first circuit board, the routing space of the first circuit board is increased through the second circuit board, and the thickness of the printed circuit board assembly is reduced under the condition that the sufficient routing space of the first circuit board is ensured; meanwhile, compared with the prior art (a double-layer or multi-layer structure is formed by increasing the number of layers in the PCB), the manufacturing cost is reduced.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (9)
1. A printed circuit board assembly, comprising: a first circuit board and a second circuit board; the first circuit board is electrically connected with the second circuit board;
the first circuit board is provided with N device areas, wherein N is an integer greater than or equal to 1; a plurality of components are welded in the N device areas;
the second circuit board is provided with N hollow areas, the second circuit board is covered on the first circuit board, and the hollow areas correspond to the device areas one by one;
at least one of the components is connected to the second circuit board through the traces on the first circuit board, connected to the first circuit board through the traces on the second circuit board, and connected to the other component through the traces of the first circuit board;
at least one shielding region exists in the N device regions; the printed circuit board assembly further comprises: at least one shielding member; the shielding pieces correspond to the shielding areas one by one; each shielding piece is fixed on the second circuit board and covers the shielding area corresponding to the shielding piece.
2. The printed circuit board assembly of claim 1, wherein the second circuit board is a double-sided circuit board or a multilayer circuit board.
3. The printed circuit board assembly of claim 1, wherein the thickness of the second circuit board is greater than a maximum height of the plurality of components.
4. The printed circuit board assembly of claim 3, wherein the shield is a shield sheet.
5. The printed circuit board assembly of claim 1, wherein the first circuit board is electrically connected to the second circuit board by at least one solder pad;
the at least one welding disc is arranged at the signal connection position of the first circuit board and the second circuit board.
6. The printed circuit board assembly of claim 1, the first circuit board electrically connected to the second circuit board by at least one connector;
the at least one connector is arranged at the signal connection position of the first circuit board and the second circuit board.
7. The printed circuit board assembly of claim 4, the shielding sheet being a steel sheet.
8. The printed circuit board assembly of claim 4, the shield sheet having a thickness greater than or equal to 0.1 millimeters and less than or equal to 0.2 millimeters.
9. An electronic device, comprising: the printed circuit board assembly of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811154121.6A CN109121293B (en) | 2018-09-30 | 2018-09-30 | Printed circuit board assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811154121.6A CN109121293B (en) | 2018-09-30 | 2018-09-30 | Printed circuit board assembly and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109121293A CN109121293A (en) | 2019-01-01 |
| CN109121293B true CN109121293B (en) | 2020-05-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811154121.6A Active CN109121293B (en) | 2018-09-30 | 2018-09-30 | Printed circuit board assembly and electronic device |
Country Status (1)
| Country | Link |
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| CN (1) | CN109121293B (en) |
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| EP0712266A2 (en) * | 1994-11-10 | 1996-05-15 | Vlt Corporation | Packaging electrical components |
| CN1133498A (en) * | 1994-11-16 | 1996-10-16 | 日本电气株式会社 | Installation for circuit elements |
| WO1999025163A1 (en) * | 1997-11-10 | 1999-05-20 | Caterpillar Inc. | Modular circuit board construction and method of producing the same |
| JP2000196213A (en) * | 1998-12-25 | 2000-07-14 | Olympus Optical Co Ltd | Electronic unit |
| JP2001267710A (en) * | 2000-03-15 | 2001-09-28 | Sony Corp | Electronic circuit device and multilayer printed wiring board |
| CN1094717C (en) * | 1995-11-16 | 2002-11-20 | 松下电器产业株式会社 | PC board and fixing body thereof |
| CN1550123A (en) * | 2001-08-31 | 2004-11-24 | 埃普科斯股份有限公司 | Component arrangement |
| CN102845140A (en) * | 2010-04-13 | 2012-12-26 | At&S奥地利科技及系统技术股份公司 | Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein |
| JP2012256804A (en) * | 2011-06-10 | 2012-12-27 | Dainippon Printing Co Ltd | Component-built-in wiring board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7015571B2 (en) * | 2003-11-12 | 2006-03-21 | Advanced Semiconductor Engineering, Inc. | Multi-chips module assembly package |
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2018
- 2018-09-30 CN CN201811154121.6A patent/CN109121293B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677623A (en) * | 1992-08-25 | 1994-03-18 | Sony Corp | Electronic circuit device and manufacture thereof |
| EP0712266A2 (en) * | 1994-11-10 | 1996-05-15 | Vlt Corporation | Packaging electrical components |
| CN1133498A (en) * | 1994-11-16 | 1996-10-16 | 日本电气株式会社 | Installation for circuit elements |
| CN1094717C (en) * | 1995-11-16 | 2002-11-20 | 松下电器产业株式会社 | PC board and fixing body thereof |
| WO1999025163A1 (en) * | 1997-11-10 | 1999-05-20 | Caterpillar Inc. | Modular circuit board construction and method of producing the same |
| JP2000196213A (en) * | 1998-12-25 | 2000-07-14 | Olympus Optical Co Ltd | Electronic unit |
| JP2001267710A (en) * | 2000-03-15 | 2001-09-28 | Sony Corp | Electronic circuit device and multilayer printed wiring board |
| CN1550123A (en) * | 2001-08-31 | 2004-11-24 | 埃普科斯股份有限公司 | Component arrangement |
| CN102845140A (en) * | 2010-04-13 | 2012-12-26 | At&S奥地利科技及系统技术股份公司 | Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein |
| JP2012256804A (en) * | 2011-06-10 | 2012-12-27 | Dainippon Printing Co Ltd | Component-built-in wiring board |
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| Publication number | Publication date |
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| CN109121293A (en) | 2019-01-01 |
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