CN101730384A - Soft hard circuit board - Google Patents
Soft hard circuit board Download PDFInfo
- Publication number
- CN101730384A CN101730384A CN200810169134A CN200810169134A CN101730384A CN 101730384 A CN101730384 A CN 101730384A CN 200810169134 A CN200810169134 A CN 200810169134A CN 200810169134 A CN200810169134 A CN 200810169134A CN 101730384 A CN101730384 A CN 101730384A
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- CN
- China
- Prior art keywords
- soft
- circuit board
- circuit
- hard circuit
- shielded film
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a soft hard circuit board, comprising a plurality of hard circuits, a soft circuit and a shielding film. The soft circuit is connected among the hard circuits, and is provided with a grounding pad which is exposed on one surface of the soft circuit. The shielding film covers the surface of the soft circuit, and is connected with the grounding pad. Therefore, the shielding film covering on the soft circuit is directly connected with the grounding pad of the soft circuit to ensure that the shielding film is indirectly connected with the grounding of the hard circuits through the soft circuit.
Description
Technical field
The invention relates to a kind of wiring board, and particularly relevant for a kind of soft hard circuit board that has soft circuit and rigid circuit simultaneously.
Background technology
With regard to the soft or hard different in kind of dielectric layer, wiring board comprises rigid wiring board (abbreviation hardboard), Flexible Printed Circuit (abbreviation soft board) and soft hard circuit board (abbreviation rigid-flex).The processing procedure of rigid-flex is made the conducting wire simultaneously on soft dielectric layer and rigid dielectric layer, this makes rigid-flex have soft circuit and rigid circuit simultaneously.Under the situation of the rapid compression in the inner space of electronic product, because rigid-flex provides part to connect and the maximum flexibility of assembling space, so electronic product often adopts rigid-flex as its part carrier.
Summary of the invention
The invention provides a kind of soft hard circuit board, so that shield effectiveness to be provided.
The present invention proposes a kind of soft hard circuit board, and it comprises a plurality of rigid circuits, a soft circuit and a shielded film.Soft circuit is connected between these rigid circuits, and has a ground mat, and it is exposed to a surface of soft circuit.Shielded film covers the surface of soft circuit, and connects ground mat.
In one embodiment of this invention, soft circuit has a protuberance, its outstanding lateral margin from soft circuit, and ground mat is positioned at protuberance.
In one embodiment of this invention, soft circuit has an earth connection, and ground mat is the part of earth connection.
In one embodiment of this invention, soft circuit has more a soft dielectric layer, and it covers earth connection, but exposes ground mat.
In one embodiment of this invention, shielded film is connected to the ground connection of these rigid circuits by earth connection.
In one embodiment of this invention, soft hard circuit board more comprises a soft insulating barrier, and it is disposed on the surface of soft circuit, and covers shielded film.
In one embodiment of this invention, shielded film is a conductive material.
In one embodiment of this invention, shielded film is a silverskin.
The present invention more proposes a kind of electronic installation, and it comprises above-mentioned soft hard circuit board.
Based on above-mentioned, the present invention is by the direct ground mat that connects soft circuit of shielded film that will cover on the soft circuit, so that shielded film is connected to the ground connection of these rigid circuits indirectly by soft circuit.
Description of drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, below in conjunction with accompanying drawing the specific embodiment of the present invention is elaborated, wherein:
Fig. 1 is the vertical view of a kind of soft hard circuit board of embodiments of the invention.
Fig. 2 is the enlarged drawing of a-quadrant of the soft hard circuit board of Fig. 1.
Fig. 3 is the profile along the 3-3 line of the soft hard circuit board of Fig. 2.
The main element symbol description:
100: soft hard circuit board
110: rigid circuit
120: soft circuit
120a: protuberance
122: conductive pattern
122a: earth connection
122a ': ground mat
122b: holding wire
124: soft dielectric layer
124a: opening
130: shielded film
140: soft insulating barrier
Embodiment
Fig. 1 is the vertical view of a kind of soft hard circuit board of embodiments of the invention.Please refer to Fig. 1, the soft hard circuit board 100 of present embodiment has a plurality of rigid circuits 110 and a soft circuit 120.These rigid circuits 110 be with rigid dielectric material as its dielectric layer material, and these rigid circuits 110 are to be used for carrying electronic component or connector.In addition, as its dielectric layer material, and soft circuit 120 is connected between these rigid wiring boards 110 with the soft dielectric material for 120 in soft circuit, in order to transmit electrical signals.
Fig. 2 is the enlarged drawing of a-quadrant of the soft hard circuit board of Fig. 1, and Fig. 3 is the profile along the 3-3 line of the soft hard circuit board of Fig. 2.Please refer to Fig. 1, Fig. 2 and Fig. 3, in order to provide good shielding to many leads in the soft circuit 120, soft hard circuit board 100 more comprises a shielded film 130 (see figure 3)s, and it covers a surface of soft circuit 120.
In order to allow shielded film 130 ground connection, soft circuit 120 has a ground mat 122a ', and it is exposed to the above-mentioned surface of soft circuit 120, as shown in Figure 3.Therefore, when shielded film 130 covers the above-mentioned surface of soft circuit 120, shielded film 130 will pass the top soft dielectric layer 124 opening 124a and structurally connect ground mat 122a ', in order to be electrically connected to the ground connection of rigid circuit 110.
In the present embodiment, shielded film 130 can be connected to the ground connection of rigid circuit 110 via ground mat 122a '.The shielded film 130 of conductive material can be a silverskin.
In the present embodiment, soft circuit 120 has an earth connection 122a and a soft dielectric layer 124a, and wherein ground mat 122a ' is the part of earth connection 122a, and is exposed to outside the soft dielectric layer 124a.In addition, soft circuit 120 has more a protuberance 120a, its outstanding lateral margin from soft circuit 120, and ground mat 122a ' is the evagination part of earth connection 122a, and be positioned at protuberance 120a.
In the present embodiment, except the soft dielectric layer 124 of top, soft circuit 120 has more two conductive patterns 122 and other two soft dielectric layer 124, wherein these conductive patterns 122 and these soft dielectric layer 124 are superimposed, and the conductive pattern 122 of top has more constituted earth connection 122a and many holding wire 122b that are positioned at earth connection 122a side.
In the present embodiment, soft hard circuit board 100 has more a soft insulating barrier 140, and it is disposed on the surface of soft circuit 120, and covers shielded film 130, and detailed structure as shown in Figure 3.Soft insulating barrier 140 can prevent shielded film 130 to electrically connect mutually with extraneous.
Above-mentioned soft hard circuit board 100 can be applied in the various electronic installations, for example PC (PC), mini mobile computer (UMPC), mobile phone (Mobile Phone), PDA(Personal Digital Assistant), satellite navigator (GPS) etc.
In sum, the present invention is by the direct ground mat that connects soft circuit of shielded film that will cover on the soft circuit, so that shielded film is connected to the ground connection of those rigid circuits indirectly by soft circuit.
Though the present invention discloses as above with preferred embodiment; right its is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can doing a little modification and perfect, so protection scope of the present invention is when with being as the criterion that claims were defined.
Claims (9)
1. soft hard circuit board comprises:
A plurality of rigid circuits;
One soft circuit is connected between those rigid circuits, and has a ground mat, and it is exposed to a surface of this soft circuit; And
One shielded film covers this surface of this soft circuit, and connects this ground mat.
2. soft hard circuit board as claimed in claim 1 is characterized in that, this soft circuit has a protuberance, its outstanding lateral margin from this soft circuit, and this ground mat is positioned at this protuberance.
3. soft hard circuit board as claimed in claim 1 is characterized in that, this soft circuit has an earth connection, and this ground mat is the part of this earth connection.
4. soft hard circuit board as claimed in claim 3 is characterized in that, this soft circuit has more a soft dielectric layer, and it covers this earth connection, but exposes this ground mat.
5. soft hard circuit board as claimed in claim 1 is characterized in that, this shielded film is connected to the ground connection of those rigid circuits by this earth connection.
6. soft hard circuit board as claimed in claim 1 is characterized in that, more comprises:
One soft insulating barrier is disposed on this surface of this soft circuit, and covers this shielded film.
7. soft hard circuit board as claimed in claim 1 is characterized in that, this shielded film is a conductive material.
8. soft hard circuit board as claimed in claim 1 is characterized in that, this shielded film is a silverskin.
9. an electronic installation comprises soft hard circuit board as claimed in claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810169134A CN101730384A (en) | 2008-10-22 | 2008-10-22 | Soft hard circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810169134A CN101730384A (en) | 2008-10-22 | 2008-10-22 | Soft hard circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101730384A true CN101730384A (en) | 2010-06-09 |
Family
ID=42450330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810169134A Pending CN101730384A (en) | 2008-10-22 | 2008-10-22 | Soft hard circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101730384A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582233A (en) * | 2013-10-10 | 2015-04-29 | 富士康(昆山)电脑接插件有限公司 | Flat cable component and assembly method thereof |
| CN105221984A (en) * | 2015-11-10 | 2016-01-06 | 台龙电子（昆山）有限公司 | A kind of two-sided rigid-flex luminous lamp strip |
-
2008
- 2008-10-22 CN CN200810169134A patent/CN101730384A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582233A (en) * | 2013-10-10 | 2015-04-29 | 富士康(昆山)电脑接插件有限公司 | Flat cable component and assembly method thereof |
| CN104582233B (en) * | 2013-10-10 | 2018-06-05 | 富士康(昆山)电脑接插件有限公司 | Flat cable component and its assemble method |
| CN105221984A (en) * | 2015-11-10 | 2016-01-06 | 台龙电子（昆山）有限公司 | A kind of two-sided rigid-flex luminous lamp strip |
| CN105221984B (en) * | 2015-11-10 | 2017-09-22 | 台龙电子（昆山）有限公司 | A kind of two-sided rigid-flex luminous lamp strip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100609 |