CN109121293A - Printed circuit-board assembly and electronic equipment - Google Patents
Printed circuit-board assembly and electronic equipment Download PDFInfo
- Publication number
- CN109121293A CN109121293A CN201811154121.6A CN201811154121A CN109121293A CN 109121293 A CN109121293 A CN 109121293A CN 201811154121 A CN201811154121 A CN 201811154121A CN 109121293 A CN109121293 A CN 109121293A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board
- circuit
- shielding
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present embodiments relate to field of circuit technology, a kind of printed circuit-board assembly and electronic equipment are disclosed.Printed circuit-board assembly, comprising: first circuit board and second circuit board；First circuit board and second circuit board are electrically connected；There is N number of device area, N is the integer more than or equal to 1 on first circuit board；Multiple components are welded in N number of device area；There is N number of hollowed out area, second circuit board covers at first circuit board, and hollowed out area and device area correspond on second circuit board；Wherein, at least there is a component and second circuit board is connected to by the cabling on first circuit board, then first circuit board is connected to by the cabling on second circuit board, and another component is connected to by the cabling of first circuit board.In the present invention, under conditions of ensure that the wiring space abundance of first circuit board, the thickness of printed circuit-board assembly is reduced；Meanwhile compared with the existing technology, it reduces the production cost.
Description
Technical field
The present embodiments relate to field of circuit technology, in particular to a kind of printed circuit-board assembly and electronic equipment.
Background technique
Currently, veneer printed circuit board (Printed Circuit Board, PCB) design method is put on one piece of PCB
Various electronic components are put, then the line between the surface of PCB and internal each plane layer, the pin of different components is connected
Pick up and, to realize that the signal between component transmits, PCB is, for example, computer main board, computer main board can by video card, sound card,
Memory bar etc. links together.
In highly integrated veneer PCB design, especially cell phone mainboard PCB design when, since PCB size is small, first device
Part layout is put intensive, and along with number of vias is too many inside PCB, space is not enough when leading to PCB layout, can pass through at this time
Increase the number of plies inside PCB and form double-deck or multilayered structure PCB, to increase wiring space.
At least there are the following problems in the prior art for inventor's discovery: in the prior art, by increasing the number of plies inside PCB
When forming wiring space of the double-deck or multilayered structure to increase PCB, the thickness of PCB is increased, while can be obviously increased entire
The cost of manufacture of PCB.
Summary of the invention
Embodiment of the present invention is designed to provide a kind of printed circuit-board assembly and electronic equipment, ensure that first
Under conditions of the wiring space of circuit board is sufficient, the thickness of printed circuit-board assembly is reduced；Meanwhile not increasing substantially and being fabricated to
This.
In order to solve the above technical problems, embodiments of the present invention provide a kind of printed circuit-board assembly, comprising: first
Circuit board and second circuit board；First circuit board and second circuit board are electrically connected；There is N number of device region on first circuit board
Domain, N are the integer more than or equal to 1；Multiple components are welded in N number of device area；There is N number of hollow out on second circuit board
Region, second circuit board covers at first circuit board, and hollowed out area and device area correspond；Wherein, at least have one
A component is connected to second circuit board by the cabling on first circuit board, then is connected to by the cabling on second circuit board
First circuit board, and another component is connected to by the cabling of first circuit board.
Embodiments of the present invention additionally provide a kind of electronic equipment, comprising: at least one above-mentioned printed circuit-board assembly.
Embodiment of the present invention in terms of existing technologies, is welded with multiple in N number of device area on the first circuit
Component, N number of hollowed out area on second circuit board, second circuit board is located on first circuit board, on second circuit board
N number of hollowed out area corresponded respectively with N number of device area on first circuit board, so that second circuit board can be fitted in
On first circuit board, at least there is a component by the cabling on first circuit board and be connected to second circuit board, then pass through
Cabling on second circuit board is connected to first circuit board, and is connected to another component by the cabling of first circuit board,
The wiring space that first circuit board is increased by second circuit board, in the item for the wiring space abundance that ensure that first circuit board
Under part, the thickness of printed circuit-board assembly is reduced；Meanwhile it (being formed compared with the existing technology by increasing the number of plies inside PCB
Double-deck or multilayered structure), it reduces the production cost.
In addition, there are at least one shielding areas in N number of device area；Printed circuit-board assembly further include: an at least screen
Shield；Shielding part and shielding area correspond；Each shielding part is fixed on second circuit board, and covers the corresponding screen of shielding part
Cover region.In present embodiment, when there are at least one shielding area, shielding part covering pair can be passed through in N number of device area
The shielding area answered, so as to shield interference.
In addition, second circuit board is double-sided PCB or multilayer circuit board.In present embodiment, first circuit board is covered at
On second circuit board be double-sided PCB or multilayer circuit board, to further increase the wiring space of first circuit board.
In addition, the thickness of second circuit board is greater than the maximum height of multiple components.In the present embodiment, second circuit board
Thickness is greater than the maximum height of multiple components, thus there are when at least one shielding area in N number of device area, convenient for setting
Set shielding part.
In addition, shielding part is shielding piece.In the present embodiment, using shielding piece be used as shielding part, production simply and cost compared with
It is low.
In addition, first circuit board and second circuit board are electrically connected by an at least pad；An at least pad is set to
The signal junction of one circuit board and second circuit board.Present embodiments provide for first circuit boards electrically to connect with second circuit board
A kind of specific implementation connect.
In addition, first circuit board and second circuit board are electrically connected by least a connector；At least a connector is arranged
In the signal junction of first circuit board and second circuit board.Present embodiments provide for first circuit boards and second circuit board electricity
Another specific implementation of gas connection.
In addition, shielding piece is steel disc.
In addition, the thickness of shielding piece is greater than or equal to 0.1 millimeter, and it is less than or equal to 0.2 millimeter.
Detailed description of the invention
One or more embodiments are illustrated by the picture in corresponding attached drawing, these exemplary theorys
The bright restriction not constituted to embodiment, the element in attached drawing with same reference numbers label are expressed as similar element, remove
Non- to have special statement, composition does not limit the figure in attached drawing.
Fig. 1 is the top view of the first circuit board in first embodiment according to the present invention；
Fig. 2 is the top view of the second circuit board in first embodiment according to the present invention；
Fig. 3 is the top view of the printed circuit-board assembly in first embodiment according to the present invention；
Fig. 4 is the cross-sectional view of the printed circuit-board assembly in second embodiment according to the present invention, wherein second circuit board
Thickness be greater than or equal to first circuit board on multiple components maximum height；
Fig. 5 is the cross-sectional view of the printed circuit-board assembly in second embodiment according to the present invention, wherein second circuit board
Thickness be less than first circuit board on multiple components maximum height；
Fig. 6 is the top view of the printed circuit-board assembly in third embodiment according to the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with attached drawing to the present invention
Each embodiment be explained in detail.However, it will be understood by those skilled in the art that in each embodiment party of the present invention
In formula, in order to make the reader understand this application better, many technical details are proposed.But even if without these technical details
And various changes and modifications based on the following respective embodiments, the application technical solution claimed also may be implemented.
The first embodiment of the present invention is related to a kind of printed circuit-board assemblies, are applied to electronic equipment, electronic equipment example
For example mobile phone, tablet computer etc..Fig. 1 to Fig. 3 is please referred to, printed circuit-board assembly includes: first circuit board 1 and second circuit board
2；First circuit board 1 and second circuit board 2 are electrically connected.
Referring to FIG. 1, having N number of device area 11 on first circuit board 1, multiple members are welded in N number of device area 11
Device 3, wherein N is the integer more than or equal to 1, wherein the shape and size of each device area 11 are needed according to setting at it
In the size of component 3 set.It should be noted that being equal to 2 in the present embodiment and embodiment later with N, i.e.,
Have on first circuit board 1 and is illustrated for 2 device areas 11, however with no restriction to the size of N, first circuit board 1
The quantity of last device area 11 can be arranged on demand.
Fig. 2 and Fig. 3 are please referred to, there is N number of hollowed out area 21, i.e. hollowed out area on second circuit board 2 on second circuit board 2
21 quantity is equal with the quantity of device area on first circuit board 1, the production method of second circuit board 2 specifically: at one piece
According to the shape size of device area 11 N number of on first circuit board 1 on complete circuit board, dig out on the board and each device
The one-to-one hollowed out area 21 in part region 11, forms the second circuit board 2 with N number of hollowed out area 21.Therefore, when second
When circuit board 2 covers at first circuit board 1, second circuit board 2 can be fitted on first circuit board 1.
In one example, second circuit board 2 is double-sided PCB or multilayer circuit board, thus on second circuit board 2
Multilayer wiring can be carried out, the wiring space of first circuit board 1 is further increased.
It should be noted that device area also can be set in the present embodiment, on second circuit board 2 for welding first device
Part, right the present embodiment do not do any restrictions to this.
In the present embodiment, the component 3 that at least exists on first circuit board 1 passes through the cabling on first circuit board 1
It is connected to second circuit board 2, then first circuit board 1 is connected to by the cabling on second circuit board 2, and pass through first circuit board
1 cabling is connected to another component 3, it can realizes the member on first circuit board 1 by the cabling on second circuit board 2
Another component 3 on device 3 and first circuit board 1 is electrically connected, and increases first circuit board 1 using second circuit board 2
Wiring space.
Present embodiment in terms of existing technologies, is welded with multiple first devices in N number of device area on the first circuit
Part, N number of hollowed out area on second circuit board, second circuit board is located on first circuit board, N number of on second circuit board
Hollowed out area corresponds respectively with N number of device area on first circuit board, so that second circuit board can be fitted in first
On circuit board, at least there is a component by the cabling on first circuit board and be connected to second circuit board, then pass through second
Cabling on circuit board is connected to first circuit board, and is connected to another component by the cabling of first circuit board, passes through
Second circuit board increases the wiring space of first circuit board, in the condition for the wiring space abundance that ensure that first circuit board
Under, reduce the thickness of printed circuit-board assembly；Meanwhile compared with the existing technology (by increase inside PCB the number of plies formed it is double
Layer or multilayered structure), it reduces the production cost.
Second embodiment of the present invention is related to a kind of printed circuit-board assembly.Second embodiment is in the first embodiment party
Formula is roughly the same, is in place of the main distinction: in present embodiment, please refer to Fig. 4 and Fig. 5 printed circuit-board assembly further include to
A few shielding part 4.
In the present embodiment, there are at least one shielding area in N number of device area 11 on first circuit board 1, that is, shield
Component 3 in region needs to shield the electromagnetic interference of other components 3 or the external world, and shielding part 4 and shielding area one are a pair of
It answers, the size and shape of shielding part 4 is corresponding with shielding area, is welded on second circuit board 2 by shielding part 4, and cover screen
The corresponding shielding area of shield 4 realizes the shielding to shielding area.Wherein, the making material of shielding part 4 can for steel, foreign white copper,
Black sheet iron etc..
Referring to FIG. 4, when the thickness of second circuit board 2 is greater than or equal to multiple components 3 on first circuit board 1 most
When big height, shielding part 4 can be shielding piece, for example, steel disc, and shield the thickness of piece 4 is greater than or equal to 0.1 millimeter, and small
In or equal to 0.2 millimeter.When shielding piece 4 is welded on second circuit board 2, shielding piece covering shielding piece corresponds to shielding area, the
Component 3 in shielding area is surrounded by the hollowed out area of two circuit boards 2, by the group for shielding piece 4 and second circuit board 2
The shielding realized to shielding area is closed, avoids the component 3 in shielding area from being interfered, for existing shielding case
Production is simple and cost is relatively low；In addition, since the shape of shielding piece 4 is corresponding with shielding area shape, so as to greatest extent
Reduce the occupancy to the wiring space on second circuit board 2.As long as it should be noted that guaranteeing second circuit board in the present embodiment
2 thickness is greater than the maximum height for more having component 3 in shielding area.
Referring to FIG. 5, when the thickness of second circuit board 2 is less than the maximum height of multiple components 3 on first circuit board 1
When, shielding part 4 is shielding case, and when shielding case is welded on second circuit board 2, shielding case covers the corresponding shielding area of shielding part 4
Realize the shielding to shielding area.
It should be noted that the present embodiment only representatively illustrates arrangement and the number of the component 3 on first circuit board 1
Amount, and cabling of the component 3 on first circuit board 1 and second circuit board 2, specific cabling needs root are not drawn in detail
It arranges according to actual 3 connection of component.
In the present embodiment, by N number of device area 11 on first circuit board 1 there are a shielding area for said
Bright, the quantity of shielding area present in right N number of device area 11 of this implementation to first circuit board 1 is not intended to be limited in any.
Present embodiment for first embodiment, when in N number of device area there are at least one shielding area,
Corresponding shielding area can be covered, by shielding part so as to shield interference.
Third embodiment of the invention is related to one kind and is related to a kind of printed circuit-board assembly.Second embodiment is first
Embodiment is roughly the same, is in place of the main distinction: providing the tool that first circuit board 1 and second circuit board 2 are electrically connected
Body implementation.
In the present embodiment, referring to FIG. 6, first circuit board 1 and second circuit board 2 are electrically connected by an at least pad 5,
The signal junction that an at least pad 5 is set to first circuit board 1 Yu second circuit board 2, specifically, first circuit board 1 with
The position for needing signal to connect on second circuit board 2 separately designs pad 5, then sets first circuit board 1 and second circuit board 2
Weld together in respect of the position of pad 5, realizes that first circuit board 1 can be electrically connected with second circuit board 2.
It should be noted that being by the electrical connection of an at least pad 5 with first circuit board 1 and second circuit board 2 in Fig. 6
Example is illustrated, so without being limited thereto, and first circuit board 1 and second circuit board 2 are also electrically connected by least a connector, at this time
At least a connector is set to the signal junction of first circuit board 1 Yu second circuit board 2, specifically, setting on first circuit board 1
The female for being equipped with the male connector of connector, being provided with connector on second circuit board 2, after male connector is connect with female, the first circuit
Plate 1 can be electrically connected with second circuit board 2.
The present embodiment mode provides the first circuit 1 and electrically connects with second circuit board for first embodiment
The specific implementation connect.It should be noted that present embodiment is also used as improvement on the basis of second embodiment,
It can achieve same technical effect.
Four embodiment of the invention is related to a kind of electronic equipment, such as mobile phone, tablet computer etc..Electronic equipment includes the
One printed circuit-board assembly into third any one of embodiment, printed circuit-board assembly can be the mainboard of electronic equipment,
Component on printed circuit-board assembly can be processor, the memory etc. of electronic equipment internal.
Present embodiment in terms of existing technologies, is welded with multiple first devices in N number of device area on the first circuit
Part, N number of hollowed out area on second circuit board, second circuit board is located on first circuit board, N number of on second circuit board
Hollowed out area corresponds respectively with N number of device area on first circuit board, so that second circuit board can be fitted in first
On circuit board, at least there is a component by the cabling on first circuit board and be connected to second circuit board, then pass through second
Cabling on circuit board is connected to first circuit board, and is connected to another component by the cabling of first circuit board, passes through
Second circuit board increases the wiring space of first circuit board, in the condition for the wiring space abundance that ensure that first circuit board
Under, reduce the thickness of printed circuit-board assembly；Meanwhile compared with the existing technology (by increase inside PCB the number of plies formed it is double
Layer or multilayered structure), it reduces the production cost.
It will be understood by those skilled in the art that the respective embodiments described above are to realize specific embodiments of the present invention,
And in practical applications, can to it, various changes can be made in the form and details, without departing from the spirit and scope of the present invention.
Claims (10)
1. a kind of printed circuit-board assembly characterized by comprising first circuit board and second circuit board；First circuit board with
The second circuit board electrical connection；
There is N number of device area, N is the integer more than or equal to 1 on the first circuit board；Weldering in N number of device area
It is connected to multiple components；
There is N number of hollowed out area, the second circuit board covers at the first circuit board, and described on the second circuit board
Hollowed out area and the device area correspond；
Wherein, at least there is a component and the second circuit is connected to by the cabling on the first circuit board
Plate, then the first circuit board, and walking by the first circuit board are connected to by the cabling on the second circuit board
Line is connected to another component.
2. printed circuit-board assembly according to claim 1, which is characterized in that exist at least in N number of device area
One shielding area；The printed circuit-board assembly further include: an at least shielding part；The shielding part and the shielding area one
One is corresponding；Each shielding part is fixed on the second circuit board, and covers the corresponding shielding area of the shielding part.
3. printed circuit-board assembly according to claim 1, which is characterized in that the second circuit board is double-sided PCB
Or multilayer circuit board.
4. printed circuit-board assembly according to claim 2, which is characterized in that the thickness of the second circuit board is greater than more
The maximum height of a component.
5. printed circuit-board assembly according to claim 4, which is characterized in that the shielding part is shielding piece.
6. printed circuit-board assembly according to claim 1, which is characterized in that the first circuit board and second electricity
Road plate is electrically connected by an at least pad；
An at least pad is set to the signal junction of the first circuit board Yu the second circuit board.
7. printed circuit-board assembly according to claim 1, the first circuit board and the second circuit board are by extremely
Few a connector electrical connection；
Described at least a connector is set to the signal junction of the first circuit board Yu the second circuit board.
8. printed circuit-board assembly according to claim 5, the shielding piece is steel disc.
9. printed circuit-board assembly according to claim 5, the thickness of the shielding piece is greater than or equal to 0.1 millimeter,
And it is less than or equal to 0.2 millimeter.
10. a kind of electronic equipment characterized by comprising an at least claim 1 to printed circuit as claimed in claim 9
Board group part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811154121.6A CN109121293B (en) | 2018-09-30 | 2018-09-30 | Printed circuit board assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811154121.6A CN109121293B (en) | 2018-09-30 | 2018-09-30 | Printed circuit board assembly and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109121293A true CN109121293A (en) | 2019-01-01 |
| CN109121293B CN109121293B (en) | 2020-05-15 |
Family
ID=64857560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811154121.6A Active CN109121293B (en) | 2018-09-30 | 2018-09-30 | Printed circuit board assembly and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109121293B (en) |
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| CN1133498A (en) * | 1994-11-16 | 1996-10-16 | 日本电气株式会社 | Installation for circuit elements |
| WO1999025163A1 (en) * | 1997-11-10 | 1999-05-20 | Caterpillar Inc. | Modular circuit board construction and method of producing the same |
| JP2000196213A (en) * | 1998-12-25 | 2000-07-14 | Olympus Optical Co Ltd | Electronic unit |
| JP2001267710A (en) * | 2000-03-15 | 2001-09-28 | Sony Corp | Electronic circuit device and multilayer printed wiring board |
| CN1094717C (en) * | 1995-11-16 | 2002-11-20 | 松下电器产业株式会社 | PC board and fixing body thereof |
| CN1550123A (en) * | 2001-08-31 | 2004-11-24 | 埃普科斯股份有限公司 | Component arrangement |
| US20050098868A1 (en) * | 2003-11-12 | 2005-05-12 | Advanced Semiconductor Engineering, Inc. | Multi-chips module assembly package |
| CN102845140A (en) * | 2010-04-13 | 2012-12-26 | At&S奥地利科技及系统技术股份公司 | Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein |
| JP2012256804A (en) * | 2011-06-10 | 2012-12-27 | Dainippon Printing Co Ltd | Component-built-in wiring board |
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- 2018-09-30 CN CN201811154121.6A patent/CN109121293B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677623A (en) * | 1992-08-25 | 1994-03-18 | Sony Corp | Electronic circuit device and manufacture thereof |
| EP0712266A2 (en) * | 1994-11-10 | 1996-05-15 | Vlt Corporation | Packaging electrical components |
| CN1133498A (en) * | 1994-11-16 | 1996-10-16 | 日本电气株式会社 | Installation for circuit elements |
| CN1094717C (en) * | 1995-11-16 | 2002-11-20 | 松下电器产业株式会社 | PC board and fixing body thereof |
| WO1999025163A1 (en) * | 1997-11-10 | 1999-05-20 | Caterpillar Inc. | Modular circuit board construction and method of producing the same |
| JP2000196213A (en) * | 1998-12-25 | 2000-07-14 | Olympus Optical Co Ltd | Electronic unit |
| JP2001267710A (en) * | 2000-03-15 | 2001-09-28 | Sony Corp | Electronic circuit device and multilayer printed wiring board |
| CN1550123A (en) * | 2001-08-31 | 2004-11-24 | 埃普科斯股份有限公司 | Component arrangement |
| US20050098868A1 (en) * | 2003-11-12 | 2005-05-12 | Advanced Semiconductor Engineering, Inc. | Multi-chips module assembly package |
| CN102845140A (en) * | 2010-04-13 | 2012-12-26 | At&S奥地利科技及系统技术股份公司 | Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein |
| JP2012256804A (en) * | 2011-06-10 | 2012-12-27 | Dainippon Printing Co Ltd | Component-built-in wiring board |
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| Publication number | Publication date |
|---|---|
| CN109121293B (en) | 2020-05-15 |
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