CN105636335A - Mobile terminal, flexible printed circuit board and manufacturing method thereof - Google Patents
Mobile terminal, flexible printed circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN105636335A CN105636335A CN201511025928.6A CN201511025928A CN105636335A CN 105636335 A CN105636335 A CN 105636335A CN 201511025928 A CN201511025928 A CN 201511025928A CN 105636335 A CN105636335 A CN 105636335A
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- wiring region
- conducting wires
- many
- conductive layer
- flexible pcb
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Conductors (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a flexible printed circuit board. The flexible printed circuit board comprises a dielectric layer, a conductive layer, a shielding film layer and a covering film layer, which are successively laminated. The dielectric layer comprises a first wiring region, a second wiring region and a third wiring region, which are successively connected. The conductive layer comprises multiple conductive circuits and multiple grounding regions. The conductive circuits are arranged in the second wiring region. Two ends of each of the conductive circuits are connected with the first wiring region and the third wiring region, so signal transmission paths are formed. The grounding regions provide grounding signals for the conductive circuits. The covering film layer comprises multiple openings which correspond to the grounding regions. The shielding film layer is connected with the grounding regions via the openings, so a grounding path between the first wiring region and the third wiring region is formed. In addition, the invention also provides a mobile terminal and a manufacturing method of the flexible printed circuit board. The flexible printed circuit board has quite high flexibility.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of mobile terminal, flexible PCB and manufacture method thereof.
Background technology
Flexible PCB (FlexiblePrintedCircuit, FPC) it is the printed circuit board (PCB) made with flexible insulating substrate, it has many rigid printed circuit board (PrintedCircuitboard, PCB) advantage not possessed, such as FPC can freely bend, reels, fold, can require to arrange arbitrarily according to space layout, thus reach the integration that components and parts assembling connects with wire. Owing to there is above-mentioned advantage so that adopt FPC can effectively reduce the volume of electronic product, increase the handiness of circuit layout, meet the needs that electronic product develops to high-density, miniaturization, highly reliable direction. At present, FPC is widely used in the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, personal digital assistant (PersonalDigitalAssistant, PDA), digital camera or product.
For ensureing the reliability and stability of FPC Signal transmissions, it is necessary to the conducting wire of FPC is carried out meticulous layout and design, to prevent the mutual interference between conducting wire; Simultaneously, in addition it is also necessary to paste electromagnetic interference (ElectromagneticInterference, EMI) screened film on the conducting wire of FPC, to prevent the signal transmitted in conducting wire is subject to electromagnetic interference and affects signal transmission quality. In prior art, when conducting wire is more, the increase FPC number of plies is usually adopted to realize required circuit layout, as adopted the FPC structure etc. of doubling plate or three laminates. But, owing to FPC needs good snappiness, cause its thickness increase can the snappiness of FPC be had an impact undoubtedly by increasing the number of plies of FPC. Therefore, how to ensure the rational circuit layout of FPC and preferably while signal transmission quality, to make FPC possess better snappiness, be the problem needing during current FPC designs to solve.
Summary of the invention
In view of the above-mentioned problems in the prior art, the present invention provides a kind of flexible PCB, without the need to increasing the number of plies of flexible PCB and can realize the layout of the conducting wire of a greater number, the good signal transmission quality in conducting wire can also be ensured so that flexible PCB possesses better snappiness simultaneously.
Separately, the present invention also provides the manufacture method of a kind of flexible PCB.
Separately, the present invention also provides a kind of mobile terminal applying described flexible PCB.
A kind of flexible PCB, comprises medium layer, conductive layer and barrier film layer, and described flexible PCB also comprises covering rete, and described medium layer, described conductive layer, described covering rete and described barrier film layer are cascading;
Described medium layer comprises the first wiring region, the 2nd wiring region and the 3rd wiring region that connect successively;
Described conductive layer comprises many conducting wires and multiple ground area; Each described conducting wire be arranged at described 2nd wiring region on, and the two ends of described conducting wire connect respectively described first wiring region and described 3rd wiring region with formed described first wiring region and described 3rd wiring region between Signal transmissions path; Multiple described ground area is many described conducting wires offer ground connection signals;
Described covering rete comprises multiple opening, multiple described opening respectively with multiple ground areas one_to_one corresponding of described conductive layer;
Described barrier film layer is electrically connected with multiple described ground area respectively by multiple described opening, with the grounding path formed between described first wiring region and described 3rd wiring region.
Wherein, many articles of described conducting wires are arranged at intervals on described 2nd wiring region, and one end of many articles of described conducting wires extends to described first wiring region from described 2nd wiring region, and is electrically connected with described first wiring region; The other end of many articles of described conducting wires extends to described 3rd wiring region from described 2nd wiring region, and is electrically connected with described 3rd wiring region.
Wherein, described first wiring region and described 3rd wiring region include at least one ground area, and described barrier film layer part covers at least one ground area being positioned at described first wiring region and the 3rd wiring region and described 2nd wiring region.
Wherein, many described conducting wires are positioned at same conductive layer, and evenly spaced apart in described 2nd wiring region.
Wherein, described first wiring region and described 3rd wiring region respectively comprise two ground areas, two ground areas in described first wiring region are arranged at the relative both sides of many described conducting wires, and two ground areas in described 3rd wiring region are arranged at the relative both sides of many articles of described conducting wires.
A manufacture method for flexible PCB, comprising:
Thering is provided medium layer, described medium layer comprises the first wiring region, the 2nd wiring region and the 3rd wiring region;
Forming conductive layer on described medium layer, described conductive layer comprises many conducting wires and multiple ground area;
The mulch film with multiple opening is placed on described conductive layer, and makes multiple described opening and multiple described ground areas one_to_one corresponding;
Forming barrier film layer on described covering rete, described barrier film layer is electrically connected with multiple described ground area respectively by multiple described opening.
Wherein, many articles of described conducting wires are arranged at intervals on described 2nd wiring region, and one end of many articles of described conducting wires extends to described first wiring region from described 2nd wiring region, and is electrically connected with described first wiring region; The other end of many articles of described conducting wires extends to described 3rd wiring region from described 2nd wiring region, and is electrically connected with described 3rd wiring region.
Wherein, described first wiring region and described 3rd wiring region include at least one ground area, and described barrier film layer covers at least one ground area being positioned at described first wiring region and the 3rd wiring region and described 2nd wiring region at least partly.
Wherein, many described conducting wires are positioned at same conductive layer, and evenly spaced apart in described 2nd wiring region.
Wherein, described first wiring region and described 3rd wiring region respectively comprise two ground areas, two ground areas in described first wiring region are arranged at the relative both sides of many described conducting wires, and two ground areas in described 3rd wiring region are arranged at the relative both sides of many articles of described conducting wires.
A kind of mobile terminal, comprise flexible PCB, described flexible PCB comprises medium layer, conductive layer and barrier film layer, and described flexible PCB also comprises covering rete, and described medium layer, described conductive layer, described covering rete and described barrier film layer are cascading;
Described medium layer comprises the first wiring region, the 2nd wiring region and the 3rd wiring region that connect successively;
Described conductive layer comprises many conducting wires and multiple ground area; Each described conducting wire be arranged at described 2nd wiring region on, and the two ends of described conducting wire connect respectively described first wiring region and described 3rd wiring region with formed described first wiring region and described 3rd wiring region between Signal transmissions path; Multiple described ground area is many described conducting wires offer ground connection signals;
Described covering rete comprises multiple opening, multiple described opening respectively with multiple ground areas one_to_one corresponding of described conductive layer;
Described barrier film layer is electrically connected with multiple described ground area respectively by multiple described opening, with the grounding path formed between described first wiring region and described 3rd wiring region.
In sum, according to technique scheme, described flexible PCB by arranging many conducting wires and multiple ground area on described conductive layer, and forms the Signal transmissions path between described first wiring region and described 3rd wiring region by many articles of described conducting wires; By arranging the opening corresponding with multiple described ground area on described covering rete, so that described barrier film layer is electrically connected with multiple described ground area respectively by multiple described opening, thus form the grounding path between described first wiring region and described 3rd wiring region by described barrier film layer. So not only can effectively reduce the thickness of described flexible PCB, promote the snappiness of described flexible PCB, good signal transmission quality can also be ensured simultaneously.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, it is briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the two dimensional structure perspective diagram of the flexible PCB that the embodiment of the present invention provides;
Fig. 2 is the cross-sectional view of flexible PCB along A1-A2 direction of embodiment of the present invention offer;
Fig. 3 is the schema of the manufacture method of the flexible PCB that the embodiment of the present invention provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only the present invention's part embodiment, instead of whole embodiments. Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
For ease of describing, can use such as here " ... under ", " ... below ", D score, " ... on ", " on " etc. space relative terms the relation of an element or feature and another (a bit) element or feature as illustrated in the drawing is described. It is appreciated that, when an element or layer be called as another element or layer " on ", " being connected to " or " being couple to " another element or during layer, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or can there is element or layer between two parties.
It can be appreciated that term used is only to describe specific embodiment, do not really want restriction the present invention here. When using here, clearly state unless context separately has, otherwise odd number form " " and " being somebody's turn to do " are also intended to comprise plural form. Further, when using in this manual, term " comprises " and/or shows " comprising " existence of described feature, entirety, step, element and/or assembly, but does not get rid of existence or the increase of other features one or more, entirety, step, element, assembly and/or its combination.
Referring to Fig. 1, first embodiment of the invention provides a kind of flexible PCB 10, and it comprises medium layer 11, conductive layer 13, covers rete 15 and barrier film layer 17. Described medium layer 11, conductive layer 13, covering rete 15 and described barrier film layer 17 are cascading. Described medium layer 11 comprises the first wiring region 111, the 2nd wiring region 113 and the 3rd wiring region 115, described first wiring region 111 is connected with described 3rd wiring region 115 by described 2nd wiring region 113, that is, described 2nd wiring region 113 is connected between described first wiring region 111 and the 3rd wiring office territory 115.
Described conductive layer 13 is arranged on described medium layer 11, and it comprises many conducting wires 131 and multiple ground area 133. Many articles described conducting wire 131 is arranged at intervals on described 2nd wiring region 113, and one end of many articles of described conducting wires 131 extends to described first wiring region 111 from described 2nd wiring region 113, and is electrically connected with described first wiring region 111; The other end of many articles of described conducting wires 131 extends to described 3rd wiring region 115 from described 2nd wiring region 113, and be electrically connected with described 3rd wiring region 115, thus between described first wiring region 111 and described 3rd wiring region 115, form Signal transmissions path by many articles of described conducting wires 131. Described conducting wire 131 is the signal lead of ungrounded network, for transmitting non-ground signal. Multiple described ground area 133 is arranged at described first wiring region 111 respectively and connects up in region 115 with the described 3rd, for providing ground connection signal for many described conducting wires 131.
Described covering rete 15 is arranged on described conductive layer 13, comprises multiple opening 151, described opening 151 respectively with ground area 133 one_to_one corresponding of described conductive layer 13, to expose this ground area 133. Described barrier film layer 17 is arranged on described covering rete 15, and be electrically connected with multiple described ground area 133 respectively by the opening 151 of correspondence, for the multiple described ground area 133 of conducting, with the grounding path formed between described first wiring region 111 and described 3rd wiring region 115, and provide electromagnetic interference shielding action for many described conducting wires 131. Specifically, described barrier film layer 17 is made up of electro-conductive material (such as silverskin), described barrier film layer 17 is electrically connected with the described ground area 133 being positioned on described first wiring region 111 and the 3rd wiring region 115 respectively by described opening 151, and part covers described first wiring region 111 and the 3rd wiring region 115 and covers described 2nd wiring region 113 completely, thus form grounding path between described first wiring region 111 and described 3rd wiring region 115; Meanwhile, described barrier film layer 17 provides electromagnetic interference shielding action for many described conducting wires 131.
In an alternative embodiment, the width in described first wiring region 111 and the 3rd wiring region 115 is greater than the width in described 2nd wiring region 113. Described first wiring region 111, the 2nd wiring region 113 and the 3rd wiring region 115 form one " work " type structure on the whole jointly, that is, described first wiring region 111 is positioned at the relative two ends in described 2nd wiring region 113 respectively vertically with the 3rd wiring region 115. Described first wiring region 111 includes at least one ground area 133 with described 3rd wiring region 115. Described barrier film layer 17 covers the ground area 133 being positioned at described first wiring region 111 and the 3rd wiring region 115 at least partly and covers described 2nd wiring region 113 completely.
Seeing also Fig. 1 and Fig. 2, wherein, Fig. 2 is that flexible PCB 10 shown in Fig. 1 is along the cross-sectional view in A1-A2 direction. In an alternative embodiment, many described conducting wire 131 is positioned at same conductive layer 13, and in the way of evenly spaced apart by described 2nd wiring region 113 and extend to described first wiring region 111 and the 3rd wiring region 115, and be connected with described first wiring region 111 and the 3rd wiring region 115 respectively. Described conductive layer 13 comprises four grounded region 133, and wherein two ground areas 133 are distributed in described first wiring region 111, and are arranged at the relative both sides of many described conducting wires 131; Two other ground area 133 is distributed in described 3rd wiring region 115, and is arranged at the relative both sides of many described conducting wires 131.
Described covering rete 15 comprises four openings 151, described four openings 151 respectively with four grounded region 133 one_to_one corresponding of described conductive layer 13, to expose this ground area 133. Described barrier film layer 17 entirety is in " work " type structure, described barrier film layer 17 covers the four grounded region 133 of described conductive layer 13 and described 2nd wiring region 113, and four grounded region 133 with described conductive layer 13 is electrically connected respectively by described four openings 151, thus form grounding path between described first wiring region 111 and described 3rd wiring region 115, simultaneously for many described conducting wires 131 provide electromagnetic interference shielding action. It is appreciated that, for promoting the snappiness in described 2nd wiring region 113 further, at described covering rete 15, corresponding opening can be set in the region of described 2nd wiring region 113 correspondence, such that it is able to reduce the thickness of described flexible PCB 10 in described 2nd wiring region 113 so that it is in described 2nd wiring region 113, also there is preferably snappiness.
Referring to Fig. 3, second embodiment of the invention provides a kind of manufacture method being applicable to the flexible PCB described in first embodiment of the invention, and described manufacture method comprises at least following steps:
Step S201: medium layer is provided, described medium layer comprises the first wiring region, the 2nd wiring region and the 3rd wiring region;
Being specially, described first wiring region is by described 2nd wiring region and described 3rd wiring joint area, that is, described 2nd wiring region is connected between described first wiring region and the 3rd wiring office territory. Can selection of land, described first wiring region and the 3rd wiring region width be greater than described 2nd wiring region width. Described first wiring region, the 2nd wiring region and the 3rd wiring region form one " work " type structure jointly. The material of described medium layer can be polyimide, and polyimide has excellent snappiness and good dimensional stability, and operating temperature range is wider, has outstanding flame retardant properties, and its electrical property under soldering conditions is almost not influenced. It can be appreciated that the material of described medium layer can also be polyester, polyester is polyvalent alcohol and polyprotonic acid polycondensation and the polymkeric substance general name that obtains, and it mainly refers to polyethylene terephthalate, it is possible to comprise polybutylene terephthalate and polyarylester.
Step S202: form conductive layer on described medium layer, described conductive layer comprises many conducting wires and multiple ground area;
It is specially, by covering Copper Foil on described medium layer to form described conductive layer. Can selection of land, described conductive layer entirety in " work " type structure, covers described first wiring region and the 3rd wiring region with part and covers described 2nd wiring region completely. Described Copper Foil can be calendering Copper Foil or electrolytic copper foil, wherein rolls Copper Foil and has the characteristics such as good ductility, repeated deflection, and compared to described calendering Copper Foil, and electrolytic copper foil is then have lower manufacturing cost, be conducive to the advantages such as fine-line making. In addition, the Copper Foil of different thickness can be covered thereon according to demands such as the suppleness of described flexible PCB, bending property and current-carrying abilities.
Wherein, many articles of described conducting wires are arranged at intervals on described 2nd wiring region, and one end of many articles of described conducting wires extends to described first wiring region from described 2nd wiring region, and is electrically connected with described first wiring region; The other end of many articles of described conducting wires extends to described 3rd wiring region from described 2nd wiring region, and be electrically connected with described 3rd wiring region, thus between described first wiring region and described 3rd wiring region, form Signal transmissions path by many articles of described conducting wires. Many described conducting wires are the signal lead of ungrounded network, for transmitting non-ground signal. Multiple described ground area is arranged in described first wiring region and described 3rd wiring region respectively, for providing ground connection signal for many described conducting wires.
Step S203: the mulch film with multiple opening is placed on described conductive layer, and make multiple described opening and multiple described ground areas one_to_one corresponding;
Being specially, described covering rete can optionally cover described conductive layer, for the protection of described conducting wire. Can selection of land, described covering rete is in " work " type structure. Can selection of land, described covering rete arranges opening in described 2nd region corresponding to wiring region, to promote the snappiness of described flexible PCB in described 2nd wiring region. The material of described covering rete can be polyimide or polyester, and polyimide has good snappiness and high temperature resistant feature; Polyester then has the feature that cost is low, snappiness is good. In an alternative embodiment, the material of described covering rete can also be solder mask, such that it is able to adopt mode of printing processing, to reduce production cost further.
Step S204: form barrier film layer on described covering rete, described barrier film layer is electrically connected with multiple described ground area respectively by multiple described opening.
Wherein, described barrier film layer covers the ground area being positioned at described first wiring region and described 3rd wiring region and completely described 2nd wiring region at least partly, and be electrically connected with multiple described ground area respectively by multiple described opening, for the multiple described ground area of conducting, with the grounding path formed between described first wiring region and described 3rd wiring region, and be many described conducting wires offer electromagnetic interference (ElectromagneticInterference, EMI) shielding effects. Specifically, described barrier film layer is made up of electro-conductive material (such as silverskin), described barrier film layer is electrically connected with the described ground area being positioned on described first wiring region and the 3rd wiring region respectively by described opening, and part covers described first wiring region and the 3rd wiring region and covers described 2nd wiring region completely, thus form grounding path between described first wiring region and described 3rd wiring region; Meanwhile, described barrier film layer is many described conducting wires offer electromagnetic interference shielding actions. It can be appreciated that in other embodiments, it is also possible to realize electromagnetic interference shield by brushing the mode of silver slurry.
Third embodiment of the invention provides a kind of mobile terminal, comprises flexible PCB as described in the first embodiment of the present invention. Wherein, described mobile terminal can be but be not limited to mobile phone, panel computer, intelligent watch, motion bracelet etc.
In sum, state the mobile terminal of embodiment on the invention, in flexible PCB and manufacture method thereof, described flexible PCB by arranging many conducting wires and multiple ground area on described conductive layer, and form the Signal transmissions path between described first wiring region and described 3rd wiring region by many articles of described conducting wires, and by arranging the opening corresponding with multiple described ground area on described covering rete, so that described barrier film layer is electrically connected with multiple described ground area respectively by multiple described opening, thus form the grounding path between described first wiring region and described 3rd wiring region by described barrier film layer, therefore without the need to increasing the number of plies of flexible PCB and can realize the layout of the conducting wire of a greater number, so not only can effectively reduce the thickness of described flexible PCB, promote the snappiness of described flexible PCB, good electromagnetic interference shield performance and signal transmission quality can also be ensured.
The above disclosed better embodiment being only the present invention, certainly the interest field of the present invention can not be limited with this, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and according to the equivalent variations that the claims in the present invention are done, still belong to the scope that invention is contained.
Claims (10)
1. a flexible PCB, comprises medium layer, conductive layer and barrier film layer, it is characterised in that, described flexible PCB also comprises covering rete, and described medium layer, described conductive layer, described covering rete and described barrier film layer are cascading;
Described medium layer comprises the first wiring region, the 2nd wiring region and the 3rd wiring region that connect successively;
Described conductive layer comprises many conducting wires and multiple ground area; Each described conducting wire be arranged at described 2nd wiring region on, and the two ends of described conducting wire connect respectively described first wiring region and described 3rd wiring region with formed described first wiring region and described 3rd wiring region between Signal transmissions path; Multiple described ground area is many described conducting wires offer ground connection signals;
Described covering rete comprises multiple opening, multiple described opening respectively with multiple ground areas one_to_one corresponding of described conductive layer;
Described barrier film layer is electrically connected with multiple described ground area respectively by multiple described opening, with the grounding path formed between described first wiring region and described 3rd wiring region.
2. flexible PCB as claimed in claim 1, it is characterized in that, many articles described conducting wire is arranged at intervals on described 2nd wiring region, one end of many articles of described conducting wires extends to described first wiring region from described 2nd wiring region, and is electrically connected with described first wiring region; The other end of many articles of described conducting wires extends to described 3rd wiring region from described 2nd wiring region, and is electrically connected with described 3rd wiring region.
3. flexible PCB as claimed in claim 2, it is characterized in that, described first wiring region and described 3rd wiring region include at least one ground area, and described barrier film layer part covers at least one ground area being positioned at described first wiring region and the 3rd wiring region and described 2nd wiring region.
4. flexible PCB as claimed in claim 2, it is characterised in that, many described conducting wires are positioned at same conductive layer, and evenly spaced apart in described 2nd wiring region.
5. flexible PCB as described in claim 3 or 4, it is characterized in that, described first wiring region and described 3rd wiring region respectively comprise two ground areas, two ground areas in described first wiring region are arranged at the relative both sides of many described conducting wires, and two ground areas in described 3rd wiring region are arranged at the relative both sides of many articles of described conducting wires.
6. the manufacture method of a flexible PCB, it is characterised in that, described manufacture method comprises:
Thering is provided medium layer, described medium layer comprises the first wiring region, the 2nd wiring region and the 3rd wiring region;
Forming conductive layer on described medium layer, described conductive layer comprises many conducting wires and multiple ground area;
The mulch film with multiple opening is placed on described conductive layer, and makes multiple described opening and multiple described ground areas one_to_one corresponding;
Forming barrier film layer on described covering rete, described barrier film layer is electrically connected with multiple described ground area respectively by multiple described opening.
7. manufacture method as claimed in claim 6, it is characterized in that, many articles described conducting wire is arranged at intervals on described 2nd wiring region, and one end of many articles of described conducting wires extends to described first wiring region from described 2nd wiring region, and is electrically connected with described first wiring region; The other end of many articles of described conducting wires extends to described 3rd wiring region from described 2nd wiring region, and is electrically connected with described 3rd wiring region.
8. method as claimed in claim 7, it is characterized in that, described first wiring region and described 3rd wiring region include at least one ground area, and described barrier film layer covers at least one ground area being positioned at described first wiring region and the 3rd wiring region and described 2nd wiring region at least partly.
9. method as claimed in claim 7, it is characterised in that, many described conducting wires are positioned at same conductive layer, and evenly spaced apart in described 2nd wiring region.
10. a mobile terminal, it is characterised in that, described mobile terminal comprises the flexible PCB as described in claim 1-5 any one.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025928.6A CN105636335B (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible PCB and its manufacture method |
| CN201711320220.2A CN108024447B (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible circuit board and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025928.6A CN105636335B (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible PCB and its manufacture method |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711320220.2A Division CN108024447B (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible circuit board and its manufacturing method |
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| Publication Number | Publication Date |
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| CN105636335A true CN105636335A (en) | 2016-06-01 |
| CN105636335B CN105636335B (en) | 2018-01-23 |
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| CN201711320220.2A Expired - Fee Related CN108024447B (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible circuit board and its manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107278028A (en) * | 2017-07-28 | 2017-10-20 | 维沃移动通信有限公司 | A kind of flexible PCB and preparation method thereof and mobile terminal |
| CN108738226A (en) * | 2018-05-04 | 2018-11-02 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN109275263A (en) * | 2018-11-23 | 2019-01-25 | 威创集团股份有限公司 | A kind of preparation method and FPC plate of FPC plate |
| CN109581074A (en) * | 2018-12-05 | 2019-04-05 | 上海龙旗科技股份有限公司 | The transmission path structure and its setting method of SAR SENSOR control unit |
| CN109845239A (en) * | 2016-10-18 | 2019-06-04 | Lg伊诺特有限公司 | Camera model |
| CN111771427A (en) * | 2018-02-23 | 2020-10-13 | 三星电子株式会社 | Electronic device including rigid-flexible circuit board |
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| JP6260604B2 (en) * | 2015-11-16 | 2018-01-17 | ウシオ電機株式会社 | Light irradiation device |
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| CN109845239A (en) * | 2016-10-18 | 2019-06-04 | Lg伊诺特有限公司 | Camera model |
| CN109845239B (en) * | 2016-10-18 | 2020-10-30 | Lg伊诺特有限公司 | Camera module |
| CN107278028A (en) * | 2017-07-28 | 2017-10-20 | 维沃移动通信有限公司 | A kind of flexible PCB and preparation method thereof and mobile terminal |
| CN111771427A (en) * | 2018-02-23 | 2020-10-13 | 三星电子株式会社 | Electronic device including rigid-flexible circuit board |
| CN111771427B (en) * | 2018-02-23 | 2024-05-28 | 三星电子株式会社 | Electronic device including rigid-flexible circuit board |
| CN108738226A (en) * | 2018-05-04 | 2018-11-02 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN108738226B (en) * | 2018-05-04 | 2020-11-13 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN109275263A (en) * | 2018-11-23 | 2019-01-25 | 威创集团股份有限公司 | A kind of preparation method and FPC plate of FPC plate |
| CN109581074A (en) * | 2018-12-05 | 2019-04-05 | 上海龙旗科技股份有限公司 | The transmission path structure and its setting method of SAR SENSOR control unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105636335B (en) | 2018-01-23 |
| CN108024447A (en) | 2018-05-11 |
| CN108024447B (en) | 2019-08-30 |
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