CN108024447B - Mobile terminal, flexible circuit board and its manufacturing method - Google Patents
Mobile terminal, flexible circuit board and its manufacturing method Download PDFInfo
- Publication number
- CN108024447B CN108024447B CN201711320220.2A CN201711320220A CN108024447B CN 108024447 B CN108024447 B CN 108024447B CN 201711320220 A CN201711320220 A CN 201711320220A CN 108024447 B CN108024447 B CN 108024447B
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- Prior art keywords
- wiring area
- wiring
- conducting wire
- area
- ground
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 230000004888 barrier function Effects 0.000 claims abstract description 29
- 230000008054 signal transmission Effects 0.000 claims description 12
- 230000011664 signaling Effects 0.000 claims description 7
- 239000004744 fabric Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Conductors (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides a kind of flexible circuit board, it is formed with sequentially connected first wiring area, the second wiring area and third wiring area, the width of first wiring area and third wiring area is greater than the width of second wiring area, and make the flexible circuit board is " work " type structure on the whole；The flexible circuit board includes: conductive layer, including a plurality of conducting wire and multiple ground areas, and each conducting wire is set on second wiring area, and multiple ground areas are set to first wiring area and the third wiring area；Cover layer, including multiple openings, multiple openings are corresponded with multiple ground areas of the conductive layer respectively；Barrier film layer is electrically connected, with the grounding path formed between first wiring area and the third wiring area respectively with multiple ground areas by multiple openings.In addition, the present invention also provides a kind of mobile terminal and a kind of manufacturing methods of flexible circuit board.The flexible circuit board has preferable flexibility.
Description
Technical field
The present invention relates to electronic technology field more particularly to a kind of mobile terminals, flexible circuit board and its manufacturing method.
Background technique
Flexible circuit board (Flexible Printed Circuit, FPC) is the printing made of insulating substrate flexible
Circuit board, the advantages of not having with many rigid printed circuit boards (Printed Circuit board, PCB), such as
FPC can require any arrangement according to space layout, to reach components and parts assembling and conducting wire with free bend, winding, folding
The integration of connection.The volume of electronic product is effectively reduced using FPC due to allowing there are above-mentioned advantage, increases circuit
The flexibility of layout meets the needs that electronic product develops to high density, miniaturization, highly reliable direction.Currently, FPC is navigating
It, military affairs, mobile communication, laptop computer, computer peripheral equipment, personal digital assistant (Personal Digital Assistant,
PDA), the fields such as digital camera or product are widely used.
For the reliability and stability for guaranteeing the transmission of FPC signal, need to carry out the conducting wire of FPC meticulous layout and
Design, to prevent interfering with each other between conducting wire；It is also desirable to paste electromagnetic interference in the conducting wire of FPC
(Electromagnetic Interference, EMI) screened film, to prevent the signal transmitted in conducting wire dry by electromagnetism
It disturbs and influences signal transmission quality.In the prior art, it when conducting wire is more, generallys use and increases the FPC number of plies to realize
The configuration needed, such as the FPC structure using doubling plate or three ply board.However, since FPC needs preferable flexibility,
The number of plies by increasing FPC, which causes its thickness increase undoubtedly, to have an impact the flexibility of FPC.Therefore, how to guarantee FPC
While reasonable configuration and preferable signal transmission quality, FPC is made to have better flexibility, is current FPC design
Middle problem to be solved.
Summary of the invention
In view of the above-mentioned problems in the prior art, the present invention provides a kind of flexible circuit board, without increasing flexible electrical
The layout of greater number of conducting wire can be realized in the number of plies of road plate, while also ensuring the preferable signal transmission of conducting wire
Quality, so that flexible circuit board has better flexibility.
In addition, the present invention also provides a kind of manufacturing methods of flexible circuit board.
In addition, the present invention also provides a kind of mobile terminals using the flexible circuit board.
A kind of flexible circuit board is formed with sequentially connected first wiring area, the second wiring area and third wiring region
The width of domain, first wiring area and third wiring area is greater than the width of second wiring area, makes the flexibility
Circuit board is " work " type structure on the whole；The flexible circuit board includes the conductive layer, cover layer and screen stacked gradually
Film layer is covered, the conductive layer includes a plurality of conducting wire and multiple ground areas；Each conducting wire is set to described
On two wiring areas, and the both ends of the conducting wire be separately connected first wiring area and the third wiring area with
Form the signal transmission path between first wiring area and the third wiring area；Multiple ground areas are set to
First wiring area and the third wiring area, and ground signalling is provided for a plurality of conducting wire；The covering
Film layer includes multiple openings, and multiple openings are corresponded with multiple ground areas of the conductive layer respectively；The shielding
Film layer is electrically connected with multiple ground areas respectively by multiple openings, to form first wiring area and institute
State the grounding path between third wiring area.
Wherein, a plurality of conducting wire is arranged at intervals on second wiring area, a plurality of conducting wire
One end extends on first wiring area from second wiring area, and is electrically connected with first wiring area；
The other end of a plurality of conducting wire extends on the third wiring area from second wiring area, and with described
Three wiring areas are electrically connected.
Wherein, first wiring area and the third wiring area include at least one ground area, the screen
Cover at least one ground area and described second that membrane layer portion covering is located at first wiring area and third wiring area
Wiring area.
Wherein, a plurality of conducting wire is located at same conductive layer, and is evenly spaced in second wiring area.
Wherein, first wiring area and the third wiring area respectively include two ground areas, first cloth
Two ground areas in line region are set to the opposite sides of a plurality of conducting wire, and two of the third wiring area connect
Ground region is set to the opposite sides of a plurality of conducting wire；The barrier film layer part cover first wiring area and
Third wiring area and second wiring area is completely covered, so that whole is in " work " type structure.
A kind of manufacturing method of flexible circuit board, comprising:
Dielectric layer is provided, the dielectric layer includes the first wiring area, the second wiring area and third wiring area, described
The width of first wiring area and third wiring area is greater than the width of second wiring area, makes the dielectric layer on the whole
For " work " type structure；
Form conductive layer on the dielectric layer, the conductive layer includes a plurality of conducting wire and multiple ground areas, often
One conducting wire is set on second wiring area, and the both ends of the conducting wire are separately connected first cloth
Line region and the third wiring area are passed with the signal formed between first wiring area and the third wiring area
Defeated path；Multiple ground areas are set to first wiring area and the third wiring area, and described lead to be a plurality of
Electric line provides ground signalling；
Cover layer with multiple openings is placed on the conductive layer, and connects multiple openings described with multiple
Ground region corresponds；
Form barrier film layer on the cover layer, the barrier film layer by multiple openings respectively with multiple institutes
Ground area electric connection is stated, with the grounding path formed between first wiring area and the third wiring area.
Wherein, a plurality of conducting wire is arranged at intervals on second wiring area, a plurality of conducting wire
One end extends on first wiring area from second wiring area, and is electrically connected with first wiring area；
The other end of a plurality of conducting wire extends on the third wiring area from second wiring area, and with described
Three wiring areas are electrically connected.
Wherein, first wiring area and the third wiring area include at least one ground area, the screen
Film layer is covered at least partly to cover positioned at least one ground area of first wiring area and third wiring area and described
Second wiring area.
Wherein, first wiring area and the third wiring area respectively include two ground areas, first cloth
Two ground areas in line region are set to the opposite sides of a plurality of conducting wire, and two of the third wiring area connect
Ground region is set to the opposite sides of a plurality of conducting wire；The barrier film layer part cover first wiring area and
Third wiring area and second wiring area is completely covered, so that whole is in " work " type structure.
A kind of mobile terminal, including flexible circuit board, the flexible circuit board are formed with sequentially connected first wiring region
The width of domain, the second wiring area and third wiring area, first wiring area and third wiring area is greater than described the
The width of two wiring areas, make the flexible circuit board is " work " type structure on the whole；The flexible circuit board include according to
Conductive layer, cover layer and the barrier film layer of secondary stacking, the conductive layer include a plurality of conducting wire and multiple ground areas；Often
One conducting wire is set on second wiring area, and the both ends of the conducting wire are separately connected first cloth
Line region and the third wiring area are passed with the signal formed between first wiring area and the third wiring area
Defeated path；Multiple ground areas are set to first wiring area and the third wiring area, and described lead to be a plurality of
Electric line provides ground signalling；The cover layer includes multiple openings, and multiple openings are more with the conductive layer respectively
A ground area corresponds；The barrier film layer is electrically connected with multiple ground areas respectively by multiple openings
It connects, with the grounding path formed between first wiring area and the third wiring area.
In conclusion according to the above technical scheme, the flexible circuit board on the conductive layer by being arranged a plurality of lead
Electric line and multiple ground areas, and first wiring area and third wiring are formed by a plurality of conducting wire
Signal transmission path between region；By the way that opening corresponding with multiple ground areas is arranged on the cover layer,
So that the barrier film layer is electrically connected with multiple ground areas respectively by multiple openings, to pass through the screen
Cover the grounding path that film layer is formed between first wiring area and the third wiring area.It so not only can be effectively
The thickness for reducing the flexible circuit board promotes the flexibility of the flexible circuit board, while can also guarantee preferable signal
Transmission quality.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the planar structure perspective diagram of flexible circuit board provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram of the section structure of the flexible circuit board provided in an embodiment of the present invention along the direction A1-A2；
Fig. 3 is the flow chart of the manufacturing method of flexible circuit board provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
For ease of description, may be used herein such as " ... under ", " ... below ", "lower", " ... on ", "upper"
Spaces relative terms are waited to describe the relationship of an elements or features and another (a little) elements or features as illustrated in the drawing.
It is appreciated that be referred to as in another element or layer "upper", " being connected to " or " being couple to " another element when an element or layer or
When layer, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or there may be occupy
Between element or layer.
It is appreciated that terminology used here is merely to description specific embodiment, is not intended to limit the present invention.Herein
In use, clearly stating unless the context otherwise, otherwise singular " one " and "the" are also intended to including plural form.Further
Ground, when used in this manual, term " includes " and/or "comprising" show the feature, entirety, step, element and/or
The presence of component, but the presence that is not excluded for other one or more features, entirety, step, element, component and/or combination thereof or
Increase.
Referring to Fig. 1, first embodiment of the invention provides a kind of flexible circuit board 10 comprising dielectric layer 11, conductive layer
13, cover layer 15 and barrier film layer 17.The dielectric layer 11, conductive layer 13, cover layer 15 and the barrier film layer 17 according to
It is secondary to be stacked.The dielectric layer 11 includes the first wiring area 111, the second wiring area 113 and third wiring area 115,
First wiring area 111 is connect by second wiring area 113 with the third wiring area 115, that is, described
Two wiring areas 113 are connected between first wiring area 111 and third wiring local 115.
The conductive layer 13 is set on the dielectric layer 11 comprising a plurality of conducting wire 131 and multiple ground areas
133.The a plurality of conducting wire 131 is arranged at intervals on second wiring area 113, a plurality of conducting wire 131
One end extends on first wiring area 111 from second wiring area 113, and with first wiring area 111
It is electrically connected；The other end of a plurality of conducting wire 131 extends to the third wiring region from second wiring area 113
It on domain 115, and is electrically connected with the third wiring area 115, thus by a plurality of conducting wire 131 described first
Signal transmission path is formed between wiring area 111 and the third wiring area 115.The conducting wire 131 is ungrounded
The signal lead of network is used for transmission non-earth signal.Multiple ground areas 133 are respectively arranged at first wiring area
111 with the third wiring area 115 in, for providing ground signalling for a plurality of conducting wire 131.
The cover layer 15 is set on the conductive layer 13, including it is multiple opening 151, it is described opening 151 respectively with
The ground area 133 of the conductive layer 13 corresponds, to expose the ground area 133.The barrier film layer 17 is set to institute
It states on cover layer 15, and is electrically connected respectively with multiple ground areas 133 by corresponding opening 151, for being connected
Multiple ground areas 133, with the ground connection formed between first wiring area 111 and the third wiring area 115
Path, and electromagnetic interference shielding action is provided for a plurality of conducting wire 131.Specifically, the barrier film layer 17 is by conduction
Material (such as silverskin) is made, the barrier film layer 17 by it is described opening 151 respectively be located at first wiring area 111 and
The ground area 133 on third wiring area 115 is electrically connected, and part covers first wiring area 111 and the
Three wiring areas 115 and second wiring area 113 is completely covered, thus first wiring area 111 with it is described
Grounding path is formed between third wiring area 115；Meanwhile the barrier film layer 17 is that a plurality of conducting wire 131 provides
Electromagnetic interference shielding action.
In an alternative embodiment, the width of first wiring area 111 and third wiring area 115 is greater than described second
The width of wiring area 113.First wiring area 111, the second wiring area 113 and third wiring area 115 are on the whole
" work " type structure is collectively formed, that is, first wiring area 111 is located at institute with being respectively perpendicular with third wiring area 115
State the opposite end of the second wiring area 113.First wiring area 111 includes extremely with the third wiring area 115
A few ground area 133.The barrier film layer 17 is at least partly covered to be routed positioned at first wiring area 111 and third
The ground area 133 in region 115 and second wiring area 113 is completely covered.
Also referring to Fig. 1 and Fig. 2, wherein Fig. 2 is cross-section structure of the flexible circuit board 10 shown in Fig. 1 along the direction A1-A2
Schematic diagram.In an alternative embodiment, a plurality of conducting wire 131 is located at same conductive layer 13, and be distributed in a uniformly spaced manner
Mode passes through second wiring area 113 and extends to first wiring area 111 and third wiring area 115, and point
It is not connected with first wiring area 111 and third wiring area 115.The conductive layer 13 includes four grounded region
133, two of them ground area 133 is distributed in first wiring area 111, and is set to a plurality of conducting wire
131 opposite sides；Other two ground area 133 is distributed in the third wiring area 115, and is set to a plurality of described
The opposite sides of conducting wire 131.
The cover layer 15 includes four openings 151, four openings, 151 four with the conductive layer 13 respectively
Ground area 133 corresponds, to expose the ground area 133.The whole barrier film layer 17 is in " work " type structure, the screen
Four grounded region 133 and second wiring area 113 that film layer 17 covers the conductive layer 13 are covered, and passes through described four
Opening 151 is electrically connected with the four grounded region 133 of the conductive layer 13 respectively, thus in first wiring area 111
Grounding path is formed between the third wiring area 115, while providing electromagnetic interference screen for a plurality of conducting wire 131
The effect of covering.It is appreciated that further to promote the flexibility of second wiring area 113, it can be in the cover layer 15
Corresponding opening is set in the corresponding region in second wiring area 113, is existed so as to reduce the flexible circuit board 10
The thickness of second wiring area 113 makes it also have preferable flexibility in second wiring area 113.
Referring to Fig. 3, second embodiment of the invention provide it is a kind of suitable for flexible electrical described in first embodiment of the invention
The manufacturing method of road plate, the manufacturing method include at least following steps:
Step S201: providing dielectric layer, and the dielectric layer includes the first wiring area, the second wiring area and third wiring
Region；
Specifically, first wiring area is connect by second wiring area with the third wiring area, that is,
Second wiring area is connected between first wiring area and third wiring local.Optionally, first wiring
The width of region and third wiring area is greater than the width of second wiring area.First wiring area, the second wiring
" work " type structure is collectively formed in region and third wiring area.The material of the dielectric layer can be polyimides, and polyamides is sub-
Amine has excellent flexibility and good dimensional stability, and operating temperature range is wider, has flame retardant property outstanding,
Its electrical property under soldering conditions is barely affected.It is appreciated that the material of the dielectric layer can also be polyester, polyester
It is polymer general name obtained by polyalcohol and polyacid polycondensation, refers mainly to polyethylene terephthalate, may also comprise poly- pair
Terephtha-late and polyarylate.
Step S202: forming conductive layer on the dielectric layer, and the conductive layer includes a plurality of conducting wire and multiple connects
Ground region；
Specifically, can be by copper foil being covered on the dielectric layer to form the conductive layer.Optionally, the conductive layer
Whole is in " work " type structure, partially to cover first wiring area and third wiring area and be completely covered described second
Wiring area.The copper foil can be rolled copper foil or electrolytic copper foil, and wherein rolled copper foil has preferable ductility, repeats to scratch
The characteristics such as song, and compared to the rolled copper foil, electrolytic copper foil is then to have lower manufacturing cost, be conducive to fine-line system
The advantages such as work.In addition, can be covered on it not according to demands such as the suppleness, bending and current-carrying capability of the flexible circuit board
The copper foil of stack pile.
Wherein, a plurality of conducting wire is arranged at intervals on second wiring area, a plurality of conducting wire
One end extends on first wiring area from second wiring area, and is electrically connected with first wiring area；
The other end of a plurality of conducting wire extends on the third wiring area from second wiring area, and with described
Three wiring areas are electrically connected, thus by a plurality of conducting wire in first wiring area and the third wiring region
Signal transmission path is formed between domain.The a plurality of conducting wire is the signal lead of ungrounded network, is used for transmission and believes non-ly
Number.Multiple ground areas are respectively arranged in first wiring area and the third wiring area, for being a plurality of
The conducting wire provides ground signalling.
Step S203: the cover layer with multiple openings is placed on the conductive layer, and make it is multiple it is described opening with
Multiple ground areas correspond；
Specifically, the cover layer property of can choose cover the conductive layer, for protecting the conducting wire.It can
Selection of land, the cover layer are in " work " type structure.Optionally, the cover layer is in the corresponding region in second wiring area
Setting opening, to promote the flexible circuit board in the flexibility of second wiring area.The material of the cover layer can
Think polyimides or polyester, polyimides has the characteristics that preferable flexibility and resistant to high temperature；Polyester then has at low cost, soft
The characteristics of good toughness.In an alternative embodiment, the material of the cover layer can also be solder mask, so as to using print
Brush mode is processed, to further decrease production cost.
Step S204: forming barrier film layer on the cover layer, and the barrier film layer passes through multiple openings point
It is not electrically connected with multiple ground areas.
Wherein, the barrier film layer is at least partly covered positioned at first wiring area and the third wiring area
Ground area and completely second wiring area, and electrically connected with multiple ground areas respectively by multiple openings
It connects, for multiple ground areas to be connected, to form connecing between first wiring area and the third wiring area
Ground path, and electromagnetic interference (Electromagnetic Interference, EMI) shielding is provided for a plurality of conducting wire
Effect.Specifically, the barrier film layer is made of conductive material (such as silverskin), the barrier film layer by it is described opening respectively with
The ground area on first wiring area and third wiring area is electrically connected, and part covers described first
Wiring area and third wiring area and second wiring area is completely covered, thus in first wiring area and institute
It states and forms grounding path between third wiring area；Meanwhile the barrier film layer provides electromagnetism for a plurality of conducting wire and does
Disturb shielding action.It is appreciated that in other embodiments, can also realize electromagnetic interference shield by way of brush silver paste.
Third embodiment of the invention provides a kind of mobile terminal, including flexible circuit as described in the first embodiment of the present invention
Plate.Wherein, the mobile terminal can be but not limited to mobile phone, tablet computer, smartwatch, motion bracelet etc..
In conclusion in the mobile terminal, flexible circuit board and its manufacturing method of the above embodiment of the present invention, it is described soft
Property circuit board by being arranged a plurality of conducting wire and multiple ground areas on the conductive layer, and pass through a plurality of conductor wire
Road forms the signal transmission path between first wiring area and the third wiring area, and by the cover film
Setting opening corresponding with multiple ground areas on layer so that the barrier film layer by it is multiple it is described be open respectively with it is more
A ground area is electrically connected, to form first wiring area and third wiring by the barrier film layer
Grounding path between region, there is no need to increase the number of plies of flexible circuit board the cloth of greater number of conducting wire can be realized
Office, so can not only effectively reduce the thickness of the flexible circuit board, promote the flexibility of the flexible circuit board, can be with
Guarantee preferable electromagnetic interference shield performance and signal transmission quality.
Above disclosed is only presently preferred embodiments of the present invention, cannot limit the right of the present invention with this certainly
Range, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and according to right of the present invention
Equivalent variations made by it is required that, still belongs to the scope covered by the invention.
Claims (9)
1. a kind of flexible circuit board is formed with sequentially connected first wiring area, the second wiring area and third wiring area,
The width of first wiring area and third wiring area is greater than the width of second wiring area, makes the flexible circuit
Plate is " work " type structure on the whole；The flexible circuit board includes the conductive layer, cover layer and screened film stacked gradually
Layer, the conductive layer includes a plurality of conducting wire and multiple ground areas；Each conducting wire is set to second cloth
On line region, and the both ends of the conducting wire are separately connected first wiring area with the third wiring area to be formed
Signal transmission path between first wiring area and the third wiring area；Multiple ground areas are set to described
First wiring area and the third wiring area, and ground signalling is provided for a plurality of conducting wire；The cover layer
Including multiple openings, multiple openings are corresponded with multiple ground areas of the conductive layer respectively；The barrier film layer
It is electrically connected respectively with multiple ground areas by multiple openings, to form first wiring area and described the
Grounding path between three wiring areas；The a plurality of conducting wire is arranged at intervals on second wiring area, a plurality of institute
The one end for stating conducting wire extends on first wiring area from second wiring area, and with first wiring region
Domain is electrically connected；The other end of a plurality of conducting wire extends to the third wiring area from second wiring area
On, and be electrically connected with the third wiring area.
2. flexible circuit board as described in claim 1, which is characterized in that first wiring area and the third wiring region
Domain includes at least one ground area, and the barrier film layer part covering is located at first wiring area and third wiring region
At least one ground area in domain and second wiring area.
3. flexible circuit board as described in claim 1, which is characterized in that a plurality of conducting wire is located at same conductive layer,
And it is evenly spaced in second wiring area.
4. flexible circuit board as claimed in claim 2, which is characterized in that first wiring area and the third wiring region
Domain respectively includes two ground areas, and two ground areas of first wiring area are set to the phase of a plurality of conducting wire
To two sides, two ground areas of the third wiring area are set to the opposite sides of a plurality of conducting wire；The screen
Membrane layer portion is covered to cover first wiring area and third wiring area and second wiring area is completely covered, thus
Whole is in " work " type structure.
5. a kind of manufacturing method of flexible circuit board, which is characterized in that the manufacturing method includes:
There is provided dielectric layer, the dielectric layer include the first wiring area, the second wiring area and third wiring area, described first
The width of wiring area and third wiring area is greater than the width of second wiring area, and make the dielectric layer is one on the whole
" work " type structure；
Conductive layer is formed on the dielectric layer, the conductive layer includes a plurality of conducting wire and multiple ground areas, Mei Yisuo
It states conducting wire to be set on second wiring area, and the both ends of the conducting wire are separately connected first wiring region
The signal transmission road of domain and the third wiring area to be formed between first wiring area and the third wiring area
Diameter；Multiple ground areas are set to first wiring area and the third wiring area, and are a plurality of conductor wire
Road provides ground signalling；
Cover layer with multiple openings is placed on the conductive layer, and makes multiple openings and multiple access areas
Domain corresponds；
Form barrier film layer on the cover layer, the barrier film layer described is connect with multiple respectively by multiple openings
Ground region is electrically connected, with the grounding path formed between first wiring area and the third wiring area.
6. manufacturing method as claimed in claim 5, which is characterized in that a plurality of conducting wire is arranged at intervals at described second
On wiring area, one end of a plurality of conducting wire extends on first wiring area from second wiring area,
And it is electrically connected with first wiring area；The other end of a plurality of conducting wire is extended to from second wiring area
On the third wiring area, and it is electrically connected with the third wiring area.
7. method as claimed in claim 6, which is characterized in that first wiring area and the third wiring area Jun Bao
At least one ground area is included, the barrier film layer, which at least partly covers, is located at first wiring area and third wiring area
At least one ground area and second wiring area.
8. the method for claim 7, which is characterized in that respectively wrapped with the third wiring area first wiring area
Two ground areas are included, two ground areas of first wiring area are set to opposite the two of a plurality of conducting wire
Side, two ground areas of the third wiring area are set to the opposite sides of a plurality of conducting wire；The screened film
Layer part covers first wiring area and third wiring area and second wiring area is completely covered, thus whole
In " work " type structure.
9. a kind of mobile terminal, which is characterized in that the mobile terminal includes the flexibility as described in claim 1-4 any one
Circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711320220.2A CN108024447B (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible circuit board and its manufacturing method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711320220.2A CN108024447B (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible circuit board and its manufacturing method |
| CN201511025928.6A CN105636335B (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible PCB and its manufacture method |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511025928.6A Division CN105636335B (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible PCB and its manufacture method |
Publications (2)
| Publication Number | Publication Date |
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| CN108024447A CN108024447A (en) | 2018-05-11 |
| CN108024447B true CN108024447B (en) | 2019-08-30 |
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| CN201511025928.6A Active CN105636335B (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible PCB and its manufacture method |
| CN201711320220.2A Expired - Fee Related CN108024447B (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible circuit board and its manufacturing method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201511025928.6A Active CN105636335B (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible PCB and its manufacture method |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6260604B2 (en) * | 2015-11-16 | 2018-01-17 | ウシオ電機株式会社 | Light irradiation device |
| KR102612541B1 (en) * | 2016-10-18 | 2023-12-12 | 엘지이노텍 주식회사 | Camera module |
| CN107278028A (en) * | 2017-07-28 | 2017-10-20 | 维沃移动通信有限公司 | A kind of flexible PCB and preparation method thereof and mobile terminal |
| KR102640731B1 (en) * | 2018-02-23 | 2024-02-27 | 삼성전자주식회사 | Electronic device including rigid-flex circuit |
| CN108738226B (en) * | 2018-05-04 | 2020-11-13 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN109275263A (en) * | 2018-11-23 | 2019-01-25 | 威创集团股份有限公司 | A kind of preparation method and FPC plate of FPC plate |
| CN109581074A (en) * | 2018-12-05 | 2019-04-05 | 上海龙旗科技股份有限公司 | The transmission path structure and its setting method of SAR SENSOR control unit |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108024447A (en) | 2018-05-11 |
| CN105636335A (en) | 2016-06-01 |
| CN105636335B (en) | 2018-01-23 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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