CN101551406A - Probe card - Google Patents
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- CN101551406A CN101551406A CNA2008100858996A CN200810085899A CN101551406A CN 101551406 A CN101551406 A CN 101551406A CN A2008100858996 A CNA2008100858996 A CN A2008100858996A CN 200810085899 A CN200810085899 A CN 200810085899A CN 101551406 A CN101551406 A CN 101551406A
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- probe
- circuit board
- coverlay
- board
- jumper wire
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Abstract
The invention discloses a probe card comprising a circuit board, a base, a probe, at least one flexible jumping wire board and a plurality of metal conducing wires. The circuit board is provided with a wiring hole and the metal conducing wires pass through the wiring hole. The base is provided with a plurality of through holes arranged at the bottom of the circuit board, and the probe is provided with a plurality of wire probes and arranged on the bottom of the base so that each wire probe corresponds to each through hole and the probe is arranged below the wiring hole. The flexible jumping wire board is arranged above the circuit board and electrically connected to the circuit board so as to provide an electric conduction path connected to the circuit board. The metal conducting wires are electrically connected with the wire probes and the flexible jumping wire board after passing through the wiring hole so that the wire probes are electrically connected to the circuit board after passing through the metal conducting wires and the flexible jumping wire board.
Description
Technical field
The present invention is relevant with probe, particularly about utilizing the probe of non-rigid Connection Element connecting circuit plate and probe.
Background technology
Whether probe is the signal contact with trickle probe contact measured chip, and to chip feed-in to be measured chip to be measured, and receives the feedback signal of chip to be measured, can normal operation to judge chip to be measured.
The probe primary structure comprises circuit board, Connection Element and comprises probe, and probe has probe, and probe is to be arranged on the pedestal.Pedestal is the bottom surface of being fixed in circuit board with mechanical connection manner, electrically connects probe and circuit board by Connection Element again, allowing probe can receive the test signal of circuit board, and makes circuit board receive feedback signal by probe.Probe is the bottom surface that is arranged at circuit board, and by Connection Element, for example plain conductor is electrically connected at circuit board, or the guide hole of direct contact circuit plate, and is electrically connected at circuit board.
Along with the Highgrade integration of chip, the signal contact of chip to be measured is arranged and is also become more intensive, and probe also must adopt highdensity arrangement.Therefore, aforesaid Connection Element or guide hole number also increase thereupon.And probe is when directly electrically connecting circuit board directly over being positioned at Connection Element or guide hole, also can arrange excessively intensively because of probe gap (Pitch) dwindles, and causes being difficult for construction.
At foregoing problems, the flexible joint element has been proposed in the known technology, disperse electrical contact to other position of circuit board, cause Connection Element to be not easy the problem of connecting circuit plate and probe to improve the probe high density to arrange.For example, U.S. Patent Publication US20070229102 patent disclosure case proposes a kind of structure with soft arranging wire connecting circuit plate and probe, utilizes soft arranging wire to extend to form a signal conducting path, replaces traditional Connection Element.Yet the soft arranging wire two ends of being adopted for US20070229102 number are with electric connector (Socket) connecting circuit plate and probe, so the arrangement of soft arranging wire two tip nodes in fact still is subjected to the electric connector restriction, can't the arbitrary signal conducting path.
And No. 6707311 patent cases of U.S. Pat then directly replace probe and Connection Element with plain conductor.Its practice is that the plain conductor rear end is connected to circuit board, and front end passes probe substrate, in order to the signal contact of contact measured chip.This practice has two shortcomings to exist, one, and the physical characteristics demand of plain conductor with the physical characteristics demand to probe is different traditionally, therefore utilizes the plain conductor front end to replace probe, and low problem of mechanical undercapacity, serviceable life may be arranged.Secondly, the rear end of plain conductor directly is soldered to after the circuit board, can also reduce for the space that electronic components (being used for voltage stabilizing or filtering noise) such as electric capacity, resistance are set on the circuit board, promotes the degree of difficulty when electronic component is set.Therefore, at the application of non-rigid Connection Element, still must there be further technical scheme to be suggested.
Summary of the invention
In the probe of known technology, utilize non-rigid Connection Element connecting circuit plate and probe still to have many technical matterss.In view of the above problems, the object of the invention is to propose a kind ofly to electrically connect the probe of circuit board and probe with non-rigid support, promotes the probe yield and reduces manufacturing cost.
In order to reach above-mentioned purpose, the invention provides a kind of probe, it is characterized in that, comprise:
One circuit board has a wiring hole;
One pedestal has a plurality of perforations, and this pedestal is arranged at the bottom surface of this circuit board;
One probe has a plurality of probes, is arranged at the bottom surface of this pedestal, make each probe corresponding to these a plurality of perforations one of them, these a plurality of probes are positioned at this wiring hole below;
At least one soft jumper wire board is arranged at this circuit board top, is electrically connected at this circuit board, in order to the electrical conductivity path to be provided; And
A plurality of plain conductors by this wiring hole, and pass each perforation respectively, to electrically connect these a plurality of probes and this soft jumper wire board, so that these a plurality of probes are electrically connected at this circuit board by these a plurality of plain conductors and this soft jumper wire board.
Wherein also comprise a distance piece, kenel is set in this wiring hole in the form of a ring, with inwall and this wiring hole volume inside of isolating this wiring hole.
Wherein the edge of the end face of this pedestal is connected in this distance piece.
Wherein an end of this soft jumper wire board is arranged at the end face of this distance piece, is electrically connected at this a plurality of probes with these a plurality of plain conductors, and the other end of this soft jumper wire board is electrically connected at this circuit board.
Wherein an end of this soft jumper wire board is positioned at the edge of this wiring hole, is electrically connected at this a plurality of probes with these a plurality of plain conductors, and the other end of this soft jumper wire board is electrically connected at this circuit board.
Wherein comprise an electronic component, be arranged at the end that this soft jumper wire board is positioned at this wiring hole edge.
Wherein comprise an electronic component, be arranged at this soft jumper wire board.
Wherein this soft jumper wire board comprises:
One signal conductive layer possesses at least one printed wire; And
Coverlay and coverlay once are made with soft insulating material on one, are arranged at the upper and lower side of this signal conductive layer, and this signal conductive layer clamping is arranged on this between the coverlay and this time coverlay.
Wherein this signal conductive layer has the contact mat of a plurality of these printed wires of connection, as the external electrical contact of this printed wire.
Wherein upward coverlay and this time coverlay possess at least one contact hole respectively, use for these a plurality of contact mats and expose by each contact hole.
Wherein this soft jumper wire board comprises:
The line layer of a plurality of mutual stacked combinations has at least one printed wire respectively; And
Coverlay reaches coverlay on one, is made with soft insulating material, coats described line layer among it.
Wherein comprise a plurality of contact mats, be formed at described line layer, as the external electrical contact of this printed wire.
Wherein upward coverlay and this time coverlay possess at least one contact hole respectively, use for described first contact mat and expose by each contact hole.
Wherein the P.e.c. of at least one described line layer comprises a ground path and at least one described contact mat, is formed at a side of this line layer.
Wherein at least one described line layer has two printed wires, is formed at the two side faces of this line layer.
Wherein the P.e.c. of at least one described line layer comprises an at least one signal transducting wire road and a ground path, is formed at a side of this line layer.
Wherein comprise a sealing, be covered in these a plurality of plain conductors and this pedestal junction.
Wherein these a plurality of plain conductors comprise the plain conductor of at least one transmission high-frequency signal and the plain conductor of a ground connection, and the plain conductor of this high-frequency signal is adjacent with the plain conductor of this ground connection.
Wherein insert a sealing between the plain conductor of the plain conductor of this high-frequency signal and this ground connection, make aforesaid this two plain conductor be connected and the isolation of insulating the control interval distance by this sealing.
Wherein this sealing is an insulating material.
Plain conductor of the present invention can extend the signal conducting path arbitrarily, so the signal contact of flexible circuit board is provided with regard to not needing to cooperate the arrangement kenel of probe.The signal contact arrangement mode of flexible circuit board is not restricted, and therefore can change the gap between its inner printed wire arbitrarily yet, thereby reduces the interference between the adjacent printed wire.Simultaneously, with the plain conductor ways of connecting, can guarantee easier that also each probe all is connected with circuit board.And metallic circuit also can be brought into play buffer action, probe is not produced and pulls stress, promotes probe yield and and reduction manufacturing cost.
Description of drawings
In order to describe structure of the present invention and characteristics place in detail, below enumerate preferred embodiment and conjunction with figs. the explanation as after, wherein:
Fig. 1 is the decomposing schematic representation of the embodiment of the invention.
Fig. 2 is the diagrammatic cross-section of the embodiment of the invention.
Fig. 3 is the partial enlarged drawing of Fig. 2.
Fig. 4 is another partial enlarged drawing of Fig. 2.
Fig. 5 A is in the embodiment of the invention, the vertical view of soft jumper wire board.
Fig. 5 B is in the embodiment of the invention, the sectional exploded view of soft jumper wire board.
Fig. 6 A to Fig. 6 F is in the embodiment of the invention, the vertical view of each structural sheet of soft jumper wire board.
Fig. 7 is the diagrammatic cross-section of another aspect of the embodiment of the invention.
The main element symbol description
10 ... circuit board
11 ... wiring hole
12 ... solder joint
20 ... distance piece
22 ... sealing
24 ... sealing
30 ... probe
32 ... probe
40 ... soft jumper wire board
41 ... signal conductive layer
413 ... contact mat
42 ... last coverlay
43 ... following coverlay
44 ... line layer
441 ... printed wire
442 ... printed wire
45 ... line layer
451 ... P.e.c.
452 ... ground path
46 ... line layer
461 ... P.e.c.
462 ... ground path
50 ... plain conductor
50S ... transmit the plain conductor of high-frequency signal
50G ... the plain conductor of ground connection
60 ... pedestal
61 ... perforation
70 ... electronic component
Embodiment
See also Fig. 1, Fig. 2, Fig. 3, and shown in Figure 4, shown in, be to be the disclosed a kind of probe of one embodiment of the invention, it comprises a circuit board 10, a distance piece 20, a probe 30, a pedestal 60, a plurality of soft jumper wire board 40, reaches a plurality of plain conductors 50.
In present embodiment, circuit board 10 is rounded, however the kenel of circuit board 10 do not exceed with circle, can be other kenel.Have test circuit on the circuit board 10, in order to providing test chip required signal conducting path, and form a plurality of solder joints 12 on the circuit board 10, use for signal line to connect, to be communicated in the test circuit of circuit board 10.In addition, the central authorities of circuit board 10 have wiring hole 11, and it is circular that this wiring hole 11 is generally, and are positioned at the central authorities of circuit board 10.
Soft jumper wire board 40 is to be arranged at circuit board 10 tops, in order to the electrical conductivity path to be provided.Soft jumper wire board 40 is to be bent distortion, the one end is positioned at the edge of wiring hole 11, normally be arranged at the end face of distance piece 20, the other end is electrically connected at the test circuit of circuit board, and formation one is extended to the signal transducting wire road at wiring hole 11 edges by circuit board 10.
Plain conductor 50 is by wiring hole 11, and be arranged in each perforation 61 of pedestal 60 respectively, to electrically connect probe 32 and soft jumper wire board 40, so that probe 32 is electrically connected at circuit board 10 by plain conductor 50 and soft jumper wire board 40, with the test signal that circuit board for receiving 10 sends, send in the chip to be measured, and receive feedback signal by chip to be measured, whether the circuit board 10 that transmits can normal operation to judge chip to be measured.Plain conductor 50 is to make with the material that possesses high perveance, and its function is to connect the electrical contact of soft jumper wire board 40, makes the electrical conductivity path extend to the optional position, to cooperate the arrangement of probe 32.Generally speaking, the surface area of soft jumper wire board 40 electrical contacts is big, and has big gap (Pitch), and can't directly connect the probe 32 that high density is arranged, and the characteristic that plain conductor 50 can extend arbitrarily, the probe 32 that just can cooperate high density to arrange, and make probe 32 be electrically connected at soft jumper wire board 40.So connected mode, compared to electric connector (Socket) connecting circuit plate and probe (for example U.S. Patent Publication US20070229102 number), the arranging density of present embodiment middle probe 32 can not be subjected to the kenel restriction of soft jumper wire board 40.In addition, select trickle plain conductor 50 for use, and make its length be positioned at the distance of an end of wiring hole 11, can reduce the elasticity coefficient of plain conductor 50 integral body to tat probe 32 greater than soft jumper wire board 40, make plain conductor 50 can not produce stress, the effect of performance buffer structure to probe 32.
Refer again to Fig. 3 and shown in Figure 4, in the process of test chip to be measured, after partly signal must be handled via electronic component 70, could effectively test.Electronic component 70 is generally electric capacity or resistance, and in order to the performance voltage stabilizing or the effect of filtering noise, so and electronic component 70 can play a role more the closer to chip to be measured.In the embodiment of the invention, electronic component 70 is to be arranged at the end that soft jumper wire board 40 is positioned at wiring hole 11 edges, and electronic component 70 need not be set at circuit board 10, and more approaching chip to be measured.
Consult Fig. 2, Fig. 3, and shown in Figure 4, after plain conductor 50 is connected to its pairing probe 32 respectively, can further insert sealing 22 in the distance piece 20, epoxy resin (Epoxy) for example, so that plain conductor 50 is produced further fixed effect on pedestal 60, to avoid plain conductor 50 and probe 32 electric connections place to come off, avoid 50 contacts of adjacent metal lead simultaneously, and the performance insulating effect.Though must be noted that whole distance piece 20 bottoms have been filled in sealing 22 in the accompanying drawing, in fact 22 needs coverings of sealing plain conductor 50 gets final product with probe electric connection place.
Shown in Fig. 5 A and Fig. 5 B, flexible circuit board 40 comprises coverlay 42 on the signal conductive layer 41,, and coverlay 43 once, and wherein the thickness that is illustrated among Fig. 5 B is not actual thickness proportion, but forms in order to the detailed structure of conveniently recognized announcement.The two side faces of signal conductive layer 41 all possesses printed wire 451,461 and connects the contact mat 413 of printed wire, wherein printed wire 451,461 is arranged at the stage casing part of signal conductive layer 41, contact mat 413 then is positioned at two ends of signal conductive layer 41, as the external electrical contact of printed wire.
Consult Fig. 5 A and Fig. 5 B, Fig. 6 A, reach shown in Fig. 6 B, last coverlay 42 reaches down, and coverlay 43 is that soft insulating material is made, be arranged at the upper and lower side of signal conductive layer 41 respectively, and signal conductive layer 41 clampings are arranged between coverlay 42 and the following coverlay 43, and cover printed wire 451,461.Last coverlay 42 reaches down, and coverlay 43 is in order to printed wire 451,461 is brought into play protection and insulation, avoid printed wire 451,461 to be worn or short circuit.Because contact mat 413 need expose for the welding or the electric connection of alternate manner, therefore go up coverlay 42 and down coverlay 43 only cover printed wire 451,461 and do not cover contact mat 413.Contact mat 413 can reach down by last coverlay 42, and the contact hole 421,431 of coverlay 43 exposes, or the length of last coverlay 42 of order and following coverlay 43 is less than signal conductive layer 41, the stage casing that is attached at signal conductive layer 41 to be covering printed wire 451,461, and allows the contact mat 413 at signal conductive layer 41 two ends expose.
Consult shown in Fig. 5 B, signal conductive layer 41 can comprise one or more line layer 44,45,46 mutual stacked combinations and form, and being reached down by last coverlay 42, coverlay 43 is covered in wherein.Printed wire 441,442,451,461 is formed at a side or the two side faces of each line layer 44,45,46.Contact mat 413 is formed at line layer 44,45,46, uses for the external electric signal transport element to connect, and is extremely outside for printed wire 441,442,451,461 conducting electrical signals.
Consult Fig. 6 C, Fig. 6 D, Fig. 6 E, reach shown in Fig. 6 F, and combination is with reference to Fig. 5 B.According to the effect difference of each line layer 44,45,46, each printed wire 441,442,451,461 also possesses different kenels.
Shown in Fig. 6 C and Fig. 6 F, line layer 45,46 is made with soft insulating material respectively, and the printed wire the 451, the 461st of its grade is formed at lateral surface, and each printed wire 451,461 comprises a ground path 452,462, reaches a plurality of contact mats 413.Ground path 452,462 and contact mat 413 are films of making for conductive material, are formed at line layer 45,46 surfaces with PCB processing procedure or conductor etching mode.Ground path 452,462 is covered in line layer 45,46 surfaces, in order to produce the signal screening effect behind signal ground.Contact mat 413 is formed at two ends of line layer 45,46, that is is formed at two ends of signal conductive layer 41, as the external electrical contact of printed wire 451,461, to connect plain conductor 50 or electronic component 70.
Consult shown in Fig. 6 E and Fig. 6 F, the line layers 44 that are positioned in the middle of the signal conductive layer 41 partly are also made with soft insulating material, and this line layer 44 has two printed wires 441,442, are formed at the two side faces of line layer 44.Each printed wire 441,442 comprises an at least one signal transducting wire road 443 and a ground path 444, the film made for conductive material of signal transducting wire road 443 and ground path 444 wherein is formed at two side surfaces of line layer 44 with PCB processing procedure or conductor etching mode.Ground path 444 mainly is in order to ground connection and isolates adjacent signal transducting wire road 443 that the end points on signal transducting wire road 443 then connects the contact mat 413 of other two line layers 45,46, and electrically connects with external metallization circuit 50 or electronic component 70.
Line layer the 44,45, the 46th for stacked mutually, is isolated the printed wire 441,442,451,461 in the different line layers 41, and not short circuit mutually, so that a large amount of printed wires to be set at limited thickness.Increase by printed wire lamination quantity, can reduce the quantity on signal transducting wire road 443 in the single printed wire, increase the spacing distance of adjacent signals transmission line 443, and adjacent signals transmission line 443 can be grounded circuit 444 and isolate and cover, reduce the interactive signal interference phenomenon.Being positioned at outermost ground path 452,462 can further cover signal transducting wire road 443, avoids interfering with each other with all the other soft jumper wire boards or external circuit.
The configuration kenel of the printed wire 441,442,451,461 of soft jumper wire board 40 does not need to cooperate the dense arrangement of probe 32, therefore can strengthen the gap between the printed wire 413, reduces phase mutual interference between the printed wire 413.Simultaneously, printed wire 413 circuits can be dispersed in the different structural sheets, more can further strengthen in each line layer 415, and the gap between the printed wire 413, and more effectively reduce phase mutual interference between the printed wire 413.Each structural sheet in the soft jumper wire board 40 can a large amount of fast production, therefore also can reduce the whole manufacturing cost of probe effectively.
With reference to shown in Figure 7, as previously mentioned, in the distance piece 20 be insert sealing 22 and fixing metal lead 50 on pedestal 60.In addition, when needs transmit high-frequency signal, plain conductor 50 can provide to be possessed one to transmit the plain conductor 50G of the plain conductor 50S of high-frequency signal and a ground connection adjacent, and between two plain conductor 50S, 50G, insert a sealing 24, this sealing 24 is to be insulating material, possess a dielectric property, two plain conductor 50S, 50G are connected by sealing 24 and the isolation of insulating, control the spacing distance between two plain conductor 50S, the 50G.Wherein, the plain conductor 50S that transmits high-frequency signal is the probe 32 that is connected to a correspondence, and the plain conductor 50G of ground connection is electrically connected to another corresponding probe 32 and other plain conductor shared one probe 32 as the ground connection use.Line by plain conductor 50S, 50G directly designs, the distance design between plain conductor 50S, the 50G, the dielectric property of insulating material are selected, and reaches impedance matching, makes plain conductor 50S be applicable to the transmission high-frequency signal.
Only, above-described, only be preferable possible embodiments of the present invention, so the equivalent structure that every application instructions of the present invention and claim are done changes, ought to be included in the claim scope of the present invention.
Claims (20)
1. a probe is characterized in that, comprises:
One circuit board has a wiring hole;
One pedestal has a plurality of perforations, and this pedestal is arranged at the bottom surface of this circuit board;
One probe has a plurality of probes, is arranged at the bottom surface of this pedestal, make each probe corresponding to these a plurality of perforations one of them, these a plurality of probes are positioned at this wiring hole below;
At least one soft jumper wire board is arranged at this circuit board top, is electrically connected at this circuit board, in order to the electrical conductivity path to be provided; And
A plurality of plain conductors by this wiring hole, and pass each perforation respectively, to electrically connect these a plurality of probes and this soft jumper wire board, so that these a plurality of probes are electrically connected at this circuit board by these a plurality of plain conductors and this soft jumper wire board.
2. probe as claimed in claim 1 is characterized in that, wherein also comprises a distance piece, and kenel is set in this wiring hole in the form of a ring, with inwall and this wiring hole volume inside of isolating this wiring hole.
3. probe as claimed in claim 2 is characterized in that, wherein the edge of the end face of this pedestal is connected in this distance piece.
4. probe as claimed in claim 2 is characterized in that, wherein an end of this soft jumper wire board is arranged at the end face of this distance piece, is electrically connected at this a plurality of probes with these a plurality of plain conductors, and the other end of this soft jumper wire board is electrically connected at this circuit board.
5. probe as claimed in claim 1 is characterized in that, wherein an end of this soft jumper wire board is positioned at the edge of this wiring hole, is electrically connected at this a plurality of probes with these a plurality of plain conductors, and the other end of this soft jumper wire board is electrically connected at this circuit board.
6. as claim 4 or 5 described probe, it is characterized in that, wherein comprise an electronic component, be arranged at the end that this soft jumper wire board is positioned at this wiring hole edge.
7. probe as claimed in claim 1 is characterized in that, wherein comprises an electronic component, is arranged at this soft jumper wire board.
8. probe as claimed in claim 1 is characterized in that, wherein this soft jumper wire board comprises:
One signal conductive layer possesses at least one printed wire; And
Coverlay and coverlay once are made with soft insulating material on one, are arranged at the upper and lower side of this signal conductive layer, and this signal conductive layer clamping is arranged on this between the coverlay and this time coverlay.
9. probe as claimed in claim 8 is characterized in that wherein this signal conductive layer has the contact mat of a plurality of these printed wires of connection, as the external electrical contact of this printed wire.
10. probe as claimed in claim 9 is characterized in that, wherein upward coverlay and this time coverlay possess at least one contact hole respectively, use for these a plurality of contact mats and expose by each contact hole.
11. probe as claimed in claim 1 is characterized in that, wherein this soft jumper wire board comprises:
The line layer of a plurality of mutual stacked combinations has at least one printed wire respectively; And
Coverlay reaches coverlay on one, is made with soft insulating material, coats described line layer among it.
12. probe as claimed in claim 11 is characterized in that, wherein comprises a plurality of contact mats, is formed at described line layer, as the external electrical contact of this printed wire.
13. probe as claimed in claim 12 is characterized in that, wherein upward coverlay and this time coverlay possess at least one contact hole respectively, use for described first contact mat and expose by each contact hole.
14. probe as claimed in claim 11 is characterized in that, wherein the P.e.c. of at least one described line layer comprises a ground path and at least one described contact mat, is formed at a side of this line layer.
15. probe as claimed in claim 11 is characterized in that, wherein at least one described line layer has two printed wires, is formed at the two side faces of this line layer.
16. probe as claimed in claim 11 is characterized in that, wherein the P.e.c. of at least one described line layer comprises an at least one signal transducting wire road and a ground path, is formed at a side of this line layer.
17. probe as claimed in claim 1 is characterized in that, wherein comprises a sealing, is covered in these a plurality of plain conductors and this pedestal junction.
18. probe as claimed in claim 1 is characterized in that, wherein these a plurality of plain conductors comprise the plain conductor of at least one transmission high-frequency signal and the plain conductor of a ground connection, and the plain conductor of this high-frequency signal is adjacent with the plain conductor of this ground connection.
19. probe as claimed in claim 18 is characterized in that, wherein inserts a sealing between the plain conductor of the plain conductor of this high-frequency signal and this ground connection, makes aforesaid this two plain conductor be connected and the isolation of insulating the control interval distance by this sealing.
20. probe as claimed in claim 19 is characterized in that, wherein this sealing is an insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100858996A CN101551406A (en) | 2008-04-02 | 2008-04-02 | Probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100858996A CN101551406A (en) | 2008-04-02 | 2008-04-02 | Probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101551406A true CN101551406A (en) | 2009-10-07 |
Family
ID=41155759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100858996A Pending CN101551406A (en) | 2008-04-02 | 2008-04-02 | Probe card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101551406A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102043074A (en) * | 2009-10-14 | 2011-05-04 | 旺矽科技股份有限公司 | High-frequency probe card |
| CN103765232A (en) * | 2011-08-29 | 2014-04-30 | 西门子公司 | Wiring test device for electronics cabinets having internal signal wiring |
| CN103869109A (en) * | 2012-12-12 | 2014-06-18 | 华邦电子股份有限公司 | Probe card and welding method |
| CN108072776A (en) * | 2016-11-14 | 2018-05-25 | 旺矽科技股份有限公司 | Probe card and multi-signal transmission board thereof |
| CN108152544A (en) * | 2016-12-05 | 2018-06-12 | 中华精测科技股份有限公司 | Probe card for testing integrated circuit |
| CN108279325A (en) * | 2017-01-06 | 2018-07-13 | 新特系统股份有限公司 | To the probe card module of test circuit chip |
| CN108535552A (en) * | 2018-05-10 | 2018-09-14 | 环旭电子股份有限公司 | Test device |
| CN108872651A (en) * | 2017-05-08 | 2018-11-23 | 旺矽科技股份有限公司 | Probe card |
| CN111213438A (en) * | 2017-11-24 | 2020-05-29 | 川崎重工业株式会社 | Shell body |
| CN111721979A (en) * | 2019-03-18 | 2020-09-29 | 中华精测科技股份有限公司 | Probe card testing device and signal switching module thereof |
| TWI782505B (en) * | 2021-04-27 | 2022-11-01 | 旺矽科技股份有限公司 | Probe Mount Circuit Board for Probe Cards |
-
2008
- 2008-04-02 CN CNA2008100858996A patent/CN101551406A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102043074A (en) * | 2009-10-14 | 2011-05-04 | 旺矽科技股份有限公司 | High-frequency probe card |
| CN103765232A (en) * | 2011-08-29 | 2014-04-30 | 西门子公司 | Wiring test device for electronics cabinets having internal signal wiring |
| CN103765232B (en) * | 2011-08-29 | 2016-09-28 | 西门子公司 | For having the wiring test device of the electronic equipment case of the signal wiring of inside |
| US9470736B2 (en) | 2011-08-29 | 2016-10-18 | Siemens Aktiengesellschaft | Wiring test device for electronics cabinets having internal signal wiring |
| CN103869109A (en) * | 2012-12-12 | 2014-06-18 | 华邦电子股份有限公司 | Probe card and welding method |
| CN103869109B (en) * | 2012-12-12 | 2017-10-10 | 华邦电子股份有限公司 | Probe card and its welding method |
| CN108072776B (en) * | 2016-11-14 | 2020-05-26 | 旺矽科技股份有限公司 | Probe card and multi-signal transmission board thereof |
| CN108072776A (en) * | 2016-11-14 | 2018-05-25 | 旺矽科技股份有限公司 | Probe card and multi-signal transmission board thereof |
| CN108152544A (en) * | 2016-12-05 | 2018-06-12 | 中华精测科技股份有限公司 | Probe card for testing integrated circuit |
| CN108279325A (en) * | 2017-01-06 | 2018-07-13 | 新特系统股份有限公司 | To the probe card module of test circuit chip |
| CN108872651A (en) * | 2017-05-08 | 2018-11-23 | 旺矽科技股份有限公司 | Probe card |
| CN111213438A (en) * | 2017-11-24 | 2020-05-29 | 川崎重工业株式会社 | Shell body |
| CN111213438B (en) * | 2017-11-24 | 2021-05-07 | 川崎重工业株式会社 | Shell body |
| CN108535552A (en) * | 2018-05-10 | 2018-09-14 | 环旭电子股份有限公司 | Test device |
| CN108535552B (en) * | 2018-05-10 | 2020-07-07 | 环旭电子股份有限公司 | Testing device |
| CN111721979A (en) * | 2019-03-18 | 2020-09-29 | 中华精测科技股份有限公司 | Probe card testing device and signal switching module thereof |
| CN111721979B (en) * | 2019-03-18 | 2023-05-23 | 台湾中华精测科技股份有限公司 | Probe card testing device and signal switching module thereof |
| TWI782505B (en) * | 2021-04-27 | 2022-11-01 | 旺矽科技股份有限公司 | Probe Mount Circuit Board for Probe Cards |
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Open date: 20091007 |