CN207802499U - Flexible PCB - Google Patents
Flexible PCB Download PDFInfo
- Publication number
- CN207802499U CN207802499U CN201721767075.8U CN201721767075U CN207802499U CN 207802499 U CN207802499 U CN 207802499U CN 201721767075 U CN201721767075 U CN 201721767075U CN 207802499 U CN207802499 U CN 207802499U
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- ground plane
- substrate portion
- flexible pcb
- substrate
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- 239000000758 substrate Substances 0.000 claims abstract description 287
- 230000005611 electricity Effects 0.000 claims description 15
- 230000033228 biological regulation Effects 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000004020 conductor Substances 0.000 description 10
- 238000010276 construction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model is related to a kind of flexible PCBs comprising multiple baseplate parts, the substrate include：It is formed with the first dielectric of signal wire in plane；Second dielectric opposed with described first dielectric plane；The first ground plane of a pair of described first dielectric plane is laminated on across the signal line layer；It is formed in the second ground plane of described first dielectric bottom surface；And it is laminated in the third ground plane of described second dielectric plane, and the multiple baseplate part connects and forms a substrate in the horizontal direction.According to the utility model, the flexible PCB for being formed with multiple signal wires can be manufactured；It is easy the characteristic impedance of flexible PCB being designed as preset a reference value；The position relationship of consideration signal wire and ground plane is applicable in the shape of ground plane, makes the reduced minimum of the characteristic impedance of flexible PCB and with shielding reliability；Multiple through-holes are formed between signal wire, and adjust the spacing of these through-holes, and the signal interference between signal wire is made to minimize.
Description
Technical field
The utility model is related to a kind of flexible PCBs.
Background technology
In general, have RF (Radio Frequency, radio frequency) signal line in the wireless terminal devices such as mobile phone, though and
So previous RF signal lines are installed in the form of coaxial cable, but in the case where being installed in the form of coaxial cable, wireless
Space in terminal device can decline with rate, therefore, recently, it is common to use flexible PCB.
On the one hand, due to can be using at least two RF signals come the prosperity of the multi-band technique of high speed transmission data, closely
The wireless terminal device come uses multiple RF signal lines.Also that is, as multiple flexible PCBs are installed on wireless terminal device
Inside, space the problem of declining again with rate occurs.
In particular, due to the trend toward miniaturization of wireless terminal device, the inner space of wireless terminal device becomes narrower, because
This, from the point of view of present situation, it is desirable that a kind of effective stepped construction that multiple RF signal lines can be formed in a substrate.
In addition, flexible PCB makes ground plane and dielectric be bonded or make ground plane and ground plane viscous by medium of bonding sheet
It connects, and in the case where being respectively formed in mutually different dielectric ground plane and being bonded as medium using bonding sheet, characteristic impedance
It is possible that can decline.
As reference, the optimal impedance of the signal sending end of flexible PCB is about 33 Ω, the optimal resistance of signal receiving end
It is about 75 Ω to resist, thus both signal sending end and receiving terminal all consider to be designed to the characteristic impedance with about 50 Ω.
In previous flexible PCB, usually using one be respectively formed in mutually different dielectric ground plane
A ground plane is not applicable mode, but in that case it is possible to can because ground plane be not applicable in cause to shielding can
Decline by property and has external signal inflow.
In addition, if external signal flows into flexible PCB, above-mentioned characteristic impedance can be detached from 50 Ω of a reference value, it is possible to meeting
It has a negative impact to effectiveness, thus in the case where being intended to multiple RF signal lines being formed in a substrate, from
Present situation is seen always, needs one kind being not only able to shielding external signal, moreover it is possible to which characteristic impedance is designed as a reference value (50 Ω)
Effective stepped construction.
Utility model content
The utility model proposes in view of the above problems, it is intended that a kind of easy design characteristics impedance of offer and screen
While covering external signal, there is the flexible PCB for the effective stepped construction that can form multiple signal wires.
The purpose of this utility model is not limited to above-mentioned purpose, and those skilled in the art will be from following record
Other purposes not referred to are expressly understood.
Above-mentioned the purpose of this utility model can be achieved through the following technical solutions.
The utility model to reach above-mentioned purpose provides a kind of flexible PCB, which is characterized in that including baseplate part, institute
Stating baseplate part includes：It is formed with the first dielectric of signal wire in plane；Second opposed with described first dielectric plane
Dielectric；The first ground plane of a pair of described first dielectric plane is laminated on across the signal line layer；It is formed in described
Second ground plane of one dielectric bottom surface；And it is laminated in the third ground plane of described second dielectric plane, and it is described
Multiple baseplate parts connect and form a substrate in the horizontal direction.
In a preferred embodiment, the substrate is made of two baseplate parts including first substrate portion and second substrate portion,
Described two baseplate parts with identical sequence be laminated with first dielectric, second dielectric, first ground plane,
Second ground plane and the third ground plane.
In a preferred embodiment, in the substrate, first dielectric in the first substrate portion and the second substrate portion
The first dielectric be integrally formed, the second dielectric of second dielectric in the first substrate portion and the second substrate portion
It is integrally formed.
In a preferred embodiment, described two baseplate parts further include being formed in the 4th of described second dielectric bottom surface to connect
Stratum.
In a preferred embodiment, second dielectric formation is that thickness is more relatively thin than first dielectric.
In a preferred embodiment, first dielectric is formed with the thickness of 0.05mm to 0.1mm, second dielectric
It is formed with the thickness of 0.025mm to 0.05mm.
In a preferred embodiment, the substrate is made of two baseplate parts including first substrate portion and second substrate portion,
It is laminated with first dielectric, second dielectric, described to a baseplate part backward in described two baseplate parts
One ground plane, second ground plane and the third ground plane.
In a preferred embodiment, in the substrate, first dielectric in the first substrate portion and the second substrate portion
The second dielectric be integrally formed, the first dielectric of second dielectric in the first substrate portion and the second substrate portion
It is integrally formed.
In a preferred embodiment, the first substrate portion and the second substrate portion further include a pair of 4th ground plane,
It is formed with shape identical with first ground plane in described second dielectric face opposed with first dielectric, institute
The first ground plane and the 4th ground plane in the second substrate portion for stating first substrate portion are integrally formed, the first substrate portion
The 4th ground plane and first ground plane in the second substrate portion be integrally formed.
In a preferred embodiment, the substrate is by including the three of first substrate portion, second substrate portion and third baseplate part
A baseplate part is constituted, and three baseplate parts are laminated with first dielectric, second dielectric, institute with identical sequence
State the first ground plane, second ground plane and the third ground plane.
In a preferred embodiment, in the substrate, first dielectric in the first substrate portion, the second substrate portion
First dielectric of the first dielectric and the third baseplate part is integrally formed, and second electricity in the first substrate portion is situated between
Second dielectric of matter, second dielectric in the second substrate portion and the third baseplate part is integrally formed.
In a preferred embodiment, three baseplate parts further include being formed in the 4th of described second dielectric bottom surface to connect
Stratum.
In a preferred embodiment, second dielectric formation is that thickness is more relatively thin than first dielectric.
In a preferred embodiment, first dielectric is formed with the thickness of 0.05mm to 0.1mm, second dielectric
It is formed with the thickness of 0.025mm to 0.05mm.
In a preferred embodiment, the substrate is by including the three of first substrate portion, second substrate portion and third baseplate part
A baseplate part is constituted, and is laminated at least one of described three baseplate parts baseplate part backward first dielectric, described
Second dielectric, first ground plane, second ground plane and the third ground plane.
In a preferred embodiment, in the substrate, first dielectric and the second dielectric in the first substrate portion
One dielectric, the second substrate portion the first dielectric and the second dielectric in a dielectric and the third base
A dielectric in the first dielectric and the second dielectric of plate portion is integrally formed.
In a preferred embodiment, the first substrate portion to the third baseplate part further includes a pair of 4th ground plane,
It is formed with shape identical with first ground plane in described second dielectric face opposed with first dielectric, institute
The first ground plane and the 4th ground plane in the second substrate portion for stating first substrate portion are integrally formed, the first substrate portion
The 4th ground plane and first ground plane in the second substrate portion be integrally formed, first ground plane in the second substrate portion
It is integrally formed with the 4th ground plane of the third baseplate part, the 4th ground plane and the third base in the second substrate portion
First ground plane of plate portion is integrally formed.
In a preferred embodiment, second ground plane and the third ground plane are sheet shape, or in same plane
On separate regulation spacing and the shape that is formed parallel to, or be formed with the shape or mesh shape of multiple ground holes.
In a preferred embodiment, the void for being arranged in and parallelly being separated with each signal wire is formed in the multiple baseplate part
Multiple through-holes on quasi- line, the spacing between signal wire between two opposed through-holes be 0.2mm to 0.5mm or 2mm extremely
3mm。
In a preferred embodiment, the substrate is by including first substrate portion, second substrate portion, third baseplate part and the 4th
Four baseplate parts of baseplate part are constituted, and in four baseplate parts, the first substrate portion and the second substrate portion are along level
Direction connects, and the third baseplate part and tetrabasal portion connect and be adhered to institute by medium of bonding sheet in the horizontal direction
State the bottom surface in first substrate portion and the second substrate portion.
In a preferred embodiment, four baseplate parts further include being formed in the 4th of described second dielectric bottom surface to connect
Stratum.
The effect of the utility model is as follows.
By technical solution above-mentioned, the utility model is capable of providing a kind of can manufacture and is formed with the soft of multiple signal wires
The effective stepped construction of property circuit board.
It is easy the characteristic impedance of flexible PCB being designed as preset a reference value in addition, the utility model has
Effect.
In addition, the position relationship of the utility model consideration signal wire and ground plane is applicable in the shape of ground plane, to have
Make the reduced minimum of the characteristic impedance of flexible PCB and has the effect of shielding reliability.
In addition, the utility model forms multiple through-holes between signal wire, and adjusts the spacing of these through-holes, to have
The effect for making the signal interference between signal wire minimize.
Description of the drawings
Fig. 1 and Fig. 2 is the figure of the flexible PCB of the first embodiment for illustrating the utility model.
Fig. 3 (a) to Fig. 3 (d) is the figure of the ground plane for illustrating flexible PCB.
Fig. 4 and Fig. 5 is the figure of the flexible PCB and its variation of the second embodiment for illustrating the utility model.
Fig. 6 is the figure of the flexible PCB of the 3rd embodiment for illustrating the utility model.
Fig. 7 is the figure of the flexible PCB of the fourth embodiment for illustrating the utility model.
Fig. 8 to Figure 12 is the figure of the flexible PCB and its variation for illustrating the 5th embodiment.
Figure 13 is the figure of the flexible PCB of the sixth embodiment for illustrating the utility model.
Figure 14 and Figure 15 is the figure of the flexible PCB and its variation of the 7th embodiment for illustrating the utility model.
Symbol description
100a- first substrates portion, 100b- second substrates portion, 100c- third baseplate parts, 110a, 110b, 110c-
First dielectric, the second dielectric of 120a, 120b, 120c-, the first ground plane of 130a, 130b, 130c-, 140a, 140b,
The second ground planes of 140c-, 150a, 150b, 150c- third ground plane, the 4th ground plane of 160a, 160b, 160c-, S1-
One signal wire, S2- second signal lines, S3- third signal wires.
Specific implementation mode
In illustrating below, show that the regulation of the utility model is thin to provide the understanding of more globality of the utility model
Section, but the general technical staff of this field without these provided details by these deformation it will be appreciated that even if can be also easy
Implement the utility model.
First, the flexible PCB of an embodiment of the utility model provides effective stepped construction, so as to one
A substrate forms multiple signal wires, and is easy the characteristic impedance of flexible PCB being designed to a reference value (50 Ω), can make it
Manufacturing process is simplified, and shortens manufacturing time.
1 to Figure 15 the preferred embodiment of the utility model is described in detail with reference to the accompanying drawings, and to understand this reality
With being illustrated centered on novel action and the required part of effect.
Fig. 1 and Fig. 2 is the figure of the flexible PCB of the first embodiment for illustrating the utility model, Fig. 3 (a) to Fig. 3
(d) be ground plane for illustrating flexible PCB figure.
Referring to figs. 1 to Fig. 3 (d), the flexible PCB of the first embodiment of the utility model can be by being respectively formed with letter
Two baseplate parts of number line connect and form tool there are two a substrate of signal wire in the horizontal direction, and the substrate includes：Shape
At the first substrate portion 100a for having the first signal wire S1；And it is formed with the second substrate portion 100b of second signal line S2.
First, first substrate portion 100a include the first dielectric 110a, the second dielectric 120a, the first ground plane 130a,
Second ground plane 140a and third ground plane 150a and constitute.
In first substrate portion, the plane of the first dielectric 110a of 100a is formed with the first signal wire S1, the second dielectric
120a is formed in parallel with the first dielectric 110a and opposed with the plane of the first dielectric 110a and separates the position of regulation spacing
It sets.
In addition, the plane in the first dielectric 110a is laminated with and separates a pair of the of regulation spacing across the first signal wire S1
One ground plane 130a and be adhered to the second dielectric 120a using bonding sheet B as medium, formed in the bottom surface of the first dielectric 110a
There is the second ground plane 140a, third ground plane 150a is laminated in the plane of the second dielectric 120a.
Second substrate portion 100b may include the first dielectric 110b, the second dielectric for being formed with second signal line S2
120b, the first ground plane 130b, the second ground plane 140b and third ground plane 150b and constitute, and dielectric and ground plane with
Sequence stacking identical with first substrate portion 100a, to be identically formed with first substrate portion 100a in structure.
In addition, the flexible PCB of the first embodiment of the utility model has in the left side or the right side of first substrate portion 100a
The side of side connection second substrate portion 100b and the structure being integrally formed.
For example, the first dielectric 110b of the first dielectric 110a and second substrate portion 100b of first substrate portion 100a can
To be integrally formed, the second dielectric 120b of the second dielectric 120a and second substrate portion 100b of first substrate portion 100a can
To be integrally formed.
In addition, the ground plane for being laminated in first substrate portion 100a and second substrate portion 100b respectively can also integrated landform
At in particular, second ground plane 140a, 140b may be integrally formed, and third ground plane 150a, 150b can integrated landform
At.
Therefore, it is possible to simplify the manufacturing process of substrate and shorten manufacturing time.
On the one hand, it can also be also formed in first substrate portion 100a and second substrate portion 100b and penetrate through the first dielectric
110a, 110b, second dielectric 120a, 120b, first ground plane 130a, 130b, second ground plane 140a, 140b and third
Electric conductor is filled in the hole of ground plane 150a, 150b and makes first ground plane 130a, 130b to third ground plane 150a, 150b electricity
The through-hole VH of connection.
In addition, through-hole VH can in the form of being arranged in the dummy line parallelly separated with each signal wire S1, S2 shape
At, and the spacing between opposed two through-hole VH between signal wire S1, S2 can be 0.2mm to 0.5mm or 2mm to 3mm.
In addition, as Fig. 3 (a) to Fig. 3 (d) is illustrated, it is respectively formed in first substrate portion 100a and second substrate portion 100b
Second ground plane 140a, 140b and third ground plane 150a, 150b can be with sheet shape (Fig. 3 (a)), or in same plane
On separate regulation spacing and the shape (Fig. 3 (b)) that is formed parallel to, or periodically form the shape (figure of multiple ground holes
3 (c)) or mesh shape (Fig. 3 (d)) formation.
Fig. 4 and Fig. 5 is the figure of the flexible PCB and its variation of the second embodiment for illustrating the utility model.
First, with reference to Fig. 4, the flexible PCB of the second embodiment of the utility model is by being respectively formed with the two of signal wire
A baseplate part connects and forms tool there are two a substrate of signal wire in the horizontal direction, and the substrate includes：It is formed with first
The first substrate portion 100a of signal wire S1；And it is formed with the second substrate portion 100b of second signal line S2.
First substrate portion 100a connects including the first dielectric 110a, the second dielectric 120a, the first ground plane 130a, second
Stratum 140a and third ground plane 150a and constitute.
Substantially, first substrate portion 100a is sequentially laminated with the second ground plane 140a, is formed with the of the first signal wire S1
One dielectric 110a, the first ground plane 130a, the second dielectric 120a and third ground plane 150a, to referring to Fig.1 and
The structure for the first substrate portion 100a that Fig. 2 illustrates is identically formed.
Second substrate portion 100b includes the first dielectric 110b, the second dielectric 120b, the first ground plane 130b, second
Ground plane 140b and third ground plane 150b, and compared with first substrate portion 100a, be situated between with the first dielectric 110b, the second electricity
The structure being laminated to matter 120b, the first ground plane 130b, the second ground plane 140b and third ground plane 150b backwards, i.e., with
The structure that first substrate portion 100a is turned over forms and is connected to the side of first substrate portion 100a.
For example, second substrate portion 100b can be with opposed with the plane of the second dielectric 120b and separate between regulation spacing
Away from position be laminated with the first dielectric 110b, being formed with second signal line S2 and first in the bottom surface of the first dielectric 110b connects
Stratum 130b is laminated with the second ground plane 140b in the plane of the first dielectric 110b, and third ground plane 150b is formed in second
The structure of the bottom surface of dielectric 120b is constituted.
Therefore, it is formed in the first signal wire S1 of first substrate portion 100a and is formed in the second of second substrate portion 100b
Signal wire S2 is located at mutually different plane, so as to make mutual signal interference minimize.
It on the one hand, can also be in first substrate in the case of the flexible PCB of the second embodiment of the utility model
The left or right side of portion 100a connects the side of second substrate portion 100b and is integrally formed.
At this point, the second dielectric 120b mono- of the first dielectric 110a and second substrate portion 100b of first substrate portion 100a
It is formed to body, the first dielectric 110b one of the second dielectric 120a and second substrate portion 100b of first substrate portion 100a
Ground is formed.
In addition, second ground plane 140a, the 140b for being laminated in first substrate portion 100a and second substrate portion 100b respectively can
To be integrally formed, and third ground plane 150a, 150b may be integrally formed.To simplify the manufacturing process of substrate
And shorten manufacturing time.
The first dielectric is being penetrated through in addition, can also be also formed in first substrate portion 100a and second substrate portion 100b
110a, 110b, second dielectric 120a, 120b, first ground plane 130a, 130b, second ground plane 140a, 140b and third
Electric conductor is filled in the hole of ground plane 150a, 150b and makes first ground plane 130a, 130b to third ground plane 150a, 150b electricity
The through-hole VH of connection.
In addition, through-hole VH can in the form of being arranged in the dummy line parallelly separated with each signal wire S1, S2 shape
At, and the spacing between opposed two through-hole VH between signal wire S1, S2 can be 0.2mm to 0.5mm or 2mm to 3mm.
On the one hand, as illustrated in fig. 5, in the flexible PCB of the second embodiment of the utility model with a baseplate part
The structure that 100a, 100b are turned over is formed, to be formed in the first signal wire S1 of first substrate portion 100a and be formed in the
In the case that the second signal line S2 of two baseplate part 100b is located at mutually different plane, each baseplate part 100a, 100b with
The face of second opposed first dielectric 110a, 110b dielectric 120a, 120b, which can also be also formed with, to be had and the first ground connection
A pair the 4th ground plane 160a, 160b of the identical shapes of layer 130a, 130b.
In this case, the first ground plane 130a of first substrate portion 100a connects with the 4th of second substrate portion 100b
Stratum 160b may be integrally formed, and the of the 4th ground plane 160a and second substrate portion 100b of first substrate portion 100a
One ground plane 130b may be integrally formed.
Fig. 6 is the figure of the flexible PCB of the 3rd embodiment for illustrating the utility model.
With reference to Fig. 6, the flexible PCB of the 3rd embodiment of the utility model is by being respectively formed with two bases of signal wire
Plate portion connects to horizontal direction and forms tool there are two a substrate of signal wire, and the substrate includes：It is formed with the first signal
Line S1's；And it is formed with the second substrate portion 100b of second signal line S2.
First substrate portion 100a connects including the first dielectric 110a, the second dielectric 120a, the first ground plane 130a, second
Stratum 140a, third ground plane 150a and the 4th ground plane 160a.
In first substrate portion, the plane of the first dielectric 110a of 100a is formed with the first signal wire S1, and with the first electricity
Medium 110a is parallel and opposed with the plane of the first dielectric 110a and separates the position of regulation spacing and is formed with the second dielectric
120a。
In addition, the plane in the first dielectric 110a is laminated with the first ground plane of a pair separated across the first signal wire S1
130a is formed with the second ground plane 140a in the bottom surface of the first dielectric 110a, is laminated in the plane of the second dielectric 120a
Third ground plane 150a.
In addition, being formed with the 4th ground plane 160a in the bottom surface of the second dielectric 120a and using bonding sheet B as medium and
One ground plane 130a bondings.
On the one hand, due to being also equipped with the 4th ground plane 160a the entire area of ground plane is increased, thus preferred tune
The thickness of the second dielectric 120a is saved with the thickness more relatively thin than the first dielectric 110a, to be designed to make flexible circuit
The characteristic impedance of plate becomes a reference value (50 Ω).
For example, the first dielectric 110a can be made to be formed with the thickness of 0.05mm to 0.1mm, and so that the second dielectric
The mode of thickness of the 120a with 0.025mm to 0.05mm is formed.
Second substrate portion 100b include the first dielectric 110b for being formed with second signal line S2, the second dielectric 120b,
First ground plane 130b, the second ground plane 140b, third ground plane 150b and the 4th ground plane 160b and constitute, and dielectric
It is laminated with sequence identical with first substrate portion 100a with ground plane, to landform identical as first substrate portion 100a in structure
At.
In addition, in the case of the flexible PCB of the 3rd embodiment of the utility model, it can also be in first substrate portion
The left or right side of 100a connects the side of second substrate portion 100b and is integrally formed.
In this case, first dielectric 110a, 110b one of first substrate portion 100a and second substrate portion 100b
Ground is formed, and second dielectric 120a, 120b of first substrate portion 100a and second substrate portion 100b is integrally formed, the first base
Second ground plane 140a, 140b of plate portion 100a and second substrate portion 100b is integrally formed, first substrate portion 100a and second
Third ground plane 150a, 150b of baseplate part 100b is integrally formed.
Therefore, it is possible to simplify the manufacturing process of substrate and shorten manufacturing time.
In addition, it can also be also formed in first substrate portion 100a and second substrate portion 100b and penetrate through the first dielectric
110a, 110b, second dielectric 120a, 120b, first ground plane 130a, 130b, second ground plane 140a, 140b, third connect
Electric conductor is filled in the hole of stratum 150a, 150b and the 4th ground plane 160a, 160b and makes first ground plane 130a, 130b extremely
The through-hole VH of 4th ground plane 160a, 160b electrical connection.
In addition, through-hole VH can in the form of being arranged in the dummy line parallelly separated with each signal wire S1, S2 shape
At, and the spacing between opposed two through-hole VH between signal wire S1, S2 can be 0.2mm to 0.5mm or 2mm to 3mm.
Fig. 7 is the figure of the flexible PCB of the fourth embodiment for illustrating the utility model.
With reference to Fig. 7, the flexible PCB of the fourth embodiment of the utility model is by being respectively formed with three bases of signal wire
Plate portion connects and forms tool there are three a substrates of signal wire in the horizontal direction, and includes be formed with the first signal wire S1 the
One baseplate part 100a, the second substrate portion 100b for being formed with second signal line S2 and the third for being formed with third signal wire S3
Baseplate part 100c and constitute.
First substrate portion 100a and second substrate portion 100b include first dielectric 110a, 110b, the second dielectric 120a,
120b, first ground plane 130a, 130b, second ground plane 140a, 140b and third ground plane 150a, 150b and constitute.
Substantially, first substrate portion 100a and second substrate portion 100b be sequentially laminated with second ground plane 140a, 140b,
It is formed with the first dielectric 110a, 110b, first ground plane 130a, 130b, the second dielectric of each signal wire S1, S2
120a, 120b and third ground plane 150a, 150b, to the first substrate portion 100a illustrated referring to Fig.1 with Fig. 2 and the
The structure of two baseplate part 100b is identically formed.
Third baseplate part 100c connects including the first dielectric 110c, the second dielectric 120c, the first ground plane 130c, second
Stratum 140c and third ground plane 150c and constitute, be formed with third signal wire S3 in the plane of the first dielectric 110c,
It is parallel with the first dielectric 110c and opposed with the plane of the first dielectric 110c and separate the position of regulation spacing and be formed with
Two dielectric 120c.
It is laminated in the plane of the first dielectric 110c of third baseplate part 100c and separates regulation across third signal wire S3
A pair the first ground plane 130c of spacing and be adhered to the second dielectric 120c using bonding sheet B as medium, in the first dielectric
The bottom surface of 110c is formed with the second ground plane 140c, and third ground plane 150c is laminated in the plane of the second dielectric 120c.
In addition, the flexible PCB of the fourth embodiment of utility model is connected in the left or right side of first substrate portion 100a
The side of second substrate portion 100b and the side of first substrate portion 100a or second substrate portion 100b connect third baseplate part
The side of 100c, to which there are three the structures that baseplate part is integrally formed for tool.
It is preferred that the first dielectric 110a of first substrate portion 100a, second substrate portion 100b and third baseplate part 100c,
110b, 110c are integrally formed, and the second electricity of first substrate portion 100a, second substrate portion 100b and third baseplate part 100c are situated between
Matter 120a, 120b, 120c are integrally formed, first substrate portion 100a, second substrate portion 100b and third baseplate part 100c's
Second ground plane 140a, 140b, 140c is integrally formed, first substrate portion 100a, second substrate portion 100b and third substrate
Third ground plane 150a, 150b, 150c of portion 100c is integrally formed, so as to simplify the manufacturing process of substrate and contract
Short manufacturing time.
The first dielectric is being penetrated through in addition, can also be also formed in first substrate portion 100a to third baseplate part 100c
110a, 110b, 110c, second dielectric 120a, 120b, 120c, first ground plane 130a, 130b, 130c, the second ground plane
Electric conductor is filled in the hole of 140a, 140b, 140c and third ground plane 150a, 150b, 150c and makes the first ground plane
The through-hole VH that 130a, 130b, 130c are electrically connected to third ground plane 150a, 150b, 150c.
Through-hole VH can be formed in the form of being arranged in the dummy line parallelly separated with each signal wire S1, S2, S3,
And the spacing between signal wire S1, S2, S3 between opposed two through-hole VH can be 0.2mm to 0.5mm or 2mm to 3mm.
Fig. 8 to Figure 12 is the figure of the flexible PCB and its variation for illustrating the 5th embodiment.
First, with reference to Fig. 8, the flexible PCB of the 5th embodiment of the utility model is by being respectively formed with the three of signal wire
A baseplate part connects and forms a substrate having there are three signal wire in the horizontal direction, and includes being formed with the first signal wire S1
First substrate portion 100a, be formed with the second substrate portion 100b of second signal line S2 and be formed with third signal wire S3's
Third baseplate part 100c and constitute.
First substrate portion 100a, second substrate portion 100b and third baseplate part 100c include the first dielectric 110a,
110b, 110c, second dielectric 120a, 120b, 120c, first ground plane 130a, 130b, 130c, the second ground plane 140a,
140b, 140c and third ground plane 150a, 150b, 150c and constitute, but at least one of three baseplate parts baseplate part can
With the structure being laminated with dielectric and ground plane backward, i.e., the structure being turned over baseplate part is formed and is connected to other
Baseplate part.
At this point, a dielectric in the first dielectric 110a and the second dielectric 120a of first substrate portion 100a,
A dielectric in the first dielectric 110b and the second dielectric 120b of two baseplate part 100b and third baseplate part 100c
The first dielectric 110c and the second dielectric 120c in a dielectric may be integrally formed.
For example, first substrate portion 100a can be with opposed with the plane of the second dielectric 120a and separate regulation spacing
Position is laminated with the first dielectric 110a, and the first signal wire S1 and the first ground plane are formed in the bottom surface of the first dielectric 110a
130a is laminated with the second ground plane 140a in the plane of the first dielectric 110a, is formed in the bottom surface of the second dielectric 120a
The structure of third ground plane 150a is constituted.
On the contrary, second substrate portion 100b and third baseplate part 100c are sequentially laminated with second ground plane 140b, 140c, shape
At have each signal wire S2, S3 first dielectric 110b, 110c, first ground plane 130b, 130c, the second dielectric 120b,
120c and third ground plane 150b, 150c, to the second substrate portion 100b and third baseplate part 100c that illustrate with reference to Fig. 7
Structure be identically formed.
Also that is, with first substrate portion 100a and other baseplate part 100b, 100c are differently laminated to backward and in addition
The structure that is turned over of baseplate part 100b, 100c formed, at this point, the first dielectric 110a of first substrate portion 100a, second
The second dielectric 120c of the second dielectric 120b and third baseplate part 100c of baseplate part 100b are integrally formed, and first
The second dielectric 120a of baseplate part 100a, the first dielectric 110b of second substrate portion 100b and third baseplate part 100c
The first dielectric 110c be integrally formed.
In addition, the third ground plane 150b of the second ground plane 140a of first substrate portion 100a, second substrate portion 100b with
And the third ground plane 150c of third baseplate part 100c is integrally formed, the third ground plane 150a of first substrate portion 100a,
The second ground plane 140c of the second ground plane 140b and third baseplate part 100c of two baseplate part 100b are integrally formed.
The first dielectric is being penetrated through in addition, can also be also formed in first substrate portion 100a to third baseplate part 100c
110a, 110b, 110c, second dielectric 120a, 120b, 120c, first ground plane 130a, 130b, 130c, the second ground plane
In the hole of 140a, 140b, 140c and third ground plane 150a, 150b, 150c fill electric conductor and make the first ground plane 130a,
The through-hole VH that 130b, 130c are electrically connected to third ground plane 150a, 150b, 150c.
Through-hole VH can be formed in the form of being arranged in the dummy line parallelly separated with each signal wire S1, S2, S3,
And the spacing between signal wire S1, S2, S3 between opposed two through-hole VH can be 0.2mm to 0.5mm or 2mm to 3mm.
On the one hand, as illustrated in fig. 9, can also be formed as, second substrate portion 100b and other baseplate part 100a,
100c is differently laminated and is formed with baseplate part 100a, 100c structure being turned over to backward.
First substrate portion 100a and third baseplate part 100c is sequentially laminated with second ground plane 140a, 140c, is formed with respectively
First dielectric 110a, 110c of a signal wire S1, S3, first ground plane 130a, 130c, second dielectric 120a, 120c with
And third ground plane 150a, 150c, to the structure with the first substrate portion 100a and third baseplate part 100c that illustrate with reference to Fig. 7
It is identically formed.
First electricity Jie for being laminated with to second substrate portion 100b backwards the second ground plane 140b, being formed with second signal line S2
Matter 110b, the first ground plane 130b, the second dielectric 120b and third ground plane 150b, to illustrate with reference to Fig. 4 the
The structure of two baseplate part 100b is identically formed.
At this point, the second dielectric 120b of the first dielectric 110a of first substrate portion 100a, second substrate portion 100b with
And the first dielectric 110c of third baseplate part 100c is integrally formed, the second dielectric 120a of first substrate portion 100a,
The second dielectric 120c of the first dielectric 110b and third baseplate part 100c of two baseplate part 100b are integrally formed.
In addition, the third ground plane 150b of the second ground plane 140a of first substrate portion 100a, second substrate portion 100b with
And the second ground plane 140c of third baseplate part 100c is integrally formed, the third ground plane 150a of first substrate portion 100a,
The third ground plane 150c of the second ground plane 140b and third baseplate part 100c of two baseplate part 100b are integrally formed.
The first dielectric is being penetrated through in addition, can also be also formed in first substrate portion 100a to third baseplate part 100c
110a, 110b, 110c, second dielectric 120a, 120b, 120c, first ground plane 130a, 130b, 130c, the second ground plane
In the hole of 140a, 140b, 140c and third ground plane 150a, 150b, 150c fill electric conductor and make the first ground plane 130a,
The through-hole VH that 130b, 130c are electrically connected to third ground plane 150a, 150b, 150c, through-hole VH can be to be arranged in and each letter
The form in dummy line that number line S1, S2, S3 are parallelly separated is formed, and opposed between signal wire S1, S2, S3 two are logical
Spacing between the VH of hole can be 0.2mm to 0.5mm or 2mm to 3mm.
In addition, as illustrated in Figure 10, it can also be formed as, third baseplate part 100c and other baseplate part 100a, 100b
Differently it is laminated and is formed with baseplate part 100a, 100b structure being turned over to backward.At this point, the illustrated flexibilities of Figure 10
The structure of circuit board and the flexible PCB illustrated with reference to Fig. 8 is substantially the same, thus by the repetitive description thereof will be omitted.
But in the case where third baseplate part 100c and other baseplate part 100a, 100b are differently laminated to backward,
The second electricity of first dielectric 110a, 110b and third baseplate part 100c of first substrate portion 100a and second substrate portion 100b are situated between
Matter 120c is integrally formed, second dielectric 120a, 120b and third base of first substrate portion 100a and second substrate portion 100b
The first dielectric 110c of plate portion 100c is integrally formed.
In addition, second ground plane 140a, 140b and third baseplate part of first substrate portion 100a and second substrate portion 100b
The third ground plane 140c of 100c is integrally formed, the third ground plane of first substrate portion 100a and second substrate portion 100b
The second ground plane 140c of 150a, 150b and third baseplate part 100c are integrally formed.
The first dielectric is being penetrated through in addition, can also be also formed in first substrate portion 100a to third baseplate part 100c
110a, 110b, 110c, second dielectric 120a, 120b, 120c, first ground plane 130a, 130b, 130c, the second ground plane
In the hole of 140a, 140b, 140c and third ground plane 150a, 150b, 150c fill electric conductor and make the first ground plane 130a,
The through-hole VH that 130b, 130c are electrically connected to third ground plane 150a, 150b, 150c, through-hole VH can be to be arranged in and each letter
The form in dummy line that number line S1, S2, S3 are parallelly separated is formed, and opposed between signal wire S1, S2, S3 two are logical
Spacing between the VH of hole can be 0.2mm to 0.5mm or 2mm to 3mm.
In addition, as illustrated in Figure 11, can also in three baseplate parts 100a, 100b, 100c two baseplate part 100a,
It is laminated and is formed with the structure being turned over to 100c backwards.
For example, first substrate portion 100a and third baseplate part 100c can with backward be laminated with the second ground plane 140a,
140c, the first dielectric 110a, 110c for being formed with each signal wire S1, S3, first ground plane 130a, 130c, the second electricity are situated between
Matter 120a, 120c and third ground plane 150a, 150c, to be said with the first substrate portion 100a and Figure 10 illustrated with reference to Fig. 8
The structure of bright third baseplate part 100c is identically formed.
On the contrary, second substrate portion 100b is sequentially laminated with the second ground plane 140b, is formed with the first of second signal line S2
Dielectric 110b, the first ground plane 130b, the second dielectric 120b and third ground plane 150b, thus with reference to Fig. 7 explanations
The structure of second substrate portion 100b be identically formed.
In this case, second electricity Jie of the first dielectric 110a of first substrate portion 100a, second substrate portion 100b
The first dielectric 110c of matter 120b and third baseplate part 100c is integrally formed, and the second electricity of first substrate portion 100a is situated between
The second dielectric 120c one of matter 120a, the first dielectric 110b of second substrate portion 100b and third baseplate part 100c
Ground is formed.
In addition, the third ground plane 150b of the second ground plane 140a of first substrate portion 100a, second substrate portion 100b with
And the second ground plane 140c of third baseplate part 100c is integrally formed, the third ground plane 150a of first substrate portion 100a,
The third ground plane 150c of the second ground plane 140b and third baseplate part 100c of two baseplate part 100b are integrally formed.
The first dielectric is being penetrated through in addition, can also be also formed in first substrate portion 100a to third baseplate part 100c
110a, 110b, 110c, second dielectric 120a, 120b, 120c, first ground plane 130a, 130b, 130c, the second ground plane
In the hole of 140a, 140b, 140c and third ground plane 150a, 150b, 150c fill electric conductor and make the first ground plane 130a,
The through-hole VH that 130b, 130c are electrically connected to third ground plane 150a, 150b, 150c, through-hole VH can be to be arranged in and each letter
The form in dummy line that number line S1, S2, S3 are parallelly separated is formed, and opposed between signal wire S1, S2, S3 two are logical
Spacing between the VH of hole can be 0.2mm to 0.5mm or 2mm to 3mm.
On the one hand, as illustrated in figure 12, the flexible PCB of the 5th embodiment of the utility model is in three baseplate parts
In the case that at least one of 100a, 100b, 100c baseplate part are formed with the structure being turned over, one can also be also formed with
To the 4th ground plane 160a, 160b, 160c, each baseplate part 100a, 100b, 100c and the first dielectric 110a,
The face of second 110b, 110c opposed dielectric 120a, 120b, 120c has identical as first ground plane 130a, 130b, 130c
Shape.
At this point, the 4th ground plane 160b of the first ground plane 130a and second substrate portion 100b of first substrate portion 100a
It may be integrally formed, the first ground plane of the 4th ground plane 160a and second substrate portion 100b of first substrate portion 100a
130b may be integrally formed.
Meanwhile the 4th ground plane 160c of the first ground plane 130b and third baseplate part 100c of second substrate portion 100b
It will be integrally formed, the first ground plane 130c of the 4th ground plane 160b and third baseplate part 100c of second substrate portion 100b will
It is integrally formed.
On the one hand, it can also be also formed in first substrate portion 100a to third baseplate part 100c and penetrate through the first dielectric
110a, 110b, 110c, second dielectric 120a, 120b, 120c, first ground plane 130a, 130b, 130c, the second ground plane
Electric conductor is filled in the hole of 140a, 140b, 140c and third ground plane 150a, 150b, 150c and makes the first ground plane
The through-hole VH that 130a, 130b, 130c are electrically connected to third ground plane 150a, 150b, 150c, through-hole VH can be arranged in
The form in dummy line that each signal wire S1, S2, S3 are parallelly separated is formed, and opposed between signal wire S1, S2, S3
Spacing between two through-hole VH can be 0.2mm to 0.5mm or 2mm to 3mm.
Figure 13 is the figure of the flexible PCB of the sixth embodiment for illustrating the utility model.
Referring to Fig.1 3, the flexible PCB of the sixth embodiment of the utility model is by being respectively formed with three bases of signal wire
Plate portion connects and forms tool there are three a substrates of signal wire in the horizontal direction, and includes be formed with the first signal wire S1 the
One baseplate part 100a, the second substrate portion 100b for being formed with second signal line S2 and the third base for being formed with third signal wire S3
Plate portion 100c and constitute.
First, first substrate portion 100a include the first dielectric 110a, the second dielectric 120a, the first ground plane 130a,
Second ground plane 140a, third ground plane 150a and the 4th ground plane 160a and constitute.
In first substrate portion, the plane of the first dielectric 110a of 100a is formed with the first signal wire S1, and with the first electricity
Medium 110a is parallel and opposed with the plane of the first dielectric 110a and separates the position of regulation spacing and is formed with the second dielectric
120a。
In addition, the plane in the first dielectric 110a is laminated with the first ground plane of a pair separated across the first signal wire S1
130a is formed with the second ground plane 140a in the bottom surface of the first dielectric 110a, is laminated in the plane of the second dielectric 120a
Third ground plane 150a, the bottom surface of the second dielectric 120a be formed with the 4th ground plane 160a and using bonding sheet B as medium with
First ground plane 130a bondings.
In addition, the second dielectric 120a of first substrate portion 100a can be formed as thickness than the first dielectric 110a phases
To thin, for example, the first dielectric 110a is made to be formed with the thickness of 0.05mm to 0.1mm, and so that the second dielectric 120a has
The mode of the thickness of 0.025mm to 0.05mm is formed.
Second substrate portion 100b and third baseplate part 100c may include first electricity Jie for being formed with each signal wire S2, S3
Matter 110b, 110c, second dielectric 120b, 120c, first ground plane 130b, 130c, second ground plane 140b, 140c, third
Ground plane 150b, 150c and the 4th ground plane 160b, 160c and constitute, and dielectric and ground plane with first substrate portion
The identical sequence stackings of 100a, to be identically formed with first substrate portion 100a in structure.
In this case, it can also include first substrate portion 100a, second substrate portion 100b and third baseplate part
Three baseplate parts of 100c are interconnected and are integrally formed, and first substrate portion 100a, second substrate portion 100b and third
First dielectric 110a, 110b, 110c of baseplate part 100c is integrally formed, first substrate portion 100a, second substrate portion 100b
And second dielectric 120a, 120b, 120c of third baseplate part 100c is integrally formed.
In addition, the second ground plane 140a of first substrate portion 100a, second substrate portion 100b and third baseplate part 100c,
140b, 140c are integrally formed, the third ground connection of first substrate portion 100a, second substrate portion 100b and third baseplate part 100c
Layer 150a, 150b, 150c are integrally formed.
The first dielectric is being penetrated through in addition, can also be also formed in first substrate portion 100a to third baseplate part 100c
110a, 110b, 110c, second dielectric 120a, 120b, 120c, first ground plane 130a, 130b, 130c, the second ground plane
140a, 140b, 140c, third ground plane 150a, 150b, 150c and the 4th ground plane 160a, 160b, 160c hole in fill
Electric conductor and make first ground plane 130a, 130b, 130c to the through-hole VH of the 4th ground plane 160a, 160b, 160c electrical connection.
In addition, through-hole VH can be in the form of being arranged in the dummy line parallelly separated with each signal wire S1, S2, S3
It is formed, and the spacing between opposed two through-hole VH between signal wire S1, S2, S3 can be for 0.2mm to 0.5mm or 2mm extremely
3mm。
Figure 14 and Figure 15 is the figure of the flexible PCB and its variation of the 7th embodiment for illustrating the utility model.
First, referring to Fig.1 4, the flexible PCB of the 7th embodiment of the utility model has connecting in the horizontal direction
There are two signal wire two baseplate parts plane or be bonded two baseplate parts of structure having the same in bottom surface formed tool
There are four a substrates of signal wire, and may include the first substrate portion 100a for being formed with the first signal wire S1, are formed with the
The second substrate portion 100b of binary signal line S2, it is formed with the third baseplate part 100c of third signal wire S3 and is formed with the 4th letter
The tetrabasal portion 100d of number line S4 and constitute.
Herein, first substrate portion 100a and second substrate portion 100b can be sequentially laminated with the second ground plane 140a,
140b, the first dielectric 110a, 110b for being formed with each signal wire S1, S2, first ground plane 130a, 130b, the second electricity are situated between
Matter 120a, 120b and third ground plane 150a, 150b, to with the first substrate portion 100a that illustrates referring to Fig.1 with Fig. 2
It is identically formed with the structure of second substrate portion 100b.
In addition, in the case of third baseplate part 100c and tetrabasal portion 100d, second can also be sequentially laminated with and connect
Stratum 140c, 140d, the first dielectric 110c, 110d for being formed with each signal wire S3, S4, first ground plane 130c, 130d,
Second dielectric 120c, 120d and third ground plane 150c, 150d, thus with first substrate portion 100a above-mentioned and the second base
The structure of plate portion 100b is identically formed.
In addition, third baseplate part 100c and tetrabasal portion 100d can be adhered to first substrate using bonding sheet B as medium
The bottom surface of portion 100a and second substrate portion 100b.
On the one hand, as illustrated in Figure 15, the flexible PCB of the 7th embodiment of the utility model can also be with reference Fig. 6
The first substrate portion 100a of the flexible PCB of the 3rd embodiment of the utility model of explanation is identical with second substrate portion 100b
Ground is formed with the first substrate portion 100a of the first signal wire S1 and is formed with the second substrate portion of second signal line S2
100b, and make that the third baseplate part 100c of third signal wire S3 is formed and be formed with the structure being identical with this and be formed with the 4th
The tetrabasal portion 100d of signal wire S4 is bonded by medium of bonding sheet B, and to form tool, there are four signal wire S1, S2, S3, S4
A substrate.
Although above example the preferred embodiment of the utility model is illustrated, the scope of the utility model
It is not limited to this regulation embodiment, appropriate in the scope recorded in claims can be changed.
Claims (21)
1. a kind of flexible PCB, which is characterized in that including multiple baseplate parts, the baseplate part includes：
It is formed with the first dielectric of signal wire in plane；
Second dielectric opposed with described first dielectric plane；
The first ground plane of a pair of described first dielectric plane is laminated on across the signal line layer；
It is formed in the second ground plane of described first dielectric bottom surface；And
It is laminated in the third ground plane of described second dielectric plane,
And the multiple baseplate part connects and forms a substrate in the horizontal direction.
2. flexible PCB according to claim 1, which is characterized in that
The substrate is made of two baseplate parts including first substrate portion and second substrate portion,
Described two baseplate parts are laminated with first dielectric with identical sequence, second dielectric, described first connect
Stratum, second ground plane and the third ground plane.
3. flexible PCB according to claim 2, which is characterized in that
In the substrate, the first dielectric one landform of first dielectric in the first substrate portion and the second substrate portion
At second dielectric in the first substrate portion and second dielectric in the second substrate portion are integrally formed.
4. flexible PCB according to claim 2, which is characterized in that
Described two baseplate parts further include the 4th ground plane for being formed in described second dielectric bottom surface.
5. flexible PCB according to claim 4, which is characterized in that
Second dielectric formation is that thickness is more relatively thin than first dielectric.
6. flexible PCB according to claim 5, which is characterized in that
First dielectric is formed with the thickness of 0.05mm to 0.1mm,
Second dielectric is formed with the thickness of 0.025mm to 0.05mm.
7. flexible PCB according to claim 1, which is characterized in that
The substrate is made of two baseplate parts including first substrate portion and second substrate portion,
It is laminated with first dielectric, second dielectric, institute to a baseplate part backward in described two baseplate parts
State the first ground plane, second ground plane and the third ground plane.
8. flexible PCB according to claim 7, which is characterized in that
In the substrate, the second dielectric one landform of first dielectric in the first substrate portion and the second substrate portion
At second dielectric in the first substrate portion and first dielectric in the second substrate portion are integrally formed.
9. flexible PCB according to claim 7, which is characterized in that
The first substrate portion and the second substrate portion further include a pair of 4th ground plane, described second it is dielectric with
The opposed face of first dielectric is formed with shape identical with first ground plane,
First ground plane in the first substrate portion and the 4th ground plane in the second substrate portion are integrally formed, and described first
The 4th ground plane and first ground plane in the second substrate portion of baseplate part are integrally formed.
10. flexible PCB according to claim 1, which is characterized in that
The substrate is made of three baseplate parts including first substrate portion, second substrate portion and third baseplate part,
Three baseplate parts are laminated with first dielectric with identical sequence, second dielectric, described first connect
Stratum, second ground plane and the third ground plane.
11. flexible PCB according to claim 10, which is characterized in that
In the substrate, first dielectric in the first substrate portion, first dielectric in the second substrate portion and described
First dielectric of third baseplate part is integrally formed, second dielectric in the first substrate portion, the second substrate portion
Second dielectric of the second dielectric and the third baseplate part is integrally formed.
12. flexible PCB according to claim 10, which is characterized in that
Three baseplate parts further include the 4th ground plane for being formed in described second dielectric bottom surface.
13. flexible PCB according to claim 12, which is characterized in that
Second dielectric formation is that thickness is more relatively thin than first dielectric.
14. flexible PCB according to claim 13, which is characterized in that
First dielectric is formed with the thickness of 0.05mm to 0.1mm,
Second dielectric is formed with the thickness of 0.025mm to 0.05mm.
15. flexible PCB according to claim 1, which is characterized in that
The substrate is made of three baseplate parts including first substrate portion, second substrate portion and third baseplate part,
At least one of three baseplate parts baseplate part backward it is laminated with first dielectric, second electricity is situated between
Matter, first ground plane, second ground plane and the third ground plane.
16. flexible PCB according to claim 15, which is characterized in that
A dielectric in the substrate, first dielectric and the second dielectric in the first substrate portion, described second
First dielectric of a dielectric and the third baseplate part in the first dielectric and the second dielectric of baseplate part and
A dielectric in second dielectric is integrally formed.
17. flexible PCB according to claim 15, which is characterized in that
The first substrate portion to the third baseplate part further includes a pair of 4th ground plane, described second it is dielectric with
The opposed face of first dielectric is formed with shape identical with first ground plane,
First ground plane in the first substrate portion and the 4th ground plane in the second substrate portion are integrally formed, and described first
The 4th ground plane and first ground plane in the second substrate portion of baseplate part are integrally formed, and the first of the second substrate portion
4th ground plane of ground plane and the third baseplate part is integrally formed, the 4th ground plane in the second substrate portion with it is described
First ground plane of third baseplate part is integrally formed.
18. the flexible PCB according to any one of claim 1 to 17, which is characterized in that
Second ground plane and the third ground plane are sheet shape, or separate regulation spacing in the same plane and parallel
The shape that ground is formed, or it is formed with the shape or mesh shape of multiple ground holes.
19. the flexible PCB according to any one of claim 1 to 17, which is characterized in that
Multiple through-holes in the dummy line for being arranged in and parallelly being separated with each signal wire are formed in the multiple baseplate part,
Spacing between signal wire between two opposed through-holes is 0.2mm to 0.5mm or 2mm to 3mm.
20. flexible PCB according to claim 1, which is characterized in that
The substrate is by including four baseplate parts in first substrate portion, second substrate portion, third baseplate part and tetrabasal portion
It constitutes,
In four baseplate parts,
The first substrate portion and the second substrate portion connect in the horizontal direction,
The third baseplate part and tetrabasal portion connect and are adhered to described by medium of bonding sheet in the horizontal direction
The bottom surface of one baseplate part and the second substrate portion.
21. flexible PCB according to claim 20, which is characterized in that
Four baseplate parts further include the 4th ground plane for being formed in described second dielectric bottom surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0001500 | 2017-01-04 | ||
| KR1020170001500A KR102677047B1 (en) | 2017-01-04 | 2017-01-04 | Flexible printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN207802499U true CN207802499U (en) | 2018-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721767075.8U Active CN207802499U (en) | 2017-01-04 | 2017-12-15 | Flexible PCB |
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| Country | Link |
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| KR (1) | KR102677047B1 (en) |
| CN (1) | CN207802499U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111430864A (en) * | 2019-12-16 | 2020-07-17 | 瑞声科技(新加坡)有限公司 | Transmission line and terminal device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102040790B1 (en) * | 2019-05-17 | 2019-11-27 | 주식회사 디케이티 | Flexible printed circuit board for RF |
| US11454837B2 (en) * | 2019-11-22 | 2022-09-27 | Eagle Technology, Llc | AOM system with interface board and signal vias and related methods |
| KR102468840B1 (en) * | 2020-06-02 | 2022-11-18 | (주)누리플렉스 | Flexible printed circuit board and multiband antenna apparatus using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004363315A (en) * | 2003-06-04 | 2004-12-24 | Mitsubishi Electric Corp | Printed wiring board |
| JP5349003B2 (en) * | 2008-10-27 | 2013-11-20 | 日本オクラロ株式会社 | Flexible printed circuit board and optical signal transmission device |
| KR102337398B1 (en) * | 2015-03-18 | 2021-12-09 | 주식회사 기가레인 | Flexible printed circuit board |
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2017
- 2017-01-04 KR KR1020170001500A patent/KR102677047B1/en active IP Right Grant
- 2017-12-15 CN CN201721767075.8U patent/CN207802499U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111430864A (en) * | 2019-12-16 | 2020-07-17 | 瑞声科技(新加坡)有限公司 | Transmission line and terminal device |
| CN111430864B (en) * | 2019-12-16 | 2021-07-09 | 瑞声科技(新加坡)有限公司 | Transmission line and terminal device |
Also Published As
| Publication number | Publication date |
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| KR102677047B1 (en) | 2024-06-20 |
| KR20180080612A (en) | 2018-07-12 |
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