CN108279325A - To the probe card module of test circuit chip - Google Patents
To the probe card module of test circuit chip Download PDFInfo
- Publication number
- CN108279325A CN108279325A CN201810008645.8A CN201810008645A CN108279325A CN 108279325 A CN108279325 A CN 108279325A CN 201810008645 A CN201810008645 A CN 201810008645A CN 108279325 A CN108279325 A CN 108279325A
- Authority
- CN
- China
- Prior art keywords
- probe
- ground connection
- card module
- conducting
- amplifying circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31712—Input or output aspects
- G01R31/31713—Input or output interfaces for test, e.g. test pins, buffers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31723—Hardware for routing the test signal within the device under test to the circuits to be tested, e.g. multiplexer for multiple core testing, accessing internal nodes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Networks & Wireless Communication (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a kind of probe card module to test circuit chip, which includes one first ground connection conductive pad and one second ground connection conductive pad, the probe card module include：One printed circuit board, including a ground connection conducting end；An and amplifying circuit, with a first input end, one second input terminal and an output end, the first input end connects the ground connection conducting end, second input terminal connects the first ground connection conductive pad by one first conducting probe, and the output end connects the second ground connection conductive pad by one second conducting probe.
Description
Technical field
The present invention relates to a kind of probe card technologies.
Background technology
In the manufacturing process of integrated circuit component, electrical testing can be carried out before crystal grain cutting or component encapsulation, this is logical
The power supply signal that test machine (Tester) is provided often is transferred to by element under test (Device with test signal by probe card
Under Testing, abbreviation DUT)；Wherein, power supply signal is to supply power supply needed for element under test, and test signal is detecting
Element under test.
Since integrated circuit component generally comprises analog circuit and digital circuit, test signal can include analog signal
And digital signal, it also can be by ground connection conducting end (abbreviation AGND) sum number of analog signal on the printed circuit board of probe card module
The ground connection conducting end (abbreviation DGND) of word signal separates, and the same ground connection that the two can finally be connected to test machine is conductive
End, equivalent circuit can be considered an inductance.By taking AGND as an example, because of inductive effect, the ground connection reflux of AGND can not flow immediately
To the ground connection conducting end of test machine, to which a drift ground voltage can be induced on AGND, to influence the electricity of test signal
Press precision.For example, it is assumed that the ground connection reflux of element under test is 100 milliamperes (mA), and probe card module has ten probes to connect
It is connected to the AGND of element under test and forms about 0.1 ohm of parallel resistance, then have the drift of about 10 millivolts (mV) on AGND
Voltage is moved, and then influences the accuracy of test signal.
Therefore, it is necessary to develop new probe card technology, the drift voltage that conducting end occurs is grounded effectively to solve it
The problem of.The relevant prior art also sees United States Patent (USP) case US7005879, US7049835, is all totally different from this case
Technical solution.
Invention content
It is an object of the present invention to solving the ground connection conducting end of probe card circuitry plate, in the electrical testing of element under test
The problem of drift voltage appeared in process
According to an aspect of the present invention, an embodiment provides a kind of probe card module to test circuit chip, the electricity
Road chip includes one first ground connection conductive pad and one second ground connection conductive pad, the probe card module include：One printed circuit board, packet
Containing a ground connection conducting end；And an amplifying circuit, there is a first input end, one second input terminal and an output end, this first
Input terminal connects the ground connection conducting end, which connects the first ground connection conductive pad by one first conducting probe, and
The output end connects the second ground connection conductive pad by one second conducting probe.
In one embodiment, which further includes third ground connection conductive pad, and the amplifying circuit this is defeated
Outlet connects the third by a third conducting probe and is grounded second input terminal of conductive pad or the amplifying circuit by one the
Three conducting probes connect third ground connection conductive pad.
In one embodiment, which includes an operational amplifier, which is a non-inverting input,
Second input terminal is an inverting input.
In one embodiment, which further comprises a probe base；Wherein, which has
One upper surface and a lower surface, the probe base are set to the lower surface, to the multiple conducting probe of fixation, amplification electricity
Road is set on the lower surface or the upper surface or the amplifying circuit is set on multiple conducting probe.
According to another aspect of the present invention, another embodiment provides a kind of probe card module to test circuit chip,
The circuit chip includes a ground connection conductive pad, which includes：One printed circuit board, including a ground connection conducting end；With
And an amplifying circuit, there is a first input end, one second input terminal and an output end, the first input end to connect the ground connection and lead
Electric end, second input terminal and the output end connect the ground connection conductive pad by a conducting probe.
In one embodiment, which further includes another ground connection conductive pad, and the output of the amplifying circuit
Second input terminal that end connects another ground connection conductive pad or the amplifying circuit by another conducting probe passes through another conduction
Probe connects another ground connection conductive pad.
In one embodiment, which includes an operational amplifier, which is a non-inverting input,
Second input terminal is an inverting input.
In one embodiment, which further comprises a probe base；Wherein, which has
One upper surface and a lower surface, the probe base are set to the lower surface, to the multiple conducting probe of fixation, amplification electricity
Road is set on the lower surface or the upper surface or the amplifying circuit is set on multiple conducting probe.
Description of the drawings
Fig. 1 is the structural schematic diagram according to probe card module of the embodiment of the present invention.
Fig. 2 is the circuit diagram of the probe card module testing circuit under test chip of the present embodiment.
Fig. 3 is the structural schematic diagram according to another embodiment of the present invention probe card module.
Fig. 4 is the structural schematic diagram according to another embodiment of the present invention probe card module.
Reference sign：100,200,300- probe card modules；110,111~114- conducting probes；120- printing electricity
Road plate；122- is grounded conducting end；125- through holes；130- probe bases；140- amplifying circuits；141- non-inverting inputs；
142- inverting inputs；143- output ends；150- transmission lines；160- circuit chips；161~166- conductive pads.
Specific implementation mode
There is further cognition for feature, purpose and the function to the present invention and understand, hereby schema is coordinated to be described in detail
The embodiment of the present invention is as after.In all specifications and diagram, identical element number will be used to specify identical or class
As element.
In the explanation of each embodiment, when an element be described be another element " top/on " or " lower section/
Under ", may include other yuan of setting therebetween the case where finger either directly or indirectly on or below another element
Element；Other intermediary elements are not arranged in so-called " directly " refer to therebetween.The description of " top/on " or " lower section/under " etc. is to scheme
It is illustrated on the basis of formula, but also includes other possible direction transformations.So-called " first ", " second " and " third " to
Different elements is described, these elements are not restricted because such meaning is taken leave.In order to illustrate upper facility and clear, schema
The thickness of middle each element or size by exaggerate or omit or outline in a manner of indicate, and the size of each element is entirely in fact
The size on border.
Fig. 1 is the structural schematic diagram according to probe of embodiment of the present invention card module 100.The probe card module 100 includes：It is more
A conducting probe 110, a printed circuit board 120, a probe base 130 and an amplifying circuit 140；Wherein, the probe is solid
Reservation 130 is set to 120 lower section of printed circuit board, and to the multiple conducting probe 110 of fixation, and the amplifying circuit 140 is set
It is placed on the lower surface of the printed circuit board 120 so that the amplifying circuit 140 can be positioned as close to element under test.It is multiple
It is so-called " probe card " that conducting probe 110, the printed circuit board 120 and the probe base 130 are combined into the art, and
This probe card will be placed in Chip needle detector (Prober, not shown), to carry out the electrical testing of element under test.In addition, should
Multiple conducting probes 110 can be connected via multiple transmission lines 150 (such as coaxial cable or twisted-pair feeder) printed circuit board 120 with
Multiple conducting probe 110；Alternatively, multiple conducting probe 110 also may be directly connected to the printed circuit board 120.
The element under test that the probe card module 100 is tested is circuit chip 160, and its main circuit diagram is painted
It is formed on Fig. 2；Wherein, multiple conducting probe 110 includes conducting probe 111~114, which includes multiple conductions
Pad 161~166 is connected to its external interface connection gasket as by the internal circuit of the circuit chip 160.In the present embodiment
In, which is all connected to ground connection conducting end (such as the analog signal of the circuit chip 160
It is grounded conducting end), therefore ground connection conductive pad (ground pad) can be referred to as.The amplifying circuit 140 can be operational amplifier
(Operational Amplifier or OP-Amp), there are two input terminal (non-inverting input 141 and inverting inputs for tool
And an output end 143 142)；Wherein, which connects the ground connection conducting end 122 of the printed circuit board 120, should
Inverting input 142 connects the ground connection conductive pad 161 by the conducting probe 111, and the output end 143 can be visited by the conduction
Needle 112 connects the ground connection conductive pad 163, the ground connection conductive pad 164 is connected by the conducting probe 113 and visited by the conduction
Needle 114 connects the ground connection conductive pad 165, as shown in Figure 2.Since multiple conducting probe 111~114 is connected directly to the electricity
The ground connection conducting end of road chip 160, therefore the output end 143 of the amplifying circuit 140 and inverting input 142 are the equal of short circuit
Connect.Further, since the ground connection that the inverting input 142 of the amplifying circuit 140 connects the circuit chip 160 (element under test) is led
Electric end and form a negative feedback circuit, thus the amplifying circuit 140 can push the ground connection conducting end of the circuit chip 160, to mend
It repays multiple conducting probe 110 and is formed by equiva lent impedance, it can in the ground connection conducting end to eliminate the printed circuit board 120
The drift voltage that can be generated.In addition, the ground connection reflux on the circuit chip 160 will flow into the power end of the amplifying circuit 140,
Ground connection conducting end 122 without flowing into the printed circuit board 120, reaches element under test (circuit chip 160) and probe snap gauge
Ground connection isolation between block 100.
Accordingly, probe of embodiment of the present invention card module 100 can compensate for conducting probe 110 by the way that the amplifying circuit 140 is arranged
It is formed by equiva lent impedance, while the ground connection conducting end 122 of printed circuit board 120 and the ground connection conduction of circuit chip 160 is isolated
End, therefore the issuable drift voltage in ground connection conducting end can be effectively avoided, so that it is guaranteed that the voltage essence of test signal
Accuracy.
It is worth noting that, Fig. 2 is only the one of which of probe of embodiment of the present invention card module 100 and circuit chip 160
State sample implementation.In detail, in other state sample implementations of the invention, the output end 143 and inverting input of the amplifying circuit 140
142 can be connected to the same ground connection conductive pad by a conducting probe；Alternatively, the inverting input 142 of the amplifying circuit 140
Also different ground connection conductive pads can be connected to by several conducting probes, the present invention is not limited thereto.The embodiment of the present invention is visited
When needle 100 actual implementation of card module, can depending on the amplifying circuit 140 fan-out capability, need the ground connection for being connected to conducting probe
The factors such as the number of conductive pad, the length of conducting probe and the electric current by being grounded conducting end determine the amplifying circuit that need to be arranged
The connection relation of 140 quantity and amplifying circuit 140 and each ground connection conductive pad.
Fig. 3 is the structural schematic diagram according to another embodiment of the present invention probe card module 200.As shown, the present embodiment
It is substantially identical as the probe card module 100 of Fig. 1, difference be in：The amplifying circuit 140 is set to the printed circuit board
On 120 upper surface so that the amplifying circuit 140 can coordinate the circuit layout of the printed circuit board 120 as much as possible.Due to this
Amplifying circuit 140 and multiple conducting probe 110 both sides that be disposed on about 120 printed circuit board different, it is therefore desirable to
A through hole 125 is formed in the printed circuit board 120, which runs through the upper and lower surface of the printed circuit board 120,
It uses and the amplifying circuit 140 is connected to multiple conducting probe 110.
Fig. 4 is the structural schematic diagram according to another embodiment of the present invention probe card module 300.As shown, the present embodiment
It is substantially identical as the probe card module 100 of Fig. 1, difference be in：Multiple conducting probe 110 is directly connected in the printing
Circuit board 120.In addition, the amplifying circuit 140 can be directly arranged on multiple conducting probe 110, it should with further shortening
Amplifying circuit 140 at a distance from an element under test (circuit chip), can reduce multiple conducting probe 110 be formed by it is equivalent
Impedance.
The foregoing is merely presently preferred embodiments of the present invention, when cannot be limited the scope of the invention with it.I.e. generally according to this
The equivalent change and modification that invention claim is done will not lose the main idea place of the present invention, also not depart from the essence of the present invention
God and range, former capital should be regarded as the further status of implementation of the present invention.
Claims (14)
1. a kind of probe card module to test circuit chip, which includes one first ground connection conductive pad and one second
It is grounded conductive pad, which is characterized in that the probe card module includes：
One printed circuit board, including a ground connection conducting end；And
There is one amplifying circuit a first input end, one second input terminal and an output end, the first input end to connect the ground connection
Conducting end, which connects the first ground connection conductive pad by one first conducting probe, and the output end passes through one the
Two conducting probes connect the second ground connection conductive pad.
2. probe card module as described in claim 1, which is characterized in that the circuit chip further includes third ground connection and leads
Electrical pad, and the output end of the amplifying circuit connects the third by a third conducting probe and is grounded conductive pad.
3. probe card module as described in claim 1, which is characterized in that the circuit chip further includes third ground connection and leads
Electrical pad, and second input terminal of the amplifying circuit connects the third by a third conducting probe and is grounded conductive pad.
4. probe card module as claimed in claim 1,2 or 3, which is characterized in that the amplifying circuit includes an operational amplifier,
The first input end is a non-inverting input, which is an inverting input.
5. probe card module as claimed in claim 1,2 or 3, which is characterized in that further comprise a probe base；
Wherein, which there is a upper surface and a lower surface, the probe base to be set to the lower surface, to solid
Fixed multiple conducting probe, the amplifying circuit are set on the lower surface.
6. probe card module as claimed in claim 1,2 or 3, which is characterized in that further comprise a probe base；
Wherein, which there is a upper surface and a lower surface, the probe base to be set to the lower surface, to solid
Fixed multiple conducting probe, the amplifying circuit are set on the upper surface.
7. probe card module as claimed in claim 1,2 or 3, which is characterized in that further comprise a probe base；
Wherein, which there is a upper surface and a lower surface, the probe base to be set to the lower surface, to solid
Fixed multiple conducting probe, the amplifying circuit are set on multiple conducting probe.
8. a kind of probe card module to test circuit chip, which is characterized in that the circuit chip includes a ground connection conductive pad,
The probe card module includes：
One printed circuit board, including a ground connection conducting end；And
There is one amplifying circuit a first input end, one second input terminal and an output end, the first input end to connect the ground connection
Conducting end, second input terminal and the output end connect the ground connection conductive pad by a conducting probe.
9. probe card module as claimed in claim 8, which is characterized in that it is conductive that the circuit chip further includes another ground connection
Pad, and the output end of the amplifying circuit connects another ground connection conductive pad by another conducting probe.
10. probe card module as claimed in claim 8, which is characterized in that the circuit chip further includes another ground connection and leads
Electrical pad, and second input terminal of the amplifying circuit connects another ground connection conductive pad by another conducting probe.
11. the probe card module as described in claim 8,9 or 10, which is characterized in that the amplifying circuit includes an operation amplifier
Device, the first input end are a non-inverting input, which is an inverting input.
12. the probe card module as described in claim 8,9 or 10, which is characterized in that further comprise a probe base；
Wherein, which there is a upper surface and a lower surface, the probe base to be set to the lower surface, to solid
Fixed multiple conducting probe, the amplifying circuit are set on the lower surface.
13. the probe card module as described in claim 8,9 or 10, which is characterized in that further comprise a probe base；
Wherein, which there is a upper surface and a lower surface, the probe base to be set to the lower surface, to solid
Fixed multiple conducting probe, the amplifying circuit are set on the upper surface.
14. the probe card module as described in claim 8,9 or 10, which is characterized in that further comprise a probe base；
Wherein, which there is a upper surface and a lower surface, the probe base to be set to the lower surface, to solid
Fixed multiple conducting probe, the amplifying circuit are set on multiple conducting probe.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762443155P | 2017-01-06 | 2017-01-06 | |
| US62/443,155 | 2017-01-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108279325A true CN108279325A (en) | 2018-07-13 |
Family
ID=62803149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810008645.8A Pending CN108279325A (en) | 2017-01-06 | 2018-01-04 | To the probe card module of test circuit chip |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2018112546A (en) |
| KR (1) | KR102136612B1 (en) |
| CN (1) | CN108279325A (en) |
| TW (1) | TWI636260B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11327095B2 (en) | 2019-08-19 | 2022-05-10 | Samsung Electronics Co., Ltd. | Probe cards, system for manufacturing semiconductor device, and method of manufacturing semiconductor device |
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|---|---|---|---|---|
| JPS587834A (en) * | 1981-07-07 | 1983-01-17 | Nec Corp | Device for testing semiconductor wafer |
| WO1998026300A1 (en) * | 1996-12-12 | 1998-06-18 | Ggb Industries, Inc. | Probe card for high speed testing |
| JP2003014780A (en) * | 2001-06-29 | 2003-01-15 | Micronics Japan Co Ltd | Probe card |
| JP2007198930A (en) * | 2006-01-27 | 2007-08-09 | Renesas Technology Corp | Semiconductor inspection system and semiconductor device |
| CN101080641A (en) * | 2004-12-21 | 2007-11-28 | 佛姆法克特股份有限公司 | Bi-directional buffer for interfacing test system channel |
| CN101551406A (en) * | 2008-04-02 | 2009-10-07 | 旺矽科技股份有限公司 | Probe card |
| JP3194953U (en) * | 2014-01-24 | 2014-12-18 | ▲し▼創電子股▲ふん▼有限公司 | Active probe card |
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| JPH06101501B2 (en) * | 1989-11-10 | 1994-12-12 | 三菱電機株式会社 | Semiconductor substrate for measuring high frequency characteristics of semiconductor devices |
| JP2944056B2 (en) * | 1990-08-06 | 1999-08-30 | 東京エレクトロン株式会社 | Contact detection device for electric circuit measurement probe and electric circuit measurement device using this contact detection device |
| WO1993015756A1 (en) * | 1992-02-14 | 1993-08-19 | Corvas International, Inc. | Inhibitors of thrombosis |
| JPH0786343A (en) * | 1993-09-17 | 1995-03-31 | Hitachi Ltd | Method and device for inspecting semiconductor |
| JP2005091065A (en) * | 2003-09-16 | 2005-04-07 | Oki Electric Ind Co Ltd | Apparatus and method for supplying semiconductor device with operating voltage |
| WO2006137979A2 (en) * | 2005-06-13 | 2006-12-28 | Cascade Microtech, Inc. | Wideband active-passive differential signal probe |
| US7557592B2 (en) * | 2006-06-06 | 2009-07-07 | Formfactor, Inc. | Method of expanding tester drive and measurement capability |
| US20090085598A1 (en) * | 2007-09-28 | 2009-04-02 | Qimonda Ag | Integrated circuit test system and method with test driver sharing |
| JP2008241722A (en) | 2008-06-02 | 2008-10-09 | Oki Electric Ind Co Ltd | Probe card and method of manufacturing semiconductor device |
| JP5269896B2 (en) * | 2008-06-02 | 2013-08-21 | 株式会社アドバンテスト | Test wafer unit and test system |
| JP6008332B2 (en) * | 2011-10-03 | 2016-10-19 | 国立大学法人 筑波大学 | Probe card and noise measuring device |
| CN102539927A (en) * | 2011-12-14 | 2012-07-04 | 东华大学 | Method for measuring temperature-controllable four-probe square resistance and resistivity |
| TWI634334B (en) * | 2016-10-21 | 2018-09-01 | 新特系統股份有限公司 | Probe card module |
-
2017
- 2017-12-22 TW TW106145391A patent/TWI636260B/en active
-
2018
- 2018-01-04 CN CN201810008645.8A patent/CN108279325A/en active Pending
- 2018-01-05 JP JP2018000687A patent/JP2018112546A/en active Pending
- 2018-01-08 KR KR1020180002134A patent/KR102136612B1/en active IP Right Grant
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587834A (en) * | 1981-07-07 | 1983-01-17 | Nec Corp | Device for testing semiconductor wafer |
| WO1998026300A1 (en) * | 1996-12-12 | 1998-06-18 | Ggb Industries, Inc. | Probe card for high speed testing |
| JP2003014780A (en) * | 2001-06-29 | 2003-01-15 | Micronics Japan Co Ltd | Probe card |
| CN101080641A (en) * | 2004-12-21 | 2007-11-28 | 佛姆法克特股份有限公司 | Bi-directional buffer for interfacing test system channel |
| JP2007198930A (en) * | 2006-01-27 | 2007-08-09 | Renesas Technology Corp | Semiconductor inspection system and semiconductor device |
| CN101551406A (en) * | 2008-04-02 | 2009-10-07 | 旺矽科技股份有限公司 | Probe card |
| JP3194953U (en) * | 2014-01-24 | 2014-12-18 | ▲し▼創電子股▲ふん▼有限公司 | Active probe card |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI636260B (en) | 2018-09-21 |
| KR102136612B1 (en) | 2020-07-23 |
| KR20180081473A (en) | 2018-07-16 |
| TW201825906A (en) | 2018-07-16 |
| JP2018112546A (en) | 2018-07-19 |
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