TWI636260B - Probe card module - Google Patents

Abstract

The invention discloses a probe card module for testing a circuit chip. The circuit chip includes a first grounded conductive pad and a second grounded conductive pad. The probe card module includes: a printed circuit board including a ground A conductive terminal; and an amplifying circuit having a first input terminal, a second input terminal, and an output terminal, the first input terminal is connected to the ground conductive terminal, and the second input terminal passes a first conductive probe The first grounded conductive pad is connected, and the output terminal is connected to the second grounded conductive pad through a second conductive probe.

Description

Probe card module

The invention relates to a probe card technology.

During the manufacturing of integrated circuit components, electrical testing is performed before die cutting or component packaging. This is usually done by using a probe card to transmit the power signal and test signal provided by the tester to the component under test ( Device Under Testing (DUT for short); among them, the power signal is used to supply the power required by the device under test, and the test signal is used to detect the device under test.

Since integrated circuit components usually include analog circuits and digital circuits, the test signals will include analog signals and digital signals. The printed circuit board of the probe card module will also use the ground conductive terminal (AGND) and digital signals for analog signals. The grounding conductive terminal (DGND) for the signal is separated, and the two will be finally connected to the same grounding conductive terminal of the tester, and its equivalent circuit can be regarded as an inductor. Taking AGND as an example, due to the inductance effect, the ground reflow of AGND cannot immediately flow to the ground conductive end of the test machine, and a drift ground voltage will be induced on AGND, which affects the voltage accuracy of the test signal. For example, assuming that the ground reflow of the DUT is 100 milliamperes (mA), and the probe card module has ten probes connected to the AGND of the DUT to form a parallel resistance of about 0.1 ohms, then AGND will have A drift voltage of about 10 millivolts (mV) affects the accuracy of the test signal.

Therefore, it is necessary to develop new probe card technology to effectively solve the problem of drift voltage appearing at its ground conductive end. Relevant conventional technologies can also refer to US patent cases US7005879 and US7049835, which are completely different from the invention technology of this case.

One of the objectives of the present invention is to solve the problem of the drift voltage that occurs during the electrical test of the component to be tested on the ground conductive end of the probe card circuit board.

According to an aspect of the present invention, an embodiment provides a probe card module for testing a circuit chip. The circuit chip includes a first grounded conductive pad and a second grounded conductive pad. The probe card module includes: A printed circuit board includes a grounded conductive terminal; and an amplifying circuit having a first input terminal, a second input terminal, and an output terminal. The first input terminal is connected to the ground conductive terminal and the second input terminal. The first grounded conductive pad is connected through a first conductive probe, and the second grounded conductive pad is connected to the output terminal through a second conductive probe.

In an embodiment, the circuit chip further includes a third grounded conductive pad, and the output end of the amplifier circuit is connected to the third grounded conductive pad through a third conductive probe, or the second grounded conductive pad of the amplifier circuit. The input terminal is connected to the third grounded conductive pad through a third conductive probe.

In one embodiment, the amplifier circuit includes an operational amplifier, the first input terminal is a non-inverting input terminal, and the second input terminal is an inverting input terminal.

In one embodiment, the probe card module further includes a probe fixing base; wherein the printed circuit board has an upper surface and a lower surface, and the probe fixing base is disposed on the lower surface for fixing the A conductive probe, the amplifying circuit is disposed on the lower surface or the upper surface, or the amplifying circuit is disposed on the conductive probes.

According to another aspect of the present invention, another embodiment provides a probe card module for testing a circuit chip. The circuit chip includes a grounded conductive pad. The probe card module includes a printed circuit board including a printed circuit board. A grounded conductive terminal; and an amplifier circuit having a first input terminal, a second input terminal, and an output terminal, the first input terminal is connected to the ground conductive terminal, the second input terminal and the output terminal are connected by a A conductive probe is connected to the grounded conductive pad.

In an embodiment, the circuit chip further includes another grounded conductive pad, and the output terminal of the amplification circuit is connected to the other grounded conductive pad through another conductive probe, or the second input terminal of the amplification circuit. The other grounded conductive pad is connected by another conductive probe.

In one embodiment, the amplifier circuit includes an operational amplifier, the first input terminal is a non-inverting input terminal, and the second input terminal is an inverting input terminal.

In one embodiment, the probe card module further includes a probe holder; Wherein the printed circuit board has an upper surface and a lower surface, the probe fixing base is disposed on the lower surface for fixing the conductive probes, the amplifying circuit is disposed on the lower surface or the upper surface, or the Amplifying circuits are disposed on the conductive probes.

100, 200, 300‧‧‧ probe card modules

110, 111 ~ 114‧‧‧ conductive probe

120‧‧‧printed circuit board

122‧‧‧ ground conductive terminal

125‧‧‧through hole

130‧‧‧ Probe Holder

140‧‧‧amplified circuit

141‧‧‧non-inverting input

142‧‧‧ Inverting input

143‧‧‧output

150‧‧‧ transmission line

160‧‧‧Circuit Chip

161 ~ 166‧‧‧Conductive pad

FIG. 1 is a schematic structural diagram of a probe card module according to an embodiment of the present invention.

FIG. 2 is a schematic circuit diagram of a probe card module testing a circuit chip under test in this embodiment.

FIG. 3 is a schematic structural diagram of a probe card module according to another embodiment of the present invention.

FIG. 4 is a schematic structural diagram of a probe card module according to another embodiment of the present invention.

In order to further understand and understand the features, objects, and functions of the present invention, the embodiments of the present invention will be described in detail with reference to the drawings. Throughout the description and drawings, the same component numbers will be used to designate the same or similar components.

In the description of each embodiment, when an element is described as "above / above" or "below / below" another element, it refers to a situation where it is directly or indirectly above or below the other element. , Which may include other elements placed in between; the so-called "directly" means that no other intervening elements are placed in between. Descriptions such as "above / above" or "below / below" are described based on the drawings, but also include other possible direction changes. The so-called "first", "second", and "third" are used to describe different elements, and these elements are not restricted by such predicates. For the convenience and clarity of illustration, the thickness or size of each element in the drawings is shown in an exaggerated, omitted, or sketched manner, and the size of each element is not exactly its actual size.

FIG. 1 is a schematic structural diagram of a probe card module 100 according to an embodiment of the present invention. The probe card module 100 includes a plurality of conductive probes 110, a printed circuit board 120, a probe fixing base 130, and an amplification circuit 140. The probe fixing base 130 is disposed on the printed circuit board 120. Below, the conductive probes 110 are fixed, and the amplifying circuit 140 is disposed on the lower surface of the printed circuit board 120 so that the amplifying circuit 140 can be as close as possible to the component under test. The combination of the conductive probe 110, the printed circuit board 120, and the probe holder 130 is called a “probe card” in the technical field, and this probe card will be placed on a wafer prober (Prober, not shown) ) To advance Conduct the electrical test of the component under test. In addition, the conductive probes 110 may be connected to the printed circuit board 120 and the conductive probes 110 through a plurality of transmission lines 150 (for example, coaxial cables or twisted pairs); or, the conductive probes 110 may also be directly connected. On the printed circuit board 120.

The test device tested by the probe card module 100 is a circuit chip 160, and the main circuit diagram is drawn in Figure 2. Among them, the conductive probes 110 include conductive probes 111 to 114, and the circuit chip 160 includes a plurality of conductive pads 161 to 166 as interface connection pads for connecting the internal circuit of the circuit chip 160 to the outside thereof. In this embodiment, the conductive pads 161, 163, 164, and 165 are all connected to the ground conductive end of the circuit chip 160 (such as the ground conductive end for analog signals), so it can be called a ground pad. . The amplifier circuit 140 may be an operational amplifier (Operational Amplifier or OP-Amp), and has two input terminals (a non-inverting input terminal 141 and an inverting input terminal 142) and an output terminal 143. The non-inverting input terminal 141 is connected to The ground conductive terminal 122 of the printed circuit board 120, the inverting input terminal 142 is connected to the ground conductive pad 161 through the conductive probe 111, and the output terminal 143 can be connected to the ground conductive pad 163 through the conductive probe 112 The ground conductive pad 164 is connected through the conductive probe 113 and the ground conductive pad 165 is connected through the conductive probe 114 as shown in FIG. 2. Since the conductive probes 111 to 114 are directly connected to the ground conductive terminal of the circuit chip 160, the output terminal 143 and the inverting input terminal 142 of the amplifier circuit 140 are equivalent to short-circuit connection. In addition, since the inverting input terminal 142 of the amplifier circuit 140 is connected to the ground conductive terminal of the circuit chip 160 (the device under test) to form a negative feedback loop, the amplifier circuit 140 can push the ground conductive terminal of the circuit chip 160. To compensate for the equivalent impedance formed by the conductive probes 110 and eliminate the drift voltage that may be generated on the grounded conductive terminal of the printed circuit board 120. In addition, the ground reflow on the circuit chip 160 will flow into the power terminal of the amplifier circuit 140 and will not flow into the ground conductive terminal 122 of the printed circuit board 120 to achieve the device under test (circuit chip 160) and the probe card mold. Ground isolation between groups 100.

According to this, the probe card module 100 according to the embodiment of the present invention can compensate the equivalent impedance formed by the conductive probe 110 by setting the amplifying circuit 140, and at the same time isolate the ground conductive end 122 of the printed circuit board 120 from the circuit chip 160 Ground conductive terminal, so can It can effectively avoid the drift voltage that may be generated on the ground conductive end, thereby ensuring the voltage accuracy of the test signal.

It is worth noting that FIG. 2 is only one embodiment of the probe card module 100 and the circuit chip 160 according to the embodiment of the present invention. In detail, in other embodiments of the present invention, the output terminal 143 and the inverting input terminal 142 of the amplifier circuit 140 may be connected to the same grounded conductive pad through a conductive probe; or, The phase input terminal 142 may also be connected to different grounded conductive pads through several conductive probes, which is not limited in the present invention. When the probe card module 100 according to the embodiment of the present invention is actually implemented, factors such as the output capability of the amplifying circuit 140, the number of grounded conductive pads to be connected to the conductive probes, the length of the conductive probes, and the current through the grounded conductive end may be considered Determine the number of amplifier circuits 140 to be set and the connection relationship between the amplifier circuits 140 and each grounded conductive pad.

FIG. 3 is a schematic structural diagram of a probe card module 200 according to another embodiment of the present invention. As shown in the figure, this embodiment is basically the same as the probe card module 100 in FIG. 1. The difference is that the amplifying circuit 140 is disposed on the upper surface of the printed circuit board 120 so that the amplifying circuit 140 can Match the circuit layout of the printed circuit board 120 as much as possible. Since the amplifying circuit 140 and the conductive probes 110 are disposed on different sides of the printed circuit board 120, a through hole 125 needs to be formed in the printed circuit board 120, and the through hole 125 penetrates the printed circuit board. The upper and lower surfaces of 120 are used to connect the amplifying circuit 140 to the conductive probes 110.

FIG. 4 is a schematic structural diagram of a probe card module 300 according to another embodiment of the present invention. As shown in the figure, this embodiment is basically the same as the probe card module 100 in FIG. 1. The difference is that the conductive probes 110 are directly connected to the printed circuit board 120. Furthermore, the amplifying circuit 140 can be directly disposed on the conductive probes 110 to further shorten the distance between the amplifying circuit 140 and a device under test (circuit chip), and can reduce the size of the conductive probes 110 and the like. Effective impedance.

The above are only preferred embodiments of the present invention, and should not be used to limit the scope of the present invention. That is to say, all equal changes and modifications made in accordance with the scope of the patent application of the present invention will still not lose the essence of the present invention, nor deviate from the spirit and scope of the present invention, so they should be regarded as the further implementation status of the present invention.

Claims (14)

A probe card module for testing a circuit chip. The circuit chip includes a first grounded conductive pad and a second grounded conductive pad. The probe card module includes: a printed circuit board including a grounded conductive terminal; And an amplifying circuit having a first input terminal, a second input terminal, and an output terminal, the first input terminal is connected to the ground conductive terminal, and the second input terminal is connected to the first conductive terminal through a first conductive probe; A grounded conductive pad, and the output terminal is connected to the second grounded conductive pad through a second conductive probe. The probe card module according to item 1 of the patent application scope, wherein the circuit chip further includes a third ground conductive pad, and the output end of the amplification circuit is connected to the third through a third conductive probe. Ground conductive pad. The probe card module according to item 1 of the patent application scope, wherein the circuit chip further includes a third grounded conductive pad, and the second input terminal of the amplification circuit is connected to the third conductive probe through a third conductive probe. The third grounded conductive pad. According to the probe card module described in claims 1, 2, or 3, wherein the amplifier circuit includes an operational amplifier, the first input terminal is a non-inverting input terminal, and the second input terminal is a Inverting input. According to the probe card module described in the patent application scope item 1, 2 or 3, further comprising a probe fixing base; wherein the printed circuit board has an upper surface and a lower surface, and the probe fixing base is disposed on the The lower surface is used for fixing the conductive probes, and the amplifying circuit is disposed on the lower surface. According to the probe card module described in the patent application scope item 1, 2 or 3, further comprising a probe fixing base; wherein the printed circuit board has an upper surface and a lower surface, and the probe fixing base is disposed on the The lower surface is used to fix the conductive probes, and the amplifying circuit is disposed on the upper surface. According to the probe card module described in the patent application scope item 1, 2 or 3, further comprising a probe fixing base; wherein the printed circuit board has an upper surface and a lower surface, and the probe fixing base is disposed on the The lower surface is used to fix the conductive probes, and the amplifying circuit is disposed on the conductive probes. A probe card module for testing a circuit chip. The circuit chip includes a grounded conductive pad. The probe card module includes: a printed circuit board including a grounded conductive terminal; and an amplifier circuit having a first An input terminal, a second input terminal, and an output terminal. The first input terminal is connected to the ground conductive terminal, and the second input terminal and the output terminal are connected to the ground conductive pad through a conductive probe. The probe card module according to item 8 of the scope of patent application, wherein the circuit chip further includes another grounded conductive pad, and the output terminal of the amplification circuit is connected to the other grounded conductive through another conductive probe. pad. The probe card module according to item 8 of the patent application scope, wherein the circuit chip further includes another grounded conductive pad, and the second input terminal of the amplifier circuit is connected to the other through another conductive probe. Ground conductive pad. The probe card module according to item 8, 9, or 10 of the scope of patent application, wherein the amplifier circuit includes an operational amplifier, the first input terminal is a non-inverting input terminal, and the second input terminal is a Inverting input. According to the probe card module described in claim 8, 9, or 10, the probe card module further includes a probe holder; wherein the printed circuit board has an upper surface and a lower surface, and the probe holder is disposed on the The lower surface is used for fixing the conductive probes, and the amplifying circuit is disposed on the lower surface. According to the probe card module described in claim 8, 9, or 10, the probe card module further includes a probe holder; wherein the printed circuit board has an upper surface and a lower surface, and the probe holder is disposed on the The lower surface is used to fix the conductive probes, and the amplifying circuit is disposed on the upper surface. According to the probe card module described in claim 8, 9, or 10, the probe card module further includes a probe holder; wherein the printed circuit board has an upper surface and a lower surface, and the probe holder is disposed on the The lower surface is used to fix the conductive probes, and the amplifying circuit is disposed on the conductive probes.