CN102507051A - Stress testing chip and stress testing method thereof - Google Patents
Stress testing chip and stress testing method thereof Download PDFInfo
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- CN102507051A CN102507051A CN2011103793247A CN201110379324A CN102507051A CN 102507051 A CN102507051 A CN 102507051A CN 2011103793247 A CN2011103793247 A CN 2011103793247A CN 201110379324 A CN201110379324 A CN 201110379324A CN 102507051 A CN102507051 A CN 102507051A
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Abstract
The invention provides a stress testing chip, which is capable of overcoming the defects of connection error of leads, low portability, low testing efficiency and the like of piezoresistive stress testing chips in the prior art during the stress testing process. The stress testing chip is located in a package body and comprises a resistance measuring module, an RF (radiofrequency) module and a plurality of resistor modules, wherein the resistor modules are respectively located to positions, required to be subjected to stress testing, of the stress testing chip, resistance of the resistor modules varies along with the variation of stress at the corresponding positions of the stress testing chip, the resistance measuring module is used for measuring resistance of the resistor modules and outputting the measured results to the RF module, and the RF module is used for sending the measured results received from the resistance measuring module to the outside of the package body.
Description
Technical field
The present invention relates to semiconductor applications, relate in particular to a kind of stress test chip and stress test method thereof.
Background technology
Along with the integrated circuit encapsulation technology develops to directions such as miniaturization, high density and mounted on surface, and chip area constantly increases, and the stress problem of encapsulation and chip becomes increasingly conspicuous, and the damage relevant with stress increases, and this becomes the one of the main reasons of component failure.Therefore, the test of stress parameters is one of key that guarantees device reliability with analyzing.
At present; Usually adopt with the compatible mutually resistance pressure type stress test chip of custom integrated circuit technology to come the stress distribution in the packaging body is measured; This resistance pressure type stress test chip is positioned at packaging body; And this resistance pressure type stress test chip is made up of a plurality of resistance units, and the method for testing as the one of which is to measure the variation that suffers the resistance value of each resistance unit of resistance pressure type stress test chip under the situation of stress at resistance pressure type stress test chip through going between.But this method exists problems.At first, general resistance pressure type stress test chip has a lot of resistance units, and different resistance units need be measured through different lead-in wires, so usually can occur the result of mistake because of operating personnel's carelessness; Secondly, the portability of this measuring method descends greatly, because different experimental enviroments, measuring mode also can be different with method, so will often change measuring method; The 3rd, the efficient of this measuring method is lower, because on the pad that before measuring, all need wire bonds designed at every turn, and in welding process, also tends to occur rosin joint or short circuit phenomenon, so greatly reduce efficiency of measurement.
Summary of the invention
Above-mentioned defective when the present invention is directed to the stress distribution of resistance pressure type stress test chip of the prior art in measuring packaging body provides a kind of stress test chip and stress test method thereof that can overcome above-mentioned defective.
The present invention provides a kind of stress test chip, and this stress test chip is positioned at packaging body, and this stress test chip comprises resistance measurement module, RF module and a plurality of resistive module, wherein:
The needs that each resistive module in said a plurality of resistive module lays respectively at said stress test chip carry out the position of stress test and the resistance value of each said resistive module changes along with the STRESS VARIATION of the corresponding position of said stress test chip; Said resistance measurement module is used to measure the resistance value of each said resistive module and measurement result is exported to said RF module, and said RF module is used for the measurement result that receives from said resistance measurement module is sent to the outside of said packaging body.
The present invention also provides a kind of stress test method that is used for stress test; This stress test method is carried out by the stress test chip that is positioned at packaging body; And this stress test chip comprises resistance measurement module, RF module and a plurality of resistive module, and said method comprises:
The resistance value of each said resistive module changes along with the STRESS VARIATION of the corresponding position of said stress test chip;
Said resistance measurement module is measured the resistance value of each said resistive module, and measurement result is exported to said RF module;
Said RF module will send to the outside treating apparatus of said packaging body from the measurement result that said resistance measurement module receives;
Said treating apparatus is analyzed to obtain the stress situation of said stress test chip said measurement result.
Because stress test chip according to the present invention comprises resistance measurement module, RF module and a plurality of resistive module that is positioned at packaging body; So can be in the variation of the resistance value that encapsulates each resistive module of in-vivo measurement along with the stress test die stress; And the resistance value that measures is sent to the outside of packaging body through the RF module; So the lead-in wire connection error of having avoided existing in the prior art according to stress test chip of the present invention and stress test method thereof, defective such as portability is low, efficiency of measurement is low, and can be accurate, convenient, the STRESS VARIATION of monitor stress test chip in real time.
Description of drawings
Fig. 1 schematically shows according to the layout of stress test chip of the present invention in packaging body;
Fig. 2 is the block diagram according to stress test chip of the present invention;
Fig. 3 is the process flow diagram according to stress test method of the present invention.
Embodiment
Describe in detail according to stress test chip of the present invention below in conjunction with accompanying drawing.
As shown in Figure 1, stress test chip 20 according to the present invention is positioned at packaging body 1, and this stress test chip 20 can be connected on the substrate 10 through silver slurry or alternate manner.
Describe detailed structure below in detail according to stress test chip 20 of the present invention.As shown in Figure 2; Stress test chip 20 according to the present invention comprises resistance measurement module 202, RF module 203 and a plurality of resistive module 201; Wherein: the needs that each resistive module 201 in said a plurality of resistive module 201 lays respectively at said stress test chip 20 carry out the position of stress test and the resistance value of each said resistive module 201 changes along with the STRESS VARIATION of the corresponding position of said stress test chip 20; Said resistance measurement module 202 is used to measure the resistance value of each said resistive module 201 and measurement result is exported to said RF module 203, and said RF module 203 is used for the measurement result that receives from said resistance measurement module 202 is sent to the outside of said packaging body 1.
After RF module 203 sends to the outside of packaging body 1 with measurement result; Just can analyze measurement result and obtain stress distribution and the stress situation on the stress test chip 20, thereby avoid in the prior art connecting a series of defective that measurement data caused of derivation stress test chip 20 through lead-in wire through being positioned at the outside receiving and processing equipment (not shown) of packaging body 1.
Should be understood that the layout about resistive module 201, resistance measurement module 202 and RF module 203 among Fig. 2 only is schematically, is not the actual arrangement that is used to limit each module.And; The present invention does not limit the structure of each resistive module 201, resistance measurement module 202, RF module 203; As long as it can satisfy the requirement of measuring sensitivity, measuring accuracy; For example, according to measuring accuracy and the requirement of measuring sensitivity, the structure of each resistive module 201, direction, doping polarity and concentration etc. are variable.
In a preferred implementation according to the present invention, said resistive module 201 is a piezoresister, thereby the variation of the resistance value of each piezoresister has just reflected stress distribution and stress situation on the stress test chip 20 in real time.Wherein, piezoresister can be made through IC technologies such as diffusion or ion injections, and it can be flat rectangular structure or other suitable structures.
In a preferred implementation according to the present invention; Said resistance measurement module 202 can obtain the resistance value of each resistive module 201 through the voltage and current that obtains each resistive module 201, and the variation of the resistance value of each resistive module 201 has also correspondingly reflected the stress situation of the corresponding position of stress test chip 20.
In a preferred implementation more according to the present invention, said RF module 203 also is used for the electromagnetic wave that receives from said packaging body 1 outside is changed into the required energy of said resistance measurement module 202 work.
In sum; Have the following advantages than prior art according to stress test chip of the present invention 20: at first; Than traditional resistance pressure type stress test chip; Stress test chip 20 according to the present invention is in the packaging body 1 inner interconnection that realizes resistance measurement module 202 and each resistive module 201, thereby has avoided in the prior art because of the lead-in wire mistake that connection error caused; Secondly, stress test chip 20 according to the present invention is very convenient aspect the measurement use, promptly in different tests, need not change connected mode or metering system; The 3rd; Stress test chip 20 according to the present invention has high efficiency of measurement; This is because stress test chip 20 according to the present invention is to export the output signal of stress test chips 20 but not the output signal of the derivation stress test chip 20 that passes through to go between through RF module 203; Because RF module 203 utilizes electromagnetic induction, radiowave or microwave energy etc. to realize the signal transmission; So step such as just need not weld yet, thereby avoid the variety of issue that possibly occur in trouble and the welding of welding.
As shown in Figure 3; The present invention also provides a kind of stress test method that is used for stress test; This stress test method is carried out by the stress test chip that is positioned at packaging body, and this stress test chip comprises resistance measurement module, RF module and a plurality of resistive module, and said method comprises:
The resistance value of S31, each said resistive module changes along with the STRESS VARIATION of the corresponding position of said stress test chip;
S32, said resistance measurement module are measured the resistance value of each said resistive module, and measurement result is exported to said RF module;
S33, said RF module will send to the outside treating apparatus of said packaging body from the measurement result that said resistance measurement module receives;
S34, said treating apparatus are analyzed to obtain the stress situation of said stress test chip said measurement result.
Wherein, Said resistive module is a piezoresister, and the resistance value that said resistance measurement module is measured each said resistive module comprises: said resistance measurement module obtains the resistance value of each piezoresister according to the voltage at each piezoresister two ends and the electric current that flows through each piezoresister.
In addition, in step S34, said treating apparatus obtains the stress situation of the corresponding position of stress test chip according to the resistance value of each piezoresister that receives from said RF module.Because the relation between the stress at the resistance value of piezoresister and place, piezoresister present position is well known in the art, so repeat no more here.
Below only combine preferred implementation of the present invention that stress test chip according to the present invention and stress test method thereof are described in detail; But those skilled in the art are to be understood that; Under the situation that does not deviate from spirit and scope of the invention, can carry out various distortion and modification to the present invention.
Claims (5)
1. stress test chip, this stress test chip is positioned at packaging body, and this stress test chip comprises resistance measurement module, RF module and a plurality of resistive module, wherein:
The needs that each resistive module in said a plurality of resistive module lays respectively at said stress test chip carry out the position of stress test and the resistance value of each said resistive module changes along with the STRESS VARIATION of the corresponding position of said stress test chip; Said resistance measurement module is used to measure the resistance value of each said resistive module and measurement result is exported to said RF module, and said RF module is used for the measurement result that receives from said resistance measurement module is sent to the outside of said packaging body.
2. stress test chip according to claim 1, wherein, said resistive module is a piezoresister.
3. stress test chip according to claim 1, wherein, said RF module also is used for the electromagnetic wave that receives from said packaging body outside is changed into the required energy of said resistance measurement module work.
4. stress test method that is used for stress test; This stress test method is carried out by the stress test chip that is positioned at packaging body; And this stress test chip comprises resistance measurement module, RF module and a plurality of resistive module; The needs that each resistive module in said a plurality of resistive module lays respectively at said stress test chip carry out the position of stress test, and said method comprises:
The resistance value of each said resistive module changes along with the STRESS VARIATION of the corresponding position of said stress test chip;
Said resistance measurement module is measured the resistance value of each said resistive module, and measurement result is exported to said RF module;
Said RF module will send to the outside treating apparatus of said packaging body from the measurement result that said resistance measurement module receives;
Said treating apparatus is analyzed to obtain the stress situation of said stress test chip said measurement result.
5. stress test method according to claim 4, wherein, said resistive module is a piezoresister, the resistance value that said resistance measurement module is measured each said resistive module comprises:
Said resistance measurement module obtains the resistance value of each piezoresister according to the voltage at each piezoresister two ends and the electric current that flows through each piezoresister.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011103793247A CN102507051A (en) | 2011-11-24 | 2011-11-24 | Stress testing chip and stress testing method thereof |
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| CN2011103793247A CN102507051A (en) | 2011-11-24 | 2011-11-24 | Stress testing chip and stress testing method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10163742A (en) * | 1996-11-12 | 1998-06-19 | Delco Electron Corp | Device for protecting electronic circuit from radio frequency energy |
| US20060234398A1 (en) * | 2005-04-15 | 2006-10-19 | International Business Machines Corporation | Single ic-chip design on wafer with an embedded sensor utilizing rf capabilities to enable real-time data transmission |
| DE102006039501A1 (en) * | 2006-08-23 | 2008-03-27 | Siemens Ag | Sensor device for monitoring pressure in transport container, has pressure sensor for detecting pressure in transport container, and radio frequency identification module sending radio signal based on physical condition of sensor |
| CN201653608U (en) * | 2010-05-07 | 2010-11-24 | 长沙同盛电子科技有限公司 | High-intelligent resistance strain gage sensor |
| CN102024798A (en) * | 2009-09-17 | 2011-04-20 | 胡泉凌 | Packaging structure used for integrating surface adhesive type assembly |
-
2011
- 2011-11-24 CN CN2011103793247A patent/CN102507051A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10163742A (en) * | 1996-11-12 | 1998-06-19 | Delco Electron Corp | Device for protecting electronic circuit from radio frequency energy |
| US20060234398A1 (en) * | 2005-04-15 | 2006-10-19 | International Business Machines Corporation | Single ic-chip design on wafer with an embedded sensor utilizing rf capabilities to enable real-time data transmission |
| DE102006039501A1 (en) * | 2006-08-23 | 2008-03-27 | Siemens Ag | Sensor device for monitoring pressure in transport container, has pressure sensor for detecting pressure in transport container, and radio frequency identification module sending radio signal based on physical condition of sensor |
| CN102024798A (en) * | 2009-09-17 | 2011-04-20 | 胡泉凌 | Packaging structure used for integrating surface adhesive type assembly |
| CN201653608U (en) * | 2010-05-07 | 2010-11-24 | 长沙同盛电子科技有限公司 | High-intelligent resistance strain gage sensor |
Non-Patent Citations (1)
| Title |
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| 贾松良等: "压阻型集成电路封装应力测试芯片的研究与应用", 《半导体学报》 * |
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Application publication date: 20120620 |