CN209247969U - Plugboard and wafer test equipment - Google Patents
Plugboard and wafer test equipment Download PDFInfo
- Publication number
- CN209247969U CN209247969U CN201821979130.4U CN201821979130U CN209247969U CN 209247969 U CN209247969 U CN 209247969U CN 201821979130 U CN201821979130 U CN 201821979130U CN 209247969 U CN209247969 U CN 209247969U
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- China
- Prior art keywords
- signal
- plugboard
- probe card
- electrical contacts
- pin
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- Expired - Fee Related
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- 238000012360 testing method Methods 0.000 title claims abstract description 47
- 239000000523 sample Substances 0.000 claims abstract description 53
- 230000002159 abnormal effect Effects 0.000 claims abstract description 27
- 230000008054 signal transmission Effects 0.000 claims abstract description 24
- 230000002463 transducing effect Effects 0.000 claims abstract description 12
- 230000005856 abnormality Effects 0.000 claims abstract description 10
- 230000005540 biological transmission Effects 0.000 claims abstract description 5
- 238000004806 packaging method and process Methods 0.000 claims description 12
- 230000005611 electricity Effects 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 7
- 230000007717 exclusion Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000013024 troubleshooting Methods 0.000 description 2
- 238000001467 acupuncture Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to a kind of plugboard and a kind of wafer test equipment, the plugboard is used for wafer test, comprising: conductive structure is used for transmission test signal, and described conductive structure one end is electrical contacts, for being electrically connected in test with the pin of probe card；Sensing unit is set at the detectable position of the electrical contacts, for detecting the signal transmission characteristics between the electrical contacts and the pin of probe card；Signal analysis unit is connect with the sensing unit, for receiving the transducing signal of the sensor and judging whether the signal transmission between the electrical contacts and the pin of probe card is abnormal according to the transducing signal；Signal feedback unit is connect with the signal analysis unit, for when signal transmission abnormality, being sent out abnormal signal between the electrical contacts and the pin of probe card.The plugboard can timely feedback abnormal signal, convenient for discovery failure in time, improve fault detection and exclusion efficiency.
Description
Technical field
The utility model relates to field of semiconductor devices more particularly to a kind of plugboard and wafer test equipment.
Background technique
Manufacture of semiconductor rapid technological improvement in recent years, advanced Moore's Law estimate rule several years, at this stage to 32
Nanometer or less drive on boldly.Product is stressed light and short at present, and IC volume is smaller and smaller, function is increasingly stronger, number of pins is more and more,
In order to reduce area shared by chip package and improve IC efficiency, flip (Flip Chip) mode, which encapsulates, at this stage is generally answered
For chip of drawing, chipset, memory and CPU etc..Above-mentioned high-order packaged type unit price is high, if can carry out before packaging
Chip testing finds in the presence of defective products wafer, that is, is marked, marks these not before back segment encapsulation procedure
Non-defective unit is given up, and unnecessary packaging cost can be saved.
Existing tester table is mainly made of test machine and probe station, and when being tested, test head can lead to
Plugboard is crossed, input signal is transmitted to the pin of probe card, is then communicated to probe tip, reaches measurement by having an acupuncture treatment
Purpose, since exception can often occur in plugboard in use process, such as with probe card pins poor contact the problems such as, causing cannot
It uses.
When board breaks down, needs to check the various situations of machine and exclude one by one.Therefore designing one kind can be certainly
The plugboard structure of dynamic debugging advantageously reduces the time for excluding board failure.
Utility model content
Technical problem to be solved by the utility model is to provide a kind of plugboards and wafer test equipment, can arrange automatically
Except the plugboard structure of failure advantageously reduces the time of exclusion board failure.
To solve the above-mentioned problems, the utility model provides a kind of conductive structure, is used for transmission test signal, described to lead
Electric structure one end is electrical contacts, for being electrically connected in test with the pin of probe card；Sensing unit is set to the electricity and connects
At the detectable position of contact portion, for detecting the signal transmission characteristics between the electrical contacts and the pin of probe card；Signal
Analytical unit is connect with the sensing unit, for receiving the transducing signal of the sensing unit and according to the transducing signal
Judge whether the signal transmission between the electrical contacts and the pin of probe card is abnormal；Signal feedback unit, with the signal
Analytical unit connection, for when signal transmission abnormality, being sent out exception between the electrical contacts and the pin of probe card
Signal.
Optionally, the sensing unit includes at least one in pressure sensor, current sensor and voltage sensor
Kind.
Optionally, the signal analysis unit includes analog to digital conversion circuit, D/A converting circuit, amplifying circuit and noise reduction
At least one of circuit.
Optionally, the plugboard further includes being fixed to each other between plastic packaging shell, with the conductive structure, the signal point
Analysis unit and the signal feedback unit are all set in the plastic packaging shell.
The technical solution of the utility model also provides a kind of wafer test equipment, comprising: measuring head；Probe card；At least one
A plugboard described in any of the above embodiments, one end of the plugboard are electrically connected with the measuring head, and the other end passes through electrical contact
Portion is connect with the pin of the probe card, for receiving the test signal of the measuring head output and being transferred to the probe card.
Optionally, further include display, connect with the signal feedback unit of the plugboard, for showing that the signal is anti-
Present the abnormal signal that unit is sent.
Optionally, further include controller, connect with the signal feedback unit of the plugboard, for anti-according to the signal
The abnormal signal that unit is sent is presented, the working condition of the wafer test equipment is controlled.
Optionally, including multiple plugboards, it is correspondingly arranged with Pin locations multiple in probe card, the abnormal signal
The position of plugboard including signal transmission abnormality or identification information.
The plugboard of the utility model can judge plugboard and probe card by sensing unit detection in use
Between signal transmission it is whether abnormal, find the problem in time, to reduce troubleshooting time.
The wafer test equipment of the utility model to plugboard and can be visited in real time during testing wafer
Signal transmission situation between needle card is monitored, once signal transmission abnormality occurs, can be timely feedbacked abnormal signal, is convenient for
Faulty plugboard is found in time, improves fault detection and exclusion efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the plugboard of one specific embodiment of the utility model；
Fig. 2 is the structural schematic diagram of the wafer test equipment of one specific embodiment of the utility model.
Specific embodiment
The specific embodiment of plugboard provided by the utility model and wafer test equipment is done in detail with reference to the accompanying drawing
It describes in detail bright.
Referring to FIG. 1, the structural schematic diagram of the plugboard for one specific embodiment of the utility model.
The plugboard 100 includes plastic packaging shell 101 and the conductive structure being fixed on the plastic packaging shell 101, institute
Stating conductive structure one end is the electrical contacts 102.The plugboard 100 further includes sensing unit 111, signal analysis unit
112 and signal feedback unit 113.
In the specific embodiment, the electrical contacts 102 are exposed to the outside of the plastic packaging shell 101, for surveying
It is contacted when examination with the pin of probe card and forms electrical connection.
In the specific embodiment, the other parts of the conductive structure are located inside the plastic packaging shell 101；At other
In specific embodiment, the conductive structure can also be fixed on the plastic packaging surface of shell.The conductive structure other end is used
The spy is transmitted to by the conductive structure in the test signal of the measuring head for being connected to wafer test board, measuring head output
Needle card.The conductive structure may include conducting wire and various electronic components, be not limited thereto.
The sensing unit 111, be set at the electrical contacts 102 can be at test position, for detecting the electricity
Signal transmission characteristics between contact portion 102 and the pin of probe card 202.The sensing unit 111 includes pressure sensor, electricity
At least one of flow sensor, voltage sensor.It is different according to the sensing unit 111 transducing signal to be detected, rationally
The position of the sensing unit 111 is set.
In a specific embodiment, the sensing unit 111 is pressure sensor, be can be set in the electrical contact
The contact surface or other suitable positions in portion 102 and probe card pins, for detecting the plugboard 100 and probe card 202
When contact, the pressure that the electrical contacts 102 are subject to, if the electrical contacts 102 are not affected by pressure or pressure is too small,
Poor contact between the electrical contacts 102 and probe card, the signal between the electrical contacts 102 and the pin of probe card pass
Defeated exception.
In other specific embodiments, the sensing unit 111 can also be current sensor, be in electrical contact when detecting
When being transmitted to the electric current of probe card in portion 102 less than signal code, illustrate that there is electric leakage between electrical contacts 102 and probe card asks
Topic, signal transmission abnormality.
In other specific embodiments, the sensing unit 111 can also include pressure sensor, current sense simultaneously
The multiple sensors such as device, can be complete to the electrical parameter, physical characteristic progress that contact between the electrical contacts 102 and probe card
Face detection.
The signal analysis unit 112 is connect with the sensing unit 111, for receiving the biography of the sensing unit 111
Sense signal simultaneously judges whether the transmission of the signal between the electrical contacts 102 and the pin of probe card is good.The signal analysis
The transducing signal that unit 112 is used to export sensing unit 111 is analyzed, specifically, transducing signal and one can be referred to
Value is compared, to judge whether signal transmission is abnormal.The 112 packet D/A converting circuit of signal analysis unit, analog-to-digital conversion
At least one of circuit, amplifying circuit, Dolby circuit and comparison circuit, for being analyzed and processed acquisition to transducing signal
The contact performance parameter of electrical contacts 102 and probe card.
In a specific embodiment, the sensing unit 111 is pressure sensor, and the reference value is that the electricity connects
Pressure criteria value of the contact portion 102 with probe card when well contacting；Signal analysis unit 112 passes through the sensing unit
After 111 transducing signal analysis obtains the contact pressure between electrical contacts 102 and probe card, with the pressure criteria value into
Row compares, and when being lower than the pressure criteria value, judges to contact between the electrical contacts 102 and probe card abnormal.
In another specific embodiment, the sensing unit 111 is current sensor, then the reference value is test letter
Number current value, when the signal analysis unit 112 obtains electrical contacts by the analysis of the transducing signal of the sensing unit 111
The current signal of 102 outputs is less than or greater than the current value that detector inputs the test signal of the plugboard 100, then judges institute
The electric signal transmission stated between electrical contacts 102 and probe card is abnormal.
, can be different according to the type of sensing unit 111 in other specific embodiments, to the signal analysis unit
The different judgment mode of 112 settings.
The signal feedback unit 113 is connect with the signal analysis unit 112, for the electrical contacts 102 with
Between the pin of probe card when signal transmission abnormality, abnormal signal is sent.Judging result is sent to institute by signal analysis unit 112
Signal feedback unit 113 is stated, when the signal feedback unit 113 receives the judging result of signal transmission abnormality, to outgoing
Abnormal signal is sent, to inform poor contact between the current plugboard 100 of tester and probe card, so that tester is timely
It finds the problem, is handled.
The signal analysis unit 112 and the signal feedback unit 113 are all set in the plastic packaging shell 101.
Above-mentioned plugboard 100 can judge plugboard 100 and probe by the detection of sensing unit 111 in use
Whether the signal transmission between card is abnormal, finds the problem in time, to reduce troubleshooting time.
Specific embodiment of the present utility model also provides a kind of wafer test equipment.
Referring to FIG. 2, being the partial schematic diagram of the wafer test equipment.
The wafer test equipment includes: measuring head 201；Probe card 202, and as described in above-mentioned specific embodiment
Plugboard 100.The specific structure of the plugboard 100 in Fig. 2 referring to FIG. 1, do not show.The measuring head 201 is test machine
A part, the probe card 202 is placed on probe station.When performing a test, measuring head 201 is pressed in institute by plugboard 100
It states in probe card 202.Described 100 one end of plugboard is electrically connected with the measuring head 201, and the other end (is asked by electrical contacts 102
With reference to Fig. 1) it is connect with the pin of the probe card 202, for receiving the test signal of the output of measuring head 201 and being transferred to
The probe card 202.
In the specific embodiment, the wafer test equipment can also include a display, with the plugboard 100
Signal feedback unit 113 (please referring to Fig. 1) connection, the abnormal signal sent for showing the signal feedback unit 113.It is described
Abnormal signal can be a fault code, and different abnormal conditions can correspond to different fault codes.For example, contact pressure is different
Often, corresponding code A；Transmit current anomaly, corresponding code B etc..Tester can judge to patch quickly according to the code of display
Failure cause between plate 100 and probe card 202.
In the specific embodiment, the wafer test equipment includes multiple plugboards 100, in probe card 202
Pin locations at different location are correspondingly arranged, and can be distinguished by mark or location information between different plugboards 100.
The abnormal signal that the signal feedback unit 113 (please referring to Fig. 1) of the plugboard 100 is fed back can also include that signal transmission is different
Position or identification information where normal plugboard 100, the plugboard 100 to be broken down with facilitating tester to position.
In a specific embodiment, the wafer test equipment can also include controller, with the plugboard 100
Signal feedback unit 113 connect, the abnormal signal for being fed back according to the signal feedback unit 113 controls the wafer
The working condition of test equipment.In a specific embodiment, in the abnormal signal for receiving the transmission of signal feedback unit 113
When, the controller controls the measuring head 201, stops sending test signal to probe card 202, in order to carry out consequent malfunction
Detection and exclusion.
Above-mentioned wafer test equipment, can be in real time between plugboard and probe card during testing wafer
Signal transmission situation be monitored, once occur signal transmission abnormality, abnormal signal can be timely feedbacked, convenient in time discovery
Faulty plugboard improves fault detection and exclusion efficiency.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (8)
1. a kind of plugboard is used for wafer test characterized by comprising
Conductive structure, is used for transmission test signal, and described conductive structure one end is electrical contacts, in test and probe card
Pin electrical connection；
Sensing unit is set at the detectable position of the electrical contacts, for detecting the electrical contacts and probe card
Signal transmission characteristics between pin；
Signal analysis unit is connect with the sensing unit, for receiving the transducing signal of the sensing unit and according to described
Transducing signal judges whether the transmission of the signal between the electrical contacts and the pin of probe card is abnormal；
Signal feedback unit is connect with the signal analysis unit, between the electrical contacts and the pin of probe card
When signal transmission abnormality, it is sent out abnormal signal.
2. plugboard according to claim 1, which is characterized in that the sensing unit includes pressure sensor, electric current biography
At least one of sensor and voltage sensor.
3. plugboard according to claim 1, which is characterized in that the signal analysis unit include analog to digital conversion circuit,
At least one of D/A converting circuit, amplifying circuit and Dolby circuit.
4. plugboard according to claim 1, which is characterized in that the plugboard further includes plastic packaging shell, is led with described
It is fixed to each other between electric structure, the signal analysis unit and the signal feedback unit are all set in the plastic packaging shell.
5. a kind of wafer test equipment characterized by comprising
Measuring head；
Probe card；
At least one plugboard according to any one of claims 1 to 4, one end of the plugboard and measuring head electricity
Connection, the other end are connect by electrical contacts with the pin of the probe card, for receiving the test letter of the measuring head output
Number and be transferred to the probe card.
6. wafer test equipment according to claim 5, which is characterized in that further include display, with the plugboard
The connection of signal feedback unit, the abnormal signal sent for showing the signal feedback unit.
7. wafer test equipment according to claim 5, which is characterized in that further include controller, with the plugboard
The connection of signal feedback unit, the abnormal signal for being sent according to the signal feedback unit control the wafer test equipment
Working condition.
8. wafer test equipment according to claim 5, which is characterized in that including multiple plugboards, with probe card
Upper multiple Pin locations are correspondingly arranged, and the abnormal signal includes position or the identification information of the plugboard of signal transmission abnormality.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821979130.4U CN209247969U (en) | 2018-11-28 | 2018-11-28 | Plugboard and wafer test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821979130.4U CN209247969U (en) | 2018-11-28 | 2018-11-28 | Plugboard and wafer test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209247969U true CN209247969U (en) | 2019-08-13 |
Family
ID=67529987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821979130.4U Expired - Fee Related CN209247969U (en) | 2018-11-28 | 2018-11-28 | Plugboard and wafer test equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209247969U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117706432A (en) * | 2024-02-02 | 2024-03-15 | 合肥中航天成电子科技有限公司 | Pin detection equipment for SOP packaging element |
-
2018
- 2018-11-28 CN CN201821979130.4U patent/CN209247969U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117706432A (en) * | 2024-02-02 | 2024-03-15 | 合肥中航天成电子科技有限公司 | Pin detection equipment for SOP packaging element |
| CN117706432B (en) * | 2024-02-02 | 2024-04-30 | 合肥中航天成电子科技有限公司 | Pin detection equipment for SOP packaging element |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190813 |