JP2011215007A - Testing device and testing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid a large current from flowing through a specific probe pin by a simple mechanism, relating to a testing device and a testing method.SOLUTION: A tester body part at least includes a tester head, a performance board connected electrically to the tester head, a flock ring connected electrically to the performance board, and a probe card connected electrically to the flock ring. A thermography for monitoring temperature of the probe pin provided to the probe card is provided to the tester body side of the testing device containing the tester body part.

Description

  The present invention relates to a test apparatus and a test method, for example, to a mechanism of a test apparatus such as a semiconductor test apparatus having a temperature monitoring function of a probe card Pin.

  Generally, in order to provide a highly integrated semiconductor device with high quality and stability to the market, it is necessary to strictly check (test / inspect) the manufactured semiconductor device. In the manufacturing process of a semiconductor integrated circuit device, a large number of integrated circuit devices, that is, semiconductor chips are formed on a semiconductor wafer, and then a primary electrical characteristic test is performed on each semiconductor chip in the wafer state. Sorting out. Next, the semiconductor wafer is diced into semiconductor chips, and only the semiconductor chips determined as non-defective products in the sorting test, that is, the probing test, are taken out and packaged.

  FIG. 8 is a conceptual configuration diagram of a conventional test apparatus. An external input including test items in the tester 10 is input to the external input unit 11 and transmitted to the control unit 21 on the prober 20 side via the control unit 12. Then, the measurement unit 30 tests and measures a test object such as a semiconductor chip.

  FIG. 9 is a conceptual configuration diagram of a measurement unit of a conventional test apparatus, in which a probe card 31 having a probe card base 32 to which a ceramic ring 33 having a probe pin 34 is fixed is brought into contact with a semiconductor wafer 81. Test and measure. The probe card base 32 is formed of a printed wiring board, and includes a pogo pad 35 on the back side and a stiffener 36 for increasing the strength.

  Measurement is performed by passing a current from the power supply 22 where the limit is set to each probe pin 34 via the pogo pad 35. In this case, selection of the probe pin 34 through which a current flows is performed on a program. Although a current limit is set for the main power supply 22, the current can not be set for each probe pin 34.

  In the early stage of development, there is a high possibility that a defect exists in the semiconductor manufacturing process and the test environment including the test program, and there is a case where the current exceeds the expected level and the temperature rises to about 300 ° C. For example, when a defect occurs in a semiconductor manufacturing process or a test program, a large current flows through a specific probe pin of the probe card, and a case in which the probe pin is discolored or burnt due to a temperature rise occurs.

  As a result, the semiconductor device and the test environment are damaged and the development schedule is delayed. Therefore, the problem is how to detect the failure of the semiconductor device and the test environment and stop the damage. Under these circumstances, each company is trying to detect abnormalities during testing.

  For example, it has been proposed to monitor the temperature of a semiconductor chip using a thermal diode and stop the measurement when the temperature is listed. Alternatively, it has been proposed to measure a short circuit or an open defect using an infrared imaging element (thermography) in a TAB tape test.

Japanese Patent Application Laid-Open No. 07-311239 Japanese Patent Laid-Open No. 06-252229

  As described above, the current semiconductor test apparatus is equipped with an ammeter in the main power supply, but it is not configured so that the current flowing through each probe pin of the probe card can be constantly measured individually. For this reason, when the trouble of a semiconductor manufacturing process and a test program generate | occur | produces, there exists a problem that discoloration of a probe pin and generation | occurrence | production of burning cannot be suppressed.

  Although it is possible to suppress discoloration and burnout of the probe pins by installing an ammeter for each probe pin system individually, it is impractical to install ammeters on all probe pins. is there.

  Further, in monitoring using a thermal diode, there is a problem that it is difficult to identify a defect of a specific probe pin or a defective part in a semiconductor chip. In addition, the inspection using the infrared imaging element relates to a test of a TAB tape that is sufficient with a relatively rough measurement, and there is a problem about how to apply this to a test device for an electronic device such as a semiconductor chip. It has not been solved.

  Therefore, an object of the present invention is to avoid a large current from flowing through a specific probe pin by a simple mechanism.

  From one aspect to be disclosed, a tester head, a performance board electrically connected to the tester head, a flock ring electrically connected to the performance board, and an electrical connection to the flock ring There is provided a test apparatus having a tester body having at least a probe card, and having a thermography for monitoring a temperature of a probe pin disposed on the probe card on the tester body side.

  From another point of view, a tester head, a performance board electrically connected to the tester head, a flock ring electrically connected to the performance board, and the flock ring electrically A test method using a test apparatus having a tester main body portion including at least a probe card to be connected, wherein the probe pin provided on the probe card is in contact with a test object for testing. There is provided a test method for monitoring the temperature of a pin by a thermography provided on the tester body side.

  According to the disclosed test apparatus and test method, it is possible to avoid a large current from flowing to a specific probe pin by a simple mechanism.

1 is a conceptual configuration diagram of a test apparatus according to an embodiment of the present invention. It is a notional block diagram of the measurement part of the test device of an embodiment of the invention. It is explanatory drawing of the testing apparatus of Example 1 of this invention. It is explanatory drawing during the test of a test apparatus. It is explanatory drawing of the thermography installation condition in a test apparatus. It is explanatory drawing of the evacuation state at the time of abnormality detection. It is a notional block diagram of the measurement part vicinity of the test apparatus of Example 2 of this invention. It is a notional block diagram of the conventional test apparatus. It is a notional block diagram of the measurement part of the conventional test apparatus.

  Here, with reference to FIG.1 and FIG.2, the test device of embodiment of this invention is demonstrated. FIG. 1 is a conceptual configuration diagram of a test apparatus according to an embodiment of the present invention. The tester 10 includes an external input unit 11 and a control unit 12, and the prober 20 includes a control unit 21, a measurement unit 30, and a thermography 40. It is comprised by. In addition, the tester body is provided with a data storage unit 50 that stores a database 51. In this database 51, temperature alarm values set in advance for each device to be measured are stored, and image data acquired by the thermography 40 is stored.

  An external input including test items is input to the external input unit 11 of the tester 10 and is transmitted to the control unit 21 on the prober 20 side via the control unit 12, and the test unit 30 such as a semiconductor chip is tested by the measurement unit 30.・ Measure. In addition, the test apparatus is provided with a retraction mechanism that retreats the test object from the measurement unit 30 when an abnormality occurs.

  At this time, a thermography 40 is provided in the vicinity of the measurement unit 30 to monitor the temperature of the probe pin in the measurement unit 30, and when the measured temperature exceeds a preset temperature alarm value, the test is stopped and the test object Is retracted from the measurement unit 30. The temperature alarm value in this case varies depending on the test object. For example, in a normal semiconductor integrated circuit device, if the temperature rises to about 300 ° C., the tip of the probe pin evaporates and is damaged. Set to ° C.

  FIG. 2 is a conceptual configuration diagram of the measurement unit of the test apparatus according to the embodiment of the present invention. The number of probe pins 34 corresponding to the number of pads of the test object 60 is provided on the probe card base 32 made of a printed wiring board. The implanted ceramic ring 33 is fixed and used as the probe card 31. On the back side of the probe card base 32, a pogo pad 35 that is electrically connected to the probe pin 34 is provided, and a frame-like stiffener 36 for increasing the strength is provided.

  Further, the thermography 40 is arranged so as to look at the central opening 37 of the stiffener 36, the entire temperature of the probe pin 34 is monitored, and an image is acquired when an abnormality occurs. When an abnormality occurs, for example, when the measured temperature exceeds a preset temperature alarm value, the acquired image is stored in the data storage unit 50 as the database 51. Alternatively, even when no abnormality occurs, it may be stored as real time data.

  In such an apparatus configuration, measurement is performed by passing a current from the power supply 22 where the limit is set to each probe pin 36 via the pogo pad 35. In this case, selection of the probe pin 33 through which a current flows is performed on a program.

  When the temperature measured by the thermography 40 exceeds a preset temperature alarm value, the information is input to the external input unit 11 of the tester 10 and the application of current is stopped by a command from the control unit 12. At the same time, the test object 60 is retracted from the probe card base 32.

  As a result, it is possible to easily detect a failure of the semiconductor device and a failure of the test environment by the mechanism, and it is possible to prevent damage to the semiconductor device and the probe pin due to the failure. In the development stage, the test apparatus and the semiconductor chip itself are not damaged, so that development delay can be prevented.

  Further, by storing the data at the time of occurrence of an abnormality in the database 51 as image data, it is possible to shorten the turn required for specifying the abnormal part in the semiconductor chip.

  When using a probe card with a plurality of pairs of probe tweezers to simultaneously measure a plurality of semiconductor chips provided on a semiconductor wafer, only one thermography is provided to support only one probe tweezers. Good.

  That is, adjacent semiconductor chips generally have the same manufacturing history, and if there is a defect in one semiconductor chip, there is also a defect in the adjacent semiconductor chip, so only one thermography is provided on the probe card. Just do it. Although thermography may be provided for each probe tweezer, the apparatus configuration is complicated and the cost is increased.

  Based on the above, the test apparatus according to the first embodiment of the present invention will be described next with reference to FIGS. 3 is an explanatory diagram of the test apparatus according to the first embodiment of the present invention, FIG. 3 (a) is a perspective view of the test apparatus according to the first embodiment of the present invention, and FIG. 3 (b) is a probe card. It is a perspective view which shows the attachment state of. As shown in the figure, the test apparatus 70 includes a prober main body 71 and a test head 72 attached to the prober main body 71 so as to be openable and closable.

  A performance board 74 is attached to the test head 72, and a contact pin (73) provided on the test head 72 contacts the performance board 74. On the other hand, the prober main body 71 is provided with a flock ring 76, the probe card 31 is mounted on the flock ring 76, and a contact pin (77) provided on the flock ring 76 contacts the probe card 31. The thermography 40 is disposed above the flock ring 76 and inside the flock ring 76 in a projective manner.

  A work unit 79 that can move in the xy directions is accommodated in the prober main body 71, and a work subunit 80 that includes a stage that can move in the z direction is provided on the work unit 79. ing. A semiconductor wafer 81, which is a test object, is placed on the stage, and the stage is raised in the z direction at the time of testing to bring the pad provided on the semiconductor wafer 81 into contact with the probe pin 34 provided on the probe card 31.

  FIG. 4 is an explanatory diagram during the test of the test apparatus, FIG. 4 (a) is a perspective view during the test, and FIG. 4 (b) is an explanatory diagram of a connection state of each member during the test. . As shown in FIG. 4A, when performing a test, the test head 72 is closed and the performance board 74 is brought into contact with the flock ring 76.

  As shown in FIG. 4B, during the test, the contact pin 73 provided on the test head 72 contacts the performance board 74, and the contact pin 75 provided on the performance board 74 contacts the flock ring 76. In addition, the contact pin 77 provided on the flock ring 76 contacts the probe card 31, and the probe pin 34 provided on the probe card 31 contacts the pad provided on the semiconductor wafer 81. An electrical signal from the tester 10 is input to the semiconductor wafer 81 through the above-described connection relation and measurement is performed.

  FIG. 5 is an explanatory diagram of a thermography installation state in the test apparatus, and shows a state during the test. A hollow cylindrical attachment member 41 having an L-shaped cross section is inserted into an opening 78 provided in the flock ring 76. In this case, the attachment member 41 is made of, for example, stainless steel, and an insulating material is inserted between them in order to be electrically insulated from the flock ring 76 (not shown).

  The thermography 40 is inserted into the attachment member 41 and fixed to the attachment member 41 using, for example, a screw member 42. The thermography 40 has a probe pin 34 via an opening 78 provided in the flock ring 76, an opening 37 provided in the stiffener 36, an opening provided in the probe card base 32, and an opening provided in the ceramic ring 33. Monitor the temperature.

  FIG. 6 is an explanatory diagram of a retracted state when an abnormality is detected. When the thermography 40 detects a temperature higher than a preset temperature alarm temperature, the supply of current from the power supply 22 is stopped, and the stage provided in the work subunit 80 is lowered, and the semiconductor wafer is removed from the probe card 31. 81 is retracted.

  As described above, in the first embodiment of the present invention, the thermography 40 is provided in the vicinity of the probe card 31 and the temperature of the probe pin 34 is monitored in real time. The supply can be stopped. As a result, the probe pin is not excessively heated and damaged, and a large current does not flow through the electrode pad on the semiconductor chip side.

FIG. 7 is a conceptual configuration diagram of the vicinity of the measurement unit of the test apparatus according to the second embodiment of the present invention, and here, it is shown as a probe card capable of measuring four simultaneously. As shown, the probe card base 32 four ceramic rings 33 _to 333 ₄ is provided with, so as to correspond to one of the ceramic ring 33 _one of which, thermography 40 is provided.

  As described above, even when a plurality of semiconductor chips are simultaneously measured, only one thermography 40 is provided. Even when a trouble occurs in the semiconductor chip or the measurement environment due to a simple device configuration, the probe pin is provided. The occurrence of damage can be reliably avoided. Although FIG. 7 shows an example of four simultaneous measurements, the thermography to be installed is 1 in the case of simultaneous measurement of other numbers such as two simultaneous, eight simultaneous, or sixteen simultaneous measurements. Only a piece is enough.

Here, the following supplementary notes are disclosed regarding the embodiment of the present invention including Example 1 and Example 2.
(Appendix 1)
A tester head, a performance board electrically connected to the tester head, a flock ring electrically connected to the performance board, and a probe card electrically connected to the flock ring A test apparatus having a tester body, wherein the tester has a thermography for monitoring a temperature of a probe pin disposed on the probe card on the tester body side.
(Appendix 2)
The test apparatus according to appendix 1, wherein the thermography is disposed at an upper portion of the flock ring and projected inside the flock ring.
(Appendix 3)
The test apparatus according to appendix 1 or appendix 2, which has a retracting mechanism for retracting the test object from the probe card when an abnormality is detected by the thermography.
(Appendix 4)
The test apparatus according to any one of supplementary notes 1 to 3, further comprising a data storage mechanism that stores data when abnormality is detected by the thermography as a database.
(Appendix 5)
The test apparatus according to appendix 4, wherein a temperature alarm value of a test object is stored in the data storage mechanism.
(Appendix 6)
The probe card has a plurality of probe tweezers capable of simultaneously measuring a plurality of objects to be measured, and any one of appendix 1 to appendix 5 in which the thermography is provided in only one probe tweezer of the probe tweezers. Or the test apparatus according to claim 1.
(Appendix 7)
A tester head, a performance board electrically connected to the tester head, a flock ring electrically connected to the performance board, and a probe card electrically connected to the flock ring A test method using a test apparatus having a tester body, wherein when the test is performed by bringing the probe pin provided on the probe card into contact with a test object, the temperature of the probe pin is set to the tester body side. Test method to monitor with the provided thermography.
(Appendix 8)
The test method according to appendix 7, wherein the test object is retracted from the probe card when the temperature detected by the thermography reaches a preset temperature alarm value.

DESCRIPTION OF SYMBOLS 10 Tester 11 External input part 12 Control part 20 Prober 21 Control part 22 Power supply 30 Measurement part 31 Probe card 32 Probe card base 33 Ceramic ring 34 Probe pin 35 Pogo pad 36 Stiffener 37 Opening part 40 Thermography 41 Attachment member 42 Screw member 50 Data storage Part 51 Database 60 Test object 70 Test apparatus 71 Prober main body 72 Test head 73, 75, 77 Contact pin 74 Performance board 76 Flock ring 78 Opening 79 Work unit 80 Work subunit 81 Semiconductor wafer

Claims (5)

A tester head, a performance board electrically connected to the tester head, a flock ring electrically connected to the performance board, and a probe card electrically connected to the flock ring A test apparatus having a tester body,
A test apparatus having a thermography for monitoring a temperature of a probe pin disposed on the probe card on the tester main body side.   The test apparatus according to claim 1, wherein the thermography is disposed on an upper portion of the flock ring and inside the flock ring in a projection manner.   The test apparatus according to claim 1, further comprising a retraction mechanism that retreats the test object from the probe card when an abnormality is detected by the thermography.   The probe card has a plurality of probe tweezers that allow a plurality of objects to be measured simultaneously, and the thermography is provided only in one probe tweezer of the probe tweezers. The test apparatus according to any one of the above. With a tester head,
A tester main body comprising at least a performance board electrically connected to the tester head, a flock ring electrically connected to the performance board, and a probe card electrically connected to the flock ring A test method using a test apparatus having
A test method for monitoring the temperature of the probe pin with a thermography provided on the tester body side when the test is performed with the probe pin provided on the probe card in contact with a test object.

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