CN111862019B - Intelligent detection and fault diagnosis method for thermoelectric and photoelectric soft multidimensional information fusion circuit - Google Patents
Intelligent detection and fault diagnosis method for thermoelectric and photoelectric soft multidimensional information fusion circuit Download PDFInfo
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Abstract
The invention discloses a method for intelligent detection and fault diagnosis of a thermoelectric light soft multidimensional information fusion circuit, which comprises the following steps: step one, establishing a standard plate model; step two, establishing a defect plate model; step three, comparing pixel differences; step four, positioning the defects; step five, failure analysis; sixthly, analyzing fault cause and effect logic; and seventhly, failure simulation verification. The invention has the characteristics of high testing speed, high sensitivity and accuracy, multiple fault types, reduced circuit board testing damage and quick and visual defect positioning. The method carries out high-precision thermal detection and analysis and pulse power-up excitation \ recurrence of faults on any hot spot in the circuit; the intelligent comparison pixel difference dynamic model can quickly perform fault location, failure analysis and fault guide and troubleshooting; the transparent image lamination technology can quickly and visually carry out positioning.
Description
Technical Field
The invention relates to an intelligent detection and fault diagnosis method for a thermoelectric light soft multidimensional information fusion circuit, in particular to an intelligent detection and fault diagnosis method for a thermoelectric light soft multidimensional information fusion circuit, which has the advantages of high test speed, high sensitivity and accuracy, multiple fault types identification, reduction of circuit board test damage, and rapid and visual defect positioning.
Background
Short circuits in circuit boards, semiconductors or MEMS devices are very difficult to troubleshoot. Existing test equipment can detect the presence of a short circuit, but it is often difficult to locate the specific location of the defect. Particularly local shorts and low resistance shorts, it takes a long time for a technician to locate a microscopic short by conventional electrical signal means.
Short circuits typically cause the zone temperature to rise. The temperature rise caused by high resistance short circuit (10 ohm or more) will exceed 1 ℃. The low resistance short circuit is very difficult to detect due to much less dissipated power and heat. For example, a 0.5 ohm short circuit may only experience a temperature rise of less than 0.2 c. The traditional means is difficult to detect quickly.
Disclosure of Invention
The invention aims to provide the intelligent detection and fault diagnosis method for the thermoelectric light soft multidimensional information fusion circuit, which has the advantages of high test speed, high sensitivity and accuracy, multiple fault types identification, reduction in circuit board test damage and rapid and visual defect positioning.
The purpose of the invention can be realized by the following technical scheme:
a thermoelectric light soft multidimensional information fusion circuit intelligent detection and fault diagnosis method comprises the following steps:
step one, establishing a standard plate model: manufacturing a good circuit board as a standard board, placing the standard board on a test machine, testing data of the standard board, and recording and manufacturing a standard board model by a computer;
the standard plate data test is driven by working current and working voltage, and a thermal imaging camera records a transparent circuit board thermal image of each pixel point temperature change rule on the standard plate to form a standard plate data model of the thermal image of the standard plate changing along with time;
step two, establishing a defect plate model: selecting a defective circuit board with the same specification type number as the standard board as a defective board, placing the defective board on a testing machine, testing data of the defective board, and recording and manufacturing a defective board model by a computer;
the defect plate data test is driven by working current and working voltage, and the thermal imaging camera records the transparent circuit board thermal image of each pixel point temperature change rule on the defect plate to form a defect plate data model of the defect plate thermal image changing along with time;
step three, comparing pixel differences: selecting a transparent image stack under the same driving time, overlapping and matching the thermal images of the transparent circuit board under the data model of the defect board and the data model of the standard board, and subtracting the thermal images of corresponding pixel points in the images to form a dynamic model of comparing pixel difference;
before comparing the pixel difference, carrying out algorithm pretreatment for eliminating the influence of the temperature change of the test environment on the thermal image of the defect plate data model and the standard plate data model, and then comparing the pixel difference;
step four, defect positioning: according to the difference degree of the pixel points of the compared pixel difference dynamic model, quickly positioning the defect position of the defect plate;
step five, failure analysis: locally amplifying the defect position of the defect plate, comparing the defect position with a thermal image of the pixel difference dynamic model and a local enlarged image of the corresponding position of the standard plate, and corresponding the pixel points one by one to quickly find out the defect plate at the defect position;
sixthly, fault cause and effect logic analysis: analyzing the abnormal condition caused by the defect position on the defect plate, and judging whether the abnormal condition of the defect position of the defect plate is consistent with a theoretical result caused by the defect; if the results are consistent, entering a seventh step; if the results are not consistent, analyzing the fifth step and the sixth step again;
seventhly, failure simulation verification: modifying the standard plate modeling model according to the abnormal reasons on the defect plate analyzed in the sixth step to obtain a defect plate modeling model; the method comprises the steps of performing fault thermal simulation and vibration failure simulation verification on a standard plate modeling model and a defect plate modeling model, and confirming that the result caused by the defect of the defect plate is the same as the measured result of the defect plate, so as to confirm the final defect reason of the defect plate;
the thermal imaging camera is used for imaging at 20 mu m, and the precision of the thermal imaging camera is 0.01 ℃;
the thermal imaging camera collects infrared long red waves of 7-14 micrometers;
when the thermoelectric temperature rise detected by the testing machine table is less than 0.01 ℃, an average value method is used for increasing the testing sensitivity and accuracy;
when the test machine drives the circuit board and the temperature rise caused by the short circuit of the circuit board exceeds a preset threshold value, the test machine automatically controls the relay protection device to stop supplying power;
when the comparison pixel model in the third step is smaller, the defect plate has tiny defects, and the test machine adopts a pulse accumulation algorithm to carry out fault excitation and recurrence on the defect plate;
the test machine table is provided with a contrast test troubleshooting probe;
before the test machine platform drives the test, the function test and the boundary scan test are carried out on the standard board, the defect board and the board to be tested.
The invention provides a method for intelligently detecting and diagnosing faults of a thermoelectric light soft multidimensional information fusion circuit, which has the characteristics of high testing speed, high sensitivity and accuracy, multiple fault types identification, reduction of circuit board testing damage and rapid and visual defect positioning. The invention has the beneficial effects that: the test machine platform adopts a thermal imaging camera for testing, and can diagnose, position and analyze microscopic failure of faults without analyzing and understanding a schematic diagram of a standard plate and a defect plate;
the tester is driven by working current and voltage, a thermosensitive imaging camera records, rapidly completes imaging test, establishes a standard plate data model and a defect plate data model, can complete the test within 10 seconds, and has high test speed;
comparing the pixel difference dynamic model to display the temperature change difference of the display circuit board or the device after power-on;
the pretreatment greatly improves the sensitivity and the accuracy of the dynamic model of the comparison pixel difference;
the method identifies various circuit faults and failure modes, such as short circuit, open circuit, leakage, capacitor breakdown, circuit damage, circuit degradation, device welding error, IC steady-state \ transient temperature change and the like; aiming at intermittent accidental faults of the BGA cold joint, nanosecond-level failure analysis and fault location can be carried out;
the precision of a test machine table applying the thermal imaging camera is high; the high-precision temperature sensing probe of the thermal imaging camera does not need welding, and can accurately monitor the temperature of key components in real time;
the thermal imaging camera for collecting 7-14 micron infrared long red waves is sensitive to the thermodes, so that the precision of a thermography is improved;
using an averaging method to increase test sensitivity and accuracy;
when the temperature rise caused by the short circuit of the circuit board exceeds a preset threshold value, the test machine automatically controls the relay protection device to stop supplying power, so that new damage to the circuit board is prevented;
the contrast test troubleshooting probe can carry out high-precision test on the packaging resistor, the capacitor, the inductor, the diode and the LED with the extremely small 01005 specification; the testing machine realizes high-precision testing on the positioning defect position of the defect plate by comparing a testing troubleshooting probe;
the method can detect very tiny temperature change and difference between the good boards and the defective boards, and the difference can hardly be found by other temperature measuring methods; the whole circuit board can be immediately subjected to non-contact inspection without considering the component density; thousands of detector pixel array units in the infrared detector are tested like virtual test probes, and single-point test and comparison can be carried out off line;
the method provides high-speed and high-precision detection and fault positioning capabilities by a noise reduction and image processing algorithm, an intelligent comparison method and a tiny fault excitation and reproduction means which are proprietary to circuit fault diagnosis and analysis, and can be applied to defect detection and fault positioning with the dissipation power less than 1mW and the temperature rise less than 0.01 ℃; the fault area can be positioned after testing for 10 seconds under normal conditions; meanwhile, the program-controlled relay protection device can realize accurate synchronization and safety protection of power-on and test of the tested circuit in the power-on process;
the method carries out high-precision thermal detection and analysis and pulse power-up excitation/fault recurrence on any hot spot in the circuit; the intelligent comparison pixel difference dynamic model can quickly perform fault location, failure analysis and fault guide and troubleshooting; the transparent image stacking technology can quickly and visually position;
the method adopts a test machine to drive a circuit board, and realizes fault zeroing, quick positioning and failure analysis through a high-precision thermal imaging camera; the method can also be used for detecting the authenticity, qualification and consistency of products entering and leaving a factory of the circuit board or the electric appliance, and the quality control; the intelligent manufacturing machine learning, artificial intelligence level, autonomous learning and judgment of slight thermal difference are improved; the method has the advantages of guiding thermal design, testing, verifying, optimizing, product type selection and helping to prolong the service life of the product.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
Fig. 1 is a frame diagram of an intelligent detection and fault diagnosis method for a thermoelectric light soft multidimensional information fusion circuit according to the present invention.
Detailed Description
The purpose of the invention can be realized by the following technical scheme:
a thermoelectric light soft multidimensional information fusion circuit intelligent detection and fault diagnosis method is disclosed, referring to FIG. 1, the method comprises the following steps:
step one, establishing a standard plate model: manufacturing a good circuit board as a standard board, placing the standard board on a testing machine, testing data of the standard board, and recording and manufacturing a standard board model by a computer;
the standard plate data test is driven by working current and working voltage, and a thermal imaging camera records a transparent circuit board thermal image of each pixel point temperature change rule on the standard plate to form a standard plate data model of the thermal image of the standard plate changing along with time;
step two, establishing a defect plate model: selecting a defective circuit board with the same specification type number as the standard board as a defective board, placing the defective board on a testing machine, testing data of the defective board, and recording and manufacturing a defective board model by a computer; the test machine platform adopts a thermal imaging camera for testing, and can diagnose, position and analyze microscopic failure of faults without analyzing and understanding a schematic diagram of a standard plate and a defect plate;
the defect plate data test is driven by working current and working voltage, and the thermal imaging camera records the transparent circuit board thermal image of each pixel point temperature change rule on the defect plate to form a defect plate data model of the defect plate thermal image changing along with time; the tester is driven by working current and voltage, a thermosensitive imaging camera records, rapidly completes imaging test, establishes a standard plate data model and a defect plate data model, can complete the test within 10 seconds, and has high test speed;
step three, comparing pixel differences: selecting the same driving time, overlapping transparent images, matching the thermal images of the transparent circuit board under the data model of the defect board and the data model of the standard board in a superposition manner, and subtracting the thermal images of corresponding pixel points in the images to form a dynamic model for comparing pixel differences; comparing the pixel difference dynamic model to display the temperature change difference of the display circuit board or the device after power-on;
before comparing the pixel difference, carrying out algorithm pretreatment for eliminating the influence of the temperature change of the test environment on the thermal image of the defect plate data model and the standard plate data model, and then comparing the pixel difference; the pretreatment greatly improves the sensitivity and the accuracy of the dynamic model of the comparison pixel difference;
step four, defect positioning: according to the difference degree of the pixel points of the compared pixel difference dynamic model, the defect position of the defect plate is quickly positioned;
step five, failure analysis: locally amplifying the defect position of the defect plate, comparing the defect position with a thermal image of the pixel difference dynamic model and a local enlarged image of the corresponding position of the standard plate, and corresponding the pixel points one by one to quickly find out the defect plate at the defect position;
sixthly, fault cause and effect logic analysis: analyzing the abnormal condition caused by the defect position on the defect plate, and judging whether the abnormal condition of the defect position of the defect plate is consistent with the theoretical result caused by the defect; if the results are consistent, entering a seventh step; if the results are not consistent, analyzing the fifth step and the sixth step again;
seventhly, failure simulation verification: modifying the standard plate modeling model according to the abnormal reasons on the defect plate analyzed in the sixth step to obtain a defect plate modeling model; the method comprises the steps of performing fault thermal simulation and vibration failure simulation verification on a standard plate modeling model and a defect plate modeling model, and confirming that the result caused by the defect of the defect plate is the same as the measured result of the defect plate, so as to confirm the final defect reason of the defect plate; the method identifies various circuit faults and failure modes, such as short circuit, open circuit, leakage, capacitor breakdown, circuit damage, circuit degradation, device welding error, IC steady-state \ transient temperature change and the like; aiming at intermittent accidental faults of the BGA cold solder joint, nanosecond failure analysis and fault positioning can be carried out;
the thermal imaging camera is used for imaging at 20 mu m, the precision of the thermal imaging camera is 0.01 ℃, and the precision of a test machine table using the thermal imaging camera is high; the high-precision temperature sensing probe of the thermal imaging camera does not need welding, and can accurately monitor the temperature of key components in real time;
the thermal imaging camera collects 7-14 micron infrared long red waves, and the thermal imaging camera collecting 7-14 micron infrared long red waves is sensitive to heat, so that the precision of a thermography is improved;
when the thermoelectric temperature rise detected by the testing machine table is less than 0.01 ℃, an average value method is used for increasing the testing sensitivity and accuracy;
when the test machine drives the circuit board and the temperature rise caused by the short circuit of the circuit board exceeds a preset threshold value, the test machine automatically controls the relay protection device to stop supplying power, so that new damage to the circuit board is prevented;
when the comparison pixel model in the third step is smaller, a testing machine platform carries out fault excitation and recurrence on the defect plate with a pulse accumulation algorithm to realize high-precision fault positioning for the small defect in the defect plate;
the test machine table is provided with a contrast test troubleshooting probe, and the contrast test troubleshooting probe can carry out high-precision test on the packaging resistor, the capacitor, the inductor, the diode and the LED with the extremely small 01005 specification; the test machine platform realizes high-precision test on the positioning defect position of the defect plate through a contrast test troubleshooting probe;
before the test machine platform drives the test, the function test and the boundary scan test are carried out on the standard board, the defect board and the board to be tested.
The working principle of the invention is as follows:
the testing machine platform adopts a thermal imaging camera for testing, and can diagnose, position and analyze microscopic failure without analyzing and understanding a schematic diagram of a standard plate and a defect plate;
the tester is driven by working current and voltage, a thermosensitive imaging camera records, rapidly completes imaging test, establishes a standard plate data model and a defect plate data model, can complete the test within 10 seconds, and has high test speed;
comparing the pixel difference dynamic model to display the temperature change difference of the display circuit board or the device after power-on;
the pretreatment greatly improves the sensitivity and the accuracy of the dynamic model of the comparison pixel difference;
the method identifies various circuit faults and failure modes, such as short circuit, open circuit, leakage, capacitor breakdown, circuit damage, circuit degradation, device welding error, IC steady-state \ transient temperature change and the like; aiming at intermittent accidental faults of the BGA cold joint, nanosecond-level failure analysis and fault location can be carried out;
the precision of a test machine table applying the thermal imaging camera is high; the high-precision temperature sensing probe of the thermal imaging camera does not need welding, and the temperature of key components is accurately monitored in real time;
the thermal imaging camera for collecting 7-14 micron infrared long red waves is sensitive to heat, so that the precision of a thermal image is improved;
using an averaging method to increase test sensitivity and accuracy;
when the temperature rise caused by the short circuit of the circuit board exceeds a preset threshold value, the test machine automatically controls the relay protection device to stop supplying power, so that new damage to the circuit board is prevented;
the contrast test troubleshooting probe can carry out high-precision test on the packaging resistor, the capacitor, the inductor, the diode and the LED with the extremely small 01005 specification; the test machine platform realizes high-precision test on the positioning defect position of the defect plate through a contrast test troubleshooting probe;
the method can detect very tiny temperature change and difference between the good boards and the defective boards, and the difference can hardly be found by other temperature measuring methods; the whole circuit board can be immediately subjected to non-contact inspection without considering the component density; thousands of detector pixel array units in the infrared detector are tested like virtual test probes, and single-point test and comparison can be carried out off line;
the method provides high-speed and high-precision detection and fault positioning capabilities by a noise reduction and image processing algorithm, an intelligent comparison method and a tiny fault excitation and reproduction means which are proprietary to circuit fault diagnosis and analysis, and can be applied to defect detection and fault positioning with the dissipation power less than 1mW and the temperature rise less than 0.01 ℃; the fault area can be positioned after testing for 10 seconds under normal conditions; meanwhile, the program-controlled relay protection device can realize accurate synchronization and safety protection of power-on and test of the tested circuit in the power-on process;
the method carries out high-precision thermal detection and analysis and pulse power-up excitation/fault recurrence on any hot spot in the circuit; the intelligent comparison pixel difference dynamic model can quickly perform fault location, failure analysis and guidance troubleshooting; the transparent image stacking technology can rapidly and visually carry out positioning;
the method adopts a test machine to drive a circuit board, and realizes fault zeroing, quick positioning and failure analysis through a high-precision thermal imaging camera; the method can also be used for detecting the authenticity, qualification and consistency of products entering and leaving a factory of the circuit board or the electric appliance, and the quality control; the intelligent manufacturing machine learning, artificial intelligence level, autonomous learning and judgment of slight thermal difference are improved; the method has the advantages of guiding thermal design, testing, verifying, optimizing, product type selection and helping to prolong the service life of the product.
The invention provides a method for intelligently detecting and diagnosing faults of a thermoelectric light soft multidimensional information fusion circuit, which has the characteristics of high testing speed, high sensitivity and accuracy, multiple fault types identification, reduction of circuit board testing damage and rapid and visual defect positioning. The invention has the beneficial effects that: the test machine platform adopts a thermal imaging camera for testing, and can diagnose, position and analyze microscopic failure of faults without analyzing and understanding a schematic diagram of a standard plate and a defect plate;
the tester is driven by working current and voltage, a thermosensitive imaging camera records, rapidly completes imaging test, establishes a standard plate data model and a defect plate data model, can complete the test within 10 seconds, and has high test speed;
comparing the pixel difference dynamic model to display the temperature change difference of the display circuit board or the device after power-on;
the pretreatment greatly improves the sensitivity and the accuracy of the dynamic model of the comparison pixel difference;
the method identifies various circuit faults and failure modes, such as short circuit, open circuit, electric leakage, capacitor breakdown, circuit damage, circuit degradation, device welding error, IC steady-state \ transient temperature change and the like; aiming at intermittent accidental faults of the BGA cold solder joint, nanosecond failure analysis and fault positioning can be carried out;
the precision of a test machine table applying the thermal imaging camera is high; the high-precision temperature sensing probe of the thermal imaging camera does not need welding, and can accurately monitor the temperature of key components in real time;
the thermal imaging camera for collecting 7-14 micron infrared long red waves is sensitive to the thermodes, so that the precision of a thermography is improved;
using an averaging method to increase test sensitivity and accuracy;
when the temperature rise caused by the short circuit of the circuit board exceeds a preset threshold value, the test machine automatically controls the relay protection device to stop supplying power, so that new damage to the circuit board is prevented;
the contrast test troubleshooting probe can carry out high-precision test on the packaging resistor, the capacitor, the inductor, the diode and the LED with the extremely small 01005 specification; the testing machine realizes high-precision testing on the positioning defect position of the defect plate by comparing a testing troubleshooting probe;
the method can detect very tiny temperature change and difference between the good boards and the defective boards, and the difference can hardly be found by other temperature measuring methods; the whole circuit board can be immediately subjected to non-contact inspection without considering the component density; thousands of detector pixel array units in the infrared detector are tested like virtual test probes, and single-point test and comparison can be carried out off line;
the method provides high-speed and high-precision detection and fault positioning capabilities by a noise reduction and image processing algorithm, an intelligent comparison method and a tiny fault excitation and reproduction means which are proprietary to circuit fault diagnosis and analysis, and can be applied to defect detection and fault positioning with the dissipation power less than 1mW and the temperature rise less than 0.01 ℃; the fault area can be positioned after testing for 10 seconds under normal conditions; meanwhile, the program-controlled relay protection device can realize accurate synchronization and safety protection of power-on and test of the tested circuit in the power-on process;
the method carries out high-precision thermal detection and analysis and pulse power-up excitation \ recurrence of faults on any hot spot in the circuit; the intelligent comparison pixel difference dynamic model can quickly perform fault location, failure analysis and fault guide and troubleshooting; the transparent image stacking technology can quickly and visually position;
the method adopts a test machine to drive a circuit board, and realizes fault zeroing, quick positioning and failure analysis through a high-precision thermal imaging camera; the method can also be used for detecting the authenticity, qualification and consistency of products entering and leaving a factory of the circuit board or the electric appliance, and the quality control; the intelligent manufacturing machine learning, artificial intelligence level, autonomous learning and judgment of slight thermal difference are improved; the method has the advantages of guiding thermal design, testing, verifying, optimizing, product type selection and helping to prolong the service life of the product.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the invention as defined in the following claims.
Claims (7)
1. A thermoelectricity soft multidimensional information fusion circuit intelligent detection and fault diagnosis method is characterized by comprising the following steps;
step one, establishing a standard plate model: manufacturing a good circuit board as a standard board, placing the standard board on a test machine, testing data of the standard board, and recording and manufacturing a standard board model by a computer;
the standard plate data test is driven by working current and working voltage, and a thermal imaging camera records a transparent circuit board thermal image of each pixel point temperature change rule on the standard plate to form a standard plate data model of the thermal image of the standard plate changing along with time;
step two, establishing a defect plate model: selecting a defective circuit board with the same specification type number as the standard board as a defective board, placing the defective board on a testing machine, testing data of the defective board, and recording and manufacturing a defective board model by a computer;
the defect plate data test is driven by working current and working voltage, and the thermal imaging camera records the transparent circuit board thermal image of each pixel point temperature change rule on the defect plate to form a defect plate data model of the defect plate thermal image changing along with time;
step three, comparing pixel differences: selecting the same driving time, overlapping transparent images, matching the thermal images of the transparent circuit board under the data model of the defect board and the data model of the standard board in a superposition manner, and subtracting the thermal images of corresponding pixel points in the images to form a dynamic model for comparing pixel differences;
before comparing the pixel difference, carrying out algorithm pretreatment for eliminating the influence of the temperature change of the test environment on the thermal image of the defect plate data model and the standard plate data model, and then comparing the pixel difference;
step four, defect positioning: according to the difference degree of the pixel points of the compared pixel difference dynamic model, quickly positioning the defect position of the defect plate;
step five, failure analysis: locally amplifying the defect position of the defect plate, comparing the defect position with a thermal image of the pixel difference dynamic model and a local enlarged image of the corresponding position of the standard plate, and corresponding the pixel points one by one to quickly find out the defect plate at the defect position;
sixthly, fault cause and effect logic analysis: analyzing the abnormal condition caused by the defect position on the defect plate, and judging whether the abnormal condition of the defect position of the defect plate is consistent with the theoretical result caused by the defect; if the results are consistent, entering a seventh step; if the results are not consistent, analyzing the fifth step and the sixth step again;
seventhly, failure simulation verification: modifying the standard plate modeling model according to the abnormal reasons on the defect plate analyzed in the sixth step to obtain a defect plate modeling model; and (3) carrying out fault thermal simulation and vibration failure simulation verification on the standard plate modeling model and the defect plate modeling model, and confirming that the result caused by the defect of the defect plate is the same as the measured result of the defect plate, thereby confirming the final defect reason of the defect plate.
2. The intelligent detection and fault diagnosis method for the thermoelectric light soft multidimensional information fusion circuit according to claim 1, wherein the thermal imaging camera images at 20 μm and has an accuracy of 0.01 ℃.
3. The intelligent detection and fault diagnosis method for the thermoelectric light soft multidimensional information fusion circuit according to claim 1, wherein the thermal imaging camera collects infrared long red waves of 7-14 microns.
4. The intelligent detection and fault diagnosis method for the thermoelectric and photoelectric soft multidimensional information fusion circuit according to claim 1, characterized in that when the thermoelectric temperature rise detected by the test machine is less than 0.01 ℃, an average value method is used to increase the test sensitivity and accuracy.
5. The intelligent detection and fault diagnosis method for the thermoelectric and photoelectric soft multidimensional information fusion circuit according to claim 1, wherein when the test machine drives the circuit board, and when the temperature rise caused by the short circuit of the circuit board exceeds a preset threshold, the test machine automatically controls the relay protection device to stop supplying power.
6. The intelligent detection and fault diagnosis method for the thermoelectric and photoelectric soft multidimensional information fusion circuit as claimed in claim 1, wherein the test machine is provided with a contrast test troubleshooting probe.
7. The intelligent detection and fault diagnosis method for the thermoelectric light soft multidimensional information fusion circuit according to claim 1, wherein before the test machine drives the test, a standard board, a defective board and a board to be tested are subjected to function test and boundary scan test.
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