CN102116818A - System and method for detecting electrical connection defect - Google Patents
System and method for detecting electrical connection defect Download PDFInfo
- Publication number
- CN102116818A CN102116818A CN2009102657568A CN200910265756A CN102116818A CN 102116818 A CN102116818 A CN 102116818A CN 2009102657568 A CN2009102657568 A CN 2009102657568A CN 200910265756 A CN200910265756 A CN 200910265756A CN 102116818 A CN102116818 A CN 102116818A
- Authority
- CN
- China
- Prior art keywords
- test
- detecting
- test pin
- signal
- electric connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The invention relates to a system and a method for detecting an electrical connection defect. The system for detecting the electrical connection defect is used for detecting whether electrical connection between a test pin of an element to be tested and a signal line of a circuit board is normal, and comprises a signal supply, a detection module, an electrode plate and a plurality of grounding paths, wherein the signal supply is used for providing a test signal to the test pin by using the signal line; the electrode plate is electrically connected to the detection module, and a detecting surface of the electrode plate is contacted with a surface, which is opposite to the test pin, of the element to be tested and is a distance away from the test pin so as to provide a test signal to the test pin on the signal supply; when the test pin is normally connected with the signal line, the detection module can detect inductive capacitance; and the grounding paths correspond to one of a plurality of non-test pin groups of the element to be tested so as to be grounded respectively. The invention also discloses the method for detecting the electrical connection defect.
Description
Technical field
The present invention relates to a kind of electric arrangement for detecting, particularly relate to a kind of electric connection flaw detecting system and method.
Background technology
Electronic installation provides many conveniences in modern's life, makes in the interchange and processing of information, and more convenient pipeline is fast arranged.Usually have many different chips or connector (connector) in the electronic installation, handle or transmit different data respectively, and after placing on the circuit board, the signal wire on chip pin and circuit board comes data is handled and exchanged, to reach user's demand.
Yet, pin in the above-mentioned module and the signal wire on the circuit board usually can because of welding technology bad cause electrically connecting undesired, thereby make the electronic installation can't normal operation.So, often need detect electric connection and whether have flaw by arrangement for detecting.Usually, the mode of detecting is the test pin that provides signal to the signal wire of test to be delivered to determinand again with probe, and is positioned over to detect on the chip whether can produce the electric capacity of induction according to the signal of test by a battery lead plate that is connected with detecting module.Other pins of not testing then need through ground connection, to avoid influencing the detecting result of test pin.Please refer to Fig. 1, is in the existing known techniques, treats the side view of examining system 1.Treat that examining system 1 comprises chip 10 to be measured, circuit board 12 and ground plane 14.Whether above-mentioned arrangement for detecting (not illustrating) promptly electrically connects normally in order to the pin (illustrating the semicircle for chip to be measured 10 belows) of detecting chip 10 to be measured and the signal wire 120 on the circuit board.In Fig. 1, if the pin that signal wire 120 connected that is illustrated is the pin of test, then ground plane 14 will provide other non-test pins a common grounding path, to avoid that the pin of test is caused interference.
So design when chip pin number is little, do not influence than having significantly, but the pin number is more and more big under the chip design that becomes complicated of healing, and will make the effect generation of many equivalent capacitys, resistance with the earthing mode of same grounding path.For instance, therefore the size of the resistance R 1 between the equivalent resistance of ground plane 14 possibility approximation signal line 120 and voltage feed end Vcc will make and the inductance capacitance that equivalent capacity that produces and battery lead plate produce coupling, influence the correctness of measurement.And because coupling effect and when being sent to the power pin (indicate Vcc place) of determinand by voltage feed end Vcc, then the inductance capacitance that it produced also can be measured and influenced measurement when the signal of test.
Therefore, how designing a new electric connection flaw detecting system, avoid above-mentioned effects test result, is an industry problem demanding prompt solution for this reason.
Summary of the invention
The objective of the invention is to, a kind of new electric connection flaw detecting system and method are provided, technical matters to be solved be make its reduce the long electricresistance effect of grounding path and with the coupling effect of power source supply end.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of electric connection flaw detecting system according to the present invention's proposition, whether normal in order to the electric connection between the signal wire of detecting test pin of element under test and circuit board, electrically connect the flaw detecting system and comprise: signal providers, detecting module, battery lead plate and a plurality of grounding path.Signal providers provides test signal to testing pin by signal wire.Battery lead plate is electrically connected at detecting module, comprise detecting face, test the element under test surface of pin relatively in order to the contact measured element, and with test pin spacing distance, to provide test signal in signal providers to testing pin, and the test pin is connected just often with signal wire, and making detecting module detect inductance capacitance is greater than a critical value.Grounding path respectively corresponding element under test a plurality of non-test pin group one of them so that corresponding non-test pin group ground connection.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid electric connection flaw detecting system, wherein grounding path also is connected to grounding switch, and when grounding switch cuts out ground connection.
Aforesaid electric connection flaw detecting system wherein electrically connects the flaw detecting system and also comprises supply module, and non-test pin group respectively comprises a non-test pin, and supply module is to provide earthing potential to each non-test pin by each grounding path.
Aforesaid electric connection flaw detecting system, wherein signal providers comprises probe and signal provision source, so that probe activation signal line further provides test signal to testing pin by the signal provision source.
Aforesaid electric connection flaw detecting system wherein provides test signal to testing pin when signal providers, and test pin and signal wire malunion are often, and it is less than critical value that detecting module detects inductance capacitance.
Aforesaid electric connection flaw detecting system, wherein detecting module is also in order to electric current and the voltage of detecting according to the inductance capacitance generation.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of electric connection flaw method for detecting according to the present invention's proposition, whether normal in order to the electric connection between the signal wire of detecting test pin of element under test and circuit board, electrically connect the flaw method for detecting and comprise the following step: a plurality of non-test pin of distinguishing element under test is an a plurality of non-test pin group; Make non-test pin group respectively by grounding path ground connection; Provide test signal to testing pin by signal wire; Make the detecting face contact measured element of battery lead plate test the element under test surface of pin relatively, and with a test pin distance at interval; And ought be connected just often with signal wire by the test pin, detecting inductance capacitance is greater than a critical value.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid electric connection flaw method for detecting, wherein grounding path also is connected to grounding switch, and when grounding switch cuts out ground connection.
Aforesaid electric connection flaw method for detecting, it also comprises supply module, and non-test pin group respectively comprises a non-test pin, and supply module system provides earthing potential to each non-test pin by each grounding path.
Aforesaid electric connection flaw method for detecting, wherein test signal is that probe by signal providers provides to the test pin.
Aforesaid electric connection flaw method for detecting, wherein when testing pin and signal wire malunion often, detecting inductance capacitance is less than critical value.
By technique scheme, the present invention electrically connects the flaw detecting system and method has following advantage and beneficial effect at least: the present invention is not divided into a plurality of groups by will testing pin, with respectively by different grounding paths, reduce the long electricresistance effect of grounding path, and reach above-mentioned purpose easily.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is in the existing known techniques, treats the side view of examining system.
Fig. 2 is the side view that the present invention electrically connects flaw detecting system one embodiment.
Fig. 3 A is that the present invention electrically connects among another embodiment of flaw detecting system, and each grounding path is connected to the side view of grounding switch after parallel connection.
Fig. 3 B is that the present invention electrically connects among another embodiment of flaw detecting system, and grounding path is connected to the side view of supply module after parallel connection.
Fig. 4 is the process flow diagram that the present invention electrically connects flaw method for detecting one embodiment.
1: treat examining system 12: circuit board
14: ground plane 20: element under test
210,212,214,216: grounding path 23: grounding switch
25: supply module 260: amplifier
280: probe 282: the signal provision source
10: chip 120 to be measured: signal wire
2: electrically connect flaw detecting system 200: the element under test surface
22: circuit board 220: signal wire
24: detecting module 26: battery lead plate
262: positive and negative sense terminal 281: test signal
401-407: step
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to electric connection flaw detecting system and its embodiment of method, structure, step, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Please refer to shown in Figure 2ly, is the side view that the present invention electrically connects flaw detecting system one embodiment.Whether the electric connection flaw detecting system 2 of one embodiment of the invention is normal in order to the electric connection of 220 of the signal wires of detecting pin to be measured of element under test 20 and circuit board 22.Element under test 20 can be chip or the connector on the circuit board 22, does electric connection with the most pins (being to illustrate with a plurality of semicircles that are positioned at 22 of element under test 20 and circuit boards in Fig. 2) and the signal wire 220 of circuit board 22.
When element under test 20 and circuit board 22 were done electric connection, normal need pin being done with signal wire 220 in the mode of welding was connected.Yet it is undesired that welding technology bad will cause electrically connecting, thereby make the two can't normal operation.So, often need detect electric connection and whether have flaw by the device of detecting.
The electric connection flaw detecting system 2 of one embodiment of the invention comprises: signal providers, detecting module 24 and battery lead plate 26.Signal providers comprises probe 280 and signal provision source 282 in fact.Signal provision source 282 is in order to test signal 281 to be provided, and behind probe 280 activation signal lines 220, test signal 281 is sent to pin to be measured by signal wire 220, other pin in fact then with ground connection to avoid influencing the detecting result of the pin of measuring to be measured.
In Fig. 2, probe 280 is activation signal lines 220, so the pin that connected of signal wire 220 is the test pin, other then be non-test pin.Non-test pin is to divide into a plurality of non-test pin group.Wherein each non-test pin group all corresponds to a grounding path 210,212,214 and 216, to come ground connection by this corresponding grounding path.
In one embodiment, as shown in Figure 3A, each grounding path is more to be connected to a grounding switch 23 after parallel connection, comes by ground connection when grounding switch 23 cuts out.Therefore, the mode of these grounding paths in parallel not only can not increase the effect of its resistance, the equivalent resistance of these other grounding paths is more descended after parallel connection, and reduce its influence to battery lead plate 26 significantly.Be noted that the number of grounding path and corresponding non-test pin group is that visual different situation is adjusted, and the embodiment that is not illustrated by Fig. 2 or Fig. 3 A is limit.
In another embodiment, shown in Fig. 3 B, electrically connect flaw detecting system 2 and also comprise supply module 25.In fact, supply module 25 uses when being used to carry out electrical testing usually, so that all pin power supply or earthing potentials to be provided.In the present embodiment, each non-test pin itself is a non-test pin group, and each non-test pin is a grounding path with being connected of 25 of supply modules.Therefore, supply module 25 provides earthing potential by each grounding path to all non-test pins, can reach the effect of ground connection respectively, avoids the equivalent resistance influence that is only caused by a grounding path ground connection.
Please refer to Fig. 4, is the process flow diagram that the present invention electrically connects flaw method for detecting one embodiment.Whether the electric connection flaw method for detecting of the embodiment of the invention can be applicable to the electric connection flaw detecting system 2 that illustrates as Fig. 2, normal with the electric connection of 220 of the signal wires of the test pin of detecting element under test 20 and circuit board 22.The electric connection flaw method for detecting of the embodiment of the invention comprises the following step: in step 401, a plurality of non-test pin of distinguishing element under test 20 is an a plurality of non-test pin group.In step 402, make non-test pin group respectively by grounding path 210,212,214 and 216 ground connection.Then, provide test signal 281 to the test pin by signal wire 220 in step 403.In step 404, the detecting face contact measured element 20 that makes battery lead plate 26 is the element under test surfaces 200 of test pins relatively, and with a test pin distance at interval.And in step 405, detecting module 24 judges whether to detect inductance capacitance greater than a critical value.When detecting inductance capacitance greater than critical value, carry out step 406, confirm that the test pin is connected normally with signal wire 220.When detecting inductance capacitance less than critical value, carry out step 407, confirm that test pin and signal wire 220 malunions are normal.
Table 1 is among the embodiment, utilizes ground plane to carry out the earthing mode of single-pathway and utilize the invention provides between the earthing mode in multiple earth path, and the test pin is connected with signal wire normally and when undesired, the comparison of the amount side value of electric capacity.Wherein, CLK represents the ground plane equivalent capacity, and CDUT represents the inductance capacitance between battery lead plate 26 and test pin, the capacitance that on behalf of detecting module 24, CDUT+CLK then detected.
Table 1
| CDUT+CLK | ?CLK | Gap | The detecting result | |
| (connecting normal) | (malunion is normal) | |||
| Single-pathway | 408fF | 320fF | -22.6％ | By |
| Multi-path | 125fF | 40fF | -68％ | Do not pass through |
In the present embodiment, with the gap of a standard value-40% as being connected the normal criterion of judging.Generally under normal detecting situation, if test pin and signal wire malunion are normal, battery lead plate 26 will can not produce inductance capacitance with pin, and only can detect negligible minimum capacitance.But as shown in Table 1, the earthing mode of single-pathway is under the influence that is subjected to equivalent resistance, make the inductance capacitance that the coupling effect of equivalent capacity that equivalent resistance causes and power source supply end produces, testing pin and signal wire malunion often, still make the capacitance measure higher many and fall within-22.6% of standard value, it is normal and by testing that the detecting result will judge into test pin and being connected of signal wire.But when use multi-path of the present invention comes ground connection, the capacitance values that malunion is often measured will fall within-68% of standard value, much smaller than the former, can't successfully detect the pin with defective by test and will be judged as.
By the above embodiments and experimental data as can be known, the advantage of using this disclosure is not to be divided into a plurality of groups by will testing pin, with respectively by different grounding paths, reduce the long electricresistance effect of grounding path and with the coupling effect of power source supply end.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (12)
1. whether one kind electrically connects the flaw detecting system, normal in order to the electric connection between a signal wire of a test pin of detecting an element under test and a circuit board, it is characterized in that this electric connection flaw detecting system comprises:
One signal providers provides a test signal to test pin to this by this signal wire;
One detecting module;
One battery lead plate, be electrically connected at this detecting module, comprise a detecting face, in order to contact this element under test element under test surface of this test pin relatively, with this test pin interval one distance, providing this test signal to test pin, and should be connected just often with this signal wire by test pin, make this detecting module detect an inductance capacitance greater than a critical value to this in this signal providers; And
A plurality of grounding paths, respectively to a plurality of non-test pin group that should element under test one of them so that non-test pin group ground connection that should correspondence.
2. electric connection flaw detecting system according to claim 1 is characterized in that wherein said a plurality of grounding path also is connected to a grounding switch, ground connection when this grounding switch cuts out.
3. electric connection flaw detecting system according to claim 1, it is characterized in that it also comprises a supply module, and those non-test pin groups respectively comprise a non-test pin, and this supply module provides an earthing potential to this non-test pin respectively by each those grounding path.
4. electric connection flaw detecting system according to claim 1, it is characterized in that wherein said signal providers comprises a probe and a signal provision source, so that this probe contacts this signal wire, further provide this test signal to test pin to this by this signal provision source.
5. electric connection flaw detecting system according to claim 1, it is characterized in that wherein said signal providers provides this test signal to test pin to this, and should test pin and this signal wire malunion often, this detecting module detects this inductance capacitance less than this critical value.
6. electric connection flaw detecting system according to claim 1 is characterized in that the electric current that wherein said detecting module also produces according to this inductance capacitance in order to detecting.
7. electric connection flaw detecting system according to claim 1 is characterized in that the voltage that wherein said detecting module also produces according to this inductance capacitance in order to detecting.
8. whether one kind electrically connects the flaw method for detecting, normal in order to the electric connection between a signal wire of a test pin of detecting an element under test and a circuit board, it is characterized in that this electric connection flaw method for detecting comprises the following step:
The a plurality of non-test pin of distinguishing this element under test is an a plurality of non-test pin group;
Make those non-test pin groups respectively by a grounding path ground connection;
Provide a test signal to test pin by this signal wire to this;
Make a detecting face of a battery lead plate contact this element under test element under test surface of this test pin relatively, and test pin distance at interval with this; And
When this test pin is connected just often with this signal wire, detect an inductance capacitance greater than a critical value.
9. electric connection flaw method for detecting according to claim 8 is characterized in that wherein said grounding path also is connected to a grounding switch, ground connection when this grounding switch cuts out.
10. electric connection flaw method for detecting according to claim 8, it is characterized in that wherein said non-test pin group respectively comprises a non-test pin, each those grounding path is to be connected to a supply module, and this supply module provides extremely respectively this non-test pin of an earthing potential by each those grounding path.
11. electric connection flaw method for detecting according to claim 8 is characterized in that wherein said test signal provides to this test pin by a probe of a signal providers.
12. electric connection flaw method for detecting according to claim 8 is characterized in that wherein said test pin and this signal wire malunion often, is to detect this inductance capacitance less than this critical value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910265756 CN102116818B (en) | 2009-12-31 | 2009-12-31 | System and method for detecting electrical connection defect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910265756 CN102116818B (en) | 2009-12-31 | 2009-12-31 | System and method for detecting electrical connection defect |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102116818A true CN102116818A (en) | 2011-07-06 |
| CN102116818B CN102116818B (en) | 2013-05-29 |
Family
ID=44215678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910265756 Active CN102116818B (en) | 2009-12-31 | 2009-12-31 | System and method for detecting electrical connection defect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102116818B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103837766A (en) * | 2013-10-30 | 2014-06-04 | 惠阳东美音响制品有限公司 | Method for automatically searching for contacts for connecting electronic components |
| CN104569709A (en) * | 2013-10-22 | 2015-04-29 | 珠海格力电器股份有限公司 | Detection device and system for pole plate component |
| CN105378491A (en) * | 2013-05-10 | 2016-03-02 | 雷比诺动力系统公司 | Electrical connection member for detecting discontinuities in an electrical network |
| CN112714664A (en) * | 2019-02-27 | 2021-04-27 | 深圳迈瑞生物医疗电子股份有限公司 | Defibrillator and electrode slice |
-
2009
- 2009-12-31 CN CN 200910265756 patent/CN102116818B/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105378491A (en) * | 2013-05-10 | 2016-03-02 | 雷比诺动力系统公司 | Electrical connection member for detecting discontinuities in an electrical network |
| CN105378491B (en) * | 2013-05-10 | 2019-05-31 | 雷比诺动力系统公司 | For detecting the electric connector of the breakpoint in power grid |
| CN104569709A (en) * | 2013-10-22 | 2015-04-29 | 珠海格力电器股份有限公司 | Detection device and system for pole plate component |
| CN104569709B (en) * | 2013-10-22 | 2017-08-01 | 珠海格力电器股份有限公司 | Detection device and system for pole plate component |
| CN103837766A (en) * | 2013-10-30 | 2014-06-04 | 惠阳东美音响制品有限公司 | Method for automatically searching for contacts for connecting electronic components |
| CN103837766B (en) * | 2013-10-30 | 2019-06-11 | 惠阳东美音响制品有限公司 | A kind of method for automatically searching for the contact connecting electronic building brick |
| CN112714664A (en) * | 2019-02-27 | 2021-04-27 | 深圳迈瑞生物医疗电子股份有限公司 | Defibrillator and electrode slice |
| CN112714664B (en) * | 2019-02-27 | 2024-06-11 | 深圳迈瑞生物医疗电子股份有限公司 | Defibrillator and electrode sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102116818B (en) | 2013-05-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04309875A (en) | In-circuit tester | |
| CN103207366A (en) | Test system and test method of printed circuit board assembly | |
| CN1851488A (en) | Method and apparatus for detecting shorts on inaccessible pins using capacitive measurements | |
| CN102116818B (en) | System and method for detecting electrical connection defect | |
| CN101408583B (en) | Method and device for detecting inserting state between printed circuit boards and printed circuit boards | |
| JP2009085720A (en) | Probe card, and inspection device for semiconductor wafer using the same | |
| CN110675737A (en) | Pixel driving circuit and display panel | |
| CN101661078A (en) | Circuit board and testing device thereof | |
| CN110007215B (en) | Open-circuit short-circuit electrical testing method for FPC | |
| TWI383160B (en) | Electrical connection defect detection system and method | |
| CN113866589A (en) | Chip testing device and chip testing method | |
| US8324908B2 (en) | Electrical connection defect detection device | |
| CN101644733A (en) | Fixture for testing precise printed circuit board | |
| US20120217977A1 (en) | Test apparatus for pci-e signals | |
| CN110907776B (en) | Contact detection method for voltage withstand test probe of transformer | |
| CN102116817B (en) | Electrical connection defect detection device | |
| CN113030703A (en) | Testing arrangement of two interface smart card modules open short circuit | |
| TW529110B (en) | Film carrier tape and method of evaluating the same | |
| US7795891B2 (en) | Tester with low signal attenuation | |
| CN110376511A (en) | Test the golden finger of minimum spacing and contact chip | |
| CN101769979A (en) | Connector test fixture | |
| CN101726683A (en) | Detection apparatus and method therefor | |
| CN210572606U (en) | Short circuit tester for memory strip VREF circuit | |
| CN209247969U (en) | Plugboard and wafer test equipment | |
| TW201310559A (en) | Testing method for stacked semiconductor device structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |