CN108490334A - Chip pin welds detection method and detection device - Google Patents
Chip pin welds detection method and detection device Download PDFInfo
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- CN108490334A CN108490334A CN201810195929.2A CN201810195929A CN108490334A CN 108490334 A CN108490334 A CN 108490334A CN 201810195929 A CN201810195929 A CN 201810195929A CN 108490334 A CN108490334 A CN 108490334A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a kind of chip pins to weld detection method, includes the following steps：Chip to be measured is welded on circuit board, chooses the functional leads of chip to be measured as tested pin；High level is continuously applied to tested pin, acquires the level data for being tested pin；When low level occurs in tested pin, it is abnormal to judge that the welding for being tested pin exists.The detection method needs the situation of quick screening chip pin abnormal welding especially suitable for some as a kind of preliminary screening mode.As long as there is low level in tested pin, you can judgement is tested the abnormal welding of pin, can quickly investigate out the circuit board of cisco unity malfunction.
Description
Technical field
The present invention relates to a kind of chip pins to weld detection method, while being related to realizing the detection dress of the welding detection method
It sets, belongs to chip package technical field of measurement and test.
Background technology
Chip refers to the silicon chip for including integrated circuit, volume very little, often one of computer or other electronic equipments
Point.It is most important part in electronic equipment, carries the functions such as operation, storage.
For electronic product, chip be all by its pin welding on circuit boards, with realize its operation, control,
The functions such as storage, if welding is unsuccessful to lead to its functional lability.For different chips, since its function and pin are set
The difference set, detection method are also different.For example, in the Chinese invention patent of Patent No. ZL 201510630984.6, it is open
A kind of wafer chip size package microcontroller pin welds detection method, including test microcontroller and host computer, is tested microcontroller
Pin to be measured is connect with the respective pins of test microcontroller, is included the following steps：1) to tested microcontroller and/or test microcontroller
Burning firmware file；2) each pin for being tested microcontroller continuously transmits low and high level data；3) acquisition of test microcontroller is tested single
Each pin data of piece machine simultaneously stores；4) judge each pin data for high level or low level；5) continuous n times are counted to read
Cheng Zhong counts the quantity being tested when each pin data of microcontroller is respectively high level or low level；6) according to count results
Judge whether each pin for being tested microcontroller welds normally.The detection process that the pin welds detection method is fairly simple, is not necessarily to
It, can be to avoid a series of problems of X-ray machine using X-ray machine.
But above-mentioned pin welding detection method is essentially Probability Detection, accuracy rate is not very high.For example, when each
When the low and high level testing result of pin is within the scope of rational probability interval, it just can determine that welding is normal.Judge result foundation
A large amount of historical data is determined probability interval, as long as and low and high level testing result appear in probability interval,
Even if since Welding Problems cause not judging if level detection mistake.
Invention content
In view of the deficiencies of the prior art, primary technical problem to be solved by this invention is to provide a kind of chip pin weldering
Connect detection method；
Another technical problem to be solved by this invention provides a kind of chip pin welding detection device.
For achieving the above object, the present invention uses following technical solutions：
According to a first aspect of the embodiments of the present invention, a kind of chip pin welding detection method is provided, is included the following steps：
Chip to be measured is welded on circuit board, chooses the functional leads of chip to be measured as tested pin；
High level is continuously applied to tested pin, acquires the level data for being tested pin；
When low level occurs in tested pin, it is abnormal to judge that the welding of the tested pin exists.
Wherein more preferably, the functional leads of chip to be measured are chosen as pin is tested, further comprise following steps：
Choose all functionalities pin of the chip to be measured；
According to the chip to be measured and the installation scenarios of the circuit board of welding, functional leads are attached after the completion of judging welding
The quantity of near-earth line；All functionalities pin is ranked up according to the quantity of ground wire near the functional leads；
Using the most functional leads of neighbouring ground wire as tested pin.
Wherein more preferably, the tested pin includes multiple functional leads of chip under test.
Wherein more preferably, when tested pin is multiple functional leads of chip to be measured, to multiple on same circuit
Tested pin is carried out at the same time detection.
Wherein more preferably, when multiple chips to be measured are detected simultaneously, include the following steps：
Each chip to be measured is welded on same circuit board；
Functional leads are chosen from each chip to be measured as tested pin；
High level is continuously applied to each tested pin respectively, the level data of pin is tested described in continuous collecting；
When low level occurs in the tested pin, there are different for the chip welding of the low level tested pin of judgement appearance
Often.
Wherein more preferably, the chip to be measured is TS8000 chips.
Wherein more preferably, it is CLK pin to be tested pin.
Wherein more preferably, TS8000 chips are welded on circuit board, choose the CLK pin conduct of the TS8000 chips
Tested pin；
Default high voltage is continuously applied to the CLK pin, acquires the level data of the CLK pin；
When the CLK pin occurs being less than the level of default qualified voltage, judging the welding of the CLK pin, there are different
Often.
According to a second aspect of the embodiments of the present invention, a kind of chip pin welding detection device is provided, for realizing above-mentioned
Chip pin weld detection method, including circuit board module, level acquisition module, voltage provide module and judgment module；
Wherein, chip to be measured is welded on the circuit board module；
The voltage provides module for being continuously applied high level to the tested pin of the chip to be measured；
The level acquisition module is used for direct-connected with tested pin, acquires the level data for being tested pin, and by acquisition
Level data is sent to the judgment module；
The judgment module is used to receive the level data of level acquisition module transmission, and according to the level data, sentences
Surely the welding of tested pin is with the presence or absence of abnormal.
Wherein more preferably, the tested pin of the chip to be measured is the work(for the chip to be measured chosen according to welding situation
It can property pin.
Chip pin provided by the present invention welds detection method, by the way that chip to be measured to be welded on circuit board, chooses
The functional leads of chip to be measured are as tested pin.Then, high level is continuously applied to tested pin, continuous collecting is tested to draw
The level data of foot judges the abnormal welding for being tested pin when there is low level.The detection method is as a kind of preliminary screening
Mode is particularly suitable for some situations for needing quick screening chip pin abnormal welding.As long as there is low level in tested pin,
It can determine that the abnormal welding of tested pin, can quickly investigate out the circuit board of cisco unity malfunction.
Description of the drawings
Fig. 1 is the flow chart that chip pin provided by the present invention welds detection method；
Fig. 2 is that chip pin provided by the present invention welds in detection method, the work that multiple chips to be measured detect simultaneously
Principle schematic.
Specific implementation mode
Detailed specific description is carried out to the technology contents of the present invention in the following with reference to the drawings and specific embodiments.
As shown in Figure 1, chip pin provided by the present invention welds detection method, include the following steps：It first, will be to be measured
Chip is welded on circuit board, chooses the functional leads of chip to be measured as tested pin；Secondly, tested pin is persistently applied
Increase level, continuous collecting is tested the level data of pin；Finally, when low level occurs in tested pin, judge to be tested pin
Welding exist it is abnormal.Detailed specific description is done to this process below.
Chip to be measured is welded on circuit board by S1, chooses the functional leads of chip to be measured as tested pin.
The functional leads of chip to be measured are chosen as pin is tested, the functional leads chosen at this time can be core to be measured
Arbitrary functional leads of the on piece other than GND pin (i.e. grounding pin).
In embodiment provided by the present invention, the functional leads of chip to be measured are chosen as pin is tested, can be wrapped
Include following steps：
S11 chooses all functionalities pin of chip to be measured；
S12, according to chip to be measured and the installation scenarios of the circuit board of welding, functional leads are attached after the completion of judging welding
The quantity of near-earth line；All functionalities pin is ranked up according to the quantity of ground wire near functional leads after the completion of welding；
S13, using the most functional leads of neighbouring ground wire as tested pin.
In embodiment provided by the present invention, if the functional leads weldering of chip to be measured is askew, it is easy to be shorted to it
The GND pin on side, that is, be grounded.The level of functional leads after ground connection may be raised.So for
When chip pin welding is detected, high level is applied to any functional leads (other than GND pin), if it is not
Can be raised all be short-circuited as a result, unless circuit board be just designed to this pin ground connection, be otherwise exactly weld it is abnormal.Institute
With based on above-mentioned judgement thinking, as long as detecting low level, you can preliminary judgement be tested pin welding exist it is abnormal, from
And quickly and efficiently detection circuit board solder yield.In an embodiment of the present invention, the quantity for choosing ground wire nearby is most
Functional leads can further increase the possibility for detecting chip pin solder failure as pin to be measured.
After the functional leads for choosing chip to be measured are as pin is tested, level acquisition module and tested pin are straight
Even, the level signal for acquiring tested pin.Here level acquisition module can arbitrarily acquire level signal
Electromagnetic measurement device, such as oscillograph or microcontroller etc., just do not specifically illustrate herein.In implementation provided by the present invention
In example, level acquisition module is direct-connected by detecting pin and tested pin, and level acquisition module is made only to need to acquire drawing for itself
Foot level signal, that is, what is acquired is the level signal for the tested pin being connected with the detection pin.
S2 is continuously applied high level to tested pin, and continuous collecting is tested the level data of pin.
High level is continuously applied to tested pin, if tested pin welding is normal, the quilt of level acquisition module acquisition
High level should be continuously by surveying the level data of pin.The level data of acquisition is stored or is uploaded directly by level acquisition module
Position machine is judged.
S3, when low level occurs in tested pin, there is exception in the chip welding that preliminary judgement is tested pin.
Level data reading device reads the level data of tested pin from level acquisition module, provided by the present invention
Embodiment in, level data reading device is illustrated by taking host computer as an example.The host computer is read from level acquisition module
Take the level data of tested pin.It is preceding to have addressed, if tested pin welding is normal, tested the drawing of level acquisition module acquisition
The level data of foot should be continuously high level.When low level occurs in the level data for the tested pin that level acquisition module is acquired
When, there is exception in the welding that pin can be tested with preliminary judgement.
In embodiment provided by the present invention, when being continuously applied high level to tested pin, set according to use demand
Time threshold detects the level data for being tested pin in time threshold, when the level data for being tested pin in time threshold is equal
For high level when, judge be tested pin welding it is normal.This method can fast and effeciently to the welding situation of chip pin into
Row detection, is particularly suitable for some situations for needing quick screening chip pin abnormal welding.In addition to this, using institute of the present invention
The chip pin of offer welds detection method, as long as low level occurs in tested pin, you can preliminary judgement is tested the welding of pin
There are exceptions.
In one embodiment provided by the present invention, according to practical application scene demand, chip to be measured can also be chosen
Multiple functional leads as be tested pin be detected, the verification and measurement ratio of chip pin normal weld can be improved in this way.When
When tested pin is multiple functional leads of chip to be measured, the welding for being tested pin detects, can be one by one to each quilt
It surveys pin and carries out welding detection, detection can also be carried out at the same time to multiple tested pins on same circuit.
In another embodiment provided by the present invention, this chip pin welds detection method and is suitable for multiple cores to be measured
Piece situation detected simultaneously.When multiple chips to be measured are detected simultaneously, include the following steps：
Each chip to be measured is welded on a circuit board；
Functional leads are chosen from each chip to be measured as tested pin；
Each of level acquisition module detects pin and connects one to one with each tested pin；
High level is continuously applied to each tested pin respectively, the acquisition of level acquisition module is tested the level data of pin；
Host computer reads the level data of each tested pin from level acquisition module；When there is low level, judgement
There is the corresponding chip pin abnormal welding of low level tested pin.
Chip pin provided by the present invention welds detection method, first by the detection pin of level acquisition module and selection
Chip to be measured functional leads it is direct-connected, high level is continuously applied to the functional leads of selection, need to only detect and be acquired
The level signal of the functional leads for the chip to be measured chosen, when the level signal of the functional leads of the chip to be measured of selection goes out
When existing low level, you can preliminary judgement welding exists abnormal.This method, which can quickly investigate out some, pin abnormal welding
Situation is particularly suitable for some situations for needing quick screening chip pin abnormal welding.
It should be noted that the detection method is screened for rapid preliminary, it is therefore intended that the abnormal work of quick locating circuit board
Whether the reason of making generates in welding link, by the circuit board of this detection it is not intended that can work normally.But work as this
When detection is abnormal, the circuit board of cisco unity malfunction can be quickly investigated out.
Below with a specific embodiment, detailed specific description is carried out to said chip pin welding detection method.
TS8000 chips are a chips for handling ultrasonic signal of Triad companies production, for the chip
Dedicated test method gives disclosure as the prior art not yet.Now by taking TS8000 chips as an example, the chip pin is illustrated
Weld detection method.
If the unsuccessful of TS8000 chips welding can lead to its functional lability, find to work as one of those by experiment
When functional leads welding is unqualified, by taking CLK pin as an example, the CLK pin in communications pins can not be raised, therefore be detected
Whether TS8000, which is welded successfully, only needs to draw high CLK pin by host computer, while lasting using analog-to-digital conversion (adc) function
Monitoring CLK pin level is tested and is not passed through if can not draw high, and the method can be with high efficient detection circuit board qualification rate.Tool
Body is described as follows：
TS8000 chips are welded on circuit board.Choose TS8000 chips other than GND pin (grounding pin)
Arbitrary functional leads as be tested pin, keep the detection pin of level acquisition module and tested pin direct-connected.In the present invention
In the embodiment provided, according to TS8000 chips and the installation scenarios of the circuit board of welding, it is most to choose neighbouring ground wire
Functional leads are as pin is tested, in the present invention by taking the CLK pin of TS8000 chips as an example, by the inspection of level acquisition module
It surveys pin and CLK pin is direct-connected.High level is continuously applied to CLK pin, level acquisition module acquires the level number of CLK pin
According to.Host computer reads the level data of tested pin from level acquisition module；When there is low level, preliminary judgement is tested to be drawn
The welding of foot exists abnormal.
If fruit chip weldering is askew, the CLK pin of TS8000 chips is easy to be shorted to the GND pin beside it, that is, connects
Ground.CLK pin level after ground connection cannot be raised.So as long as detecting low level, you can judgement TS8000 cores
Piece pin abnormal welding, can quickly and efficiently detection circuit board qualification rate.And the most CLK of the quantity of ground wire draws near choosing
Foot can improve the possibility for detecting TS8000 chip pin solder failures as pin to be measured.
This chip pin welds detection method and is suitable for multiple chips to be measured situation detected simultaneously, i.e., will be multiple
TS8000 chips are welded on multiple circuit boards, make to weld a TS8000 chip to be measured on each circuit board, circuit board is same
When test.As shown in Fig. 2, when selection multichannel：By TS8000 chip power supplies, default high voltage is connected to TS8000 chips
CLK pin (clock pins communicated), in embodiment provided by the present invention, TS8000 chip pins weld detection process
In, default high voltage is illustrated by taking 3.3V voltages as an example, can be according to using needs in chip pin welds detection process
Value to presetting high voltage is set.Then the voltage value for measuring this pin (can be by oscillograph, the modulus of microcontroller
The realizations such as conversion function), when detect CLK pin voltage default qualified voltage (in embodiment provided by the present invention, when
When default high voltage is 3.3V voltages, default qualified voltage is illustrated by taking 2V voltages as an example) 2V or more when (standard TTL inputs
High level voltage minimum), it is qualified to be considered as welding；When CLK voltages are less than 2V, it is unqualified to be considered as its welding, can pass through at this time
The modes such as stroboscopic, buzzing indicate that it does not pass through detection.The chip pin welds detection method and is screened for rapid preliminary, it is therefore intended that
Whether the reason of quick locating circuit board irregular working generates in welding link, by the circuit board of this detection it is not intended that energy
Enough normal works.But when this detection is abnormal, it can quickly investigate out the circuit board of cisco unity malfunction.
On the other hand, the present invention also provides a kind of chip pin welding detection device, draw for realizing above-mentioned chip
Foot welds detection method.The detection device includes circuit board module, level acquisition module, voltage offer module and judgment module.
Wherein, when carrying out chip pin welding detection, chip to be measured is welded on circuit board module；Voltage provides mould
Block to the tested pin of chip to be measured for being continuously applied high level；Wherein, the tested pin of chip to be measured is according to welding feelings
The functional leads for the chip to be measured that condition is chosen.Level acquisition module is used for, the electricity of acquisition tested pin direct-connected with tested pin
Flat data, and the level data of acquisition is sent to judgment module.Wherein, in embodiment provided by the present invention, level is adopted
Collection module can be arbitrary the device by connecting acquisition level signal with tested pin, when level acquisition module is adopted for level
When collecting module, level acquisition module is direct-connected by detecting pin and tested pin, acquires the level data for being tested pin.
Judgment module is used to receive the level data of level acquisition module transmission, when receiving low-level data, judgement
The welding of tested pin exists abnormal.In embodiment provided by the present invention, setting time threshold value, when judgment module receives quilt
Survey pin level data time be more than time threshold after, if it is determined that module never receive low-level data,
The welding that preliminary judgement is tested pin is normal.
In conclusion chip pin welding detection method provided by the present invention and detection device, first by chip to be measured
It is welded on circuit board, chooses the functional leads of chip to be measured as tested pin.Then, height is continuously applied to tested pin
Level, continuous collecting are tested the level data of pin；When low level occurs in tested pin, preliminary judgement is tested the welding of pin
There are exceptions.The detection method is as a kind of preliminary screening mode, especially suitable for the quick screening chip pin weldering of some needs
Connect abnormal situation.As long as there is low level in tested pin, you can judgement is tested the abnormal welding of pin, can quickly investigate out
The circuit board of cisco unity malfunction.
Detection method is welded to chip pin provided by the present invention above and detection device is described in detail.It is right
For those of ordinary skill in the art, it is done under the premise of without departing substantially from true spirit any apparent
Change, all will constitute to infringement of patent right of the present invention, corresponding legal liabilities will be undertaken.
Claims (10)
1. a kind of chip pin welds detection method, it is characterised in that include the following steps：
Chip to be measured is welded on circuit board, chooses the functional leads of chip to be measured as tested pin；
High level is continuously applied to tested pin, acquires the level data for being tested pin；
When low level occurs in tested pin, it is abnormal to judge that the welding of the tested pin exists.
2. chip pin as described in claim 1 welds detection method, it is characterised in that:The functionality for choosing chip to be measured draws
Foot includes the following steps as pin is tested：
Choose all functionalities pin of the chip to be measured；
According to the chip to be measured and the installation scenarios of the circuit board of welding, judge that functional leads are nearby after the completion of welding
The quantity of line；All functionalities pin is ranked up according to the quantity of ground wire near the functional leads；
Using the most functional leads of neighbouring ground wire as tested pin.
3. chip pin as described in claim 1 welds detection method, it is characterised in that：
The tested pin includes multiple functional leads of chip under test.
4. chip pin as claimed in claim 3 welds detection method, it is characterised in that：
When tested pin is multiple functional leads of chip to be measured, multiple tested pins on same circuit are carried out at the same time
Detection.
5. chip pin as described in claim 1 welds detection method, it is characterised in that:When multiple chips to be measured are detected simultaneously
When survey, include the following steps：
Each chip to be measured is welded on same circuit board；
Functional leads are chosen from each chip to be measured as tested pin；
High level is continuously applied to each tested pin respectively, acquires the level data of the tested pin；
When low level occurs in the tested pin, there is exception in the chip welding that low level tested pin occurs in judgement.
6. chip pin as described in claim 1 welding detection method it is characterized in that：
The chip to be measured is TS8000 chips.
7. chip pin as claimed in claim 6 welds detection method, it is characterised in that：
Tested pin is CLK pin.
8. chip pin as claimed in claim 6 welds detection method, it is characterised in that：
TS8000 chips are welded on circuit board, choose the CLK pin of the TS8000 chips as tested pin；
Default high voltage is continuously applied to the CLK pin, acquires the level data of the CLK pin；
When the CLK pin occurs being less than the level of default qualified voltage, it is abnormal to judge that the welding of the CLK pin exists.
9. a kind of chip pin welding detection device, for realizing the chip pin weldering described in any one of claim 1~8
Connect detection method, it is characterised in that provide module and judgment module including circuit board module, level acquisition module, voltage；
Wherein, chip to be measured is welded on the circuit board module；
The voltage provides module for being continuously applied high level to the tested pin of the chip to be measured；
The level acquisition module is used for direct-connected with tested pin, acquires the level data for being tested pin, and by the level of acquisition
Data are sent to the judgment module；
The judgment module is used to receive the level data of level acquisition module transmission, and according to the level data, judges quilt
The welding of pin is surveyed with the presence or absence of abnormal.
10. chip pin welding detection device as claimed in claim 9, it is characterised in that：
The tested pin of the chip to be measured is the functional leads for the chip to be measured chosen according to welding situation.
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| CN109192118A (en) * | 2018-11-22 | 2019-01-11 | 京东方科技集团股份有限公司 | It is bonded undesirable detection method and detection device |
| CN109254889A (en) * | 2018-10-22 | 2019-01-22 | 河南思维轨道交通技术研究院有限公司 | A kind of localization method carrying out CPU pin short trouble using embedded software |
| CN110579701A (en) * | 2019-09-16 | 2019-12-17 | 晶晨半导体(上海)股份有限公司 | Method for detecting pin connectivity of integrated chip |
| CN111443307A (en) * | 2020-03-31 | 2020-07-24 | 四川九洲电器集团有限责任公司 | Detection method and detection system of signal processing unit |
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| CN114184936A (en) * | 2021-11-30 | 2022-03-15 | 上海儒竞智控技术有限公司 | Chip continuous welding self-detection method, system, medium and chip |
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