JP2018112546A - Probe Card Module - Google Patents

Probe Card Module Download PDF

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JP2018112546A
JP2018112546A JP2018000687A JP2018000687A JP2018112546A JP 2018112546 A JP2018112546 A JP 2018112546A JP 2018000687 A JP2018000687 A JP 2018000687A JP 2018000687 A JP2018000687 A JP 2018000687A JP 2018112546 A JP2018112546 A JP 2018112546A
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probe
conductive
ground
input terminal
probe card
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▲頼▼鴻尉
Hung-Wei Lai
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Sync Tech System Corp
Sync-Tech System Corp
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Sync Tech System Corp
Sync-Tech System Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31712—Input or output aspects
    • G01R31/31713—Input or output interfaces for test, e.g. test pins, buffers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31723—Hardware for routing the test signal within the device under test to the circuits to be tested, e.g. multiplexer for multiple core testing, accessing internal nodes

Abstract

PROBLEM TO BE SOLVED: To provide a probe card module.SOLUTION: A probe card module is used for testing a circuit chip, and the circuit chip includes a first ground conductive pad and a second ground conductive pad. The probe card module includes an amplifier circuit having: a printed circuit board containing a ground terminal; a first input end; a second input end; and an output end, wherein the first input end is connected to the ground terminal, the second input end is connected to the first ground conducive pad through a first conductive probe, and the output end is connected to the second ground conductive pad through a second conductive probe.SELECTED DRAWING: Figure 2

Description

本発明は、プローブカード技術の分野に関し、より詳しくは、プローブカードモジュール（probe card module）に関する。 The present invention relates to the field of probe card technology, and more particularly to a probe card module.

集積回路素子の製造過程において、結晶のカットまたは素子のパッケージの前には電気的試験を行う。これは通常プローブカードによりテスター（Tester）から提供される電源信及び試験信号が被測定装置（Device Under Testing、略称DUT）に伝送される。電源信号により被測定装置に必要な電源が供給され、試験信号は被測定装置の検知に用いられる。 In the manufacturing process of an integrated circuit device, an electrical test is performed before cutting the crystal or packaging the device. In general, a power source signal and a test signal provided from a tester are transmitted to a device under test (abbreviated as DUT) by a probe card. The power supply signal supplies the necessary power to the device under test, and the test signal is used to detect the device under test.

米国特許出願第７００５８７９号明細書US Patent Application No. 7005879 米国特許出願第７０４９８３５号明細書US Patent Application No. 7049835

集積回路素子は通常アナログ回路及びデジタル回路を含むため、試験信号もアナログ信号及びデジタル信号を含み、プローブカードモジュールのプリント回路基板にはアナログ信号に用いられる接地端子（略称AGND）及びデジタル信号に用いられる接地端子（略称DGND）が別設され、両者が最後にテスターの同一の接地端子に接続され、これと同等の効果を有する回路は１つのインダクタンスと見做せる。ＡＧＮＤを例にすると、インダクタンス効果のために、ＡＧＮＤの地帰路がテスターの接地端子に即時流れず、ＡＧＮＤでドリフト接地電圧が感知されるために試験信号の電圧の精度に影響が及んだ。例えば、被測定装置の地帰路が１００ミリアンペア（mA）である場合、プローブカードモジュールは１０本のプローブが被測定装置のＡＧＮＤに接続されて約０．１オームの並列抵抗が形成され、ＡＧＮＤが約１０ミリボルト（mV）のドリフト電圧を有し、試験信号の精度に影響が及んだ。従来の特許文献では、例えば、特許文献１及び特許文献２がある。
そこで、本発明者は上記の欠点が改善可能と考え、すなわち、接地端子に発生するドリフト電圧の問題を有効的に解決するため、鋭意検討を重ねた結果、合理的設計で上記の課題を効果的に改善する本発明の提案に到った。
かかる従来の実情に鑑みて、本発明は、プローブカードモジュールを提供することを目的とする。すなわち、プローブカード回路基板の接地端子に被測定装置の電気的試験中にドリフト電圧が発生するという問題を解決させる。 Since an integrated circuit element usually includes an analog circuit and a digital circuit, the test signal also includes an analog signal and a digital signal. The printed circuit board of the probe card module uses a ground terminal (abbreviated as AGND) used for an analog signal and a digital signal. A ground terminal (abbreviated as DGND) is connected separately, and both are finally connected to the same ground terminal of the tester, and a circuit having the same effect can be regarded as one inductance. Taking AGND as an example, the ground return path of AGND does not immediately flow to the ground terminal of the tester due to the inductance effect, and the drift ground voltage is sensed by AGND, which affects the accuracy of the voltage of the test signal. For example, when the ground return path of the device under test is 100 milliamps (mA), the probe card module has 10 probes connected to the AGND of the device under test to form a parallel resistance of about 0.1 ohm, It had a drift voltage of about 10 millivolts (mV) and affected the accuracy of the test signal. Conventional patent documents include, for example, Patent Document 1 and Patent Document 2.
Therefore, the present inventor considers that the above-mentioned drawbacks can be improved, that is, as a result of intensive studies in order to effectively solve the problem of the drift voltage generated at the ground terminal, the above-described problems are effectively achieved by rational design. The present invention has been improved.
In view of such a conventional situation, an object of the present invention is to provide a probe card module. That is, the problem that a drift voltage is generated at the ground terminal of the probe card circuit board during the electrical test of the device under test is solved.

上述した課題を解決し、目的を達成するために、本発明に係るプローブカードモジュールの特徴は、回路チップを試験することに用いられるプローブカードモジュールであって、前記回路チップは第一接地導電パッド及び第二接地導電パッドを備える。前記プローブカードモジュールは、接地端子を含むプリント回路基板、及び第一入力端と、第二入力端と、出力端とを有し、前記第一入力端は前記接地端子に接続され、前記第二入力端は第一導電プローブを介して前記第一接地導電パッドに接続され、且つ前記出力端は第二導電プローブを介して前記第二接地導電パッドに接続される増幅回路を備える。
好ましい実施形態において、前記回路チップは第三接地導電パッドを更に備える。前記増幅回路の前記出力端は第三導電プローブを介して前記第三接地導電パッドに接続されるか、或いは前記増幅回路の前記第二入力端は第三導電プローブを介して前記第三接地導電パッドに接続される。 In order to solve the above-mentioned problems and achieve the object, the probe card module according to the present invention is characterized by a probe card module used for testing a circuit chip, wherein the circuit chip is a first ground conductive pad. And a second ground conductive pad. The probe card module has a printed circuit board including a ground terminal, a first input terminal, a second input terminal, and an output terminal, and the first input terminal is connected to the ground terminal, The input end is connected to the first ground conductive pad via a first conductive probe, and the output end includes an amplifier circuit connected to the second ground conductive pad via a second conductive probe.
In a preferred embodiment, the circuit chip further comprises a third ground conductive pad. The output terminal of the amplifier circuit is connected to the third ground conductive pad via a third conductive probe, or the second input terminal of the amplifier circuit is connected to the third ground conductive pad via a third conductive probe. Connected to the pad.

好ましい実施形態において、前記増幅回路はオペアンプを備える。前記第一入力端は非反転入力端であり、前記第二入力端は反転入力端である。
好ましい実施形態において、前記プローブカードモジュールはプローブホルダーを更に備える。前記プリント回路基板は上表面及び下表面を有し、前記プローブホルダーは前記下表面に設置され、これら前記導電プローブの固定に用いられる。前記増幅回路は前記下表面または前記上表面に設置され、或いは前記増幅回路はこれら前記導電プローブに設置される。 In a preferred embodiment, the amplifier circuit includes an operational amplifier. The first input terminal is a non-inverting input terminal, and the second input terminal is an inverting input terminal.
In a preferred embodiment, the probe card module further comprises a probe holder. The printed circuit board has an upper surface and a lower surface, and the probe holder is installed on the lower surface and used for fixing the conductive probes. The amplifier circuit is installed on the lower surface or the upper surface, or the amplifier circuit is installed on the conductive probes.

本発明の他の実施形態に係るローブカードモジュールの特徴は、接地導電パッドを含む回路チップを試験することに用いられる。前記プローブカードモジュールは、接地端子を含むプリント回路基板、及び第一入力端と、第二入力端と、出力端とを有し、前記第一入力端は前記接地端子に接続され、前記第二入力端及び前記出力端は導電プローブを介して前記接地導電パッドに接続される増幅回路を備える。
好ましい実施形態において、前記回路チップは他の接地導電パッドを更に備える。前記増幅回路の前記出力端は他の導電プローブを介して他の前記接地導電パッドに接続され、或いは前記増幅回路の前記第二入力端は他の導電プローブを介して他の前記接地導電パッドに接続される。 The feature of the lobe card module according to another embodiment of the present invention is used for testing a circuit chip including a ground conductive pad. The probe card module has a printed circuit board including a ground terminal, a first input terminal, a second input terminal, and an output terminal, and the first input terminal is connected to the ground terminal, The input terminal and the output terminal include an amplifier circuit connected to the ground conductive pad via a conductive probe.
In a preferred embodiment, the circuit chip further includes another ground conductive pad. The output terminal of the amplifier circuit is connected to another grounded conductive pad via another conductive probe, or the second input terminal of the amplifier circuit is connected to another grounded conductive pad via another conductive probe. Connected.

好ましい実施形態において、前記増幅回路はオペアンプを備える。前記第一入力端は非反転入力端であり、前記第二入力端は反転入力端である。
好ましい実施形態において、前記プローブカードモジュールはプローブホルダーを更に備える。前記プリント回路基板は上表面及び下表面を有し、前記プローブホルダーは前記下表面に設置され、これら前記導電プローブの固定に用いられる。前記増幅回路は前記下表面または前記上表面に設置され、或いは前記増幅回路はこれら前記導電プローブに設置される。 In a preferred embodiment, the amplifier circuit includes an operational amplifier. The first input terminal is a non-inverting input terminal, and the second input terminal is an inverting input terminal.
In a preferred embodiment, the probe card module further comprises a probe holder. The printed circuit board has an upper surface and a lower surface, and the probe holder is installed on the lower surface and used for fixing the conductive probes. The amplifier circuit is installed on the lower surface or the upper surface, or the amplifier circuit is installed on the conductive probes.

本発明によれば、プローブカード回路基板の接地端子に被測定装置の電気的試験中にドリフト電圧が発生するという問題が解決する。 According to the present invention, the problem that a drift voltage is generated at the ground terminal of the probe card circuit board during the electrical test of the device under test is solved.

本発明の一実施形態に係るプローブカードモジュールの構成を説明する概略図である。It is the schematic explaining the structure of the probe card module which concerns on one Embodiment of this invention. 本発明の一実施形態に係るプローブカードモジュールにより回路チップを試験する回路を説明する概略図である。It is the schematic explaining the circuit which tests a circuit chip with the probe card module which concerns on one Embodiment of this invention. 本発明の他の実施形態に係るプローブカードモジュールの構成を説明する概略図である。It is the schematic explaining the structure of the probe card module which concerns on other embodiment of this invention. 本発明の他の実施形態に係るプローブカードモジュールの構成を説明する概略図である。It is the schematic explaining the structure of the probe card module which concerns on other embodiment of this invention.

本発明における好適な実施の形態について、添付図面を参照して説明する。尚、以下に説明する実施の形態は、特許請求の範囲に記載された本発明の内容を限定するものではない。また、以下に説明される構成の全てが、本発明の必須要件であるとは限らない。なお、全ての明細書及び図では、同じ部材の符号は同じ或いは類似する部材を指す。さらに、各実施形態の説明においては、部材が他の部材の「上方／上」或いは「下方／下」と説明されている場合、直接的或いは間接的に前記他の部材の上或いは下にある状況を指し、他の部材がそれらの間に設置される可能性も含む。 接地とはそれらの間に他の中間部材が未設置であることを指す。「上方／上」或いは「下方／下」等の説明は図式を基準として説明しているが、但し、他の方向に転換される可能性も含む。いわゆる「第一」、「第二」、及び「第三」は異なる部材を説明するものであり、これらの部材はこれらの述語によって制限されるわけではない。明確に説明し易くするために、図中では、各部材の厚さ或いは寸法は、誇張や省略、概略されて表示されており、且つ各部材の寸法は実際の寸法と完全に一致するわけではない。 Preferred embodiments of the present invention will be described with reference to the accompanying drawings. The embodiments described below do not limit the contents of the present invention described in the claims. In addition, all of the configurations described below are not necessarily essential requirements of the present invention. In all the specifications and drawings, the same reference numerals denote the same or similar members. Further, in the description of each embodiment, when a member is described as “upper / upper” or “lower / lower” of another member, it is directly or indirectly above or below the other member. Refers to the situation, including the possibility of other members being placed between them. Grounding means that no other intermediate member is installed between them. The description of “up / down” or “down / down” is described based on the diagram, but includes the possibility of changing to another direction. The so-called “first”, “second”, and “third” describe different members, which are not limited by these predicates. For the sake of clarity, the thickness or dimension of each member is shown exaggerated, omitted, or outlined in the drawings, and the dimension of each member does not exactly match the actual dimension. Absent.

図１は本発明の一実施形態に係るプローブカードモジュール１００の構成を説明する概略図である。前記プローブカードモジュール１００は、複数の導電プローブ１１０と、プリント回路基板１２０と、プローブホルダー１３０と、増幅回路１４０とを備える。前記プローブホルダー１３０は前記プリント回路基板１２０の下方に設置され、これら前記導電プローブ１１０の固定に用いられる。前記増幅回路１４０は前記プリント回路基板１２０の下表面に設置され、前記増幅回路１４０が被測定装置に極力接近するようになる。これら前記導電プローブ１１０、前記プリント回路基板１２０、及び前記プローブホルダー１３０が組み合わせられることにより本技術分野における所謂「プローブカード」が形成され、このプローブカードがチッププローバー（Prober、図示せず）に設置され、被測定装置の電気的試験に用いられる。また、これら前記導電プローブ１１０は複数の伝送線１５０（例えば、同軸ケーブルやツイストペアケーブル）により前記プリント回路基板１２０及びこれら前記導電プローブ１１０に接続される。或いは、これら前記導電プローブ１１０が前記プリント回路基板１２０に直接接続される。 FIG. 1 is a schematic diagram illustrating the configuration of a probe card module 100 according to an embodiment of the present invention. The probe card module 100 includes a plurality of conductive probes 110, a printed circuit board 120, a probe holder 130, and an amplifier circuit 140. The probe holder 130 is installed below the printed circuit board 120 and used to fix the conductive probes 110. The amplifier circuit 140 is installed on the lower surface of the printed circuit board 120 so that the amplifier circuit 140 is as close as possible to the device under test. The conductive probe 110, the printed circuit board 120, and the probe holder 130 are combined to form a so-called “probe card” in this technical field, and this probe card is installed in a chip prober (Prober, not shown). And used for electrical testing of the device under test. In addition, the conductive probes 110 are connected to the printed circuit board 120 and the conductive probes 110 by a plurality of transmission lines 150 (for example, coaxial cables and twisted pair cables). Alternatively, the conductive probes 110 are directly connected to the printed circuit board 120.

前記プローブカードモジュール１００により試験が行われる被測定装置は回路チップ１６０であり、主な回路の概略図は図２に図示する。これら前記導電プローブ１１０は導電プローブ１１１〜１１４を備え、前記回路チップ１６０は複数の導電パッド１６１〜１６６を含み、前記回路チップ１６０の内部回路を外部のインターフェースに接続させるための接続パッドとする。本実施形態では、前記導電パッド１６１、１６３、１６４、１６５は全て前記回路チップ１６０の接地端子（例えば、アナログ信号用の接地端子）に接続され、よって接地導電パッド（ground pad）と呼ばれる。前記増幅回路１４０はオペアンプ（Operational Amplifier或OP-Amp）でもよく、２つの入力端（非反転入力端１４１及び反転入力端１４２）及び出力端１４３を有する。前記非反転入力端１４１は前記プリント回路基板１２０の接地端子１２２に接続され、前記反転入力端１４２は前記導電プローブ１１１を介して前記接地導電パッド１６１に接続され、且つ前記出力端１４３は前記導電プローブ１１２を介して前記接地導電パッド１６３に接続され、前記導電プローブ１１３を介して前記接地導電パッド１６４に接続され、前記導電プローブ１１４を介して前記接地導電パッド１６５に接続される（図２参照）。これら前記導電プローブ１１１〜１１４が全て前記回路チップ１６０の接地端子に直接接続されるため、前記増幅回路１４０の出力端１４３及び反転入力端１４２は短絡回路として互いに接続される。また、前記増幅回路１４０の反転入力端１４２が前記回路チップ１６０ （被測定装置）の接地端子に接続されて負帰還回路が形成されるため、前記増幅回路１４０により前記回路チップ１６０の接地端子が押され、これら前記導電プローブ１１０により形成される等価インピーダンスが補償され、前記プリント回路基板１２０の接地端子に発生するドリフト電圧が消除される。また、前記回路チップ１６０の地帰路が前記増幅回路１４０の電源端に流入し、前記プリント回路基板１２０の接地端子１２２には流入せず、被測定装置（回路チップ１６０）とプローブカードモジュール１００との間の接地の隔離が達成される。
これにより、本発明の実施形態に係るプローブカードモジュール１００は、前記増幅回路１４０が設置されることにより導電プローブ１１０により形成される等価インピーダンスが補償され、同時にプリント回路基板１２０の接地端子１２２と回路チップ１６０の接地端子とが隔離される。よって、接地端子にドリフト電圧が発生しなくなり、試験信号の電圧精度が確保される。 The device under test to be tested by the probe card module 100 is a circuit chip 160, and a schematic diagram of main circuits is shown in FIG. The conductive probes 110 include conductive probes 111 to 114, and the circuit chip 160 includes a plurality of conductive pads 161 to 166, which serve as connection pads for connecting an internal circuit of the circuit chip 160 to an external interface. In this embodiment, the conductive pads 161, 163, 164, 165 are all connected to the ground terminal (for example, a ground terminal for analog signals) of the circuit chip 160, and are therefore called ground conductive pads (ground pads). The amplifier circuit 140 may be an operational amplifier (Operational Amplifier or OP-Amp), and has two input terminals (a non-inverting input terminal 141 and an inverting input terminal 142) and an output terminal 143. The non-inverting input terminal 141 is connected to the ground terminal 122 of the printed circuit board 120, the inverting input terminal 142 is connected to the ground conductive pad 161 via the conductive probe 111, and the output terminal 143 is the conductive terminal. Connected to the ground conductive pad 163 via the probe 112, connected to the ground conductive pad 164 via the conductive probe 113, and connected to the ground conductive pad 165 via the conductive probe 114 (see FIG. 2). ). Since all of the conductive probes 111 to 114 are directly connected to the ground terminal of the circuit chip 160, the output terminal 143 and the inverting input terminal 142 of the amplifier circuit 140 are connected to each other as a short circuit. Further, since the inverting input terminal 142 of the amplifier circuit 140 is connected to the ground terminal of the circuit chip 160 (device under test) to form a negative feedback circuit, the amplifier circuit 140 causes the ground terminal of the circuit chip 160 to be connected. The equivalent impedance formed by the conductive probes 110 is compensated, and the drift voltage generated at the ground terminal of the printed circuit board 120 is eliminated. Further, the ground return path of the circuit chip 160 flows into the power supply terminal of the amplifier circuit 140 and does not flow into the ground terminal 122 of the printed circuit board 120, and the device under test (circuit chip 160), the probe card module 100, Grounding isolation between is achieved.
Accordingly, in the probe card module 100 according to the embodiment of the present invention, the equivalent impedance formed by the conductive probe 110 is compensated by installing the amplification circuit 140, and at the same time, the ground terminal 122 and the circuit of the printed circuit board 120 are connected. The ground terminal of the chip 160 is isolated. Therefore, no drift voltage is generated at the ground terminal, and the voltage accuracy of the test signal is ensured.

ちなみに、図２は本発明の実施形態に係るプローブカードモジュール１００及び回路チップ１６０の１つの実施態様にすぎない。詳しくは、本発明の他の実施形態では、前記増幅回路１４０の出力端１４３及び反転入力端１４２が導電プローブを介して同一の接地導電パッドに接続されてもよい。或いは、前記増幅回路１４０の反転入力端１４２も複数の導電プローブを介して異なる接地導電パッドに接続されてもよく、本発明はこれらに制限されない。本発明の実施形態に係るプローブカードモジュール１００は実際の実施において、前記増幅回路１４０の出力能力に応じ、導電プローブに接続されるべき接地導電パッドの数量、導電プローブの長さ、及び接地端子を通過させる電流等の要素により設置すべき増幅回路１４０の数量及び増幅回路１４０と各接地導電パッドとの接続関係が決定される。 Incidentally, FIG. 2 is only one embodiment of the probe card module 100 and the circuit chip 160 according to the embodiment of the present invention. Specifically, in another embodiment of the present invention, the output terminal 143 and the inverting input terminal 142 of the amplifier circuit 140 may be connected to the same ground conductive pad through a conductive probe. Alternatively, the inverting input terminal 142 of the amplifier circuit 140 may be connected to different ground conductive pads via a plurality of conductive probes, and the present invention is not limited thereto. In actual implementation, the probe card module 100 according to the embodiment of the present invention has the number of ground conductive pads to be connected to the conductive probe, the length of the conductive probe, and the ground terminal according to the output capability of the amplifier circuit 140. The number of amplifying circuits 140 to be installed and the connection relationship between the amplifying circuit 140 and each grounding conductive pad are determined by factors such as the current to be passed.

図３は本発明の他の実施形態に係るプローブカードモジュール２００の構成を説明する概略図である。図３に示すように、本実施形態は基本的に図１のプローブカードモジュール１００と同じであり、差異は、前記増幅回路１４０が前記プリント回路基板１２０の上表面に設置され、前記増幅回路１４０が前記プリント回路基板１２０の回路レイアウトに極力組み合わせられる点である。前記増幅回路１４０及びこれら前記導電プローブ１１０が前記プリント回路基板１２０の上下の異なる両側に設置されるため、前記プリント回路基板１２０中に貫通孔１２５が形成される必要がある。前記貫通孔１２５により前記プリント回路基板１２０の上表面及び下表面が貫通され、これにより前記増幅回路１４０がこれら前記導電プローブ１１０に接続される。 FIG. 3 is a schematic diagram illustrating the configuration of a probe card module 200 according to another embodiment of the present invention. As shown in FIG. 3, the present embodiment is basically the same as the probe card module 100 of FIG. 1 except that the amplifier circuit 140 is installed on the upper surface of the printed circuit board 120. Is a point that can be combined with the circuit layout of the printed circuit board 120 as much as possible. Since the amplifier circuit 140 and the conductive probes 110 are installed on different upper and lower sides of the printed circuit board 120, a through hole 125 needs to be formed in the printed circuit board 120. The upper surface and the lower surface of the printed circuit board 120 are penetrated by the through-hole 125, whereby the amplifier circuit 140 is connected to the conductive probe 110.

図４は本発明の他の実施形態に係るプローブカードモジュール３００の構成を説明する概略図である。図４に示すように、本実施形態は基本的に図１のプローブカードモジュール１００と同じであり、差異は、これら前記導電プローブ１１０が前記プリント回路基板１２０に直接接続される点である。また、前記増幅回路１４０はこれら前記導電プローブ１１０に直接設置されてもよく、前記増幅回路１４０と被測定装置（回路チップ）との距離が更に短縮され、これら前記導電プローブ１１０により形成される等価インピーダンスが縮小される。
従って、本明細書に開示された実施例は、本発明を限定するものではなく、説明するためのものであり、このような実施例によって本発明の思想と範囲が限定されるものではない。本発明の範囲は特許請求の範囲により解釈すべきであり、それと同等の範囲内にある全ての技術は、本発明の権利範囲に含まれるものと解釈すべきである。 FIG. 4 is a schematic diagram illustrating the configuration of a probe card module 300 according to another embodiment of the present invention. As shown in FIG. 4, this embodiment is basically the same as the probe card module 100 of FIG. 1, and the difference is that these conductive probes 110 are directly connected to the printed circuit board 120. Further, the amplifier circuit 140 may be installed directly on the conductive probe 110, and the distance between the amplifier circuit 140 and the device under test (circuit chip) is further shortened, and the equivalent circuit formed by the conductive probe 110 is used. Impedance is reduced.
Accordingly, the embodiments disclosed herein are for the purpose of explaining, not limiting the present invention, and the spirit and scope of the present invention are not limited by such embodiments. The scope of the present invention should be construed according to the claims, and all technologies within the equivalent scope should be construed as being included in the scope of the present invention.

１００ プローブカードモジュール
１１０ 導電プローブ
１１１ 導電プローブ
１１２ 導電プローブ
１１３ 導電プローブ
１１４ 導電プローブ
１２０ プリント回路基板
１２２ 接地端子
１２５ 貫通孔
１３０ プローブホルダー
１４０ 増幅回路
１４１ 非反転入力端
１４２ 反転入力端
１４３ 出力端
１５０ 伝送線
１６０ 回路チップ
１６１ 導電パッド
１６２ 導電パッド
１６３ 導電パッド
１６４ 導電パッド
１６５ 導電パッド
１６６ 導電パッド
２００ プローブカードモジュール
３００ プローブカードモジュール 100 probe card module 110 conductive probe 111 conductive probe 112 conductive probe 113 conductive probe 114 conductive probe 120 printed circuit board 122 ground terminal 125 through hole 130 probe holder 140 amplifying circuit 141 non-inverting input terminal 142 inverting input terminal 143 output terminal 150 transmission line 160 Circuit chip 161 Conductive pad 162 Conductive pad 163 Conductive pad 164 Conductive pad 165 Conductive pad 166 Conductive pad 200 Probe card module 300 Probe card module

Claims (14)

第一接地導電パッド及び第二接地導電パッドを含む回路チップを試験することに用いられるプローブカードモジュールであって、
接地端子を含むプリント回路基板と、
第一入力端と、第二入力端と、出力端とを有し、前記第一入力端は前記接地端子に接続され、前記第二入力端は第一導電プローブを介して前記第一接地導電パッドに接続され、且つ前記出力端は第二導電プローブを介して前記第二接地導電パッドに接続される増幅回路とを備えることを特徴とするプローブカードモジュール。 A probe card module used for testing a circuit chip including a first ground conductive pad and a second ground conductive pad,
A printed circuit board including a ground terminal;
A first input terminal; a second input terminal; and an output terminal, wherein the first input terminal is connected to the ground terminal, and the second input terminal is connected to the first ground conductor through a first conductive probe. A probe card module comprising: an amplifier circuit connected to a pad, and the output end connected to the second ground conductive pad via a second conductive probe. 前記回路チップは第三接地導電パッドを更に備え、且つ前記増幅回路の前記出力端は第三導電プローブを介して前記第三接地導電パッドに接続されることを特徴とする請求項１に記載のプローブカードモジュール。   The circuit chip according to claim 1, wherein the circuit chip further includes a third ground conductive pad, and the output end of the amplifier circuit is connected to the third ground conductive pad via a third conductive probe. Probe card module. 前記回路チップは第三接地導電パッドを更に備え、且つ前記増幅回路の前記第二入力端は第三導電プローブを介して前記第三接地導電パッドに接続されることを特徴とする請求項１に記載のプローブカードモジュール。   The circuit chip further comprises a third ground conductive pad, and the second input end of the amplifier circuit is connected to the third ground conductive pad via a third conductive probe. The probe card module described. 前記増幅回路はオペアンプを備え、前記第一入力端は非反転入力端であり、前記第二入力端は反転入力端であることを特徴とする請求項１、２、或いは３に記載のプローブカードモジュール。   4. The probe card according to claim 1, wherein the amplifier circuit includes an operational amplifier, the first input terminal is a non-inverting input terminal, and the second input terminal is an inverting input terminal. module. プローブホルダーを更に備え、
前記プリント回路基板は上表面及び下表面を有し、前記プローブホルダーは前記下表面に設置され、これら前記導電プローブの固定に用いられ、前記増幅回路は前記下表面に設置されることを特徴とする請求項１、２、或いは３に記載のプローブカードモジュール。 A probe holder,
The printed circuit board has an upper surface and a lower surface, the probe holder is installed on the lower surface, used to fix the conductive probes, and the amplification circuit is installed on the lower surface. The probe card module according to claim 1, 2, or 3. プローブホルダーを更に備え、
前記プリント回路基板は上表面及び下表面を有し、前記プローブホルダーは前記下表面に設置され、これら前記導電プローブの固定に用いられ、前記増幅回路は前記上表面に設置されることを特徴とする請求項１、２、或いは３に記載のプローブカードモジュール。 A probe holder,
The printed circuit board has an upper surface and a lower surface, the probe holder is installed on the lower surface, used to fix the conductive probes, and the amplifier circuit is installed on the upper surface. The probe card module according to claim 1, 2, or 3. プローブホルダーを更に備え、
前記プリント回路基板は上表面及び下表面を有し、前記プローブホルダーは前記下表面に設置され、これら前記導電プローブの固定に用いられ、前記増幅回路はこれら前記導電プローブに設置されることを特徴とする請求項１、２、或いは３に記載のプローブカードモジュール。 A probe holder,
The printed circuit board has an upper surface and a lower surface, the probe holder is installed on the lower surface, used to fix the conductive probes, and the amplification circuit is installed on the conductive probes. The probe card module according to claim 1, 2, or 3. 接地導電パッドを含む回路チップを試験することに用いられるプローブカードモジュールであって、
接地端子を含むプリント回路基板と、
第一入力端と、第二入力端と、出力端とを有し、前記第一入力端は前記接地端子に接続され、前記第二入力端及び前記出力端は導電プローブを介して前記接地導電パッドに接続される増幅回路とを備えることを特徴とするプローブカードモジュール。 A probe card module used for testing a circuit chip including a ground conductive pad,
A printed circuit board including a ground terminal;
A first input terminal; a second input terminal; and an output terminal, wherein the first input terminal is connected to the ground terminal, and the second input terminal and the output terminal are connected to the ground conductor through a conductive probe. A probe card module comprising: an amplifier circuit connected to the pad. 前記回路チップは他の接地導電パッドを更に備え、且つ前記増幅回路の前記出力端は他の導電プローブを介して他の前記接地導電パッドに接続されることを特徴とする請求項８に記載のプローブカードモジュール。   9. The circuit chip of claim 8, wherein the circuit chip further includes another ground conductive pad, and the output end of the amplifier circuit is connected to the other ground conductive pad via another conductive probe. Probe card module. 前記回路チップは他の接地導電パッドを更に備え、且つ前記増幅回路の前記第二入力端は他の導電プローブを介して他の前記接地導電パッドに接続されることを特徴とする請求項８に記載のプローブカードモジュール。   9. The circuit chip according to claim 8, wherein the circuit chip further includes another ground conductive pad, and the second input terminal of the amplifier circuit is connected to the other ground conductive pad via another conductive probe. The probe card module described. 前記増幅回路はオペアンプを備え、前記第一入力端は非反転入力端であり、前記第二入力端は反転入力端であることを特徴とする請求項８、９、或いは１０に記載のプローブカードモジュール。   The probe card according to claim 8, 9 or 10, wherein the amplifier circuit includes an operational amplifier, the first input terminal is a non-inverting input terminal, and the second input terminal is an inverting input terminal. module. プローブホルダーを更に備え、
前記プリント回路基板は上表面及び下表面を有し、前記プローブホルダーは前記下表面に設置され、これら前記導電プローブの固定に用いられ、前記増幅回路は前記下表面に設置されることを特徴とする請求項８、９、或いは１０に記載のプローブカードモジュール。 A probe holder,
The printed circuit board has an upper surface and a lower surface, the probe holder is installed on the lower surface, used to fix the conductive probes, and the amplification circuit is installed on the lower surface. The probe card module according to claim 8, 9, or 10. プローブホルダーを更に備え、
前記プリント回路基板は上表面及び下表面を有し、前記プローブホルダーは前記下表面に設置され、これら前記導電プローブの固定に用いられ、前記増幅回路は前記上表面に設置されることを特徴とする請求項８、９、或いは１０に記載のプローブカードモジュール。 A probe holder,
The printed circuit board has an upper surface and a lower surface, the probe holder is installed on the lower surface, used to fix the conductive probes, and the amplifier circuit is installed on the upper surface. The probe card module according to claim 8, 9, or 10. プローブホルダーを更に備え、
前記プリント回路基板は上表面及び下表面を有し、前記プローブホルダーは前記下表面に設置され、これら前記導電プローブの固定に用いられ、前記増幅回路はこれら前記導電プローブに設置されることを特徴とする請求項８、９、或いは１０に記載のプローブカードモジュール。 A probe holder,
The printed circuit board has an upper surface and a lower surface, the probe holder is installed on the lower surface, used to fix the conductive probes, and the amplification circuit is installed on the conductive probes. The probe card module according to claim 8, 9, or 10.
JP2018000687A 2017-01-06 2018-01-05 Probe Card Module Pending JP2018112546A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11327095B2 (en) 2019-08-19 2022-05-10 Samsung Electronics Co., Ltd. Probe cards, system for manufacturing semiconductor device, and method of manufacturing semiconductor device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03153052A (en) * 1989-11-10 1991-07-01 Mitsubishi Electric Corp Semiconductor substrate for high-frequency characteristic measurement use of semiconductor device
JP2005091065A (en) * 2003-09-16 2005-04-07 Oki Electric Ind Co Ltd Apparatus and method for supplying semiconductor device with operating voltage
JP2007198930A (en) * 2006-01-27 2007-08-09 Renesas Technology Corp Semiconductor inspection system and semiconductor device
US20090085598A1 (en) * 2007-09-28 2009-04-02 Qimonda Ag Integrated circuit test system and method with test driver sharing
JP3194953U (en) * 2014-01-24 2014-12-18 ▲し▼創電子股▲ふん▼有限公司 Active probe card

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587834A (en) * 1981-07-07 1983-01-17 Nec Corp Device for testing semiconductor wafer
JP2944056B2 (en) * 1990-08-06 1999-08-30 東京エレクトロン株式会社 Contact detection device for electric circuit measurement probe and electric circuit measurement device using this contact detection device
DE69321344D1 (en) * 1992-02-14 1998-11-05 Corvas Int Inc INHIBITORS OF THROMBOSE
JPH0786343A (en) * 1993-09-17 1995-03-31 Hitachi Ltd Method and device for inspecting semiconductor
US6603322B1 (en) * 1996-12-12 2003-08-05 Ggb Industries, Inc. Probe card for high speed testing
JP2003014780A (en) * 2001-06-29 2003-01-15 Micronics Japan Co Ltd Probe card
US7262624B2 (en) * 2004-12-21 2007-08-28 Formfactor, Inc. Bi-directional buffer for interfacing test system channel
JP5080459B2 (en) * 2005-06-13 2012-11-21 カスケード マイクロテック インコーポレイテッド Wideband active / passive differential signal probe
US7557592B2 (en) * 2006-06-06 2009-07-07 Formfactor, Inc. Method of expanding tester drive and measurement capability
CN101551406A (en) * 2008-04-02 2009-10-07 旺矽科技股份有限公司 Probe card
KR101085565B1 (en) * 2008-06-02 2011-11-24 가부시키가이샤 어드밴티스트 Test wafer unit and test system
JP2008241722A (en) * 2008-06-02 2008-10-09 Oki Electric Ind Co Ltd Probe card and method of manufacturing semiconductor device
JP6008332B2 (en) * 2011-10-03 2016-10-19 国立大学法人 筑波大学 Probe card and noise measuring device
CN102539927A (en) * 2011-12-14 2012-07-04 东华大学 Method for measuring temperature-controllable four-probe square resistance and resistivity
TWI634334B (en) * 2016-10-21 2018-09-01 新特系統股份有限公司 Probe card module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03153052A (en) * 1989-11-10 1991-07-01 Mitsubishi Electric Corp Semiconductor substrate for high-frequency characteristic measurement use of semiconductor device
JP2005091065A (en) * 2003-09-16 2005-04-07 Oki Electric Ind Co Ltd Apparatus and method for supplying semiconductor device with operating voltage
JP2007198930A (en) * 2006-01-27 2007-08-09 Renesas Technology Corp Semiconductor inspection system and semiconductor device
US20090085598A1 (en) * 2007-09-28 2009-04-02 Qimonda Ag Integrated circuit test system and method with test driver sharing
JP3194953U (en) * 2014-01-24 2014-12-18 ▲し▼創電子股▲ふん▼有限公司 Active probe card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11327095B2 (en) 2019-08-19 2022-05-10 Samsung Electronics Co., Ltd. Probe cards, system for manufacturing semiconductor device, and method of manufacturing semiconductor device

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