CN108872651A - Probe card - Google Patents
Probe card Download PDFInfo
- Publication number
- CN108872651A CN108872651A CN201810335336.1A CN201810335336A CN108872651A CN 108872651 A CN108872651 A CN 108872651A CN 201810335336 A CN201810335336 A CN 201810335336A CN 108872651 A CN108872651 A CN 108872651A
- Authority
- CN
- China
- Prior art keywords
- connection pad
- plate body
- substrate
- probe card
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 239000004020 conductor Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000012360 testing method Methods 0.000 description 22
- 239000000463 material Substances 0.000 description 8
- 238000001514 detection method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000011469 building brick Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Abstract
A probe card comprising: a first plate body made of a conductive material and having a plurality of first through holes; the connectors are arranged in the first through holes and are provided with a first signal part and a first grounding part electrically connected with the first plate body; a plurality of cables, which are provided with a second signal part and a second grounding part, wherein one end part of each cable is connected with the connector, the second signal part is connected with the first signal part, and the second grounding part is connected with the first grounding part; a substrate having a plurality of mounting portions to which the other end portions of the cables are mounted, respectively; the connecting columns are respectively connected with the first plate body and the substrate; and the at least one probe is arranged on the surface of the substrate departing from the first plate body and is connected with the second signal part of the at least one cable. The first plate body can enlarge the grounding area, reduce noise interference and improve the overall electrical characteristics.
Description
Technical field
The present invention is related with probe card；Leakage current and noise jamming can be reduced by particularly relating to one kind, and can promote electrical spy
The probe card of property.
Background technique
With semiconductor related industry flourish with integrated circuit densification and electronic building brick miniatureization, for
The testing requirement of zero device of semiconductor associated electrical also gradually rises, and the precision for electrically measuring also have it is higher level
It is required that, wherein whether probe card is certain to detect the electric connection of zero device of electronics, is using a probe card as an inspection
Survey the coffret of the test signal and power supply signal between device and electronic devices under test.
For example, for the product test of wafer process, wafer acceptance testing (Wafer Acceptance Test,
WAT be) whether analyze wafer process according to electric test value problematic, to ensure wafer quality and stability can not or
Scarce test program.Wherein, since wafer acceptance testing focuses on the conduction of each layer structure in wafer process, work as survey
When having leakage current generation between examination path, the correctness of test result will be seriously affected, therefore, how to provide a kind of probe
Card can reduce unnecessary leakage current in test environment and generate, so that integrated testability path is protected and reduces noise and does
It disturbs, and then promotes the electrical characteristic of probe card, be that the present inventor one of wants to solve the problems, such as.
Summary of the invention
In view of this, so that integrated testability path is protected, and being dropped the purpose of the present invention is to provide a kind of probe card
The generation and noise jamming of low-leakage current.
To reach above-mentioned purpose, a kind of probe card provided by the invention includes：One first plate body, by conductive material system
At first plate body has multiple first perforation；Multiple connectors are respectively arranged in the multiple first perforation, institute
It states multiple connectors and is respectively provided with one first signal section and one first grounding parts, first grounding parts and first plate body
It is electrically connected；Multiple cables are respectively provided with a second signal portion and one second grounding parts, one end part of the multiple cable
It is not connect with the multiple connector, and the second signal portion and first signal section are electrically connected, second ground connection
Portion and first grounding parts are electrically connected；One substrate has multiple mounting portions, supplies the other end of the multiple cable respectively
Installation；Multiple connecting columns, the one end of the multiple connecting column are connected to first plate body, and the other end is connected to the base
Plate；And an at least probe, the surface that the substrate deviates from first plate body is set, an at least probe with wherein extremely
The second signal portion of a few cable is electrically connected.
Effect of the invention is that being grounded by the design of the first plate body for the multiple cable, and then expand
Contact area on electrical path ensures more stable electrical characteristic accordingly, reduces leakage current and noise jamming, further promoted
Probe card electrical characteristic.
Detailed description of the invention
Fig. 1 is the application schematic diagram of the probe card of one embodiment of the invention.
Fig. 2 is the perspective view of the probe card of above-described embodiment.
Fig. 3 is the perspective view at another visual angle of probe card of above-described embodiment.
Fig. 4 is the exploded view of the probe card of above-described embodiment.
Fig. 5 is the perspective view of the connector of the probe card of above-described embodiment.
Fig. 6 is the connector of the probe card of above-described embodiment and the schematic diagram that cable is electrically connected.
Fig. 7 is that the connection pad ring of the probe card of above-described embodiment is set to the enlarged drawing of base plate bottom.
Fig. 8 is the partial enlarged view of the connection pad ring of the probe card of above-described embodiment, is disclosed between cable, connection pad ring and probe
Electrical connection.
Fig. 9 is the laminated construction schematic diagram of the connection pad ring of the probe card of above-described embodiment.
【Symbol description】
1 detection machine
1a detection line
2 electronic objects to be measured
[present invention]
100 probe cards
10 substrates
12 mounting portions
20 first plate bodys
22 first perforation 24 grasp hole
30 ends the connector 30a end 30b
32 first 34 first grounding parts of signal section, 35 pin
36 first protection departments
40 second plate body 40a perforation
The perforation of 42 first surface, 44 second surface 46 second
50 connecting columns
60 cables
62 second signal portion, 64 second grounding parts, 66 second protection department
70 connection pad rings
72 substrate, 74 connection pad group, 741 first connection pad
742 second parts the connection pad 742a part 742b
76 insulating layers
80 probes
82 needle point, 84 needle body, 86 backshank
90 needle stands
Specific embodiment
For that can be illustrated more clearly that the present invention, now for an embodiment and it is described in detail with the accompanying drawings as follows.It please join Fig. 1 to figure
Be the probe card 100 of one embodiment of the invention shown in 5, it is applied between a detection machine 1 and an electronic object 2 to be measured,
Electronic object 2 to be measured is given will test the test signal transmitting that machine 1 is issued, or is received electrically from electronic object 2 to be measured
Signal or the test signal return of feedback carry out electrical detection to detection machine 1 accordingly.Probe card 100 includes：One substrate 10,
One first plate body 20, multiple connectors 30, one second plate body 40, multiple connecting columns 50, multiple cables 60, a connection pad ring 70 and
An at least probe 80.
Substrate 10 can be but be not limited to printed circuit board (PCB) that electronic building brick can be arranged according to use demand, and (figure is not
Show), and may be provided with multiple electrical paths, such as signal path, grounding path, and for electronic building brick electric connection.In addition,
In this present embodiment, substrate 10 includes multiple mounting portions 12 for perforating, and with for fixing cable 60, but is answered in other
With mounting portion 12 is not limited with perforation, can be also made of other structures.
First plate body 20 is made of an electrically conducting material, and is located at the top of substrate 10, and the first plate body 20 has multiple first
Perforation 22.In this present embodiment, it is preferred that the first plate body 20 is made of the metal plate of full wafer, and has good conductive characteristic.
In addition, can also offer multiple grasping holes 24 in the first plate body 20, thereby, the first plate body 20 is whole also to can be used as handle, and can
Good space of taking is provided and passes through the movement that these grasping holes 24 grasp pick-and-place for user's finger, and can be from dirt
Stain is stained the component in probe card 100, and generation the case where influence electrical characteristic.Wherein, it is preferred that these grasp hole 24 and are formed
In the central position of the first plate body 20.Wherein, aforementioned first plate body 20 is mainly used for increasing earth-continuity area and grasping
Handle uses.In electrically considering aspect, because being to make ground connection to use, metal plate can effectively increase the ground plane of probe card 100
Product to reduce noise jamming, and then is promoted whole electrical.Aspect is considered in machinery, it is main due to being to make handle grasping pick-and-place to use
It pays the utmost attention to the high material of structural strength and metal plate is made, it is preferred that steel or aluminium can be used in the material of metal plate, has
The advantages that intensity is high, cheap acquirement is easy and material property is good.In addition, other materials also can be used in other application
Material forms the first conductive plate body, for example, other metal materials such as copper, iron, silver, gold or combinations thereof can be used, without
It is limited with steel above-mentioned, aluminium.
These connectors 30 are respectively arranged in these first perforation 22 of the first plate body 20, and one end 30a is supplied and detection
The detection line 1a of machine 1 is electrically connected, and the other end 30b supplies to be electrically connected with cable 60.Separately please cooperate shown in Fig. 5 together, connects
Device 30 at least have one first signal section 32 (signal), one first grounding parts 34 (ground), the first grounding parts 34 with for
It is electrically connected with the first plate body 20.In this present embodiment, connector 30 is three mandrel connectors (Triaxial Connector), and
It include further one first protection department 36 (Guard), and the first grounding parts 34 are by the casing part institute structure of three mandrel connectors
At, and the first grounding parts 34 further include having multiple pins 35, and the first protection department 36 is located at the first signal section 32 and the first ground connection
Between portion 34.In addition, three mandrel connectors of other kenels also can be used in connector 30, without shown in Fig. 5 in other application
Form be limited.
For second plate body 40 between the first plate body 20 and circuit board 10, the second plate body 40 has opposite facing one first table
Face 42 and a second surface 44, first surface 42 face the first plate body 20, and second surface 44 faces circuit board 10, and in first
At least one of them of surface 42 and second surface 44 has a junction, with the first grounding parts 34 for these connectors 30
It is electrically connected；In addition, the second plate body 40 also have it is multiple second perforation 46, these second perforation 46 respectively with these first perforation
22 is corresponding.
In this present embodiment, the second plate body 40 is using for single side golden plate, and first surface 42 is insulating surfaces, and the
Two surfaces 44 have as changed golden (Electroless Nickel Immersion Gold, ENIG) surface treatment to be formed
The junction of electric conductivity and solderability, junction with solder for combining.It please cooperate shown in Fig. 3 to Fig. 5, these connectors 30
Pin 35 pass through these the second perforation 46, and be welded on the junction of second surface 44, and make the of connector 30
The junction of one grounding parts 34 and second surface 44 is electrically connected.
In addition, not by taking single side golden plate as an example, in practice, it also can be used in the second plate body 40 in other implementations
He forms junction at technology, such as is included to surface but be not limited to spray tin, lead-free tin spray, change tin, change silver, plating firmly
Gold, the soft gold of plating or organic surface treatment of OSP etc., it is aforementioned for being connected with what the first grounding parts 34 were electrically connected to be formed
Portion；In addition, can also be arranged on the surface of the second plate body 40 just like conducting resinl (or Conduction type adhesive) in an embodiment
Or the junction that conducting resinl is constituted, without being limited with above description, wherein conducting resinl is led to have after a kind of solidification or drying
The adhesive of electrical property, is usually mainly made of matrix resin and conductive filler.
In addition, also first surface 42 can be provided with junction in an embodiment, and for the progress of the first grounding parts 34
It is electrically connected, uses expansion contact area, noise jamming is reduced, to obtain good electrical characteristic.In addition, in an embodiment
In, the second plate body 40 also can be a metal plate, and in be provided on any surface of metal plate for welding, for solder attachment
Junction, so that the pin 35 of connector 30 is welded to connect, without being limited with above description.Wherein, the second plate body 40
It is analogous to the first plate body 20 using the material selection of metal plate, is repeated no more in this.
It please join shown in Fig. 1 and Fig. 4, these connecting columns 50 wear the second plate body 40, and one end is connected to the first plate body
On 20, the other end is connected on the substrate 10.For example, in this present embodiment, the second plate body 40 has multiple perforation 40a, respectively
Placed for these connecting columns 50, the both ends of these connecting columns 50 bear against in the first plate body 20 on substrate 10, and even
The both ends for connecing column 50 are respectively arranged with stud and screw hole, and set fixation for nut and bolt lock respectively, use and are connected by these
The configuration of column 50, with the relative position between the first plate body of strong fix 20 and substrate 10.In addition, in this present embodiment, connection
Column 50 be made of with conductor, such as using copper post as connecting column 50, and connecting column 50 can be electrically connected the first plate body 20 and
On an at least grounding path on substrate 10, expansion contact area is used, and helps to draw the noise jamming on test path
Ground is connected, to can get good electrical characteristic.In addition, in practice also the second plate body can be electrically connected by connecting column 50
40, the grounding path of the first plate body 20 and substrate 10 uses further expansion contact area, promotes electrical characteristic.
These cables 60 are set to 20 lower section of the first plate body, are electrically connected respectively with connector 30, in the present embodiment
In, it is to show two 60 explanations of cable.Please cooperate shown in Fig. 6 together, cable 60 include at least have a second signal portion 62 and
One second grounding parts 64, in addition, cable 60 can further include that one second protection department 66 is located at second signal portion 62 and
Between two grounding parts 64, interfered for shielding second signal portion 62 from external noise.In this present embodiment, the second of cable 60
Signal section 62 is surround by the second protection department 66, and the second protection department 66 is surround by the second grounding parts 64, and the second protection department 66 is located at the
Between binary signal portion 62 and the second grounding parts 64, an insulating layer is respectively arranged between second signal portion 62 and the second protection department 66
68, another insulating layer 68 is provided between the second protection department 66 and the second grounding parts 64, to be used as electrical isolation.Yu Benshi
It applies in example, the one end of cable 60 is electrically connected with connector 30 respectively, and its second signal portion 62 and 30 center of connector
First signal section 32 is electrically connected, the pin 35 of the second grounding parts 64 and connector 30 be electrically connected so that with the first grounding parts 34
It is electrically connected, the second protection department 66 is then electrically connected with the first protection department 36 of connector 30；Then pacify the other end of cable 60
In each mounting portion 12 loaded on substrate 10.
Connection pad ring 70 is to be set to substrate 10, and includes a substrate 72 and multiple connection pad groups 74.In this present embodiment,
Substrate 72 is made with insulating materials, and is connect with substrate 10, it is preferred that is set to 10 lower section of substrate, such as is set to substrate 10
Away from the surface of the first plate body 20, wherein in practice, insulating cement can be used to link substrate 72 and substrate 10.It please one
And cooperate shown in Fig. 7 to Fig. 9, connection pad ring 70 is set to the periphery of needle stand 90, and these mounting portions 12 are centered around connection pad ring 70
Periphery, these connection pad groups 74 are set to the surface that substrate 72 deviates from substrate 10 spaced apartly, and each connection pad group 74 includes at least
There is one first connection pad 741, is electrically connected and supplies the second signal portion 62 of an at least cable 60 electrically to connect with for a probe 80
It connects, probe 80 and the second signal portion 62 of cable 60 is made to establish electrical connection；Furthermore it is preferred that, each connection pad group 74 more into
One step further includes having one second connection pad 742, and the second connection pad 742 wraps around and encloses the first connection pad 741, the second connection pad 742 and first
Connection pad 741 is separated by regular intervals, separates the second connection pad 742 with the first connection pad 741 and electrically isolated from one another, these second connect
Pad 742 is electrically connected to the second protection department 66 for an at least cable 60 respectively.In the present embodiment, connection pad group 74 is base
Material 72 formed as changed golden watch surface treatment, but in other application, is not limited thereto, and in other application, can be used
Other surfaces processing mode, such as：It, can electron-donating company to be formed using the surface treatment modes such as nickel, electroplating gold and naked copper are changed
Connect the connection pad group 74 with welding；Alternatively, other modes also can be used to be arranged on 72 surface of substrate or be formed with for being electrically connected
Or the first connection pad 741 and the second connection pad 742 of welding.It is noted that by aforementioned each second connection pad 742 respectively around each
The design of first connection pad 741 can be promoted and electrically isolate effect between these first connection pads 741, and can be reduced to test process
When, generated leakage current reciprocal effect between these first connection pads 741 is used and promotes the accurate of electrical characteristic and test
Degree, so that electrical path by more perfect protection, in addition, passing through the design of the second connection pad 742, may also function as institute in environment
The noise jamming of generation or the effect of the first connection pad of electrostatic diversion 741, so that test path is protected and reduces noise
Interference promotes the electrical characteristic of probe card 100, test result is avoided to be distorted.
Additionally, it is preferred that, connection pad ring 70 also includes an insulating layer 76, is set in these connection pad groups 72, and insulating layer
76 at least part to cover these the second connection pads 742, in addition, further can be used to cover these the first connection pads 741
At least partially, and part is left behind for the demand position welding or be electrically connected, so that cable 60, probe 80 are welded
Or it is electrically connected.For example, in this present embodiment, insulating layer 76 covers the middle section part of the second connection pad 742, and not insulated
The part 742a of second connection pad 742 of 76 covering of layer, 742b are located at the two sides of the first connection pad 741.By above-mentioned design, may be used
It avoids the first connection pad 741 and the second connection pad 742 is defaced or surface short-circuit and that influence electrical characteristic, for example, can avoid using
Person's hand greasy dirt touches connection pad surface, and generation the case where cause greasy dirt and connection pad to form electrical path and influence electrical characteristic.
In this present embodiment, insulating layer 76 is to be realized with dielectric ink coating, such as anti-solder ink (Solder Mask) can be used to make
For insulating layer 76, but in other application, be not limited thereto, also can be used insulating cement, insulated rubber film or insulating tape etc. with
Constitute insulating layer 76 above-mentioned.In this present embodiment, the shape of connection pad ring is annular shape, but in other application, connection pad ring
Shape is not limited with annular shape, also can be Q-RING, vesica piscis etc. for example.
Probe 80 is set to the surface that substrate 10 deviates from the first plate body 20, and in this present embodiment, the probe 80 includes
There are a needle point 82, a needle body 84 and a backshank 86, some of the needle body 84 to be fixed in needle stand 90, and the needle body 84 is from needle stand 90
The both ends of exposing are connected separately with needle point 82 and backshank 86, and backshank 86 is electrically connected on the first connection pad 741, such as can be passed through
Backshank 86 is welded on the first connection pad 741 by the mode of welding, needle point 82 to contact measured electronic object 2 to be detected,
Furthermore, it is understood that needle point 82 is to the connection pad on contact measured electronic object 2.Wherein, please cooperate shown in Fig. 7 and Fig. 8, needle stand
90 are set to the lower section of substrate 10, are made with isolation material, such as can be made with epoxy resin (epoxy), to fixed and
Supporting probe 80.
In addition, cable 60 is with two cables 60 for one group it is noted that in this present embodiment, with connection pad group 74,
One probe 80 establishes electrical connection, and furthermore, in two cables 60, respective second grounding parts 64 are electrical each other
Connection, respective second protection department 66 is electrically connected to same second connection pad 742, for example, being all soldered to the portion of the second connection pad 742
Divide 742b, respective second signal portion 62 is electrically connected to same first connection pad 741.Wherein, it is based on Kai Erwen connection (Kelvin
Connection) principle, wherein a cable 60 is used as the path the line of induction (Sense Line), another cable 60 is then supplied
Automatic raising voltage thereby when the line of induction senses pressure drop, is carried out the offset of offset voltage by the path line (Force Line),
Solution is used as because route internal resistance value influences generated problem of pressure drop, is used so that whole test path is by completeer
Kind protection, and then promote the electrical characteristic of probe card 100 and the accuracy of test result.
Thereby, probe card 100 provided by the present invention is large area conductive material by the first plate body 20, especially golden
Belong to the design of conductive material, is electrically connected for the first grounding parts 34 of connector 30, and then expand contact area, so as to have
Help inhibit noise jamming, promotes the electrical characteristic of probe card 100.It is firm in addition to can provide by the design of the second plate body 40
Fix these connectors 30, make connector 30 be not easy to loosen because operating with it is outer, can also additional further expansion contact area,
Enhancing inhibits the effect of noise jamming.In addition, passing through the design of connection pad ring 70, facilitate the length of the probe 80 used needed for shortening
Degree, so that electrically matching is more perfect, and fixes the backshank 86 of probe 80 and the contact of cable 60, in addition, by connection pad
The design of the connection pad group 74 of ring 70 can further make test path, electrical path by more perfect protection, reduce environment
The influence of noise, leakage current to test result.
The foregoing is merely preferably possible embodiments of the invention, carried out by all application description of the invention and claim
Equivalence changes, ought to be comprising within the scope of the present invention.In addition, it should be noted that, in above-described embodiment
The top, lower section isotropy noun, are based on placement angle shown in the drawings, to illustrate between each component
Relative positional relationship, rather than absolute positional relation.
Claims (11)
1. a kind of probe card comprising have：
One first plate body, is made of an electrically conducting material, and first plate body has multiple first perforation；
Multiple connectors are respectively arranged in the multiple first perforation, and the multiple connector is respectively provided with one first letter
Number portion and one first grounding parts, first grounding parts and first plate body are electrically connected；
Multiple cables, are respectively provided with a second signal portion and one second grounding parts, the one end of the multiple cable respectively with
The multiple connector connection, and the second signal portion and first signal section are electrically connected, second grounding parts with
First grounding parts are electrically connected；
One substrate has multiple mounting portions, installs respectively for the other end of the multiple cable；
Multiple connecting columns, the one end of the multiple connecting column are connected to first plate body, and the other end is connected to the base
Plate；And
An at least probe, be arranged in the substrate deviate from first plate body surface, an at least probe with wherein at least
The second signal portion of one cable is electrically connected.
2. probe card as described in claim 1 includes one second plate body, be located at first plate body and the substrate it
Between, second plate body has an opposite facing first surface and a second surface, and the first surface faces first plate body,
The second surface faces the substrate, and at least one of them of the first surface and the second surface has one to connect
Portion, with for first grounding parts electric connection.
3. probe card as claimed in claim 2, wherein the second surface of second plate body has the junction, and
Second plate body has multiple second perforation, respectively relatively the multiple first perforation；First grounding parts include more
A pin, the multiple connector places in the multiple second perforation, and the multiple pin is electrically connected the junction.
4. probe card as described in claim 1, wherein first plate body is metal plate.
5. probe card as described in claim 1 is grabbed wherein first plate body offers multiple grasping holes with for user
Taking is put.
6. including a connection pad ring, being set to the substrate, the connection pad such as probe card described in any one of claim 1 to 5
Ring includes a substrate and multiple connection pad groups, and the substrate connects the substrate；The multiple connection pad group is arranged at intervals
Deviate from the surface of the substrate in the substrate, and each connection pad group includes one first connection pad, first connection pad to
It is electrically connected for the second signal portion of an at least probe and at least one cable.
7. probe card as claimed in claim 6, wherein each connection pad group further includes having one second connection pad；It is wherein the multiple
Connector is respectively provided with one first protection department；The multiple cable is respectively provided with one second protection department, second protection department with
First protection department is electrically connected；Wherein, each second grounding parts in two cables are electrically connected to each other, respectively
Second protection department is electrically connected to same second connection pad, and each second signal portion is electrically connected to same described
One connection pad.
8. probe card as claimed in claim 7, wherein second connection pad is around described first in the same connection pad group
Connection pad, and be separated by with first connection pad at regular intervals.
9. probe card as claimed in claim 7 is set to the multiple connection pad wherein the connection pad ring includes an insulating layer
In group, and second connection pad of each connection pad group has at least part to be covered by the insulating layer.
10. probe card as claimed in claim 9, wherein in each connection pad group, the institute that is not covered by the insulating layer
The part for stating the second connection pad is located at the two sides of first connection pad.
11. probe card as claimed in claim 7, wherein each cable is three axis cables, the second signal portion is by described
Second protection department is surround, and second protection department is surround by second grounding parts.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
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| US62/502,783 | 2017-05-08 | ||
| TW106139856 | 2017-11-17 | ||
| TW106139856A TWI642941B (en) | 2017-05-08 | 2017-11-17 | Probe card |
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| CN108872651A true CN108872651A (en) | 2018-11-23 |
| CN108872651B CN108872651B (en) | 2021-05-07 |
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