CN206696395U - Arrangement for testing integrated circuit and its electric conductor component - Google Patents
Arrangement for testing integrated circuit and its electric conductor component Download PDFInfo
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- CN206696395U CN206696395U CN201720299521.0U CN201720299521U CN206696395U CN 206696395 U CN206696395 U CN 206696395U CN 201720299521 U CN201720299521 U CN 201720299521U CN 206696395 U CN206696395 U CN 206696395U
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- electric conductor
- conductor component
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Abstract
The utility model discloses a kind of electric conductor component of arrangement for testing integrated circuit, for integrated circuit to be tested and the test printed circuit board of being electrically conducted in arrangement for testing integrated circuit, the electric conductor component includes probe mounting blocks and multiple probes, the probe mounting blocks are provided with multiple mounting holes through its upper and lower surface, the multiple probe distinguishes corresponding inserted in the multiple mounting hole, the probe mounting blocks include the electric signal shielding construction formed by conductive material, for being shielded to the electric signal passed through in each probe, to prevent the electric signal passed through in the multiple probe from interfering.A kind of arrangement for testing integrated circuit using the electric conductor component is also disclosed in the utility model.The utility model can realize the Validity Test to high-frequency signal, and possess the advantages of low cost.
Description
Technical field
It the utility model is related to ic test technique field, more particularly to a kind of arrangement for testing integrated circuit and its lead
Electric body component.
Background technology
With the reduction of integrated circuit feature size, collect expansion on a large scale and the raising of clock frequency, signal connecting line
On interconnection effect turned into influence circuit signal integrality and systematic entirety can principal element.In high speed circuit,
Due to Kelvin effect, the influence of the factor such as edge effect and substrate loss, the distributed constant of interconnection line shows with what frequency changed
As more and more common.Requirement to measuring technology also more and more higher.
Test for high-frequency integrated circuit must then be tested using special high frequency electric conductor, and this adhesive integrated circuit is surveyed
Trial assembly puts that price is high, the increase to dependence test enterprise tape test cost.
Utility model content
Main purpose of the present utility model is to provide a kind of arrangement for testing integrated circuit, by entering to its electric conductor component
Row improves, and to realize the Validity Test to high-frequency signal, and arrangement for testing integrated circuit is possessed the advantages of low cost.
To achieve these goals, the utility model provides a kind of electric conductor component of arrangement for testing integrated circuit, is used for
With integrated circuit to be tested and the test printed circuit board of electrically conducting, the electric conductor component bag in arrangement for testing integrated circuit
Probe mounting blocks and multiple probes are included, the probe mounting blocks are provided with multiple mounting holes through its upper and lower surface, institute
Multiple probe difference corresponding inserteds are stated in the multiple mounting hole, the probe mounting blocks include the electricity formed by conductive material
Signal shielding structure, for being shielded to the electric signal passed through in each probe, to prevent institute in the multiple probe
The electric signal of process interferes.
Preferably, the probe mounting blocks are made of an electrically conducting material, and are insulated between the probe mounting blocks and the probe.
Preferably, the probe mounting blocks in the internal face of the mounting hole formed with inner insulating layer, and/or the probe
Outer peripheral face formed with external insulation layer.
Preferably, the upper and lower surface of the probe mounting blocks is respectively formed with the first insulating barrier and the second insulation
Layer.
Preferably, the probe mounting blocks include upper mounting plate and lower installation board, are folded in the middle part of the probe described
Between upper mounting plate and lower installation board, the upper/lower terminal of the probe protrudes from the upper mounting plate and lower installation board respectively.
Preferably, the electric conductor component also includes postive stop baffle, the upper surface and/or lower surface of the probe mounting blocks
Provided with the postive stop baffle, corresponded on the postive stop baffle mounting hole be provided with for the probe end pass through it is spacing
Hole, with to the probe carry out positioning and it is spacing.
Preferably, the postive stop baffle is made up of insulating materials；Or
The postive stop baffle includes the conductive layer and insulating layer being superimposed together, and the spacing hole runs through the conduction
Layer and insulating barrier, the circumferential distribution in the insulating barrier in each mounting hole have the multiple conductions perpendicular with the conductive layer
Post, the multiple conductive pole are conductively connected with the conductive layer.
Preferably, the number of plies of the conductive layer is at least two layers, conductive by the conductive pole between adjacent conductive layer
Connection.
Preferably, the probe mounting blocks include the conductive layer and insulating layer being superimposed together, and the mounting hole passes through
The conductive layer and insulating layer is worn, the number of plies of the conductive layer is at least two layers, is turned between adjacent conductive layer.
Preferably, it is conductively connected between adjacent conductive layer by the conductive pole perpendicular with the conductive layer, often
The circumferential distribution of one mounting hole has multiple conductive poles.
Preferably, the probe mounting blocks include upper mounting plate and lower installation board, are folded in the middle part of the probe described
Between upper mounting plate and lower installation board, the upper/lower terminal of the probe protrudes from the upper mounting plate and lower installation board respectively.
To achieve these goals, the utility model also provides a kind of arrangement for testing integrated circuit, including hold-down mechanism and
For placing the limitting casing of to-be-measured integrated circuit, the arrangement for testing integrated circuit also includes foregoing electric conductor component, described
The lower end of the probe of electric conductor component is used to be located at the electric conductor with test printed circuit board conductive contact, the limitting casing
On the upside of component electric conductor component, the hold-down mechanism makes to treat located at the top of the limitting casing for compressing to-be-measured integrated circuit
Survey the pin of integrated circuit and corresponding probe conductive contact.
Preferably, when carrying out electric performance test to to-be-measured integrated circuit, the electric signal shielding knot of the electric conductor component
Structure is connected with the ground wire of to-be-measured integrated circuit and test with the ground wire of printed circuit board simultaneously.
The electric conductor component of the utility model arrangement for testing integrated circuit, by being set on probe mounting blocks by conduction material
Expect the electric signal shielding construction formed, it is described more to prevent for being shielded to the electric signal passed through in each probe
The electric signal passed through in individual probe interferes, so as to greatly reduce the high-frequency signal of the pin of to-be-measured integrated circuit 300
Transmission loss, the signal interference between each pin is preferably minimized, and reduces the design difficulty of arrangement for testing integrated circuit, it is real
Show inexpensive mode to test high-frequency signal.
Brief description of the drawings
Fig. 1 is the assembling view of the electric conductor component first embodiment of the utility model arrangement for testing integrated circuit.
Fig. 2 is the structural representation of electric conductor component middle probe mounting blocks shown in Fig. 1.
Fig. 3 is the exploded view of electric conductor component shown in Fig. 1.
Fig. 4 is the assembling view of the electric conductor component second embodiment of the utility model arrangement for testing integrated circuit, its
Not shown in probe.
Fig. 5 is the assembling view of the electric conductor component 3rd embodiment of the utility model arrangement for testing integrated circuit, its
Not shown in probe.
Fig. 6 is the assembling view of the electric conductor component fourth embodiment of the utility model arrangement for testing integrated circuit, its
Not shown in probe.
Fig. 7 is the assembling view of the embodiment of electric conductor component the 5th of the utility model arrangement for testing integrated circuit, its
Not shown in probe.
Fig. 8 is sectional views of the Fig. 7 along line A-A.
Fig. 9 is the assembling view of the electric conductor component sixth embodiment of the utility model arrangement for testing integrated circuit, its
Not shown in probe.
Figure 10 is sectional views of the Fig. 9 along line B-B.
Figure 11 is the exploded view of electric conductor component shown in Fig. 9.
Figure 12 be the embodiment of the utility model arrangement for testing integrated circuit one assembling schematic diagram, which part section view.
Realization, functional characteristics and the advantage of the utility model purpose will be described further referring to the drawings in conjunction with the embodiments.
Embodiment
It should be appreciated that embodiment described herein is not used to limit only to explain the utility model
The utility model.
The utility model provides a kind of electric conductor component of arrangement for testing integrated circuit, in arrangement for testing integrated circuit
With integrated circuit to be tested and the test printed circuit board of electrically conducting, the electric conductor component includes probe mounting blocks and multiple
Probe, the probe mounting blocks are provided with multiple mounting holes through its upper and lower surface, and the multiple probe corresponds to respectively
It is inserted in the multiple mounting hole, it is characterised in that the probe mounting blocks are formed with electric signal shielding construction, for every
The electric signal passed through in one probe is shielded, to prevent the electric signal passed through in the multiple probe from interfering.
As shown in Figure 1 to Figure 3, the utility model arrangement for testing integrated circuit electric conductor component first embodiment
In, electric conductor component 100 includes probe mounting blocks 10 and multiple probes 20, and the probe mounting blocks 10, which are provided with, runs through its upper surface
101 and multiple mounting holes 103 of lower surface 102, the multiple probe 20 distinguishes corresponding inserted in the multiple mounting hole 103
Interior, the probe mounting blocks 10 include the electric signal shielding construction formed by conductive material, for institute in each probe 20
The electric signal of process is shielded, to prevent the electric signal passed through in the multiple probe 20 from interfering.
Specifically, in the present embodiment, the probe mounting blocks 10 are made of an electrically conducting material so that whole probe mounting blocks
10 form the electric signal shielding construction, and the electric signal shielding construction has the electric signal function of shielding of similar coaxial cable.
Wherein, conductive material can be the one or more in copper, aluminium, iron and its alloy.The probe mounting blocks 10 with it is described
It is insulation between probe 20, i.e., is not turned between the electric signal shielding construction of probe 20 and probe mounting blocks 10, to avoid by leading
The electric signal shielding construction that electric material is formed turns on multiple probes 20 simultaneously and influences proper testing.
In the present embodiment, between probe mounting blocks 10 and probe 20 insulation be by the probe mounting blocks 10 in institute
The internal face 104 for stating mounting hole 103 forms inner insulating layer, and/or forms external insulation layer in the outer peripheral face 201 of the probe 20,
It can so make to be insulated contact between probe mounting blocks 10 and probe 20.The inner insulating layer and external insulation layer can pass through table
The nano coating or insulating oil enamelled coating that face insulation processing is formed, when probe mounting blocks 10 are made up of aluminium alloy, the interior insulation
Layer and external insulation layer can also be the oxide layer formed by aluminium alloy anode oxide.
Further, the upper surface 101 of the probe mounting blocks 10 and lower surface 102 be respectively formed with the first insulating barrier and
Second insulating barrier, so, when carrying out electric performance test to integrated circuit to be tested, the upper surface of probe mounting blocks 10 can be avoided
101 and lower surface 102 influence proper testing with integrated circuit to be tested and test printed circuit board conductive contact respectively.
Reference picture 3, in the present embodiment, the probe mounting blocks 10 include upper mounting plate 11 and lower installation board 12, described
Mounting hole 103 includes the first hole portion 1031 positioned at the upper mounting plate 11 and the second hole portion on the lower installation board 12
1032, the hole portion 1032 of the first hole portion 1031 and second is trapezoidal hole, and the big end and second of first hole portion 1031
The big end of hole portion 1032 is mutually close.The middle part of the probe 20 is folded between the upper mounting plate 11 and lower installation board 12, institute
The upper/lower terminal for stating probe 20 protrudes from the upper mounting plate 11 and lower installation board 12 respectively.Lower surface 102 as needed is with
It can also be conductive layer above mounting blocks 12.
In the present embodiment, probe mounting blocks 10 are made of an electrically conducting material and including upper mounting plates 11 and lower installation board 12.
In other embodiments, probe mounting blocks 10 can also be other structures form, the monoblock being for example, made of an electrically conducting material
Plate, or except upper mounting plate 11 and lower installation board, in addition to intermediate die plate.
As shown in figure 4, the second embodiment of the electric conductor component for the utility model arrangement for testing integrated circuit, in this reality
Apply in example, electric conductor component 100a includes probe mounting blocks 10a and multiple probes (do not go out probe, the concrete structure of probe in Fig. 4
It can refer to the probe 20 in first embodiment shown in Fig. 3, this be equally applicable to the associated description of probe 20 in first embodiment
Embodiment), the probe mounting blocks 10a is provided with multiple mounting hole 103a through its upper surface 101a and lower surface 102a, institute
State multiple probes and distinguish corresponding inserted in (mounting means of probe can refer to Fig. 1), the spy in the multiple mounting hole 103a
Pin mounting blocks 10a includes the electric signal shielding construction formed by conductive material, for the telecommunications to being passed through in each probe
Number shielded, to prevent the electric signal passed through in the multiple probe from interfering.
Specifically, in the present embodiment, the probe mounting blocks 10a is made of an electrically conducting material so that whole probe installation
Block 10a forms the electric signal shielding construction, and the electric signal shielding construction has the electric signal shielding work(of similar coaxial cable
Energy.Wherein, conductive material can be the one or more in copper, aluminium, iron and its alloy.The probe mounting blocks 10a with
It is insulation between the probe, i.e., is not turned between the electric signal shielding construction of probe and probe mounting blocks 10, to avoid by leading
The electric signal shielding construction that electric material is formed turns on multiple probes simultaneously and influences proper testing.
In the present embodiment, between probe mounting blocks 10a and probe insulation be by the probe mounting blocks 10a in institute
The internal face 104a for stating mounting hole 103a forms inner insulating layer, and/or forms external insulation layer in the outer peripheral face of the probe, so
It can make to be insulated contact between probe mounting blocks 10a and probe.The inner insulating layer and external insulation layer can be exhausted by surface
Edge processing formed nano coating or insulating oil enamelled coating, when probe mounting blocks 10a is made up of aluminium alloy, the inner insulating layer and
External insulation layer can also be the oxide layer formed by aluminium alloy anode oxide.As needed can be by connecing corresponding to integrated circuit
The mounting hole 103a of ground pin internal face 104a is arranged to conductive, so by the electrical connection in probe and internal face 104a faces,
So as to realize that shielding construction is grounded, more preferable shielding action is realized.
Further, the upper surface 101a and lower surface 102a of the probe mounting blocks 10a is respectively formed with the first insulation
Layer and the second insulating barrier, so, when carrying out electric performance test to integrated circuit to be tested, it can avoid probe mounting blocks 10a's
Upper surface 101a and lower surface 102a influences just with integrated circuit to be tested and test printed circuit board conductive contact respectively
Often test.
In the present embodiment, probe mounting blocks 10a is the monoblock plate body formed by conductive material, and mounting hole 103a is ladder
Shape hole, and mounting hole 103a big end upwards for probe on from lower insertion.
As shown in figure 5, the 3rd embodiment of the electric conductor component for the utility model arrangement for testing integrated circuit, in this reality
Apply in example, electric conductor component 100b includes probe mounting blocks 10a and multiple probes (do not go out probe, the concrete structure of probe in Fig. 5
It can refer to the probe 20 in first embodiment shown in Fig. 3, this be equally applicable to the associated description of probe 20 in first embodiment
Embodiment), the probe mounting blocks 10a is provided with multiple mounting hole 103a through its upper surface 101a and lower surface 102a, institute
State multiple probes and distinguish corresponding inserted in (mounting means of probe can refer to Fig. 1), the spy in the multiple mounting hole 103a
Pin mounting blocks 10a includes the electric signal shielding construction formed by conductive material, for the telecommunications to being passed through in each probe
Number shielded, to prevent the electric signal passed through in the multiple probe from interfering.
Second embodiment middle probe mounting blocks 10a knot shown in the structure and Fig. 4 of probe mounting blocks 10a in embodiment
Structure is identical, can refer to the description to probe mounting blocks 10a in Fig. 4 and second embodiment.In the present embodiment, electric conductor component
100b further comprises postive stop baffle 30, and the upper surface 101a of the probe mounting blocks 10a is provided with the postive stop baffle 30, described
The mounting hole 103a is corresponded on postive stop baffle 30 and is provided with the spacing hole 301 passed through for the end of probe, to determine probe
Position and it is spacing.Insulated contact between postive stop baffle 30 and probe, to prevent multiple probe mutual conductions.
In the present embodiment, mounting hole 103a is upward for trapezoidal hole and mounting hole 103a big end, probe mounting blocks 10a's
Upper surface 101a is provided with postive stop baffle 30.Probe mounting blocks 10a and the combination not limited to this of postive stop baffle 30, can also be it
Its mode, for example, mounting hole on probe mounting blocks is the big end of trapezoidal hole and mounting hole downwards so that probe is inserted by lower from upper
Enter, the lower surfaces of probe mounting blocks sets postive stop baffle to carry out positioning and spacing to probe；In another example on probe mounting blocks
Mounting hole is the constant straight hole in aperture, is available for probe from up to down or bottom-up insertion, the upper surface of probe mounting blocks and under
Surface be respectively provided with postive stop baffle with to probe carry out positioning and it is spacing.
As shown in fig. 6, the fourth embodiment of the electric conductor component for the utility model arrangement for testing integrated circuit, in this reality
Apply in example, electric conductor component 100c includes probe mounting blocks 10c and multiple probes (do not go out probe, the concrete structure of probe in Fig. 6
It can refer to the probe 20 in first embodiment shown in Fig. 3, this be equally applicable to the associated description of probe 20 in first embodiment
Embodiment), the probe mounting blocks 10c is provided with multiple mounting hole 103c through its upper surface 101c and lower surface 102c, institute
State multiple probes and distinguish corresponding inserted in (mounting means of probe can refer to Fig. 1), the spy in the multiple mounting hole 103c
Pin mounting blocks 10c includes the electric signal shielding construction formed by conductive material, for the telecommunications to being passed through in each probe
Number shielded, to prevent the electric signal passed through in the multiple probe from interfering.
Second embodiment middle probe mounting blocks 10a knot shown in the structure and Fig. 4 of probe mounting blocks 10c in embodiment
Structure is identical, and same section can refer to the description to probe mounting blocks 10a in Fig. 4 and second embodiment.In the present embodiment, probe
Mounting blocks 10c and probe mounting blocks 10a differences are：Mounting hole 103c on probe mounting blocks 10c is the constant straight hole in aperture,
It is available for probe from up to down or bottom-up insertion, probe mounting blocks 10c upper surface 101c and lower surface 102c is respectively provided with limit
Position baffle plate 30 with to probe carry out positioning and it is spacing.In such cases, in mounting hole 103c internal face 104c can not be formed
Insulating barrier, probe is separately insulated with probe mounting blocks 10c, and make probe and the insulated contact of postive stop baffle 30.
In fourth embodiment shown in 3rd embodiment shown in Fig. 5 and Fig. 6, postive stop baffle 30 is made up of insulating materials, this
Sample, it is not necessary to insulation processing is carried out to postive stop baffle 30 and probe, you can realize the insulation between postive stop baffle 30 and probe.
As shown in Figure 7 and Figure 8, for the utility model arrangement for testing integrated circuit electric conductor component the 5th embodiment.
In the present embodiment, electric conductor component 100d includes probe mounting blocks 10d and multiple probes (do not go out probe, the tool of probe in Fig. 7
Body structure can refer to the probe 20 in first embodiment shown in Fig. 3, equally suitable to the associated description of probe 20 in first embodiment
For the present embodiment), the probe mounting blocks 10d is provided with multiple mounting holes through its upper surface 101d and lower surface 102d
103d, the multiple probe difference corresponding inserted in (mounting means of probe can refer to Fig. 1) in the multiple mounting hole 103d,
The probe mounting blocks 10d includes the electric signal shielding construction formed by conductive material, for being passed through in each probe
Electric signal shielded, to prevent the electric signal passed through in the multiple probe from interfering.
Specifically, in the present embodiment, the probe mounting blocks 10d is made of an electrically conducting material so that whole probe installation
Block 10d forms the electric signal shielding construction, and the electric signal shielding construction has the electric signal shielding work(of similar coaxial cable
Energy.Wherein, conductive material can be the one or more in copper, aluminium, iron and its alloy.The probe mounting blocks 10d with
It is insulation between the probe, i.e., is not turned between the electric signal shielding construction of probe and probe mounting blocks, to avoid by conduction
The electric signal shielding construction that material is formed turns on multiple probes simultaneously and influences proper testing.
In the present embodiment, the mounting hole 103d on probe mounting blocks 10d is the constant straight hole in aperture, is available for probe from upper
Downward or bottom-up insertion, electric conductor component 100d further comprise postive stop baffle 30d, and the probe mounting blocks 10d's is upper
Surface 101d and lower surface 102d is equipped with the postive stop baffle 30d, and the mounting hole 103d is corresponded on the postive stop baffle 30d
Provided with the spacing hole 301d that passes through of end for probe, to carry out positioning and spacing to probe.Between postive stop baffle 30d and probe
Insulated contact, to prevent multiple probe mutual conductions.
In the present embodiment, the conductive layer 31 and the (figure of insulating barrier 32 that the postive stop baffle 30d includes being superimposed together
Postive stop baffle 30d 32 non-cross-hatching of insulating barrier in 7), the spacing hole 301d runs through the conductive layer 31 and insulating barrier 32,
Circumferential distribution in the insulating barrier 32 in each mounting hole 103d has the multiple conductive poles perpendicular with the conductive layer 31
33, the multiple conductive pole 33 is conductively connected with the conductive layer 31.The conductive pole 33 and conductive layer 31 collectively form telecommunications
Number auxiliary shield structure, it is the multiple further to prevent for strengthening shielding to the electric signal passed through in each probe
The electric signal passed through in probe interferes.
In the present embodiment, the number of plies of postive stop baffle 30d conductive layer 31 is one layer, in other embodiments, described to lead
The number of plies of electric layer 31 can also two layers, three layers or more layers, it is conductive even to pass through the conductive pole 33 between adjacent conductive layer 31
Connect.The postive stop baffle 30d can use the processing method of printed circuit board to be made, and conductive pole 33 can pass through printing
The plated through-hole (i.e. via) that circuit board processing method makes.
As shown in Figures 9 to 11, for the utility model arrangement for testing integrated circuit electric conductor component sixth embodiment.
In the present embodiment, electric conductor component 100e includes probe mounting blocks 10e and multiple probes (do not go out probe, the tool of probe in Fig. 9
Body structure can refer to the probe 20 in first embodiment shown in Fig. 3, equally suitable to the associated description of probe 20 in first embodiment
For the present embodiment), the probe mounting blocks 10e is provided with multiple mounting holes through its upper surface 101e and lower surface 102e
103e, the multiple probe difference corresponding inserted in (mounting means of probe can refer to Fig. 1) in the multiple mounting hole 103d,
The probe mounting blocks 10d includes the electric signal shielding construction formed by conductive material, for being passed through in each probe
Electric signal shielded, to prevent the electric signal passed through in the multiple probe from interfering.
Specifically, in the present embodiment, the probe mounting blocks 10e include the conductive layer 11e that is superimposed together and
Insulating barrier 12e (Fig. 9 middle probe mounting blocks 10e non-cross-hatchings of insulating barrier 12e), the mounting hole 103e runs through the conduction
Layer 11e and insulating barrier 12e, the conductive layer 11e number of plies are at least two layers, are turned between adjacent conductive layer 11e.
It is conductively connected between adjacent conductive layer 11e by the conductive pole 13e perpendicular with the conductive layer 11e,
Each mounting hole 103e circumferential distribution has multiple conductive pole 13e.The conductive pole 13e and conductive layer 11e collectively form institute
Electric signal shielding construction is stated, for being shielded to the electric signal passed through in each probe, to prevent the multiple probe
Middle passed through electric signal interferes.It is insulation between the probe mounting blocks 10e and probe 20, i.e., probe 20 is pacified with probe
Be not turned between dress block 10e electric signal shielding construction, with avoid the electric signal shielding construction that is formed by conductive material and meanwhile with
Multiple probes 20 turn on and influence proper testing.
The probe mounting blocks 10e can use the processing method of printed circuit board to be made, and conductive pole 33 can be
The plated through-hole (i.e. via) made by printed circuit board processing method.Conductive layer 11e and insulating barrier in probe mounting blocks 10e
12e is not limited to the number of plies shown in Fig. 9, and conductive layer 11e and insulating barrier can be suitably increased or decreased according to test request
The 12e number of plies.
As shown in figure 11, in the present embodiment, the probe mounting blocks 10e includes upper mounting plate 14e and lower installation board
15e, when installing probe 20, the middle part of probe 20 is folded between the upper mounting plate 14e and lower installation board 15e, probe 20
Upper/lower terminal protrudes from the upper mounting plate 14e and lower installation board 15e respectively.
In the present embodiment, between probe mounting blocks 10e and probe 20 insulation be by probe mounting blocks 10e in described
Mounting hole 103e internal face 104e forms inner insulating layer, and/or forms external insulation layer in the outer peripheral face 201 of the probe 20
(reference picture 3), it can so make to be insulated contact between probe mounting blocks 10e and probe 20.The inner insulating layer and external insulation layer
Can be the nano coating or insulating oil enamelled coating formed by surface insulation processing.
Further, the upper surface 101e and lower surface 102e of the probe mounting blocks 10 are respectively formed with the first insulating barrier
With the second insulating barrier, so, when carrying out electric performance test to integrated circuit to be tested, it can avoid that probe mounting blocks 10e's is upper
Surface 101e and lower surface 102e respectively with integrated circuit to be tested and test printed circuit board conductive contact and influence normal
Test.
Reference picture 11, in the present embodiment, the probe mounting blocks 10e include upper mounting plate 14e and lower installation board 15e,
The mounting hole 103e is included positioned at the first hole portion 1031e of the upper mounting plate 14e and on the lower installation board 15e
Second hole portion 1032e, the first hole portion 1031e and the second hole portion 1032e is trapezoidal hole, and the first hole portion 1031e
Big end and the second hole portion 1032e big end it is mutually close.When installing probe 20, the middle part of probe 20 is folded in the upper mounting plate
Between 14e and lower installation board 15e, the upper/lower terminal of probe 20 protrudes from the upper mounting plate 14e and lower installation board 15e respectively.
In the present embodiment, probe mounting blocks 10e includes the conductive layer 11e and insulating barrier 12e being superimposed together, and
It is divided into upper mounting plate 14e and lower installation board 15e.In other embodiments, probe mounting blocks 10 can also be other structures form,
For example, probe mounting blocks are the entire plate together with being superimposed by conductive layer 11e with insulating barrier 12e, in this case,
Fig. 4 is referred to Fig. 6, and the word description to Fig. 4 to embodiment illustrated in fig. 6, by the installation bore deformation of probe mounting blocks
Into structure shown in Fig. 4 or Fig. 6, and further can be set in the upper surface of probe mounting blocks and/or lower surface in Fig. 5 or Fig. 6
Shown postive stop baffle 30.
As shown in figure 12, it is the embodiment of the utility model arrangement for testing integrated circuit one.In the present embodiment, it is a kind of integrated
Circuit test device, including hold-down mechanism 200, the limitting casing 400 for placing to-be-measured integrated circuit 300 and electric conductor group
Part 100/100a/100b/100c/100d/100e, the lower end of the probe 20 of the electric conductor component 100 are used to print with test
The conductive contact of circuit board 500 processed, the limitting casing 400 are located at the electric conductor component 100/100a/100b/100c/100d/
100e upside, the hold-down mechanism 200 make located at the top of the limitting casing 400 for compressing to-be-measured integrated circuit 300
The pin of to-be-measured integrated circuit 300 and the corresponding conductive contact of probe 20.The electric conductor component 100/100a/100b/100c/
100d/100e concrete structure can refer to the description in this embodiment, will not be repeated here.
When carrying out electric performance test to to-be-measured integrated circuit, the electric signal shielding construction of the electric conductor component 100 is same
When and the ground wire of to-be-measured integrated circuit and the ground wire of test printed circuit board connect, realize to being passed through in each probe
Electric signal is shielded, to be measured so as to greatly reduce to prevent the electric signal passed through in the multiple probe from interfering
The transmission loss of the high-frequency signal of the pin of integrated circuit 300, is preferably minimized the signal interference between each pin, and reduces collection
Into the design difficulty of circuit test device, inexpensive mode is realized to test high-frequency signal.
The utility model is not limited to embodiment of above, under technology contents disclosed in above-mentioned embodiment, may be used also
To carry out various change.Every equivalent structure transformation made using the utility model specification and accompanying drawing content, or directly or
Other related technical areas are used in indirectly, are similarly included in scope of patent protection of the present utility model.
Claims (13)
1. a kind of electric conductor component of arrangement for testing integrated circuit, to be tested for being electrically conducted in arrangement for testing integrated circuit
Integrated circuit and test printed circuit board, the electric conductor component include probe mounting blocks and multiple probes, the probe peace
Fill block and be provided with the multiple mounting holes for running through its upper and lower surface, the multiple probe distinguishes corresponding inserted in the multiple peace
Fill in hole, it is characterised in that the probe mounting blocks include the electric signal shielding construction formed by conductive material, for each
The electric signal passed through in individual probe is shielded, to prevent the electric signal passed through in the multiple probe from interfering.
2. the electric conductor component of arrangement for testing integrated circuit as claimed in claim 1, it is characterised in that the probe mounting blocks
It is made of an electrically conducting material, is insulated between the probe mounting blocks and the probe.
3. the electric conductor component of arrangement for testing integrated circuit as claimed in claim 2, it is characterised in that the probe mounting blocks
In the mounting hole internal face formed with inner insulating layer, and/or the probe outer peripheral face formed with external insulation layer.
4. the electric conductor component of arrangement for testing integrated circuit as claimed in claim 3, it is characterised in that the probe mounting blocks
Upper and lower surface be respectively formed with the first insulating barrier and the second insulating barrier.
5. the electric conductor component of the arrangement for testing integrated circuit as described in any one in Claims 1-4 item, its feature exist
In the probe mounting blocks include upper mounting plate and lower installation board, and the upper mounting plate is folded in the middle part of the probe with
Between installing plate, the upper/lower terminal of the probe protrudes from the upper mounting plate and lower installation board respectively.
6. the electric conductor component of arrangement for testing integrated circuit as claimed in claim 2 or claim 3, it is characterised in that the electric conductor
Component also includes postive stop baffle, and the upper surface and/or lower surface of the probe mounting blocks are provided with the postive stop baffle, described spacing
The mounting hole is corresponded on baffle plate and is provided with the spacing hole passed through for the end of the probe, so that the probe is positioned and limited
Position.
7. the electric conductor component of arrangement for testing integrated circuit as claimed in claim 6, it is characterised in that the postive stop baffle by
Insulating materials is made；Or
The postive stop baffle includes the conductive layer and insulating layer that is superimposed together, the spacing hole through the conductive layer and
Insulating barrier, the circumferential distribution in the insulating barrier in each mounting hole have the multiple conductive poles perpendicular with the conductive layer,
The multiple conductive pole is conductively connected with the conductive layer.
8. the electric conductor component of arrangement for testing integrated circuit as claimed in claim 7, it is characterised in that the layer of the conductive layer
Number is at least two layers, is conductively connected between adjacent conductive layer by the conductive pole.
9. the electric conductor component of arrangement for testing integrated circuit as claimed in claim 1, it is characterised in that the probe mounting blocks
Including the conductive layer and insulating layer being superimposed together, the mounting hole runs through the conductive layer and insulating layer, the conduction
The number of plies of layer is at least two layers, is turned between adjacent conductive layer.
10. the electric conductor component of arrangement for testing integrated circuit as claimed in claim 9, it is characterised in that adjacent conductive layer
Between be conductively connected by the conductive pole perpendicular with the conductive layer, the circumferential distribution of each mounting hole has multiple lead
Electric post.
11. the electric conductor component of the arrangement for testing integrated circuit as described in claim 9 or 10, it is characterised in that the probe
Mounting blocks include upper mounting plate and lower installation board, are folded in the middle part of the probe between the upper mounting plate and lower installation board,
The upper/lower terminal of the probe protrudes from the upper mounting plate and lower installation board respectively.
12. a kind of arrangement for testing integrated circuit, including hold-down mechanism and the limitting casing for placing to-be-measured integrated circuit, its feature
It is, the arrangement for testing integrated circuit also includes the electric conductor component as described in any one in claim 1 to 11, institute
The lower end for stating the probe of electric conductor component is used to be located at the conduction with test printed circuit board conductive contact, the limitting casing
On the upside of body component electric conductor component, the hold-down mechanism makes located at the top of the limitting casing for compressing to-be-measured integrated circuit
The pin of to-be-measured integrated circuit and corresponding probe conductive contact.
13. arrangement for testing integrated circuit as claimed in claim 12, it is characterised in that carried out electrically to to-be-measured integrated circuit
When can test, the electric signal shielding construction of the electric conductor component is simultaneously electric with printing with the ground wire of to-be-measured integrated circuit and test
The ground wire connection of road plate.
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| CN201720299521.0U CN206696395U (en) | 2017-03-24 | 2017-03-24 | Arrangement for testing integrated circuit and its electric conductor component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106802391A (en) * | 2017-03-24 | 2017-06-06 | 深圳市斯纳达科技有限公司 | Arrangement for testing integrated circuit and its electric conductor component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106802391A (en) * | 2017-03-24 | 2017-06-06 | 深圳市斯纳达科技有限公司 | Arrangement for testing integrated circuit and its electric conductor component |
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