CN105634536A - Radio-frequency vertical connection circuit between two-dimensional millimeter wave modules - Google Patents
Radio-frequency vertical connection circuit between two-dimensional millimeter wave modules Download PDFInfo
- Publication number
- CN105634536A CN105634536A CN201610015093.4A CN201610015093A CN105634536A CN 105634536 A CN105634536 A CN 105634536A CN 201610015093 A CN201610015093 A CN 201610015093A CN 105634536 A CN105634536 A CN 105634536A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- probe
- dimension
- chip circuit
- board assemblies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/44—Transmit/receive switching
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention provides a radio-frequency vertical connection circuit between two-dimensional millimeter wave modules, aiming at the radio-frequency vertical connection circuit with higher reliability and more convenient assembly and disassembly. The radio-frequency vertical connection circuit is implemented through the following technical scheme: an upper module metal structural member (2) and a lower module metal structural member (4) are fixed through a screwed way or the other detachable way, and the lower end of the upper module metal structural member and the upper end of a lower module two-dimensional multi-chip circuit board component (3) are in pressure fit; a coaxial connector (5) is welded in the upper module metal structural member, so that a vertical circuit connection between an upper module two-dimensional multi-chip circuit board component (1) and the lower module two-dimensional multi-chip circuit board component is realized; and a fuzz button (53) is coaxially connected to a probe (54) of a step cylinder structure, and a small end of the probe (54) is higher than an outer circle insulating layer (52) to be in contact with the lower module two-dimensional multi-chip circuit board component. The radio-frequency vertical connection circuit has the advantages of simple structure, small insertion and extraction force and easiness in assembly and disassembly.
Description
Technical field
The present invention relates to and a kind of be applicable to millimeter-wave technology field, the radio frequency based on the intermodule of hair button vertically connects circuit, is particularly well-suited to connect by the radio frequency between mechanical separation module.
Background technology
Along with the development of communication technology, millimeter wave module constantly expands in electronic apparatus application scopes such as radar antennas, and the volume of millimeter wave module is more and more less, and its integrated level is also more and more higher. Millimeter wave electronic equipment is assembled by traditional two dimension gradually and assembles development to three dimensions solid, and three dimensions solid assembles inevitably to solve perpendicular interconnection problem. Perpendicular interconnection refers to the power supply in design three-dimensional module, interconnection required when ground connection and radiofrequency signal. In millimeter wave module, the key difficulties of perpendicular interconnection is to realize the radio frequency perpendicular interconnection between each independent millimeter wave two dimension multi-chip circuit module, radio frequency perpendicular interconnection not only requires that realizing radiofrequency signal between two dimension multi-chip circuit board assemblies and two dimension multi-chip circuit board assemblies carries out high-performance, highly-reliable transmission with very short distance in vertical direction, also needing to possess can mechanical separation performance, can dismantle easily and become several independent module realizing whole millimeter wave equipment, to reduce cost of equipment maintenance, reduce volume weight simultaneously.
The radio frequency connected mode of traditional millimeter wave module is mainly based upon the radio-frequency (RF) coaxial socket of contact pin and jack, the weak point of this connected mode is that to take volume big, when interconnecting for multi-line, the socket contact engaging and separating force of superposition crosses the assembling of the serious equipment that affects of conference.
The perpendicular interconnection mode that two dimension millimeter wave component is conventional mainly has: BGA, Z-direction conducting resinl and elastomeric connector. BGA is that this mode has the drawback that tenable environment test capability is weak, radio frequency transmission poor performance, and does not possess the ability repeatedly dismantled by carrying out perpendicular interconnection in the mode of two dimension multi-chip circuit board assemblies surface grafting BGA ball. Z-direction conduction is to fill the conducting resinl only conducted electricity in vertical direction between two pieces of two-dimentional multi-chip circuit board assemblies, but its transmission frequency is relatively low, and loss is big and maintainability is poor. Elastomeric connector based on hair button can realize elastic touching formula connection, but when not being supported protection, hair button is likely to cause establishment copper cash spallation and lost efficacy after being squeezed, and when assembling, hair button is easily deviate from, impact assembling.
Summary of the invention
It is an object of the invention to the weak point existed for prior art, it is provided that a kind of reliability is higher, the radio frequency of dismounting two dimension millimeter wave intermodule more easily vertically connects circuit.
The above-mentioned purpose of the present invention can be achieved by the following technical programs: the radio frequency of a kind of two dimension millimeter wave intermodule vertically connects circuit, including: upper surface is shaped with the upper of sagging blind slot, lower module hardware, the upper module two dimension multi-chip circuit board assemblies 1 in electrical contact with upper module hardware 2 upper end, the lower module two dimension multi-chip circuit board assemblies 3 in electrical contact with lower module hardware 4 upper end and coaxial connector 5, wherein, the hair coaxially connected probe 54 inner wire as coaxial connector 5 that have employed stepped cylindrical body structure of button 53, cylindrical insulating barrier 52 shaft shoulder Step Shaft of coaxial connector 5 is set with outer ring metallic sheath 51, it is characterized in that: filled by spiral shell between upper module hardware 2 and lower module hardware 4 or other removably is fixed, upper module hardware 2 lower end and the laminating of lower module two dimension multi-chip circuit board assemblies 3 upper end pressure, coaxial connector 5 is welded in upper module hardware 2, it is achieved the vertical circuit between upper module two dimension multi-chip circuit board assemblies 1 and lower module two dimension multi-chip circuit board assemblies 3 connects, the hair coaxially connected probe 54 that have employed stepped cylindrical body structure of button 53, probe 54 small end exceeds cylindrical insulating barrier 52, touches lower module two dimension multi-chip circuit board assemblies 3.
Include two dimension multi-chip circuit board assemblies and hardware as preferred described module, the design of hardware upper end has sagging blind slot, and two dimension multi-chip circuit board assemblies is arranged in sagging blind slot;
As preferably, the two-dimentional multi-chip circuit board assemblies of described module and hardware soldering or bond together.
As preferably, described two dimension multi-chip circuit board assemblies is Multilayer Structure, and surface, radio frequency junction makes contact weld pad, and contact weld pad is coaxial configuration, and described contact weld pad is connected by pressure touching with coaxial connector 5.
As preferably, the internal transmission line of described two dimension multi-chip circuit board assemblies is strip transmission line structure.
As preferably, described two dimension multi-chip circuit board assemblies is connected by array metal through hole positive and negatively.
As preferably, described lower module two dimension multi-chip circuit board assemblies 3 thickness sink the many 0.05��0.15mm of the blind slot degree of depth than lower module hardware 4; The upper end face of lower module two dimension multi-chip circuit board assemblies 3 is ground, is fitted and connected by pressure and upper module hardware 2 lower end describedly; The transfer strip line of lower module two dimension multi-chip circuit board assemblies 3 is in Multilayer Structure intermediate layer.
As preferably, described probe 54 is stepped cylindrical body, and consistent with hair button 53 diameter near probe one end 54 diameter of hair button 53, probe other end diameter is little; Described cylindrical insulating barrier 52 is internal is step through-hole, and bore dia mates with the stepped cylindrical shape of probe 54, fixes probe 54 and hair button 53; Described cylindrical insulating barrier 52 cylindrical is stepped cylindrical body, little at the diameter of probe 54 end, is set with described metallic sheath 51.
As preferably, described cylindrical insulating barrier 52 depends on the dielectric constant of mao button 53 diameter and insulating barrier at the external diameter of hair button 53 end, by 50 �� impedance matchings; Cylindrical insulating barrier 52 depends on the dielectric constant of probe 54 end diameter and insulating barrier at the external diameter of probe 54 end, by 50 �� impedance matchings; Described metallic sheath 51 internal diameter is consistent at the external diameter of probe 54 end with cylindrical insulating barrier 52, and metallic sheath 51 external diameter is consistent at the external diameter of hair button 53 end with cylindrical insulating barrier 52.
As preferably, for ensureing internal vertical circuit and two dimension multi-chip circuit board assemblies good contact, length �� 80% under the length of described cylindrical insulating barrier 52=probe 54 length+hair button 53 free state.
As preferably, described upper module hardware 2 is provided with step through-hole, and big nose end is in the lower end of upper module hardware 2, in order to pile up solder; The total length of described step through-hole is identical with cylindrical insulating barrier 52 length of described coaxial connector 5; Being installed by described coaxial connector 5 in the step through-hole of upper module hardware 2, coaxial connector 5 probe 54 end is arranged on the lower end of upper module hardware 2; Step through-hole soldering by the metallic sheath 51 of the outer ring of described coaxial connector 5 with described upper module hardware 2.
As preferably, described hair button 53 is resiliency compressible adapter, the copper cash of surface gold-plating uniformly work out.
The present invention has the advantages that compared to prior art
Present configuration is simple, function admirable, reliability are high, contact engaging and separating force is little, volume is little, be easily installed dismounting. Electrically connect by two dimension multi-chip circuit board assemblies with based on the touching between the coaxial connector 5 of hair button, it is achieved that the three-dimensional perpendicular electric interconnection of two dimension millimeter wave module; Probe 54 in coaxial connector 5 have employed stepped cylindrical body structure, the version that the shape of through holes of cylindrical insulating barrier 52 is mated with probe 54, it is possible to prevents mao button 53 and probe 54 from deviating from; When coaxial connector 5 is not stressed, hair button 53 is all arranged in the through hole of cylindrical insulating barrier 52, probe 54 small end exceeds cylindrical insulating barrier 52 in order to touch other module, can ensure that mao button 53 is when pressurized works, it is limited in the through hole of cylindrical insulating barrier 52, does not result in establishment copper cash spallation and lost efficacy; Cylindrical insulating barrier 52 set metal set 51, both can impedance matching probe 54 small end, improve radio frequency transmission performance, it is also possible to be used for be welded on hardware, fixing coaxial adapter 5, it is prevented that assembling and dismounting module time whole coaxial connector 5 deviate from.
The connection circuit that the present invention proposes shows good electric transmission performance in the band limits of 0��38GHz, loss is less than 0.8db, and standing wave is less than 1.6, and in certain millimeter wave electronic equipment, have passed through vibration, high-low-temperature environmental testing, it was demonstrated that the reliability of the present invention.
Accompanying drawing explanation
The radio frequency that Fig. 1 is two dimension millimeter wave intermodule of the present invention vertically connects the main sectional view of circuit structure.
Fig. 2 is coaxial connector 5 structural profile schematic diagram in embodiment shown in Fig. 1.
Fig. 3 is two dimension multi-chip circuit board assemblies sectional view in embodiment shown in Fig. 1.
Fig. 4 is touching solder joint principle schematic in two dimension multi-chip circuit board assemblies surface in embodiment shown in Fig. 1.
In figure: 1 upper module two dimension multi-chip circuit board assemblies, 2 upper module hardwares, 3 lower module two dimension multi-chip circuit board assemblies, 4 lower module hardwares, 5 coaxial connectors, 51 outer ring metallic sheaths, 52 external insulations, 53 maos of buttons, 54 probes.
Detailed description of the invention
In order to make the purpose of the present invention and technical scheme clearly understand, below in conjunction with embodiment schematic diagram, the present invention is further elaborated, it is embodied as example only for explaining the present invention it should be understood that described herein, is not intended to limit the present invention. This specification includes any feature disclosed in any accessory claim, summary and accompanying drawing, unless specifically stated otherwise, and all can by other equivalence or there is the alternative features of similar purpose replaced.
Consult Fig. 1 Fig. 2. in embodiment described below, the radio frequency of a kind of two dimension millimeter wave intermodule vertically connects circuit, including: upper surface is shaped with the upper of sagging blind slot, lower module hardware, the upper module two dimension multi-chip circuit board assemblies 1 in electrical contact with upper module hardware 2 upper end, the lower module two dimension multi-chip circuit board assemblies 3 in electrical contact with lower module hardware 4 upper end and coaxial connector 5, wherein, the hair coaxially connected probe 54 inner wire as coaxial connector 5 that have employed stepped cylindrical body structure of button 53, cylindrical insulating barrier 52 shaft shoulder Step Shaft of coaxial connector 5 is set with outer ring metallic sheath 51, coaxial connector 5 is welded in upper module hardware 2, realize the vertical circuit between upper module two dimension multi-chip circuit board assemblies 1 and lower module two dimension multi-chip circuit board assemblies 3 to connect. can being filled by spiral shell between upper module hardware 2 and lower module hardware 4 or other removably is fixed, upper module hardware 2 lower end and lower module two dimension multi-chip circuit board assemblies 3 upper end pressure are fitted, coaxial connector 5 is welded in upper module hardware 2, it is achieved the vertical circuit between upper module two dimension multi-chip circuit board assemblies 1 and lower module two dimension multi-chip circuit board assemblies 3 connects, upper module hardware 2 upper end is provided with sagging blind slot, upper module two dimension multi-chip circuit board assemblies 1 passes through welding or conductive adhesive in sagging blind slot, upper module two dimension multi-chip circuit board assemblies 1 bottom surface and upper module hardware 2 is made to be fully contacted, thus reducing contact resistance and thermal contact resistance between upper module two dimension multi-chip circuit board assemblies 1 and upper module hardware 2. upper module hardware 2 lower end is provided with stepped hole, and described coaxial connector 5 is soldered in hole. in this embodiment, upper module two dimension multi-chip circuit board assemblies 1 is welded on upper module hardware 2 and sink in blind slot, and upper module hardware 2 adopts aluminum alloy surface silver-plated.
Lower module hardware 4 upper end is provided with sagging blind slot, lower module two dimension multi-chip circuit board assemblies 3 passes through welding or conductive adhesive in sagging blind slot, lower module two dimension multi-chip circuit board assemblies 3 bottom surface and lower module hardware 4 is made to be fully contacted, thus reducing contact resistance and thermal contact resistance between lower module two dimension multi-chip circuit board assemblies 3 and lower module hardware 4. Lower module two dimension multi-chip circuit board assemblies 3 thickness sink the many 0.05��0.15mm of the blind slot degree of depth than lower module hardware 4, so that the metal ground of the upper end face of lower module two dimension multi-chip circuit board assemblies 3 is by pressure and upper module hardware 2 lower end good fit, thus reducing the contact resistance describedly and between upper module hardware 2. In this embodiment, lower module two dimension multi-chip circuit board assemblies 3 is welded on lower module hardware 4 and sink in blind slot, and lower module hardware 4 adopts aluminum alloy surface silver-plated.
Hair button 53 and probe 54 are as the inner wire of radio frequency (RF) coaxial connector 5, and external insulation 52 is as radio frequency (RF) coaxial connector 5 dielectric layer, the shielding outer conductor that external insulation surrounding hardware connects as radio-frequency (RF) coaxial. The hair coaxially connected probe 54 that have employed stepped cylindrical body structure of button 53, probe 54 small end exceeds cylindrical insulating barrier 52, touches lower module two dimension multi-chip circuit board assemblies 3. The outer conductor size of radio-frequency (RF) coaxial is arranged by 50 Europe impedance matchings, thus realizing the high-property transmission of radiofrequency signal. Described probe 54 is stepped cylindrical body, and consistent with hair button 53 diameter near probe 54 one end diameter of hair button 53, probe 54 other end diameter is little; Described cylindrical insulating barrier 52 is internal is step through-hole, and bore dia mates with the stepped cylindrical shape of probe 54, fixes probe 54 and hair button 53; Described cylindrical insulating barrier 52 is outside is stepped cylindrical body, little at the diameter of probe 54 end, is set with described metallic sheath 51. In this embodiment, as in figure 2 it is shown, probe 54 is the pyrite of surface gold-plating, adopting cylinder table stage structure, upper end diameter is big, and lower end diameter is little, mates with the step through-hole within external insulation, it is possible to prevent mao button 53 and probe 54 from deviating from. When coaxial connector 5 is not stressed, hair button 53 is all arranged in the through hole of cylindrical insulating barrier 52, probe 54 small end exceeds cylindrical insulating barrier 52 in order to touch the pad of lower module two dimension multi-chip circuit board assemblies 3, can ensure that mao button 53 is when pressurized works, it is limited in the through hole of cylindrical insulating barrier 52, does not result in establishment copper cash spallation and lost efficacy. Cylindrical insulating barrier 52 set metal set 51, both can impedance matching probe 54 small end, improve transmission performance, it is also possible to be used for be welded on hardware, fixing coaxial adapter 5, it is prevented that assembling and dismounting module time whole coaxial connector 5 deviate from. In this embodiment, cylindrical insulating barrier 52 is polytetrafluoroethylmaterial material, and metallic sheath 51 is the pyrite of surface gold-plating. For ensureing internal vertical circuit and circuit wafer good contact, length �� 80% under the length of described cylindrical insulating barrier 52=probe 54 length+hair button 53 free state. In this embodiment, hair button 53 length 3mm, the long 3.6mm of probe 54, the long 6mm of cylindrical insulating barrier 52.
Described upper module hardware 2 is provided with step through-hole, and big nose end is in the lower end of upper module hardware 2, in order to pile up solder; The total length of described step through-hole is identical with cylindrical insulating barrier 52 length of described coaxial connector 5; Being installed by described coaxial connector 5 in the step through-hole of upper module hardware 2, coaxial connector 5 probe 54 end is arranged on the lower end of upper module hardware 2; Step through-hole soldering by the outer ring metallic sheath of described coaxial connector 5 Yu described upper module hardware 2.
Described hair button 53 is resiliency compressible adapter, the copper cash of surface gold-plating uniformly work out. In this embodiment, the hair button diameter 20mil of employing, material adopts tin-phosphor bronze, and surface gold-plating processes, and axial maximum compressible 30%.
The connection circuit that the present invention proposes shows good electric transmission performance in the band limits of 0��38GHz, loss is less than 0.8db, and standing wave is less than 1.6, and in certain millimeter wave electronic equipment, have passed through vibration, high-low-temperature environmental testing, it was demonstrated that the reliability of the present invention.
Consulting Fig. 3, described two dimension multi-chip circuit board assemblies adopts multi-layer substrate structure, and surface, radio frequency junction makes contact weld pad, and contact weld pad is coaxial configuration, and described contact weld pad is connected by pressure touching with coaxial connector 5. In this embodiment, two dimension multi-chip circuit board assemblies 1 adopts multilager base plate to make, and the back side is metal ground. Two dimension multi-chip circuit board assemblies 3 adopts multilager base plate to make, and ground floor surface and last layer of back side are metal ground.
Consulting Fig. 4, touching pad in two dimension multi-chip circuit board assemblies surface realizes pressure touching and is connected with the coaxial connector based on hair button, and is connected with burying strip transmission line by radio frequency intercommunicating pore. By adjusting the impedance of quasi-coaxial transmission structure in substrate, this is made vertically to connect the radio frequency transmission Performance optimization of circuit.
Described coplanar striplines ground is by array metal through hole and its reverse side grounding connection.
Claims (9)
1. the radio frequency of a two-dimentional millimeter wave intermodule vertically connects circuit, including: upper surface is shaped with the upper of sagging blind slot, lower module hardware, upper module two dimension multi-chip circuit board assemblies (1) in electrical contact with upper module hardware (2) upper end, lower module two dimension multi-chip circuit board assemblies (3) in electrical contact with lower module hardware (4) upper end, coaxial connector (5), wherein, hair button (53) coaxially connected probe (54) is as the inner wire of coaxial connector (5), cylindrical insulating barrier (52) shaft shoulder Step Shaft of coaxial connector (5) is set with outer ring metallic sheath (51), it is characterized in that: filled by spiral shell between upper module hardware (2) and lower module hardware (4) or other removably is fixed, upper module hardware (2) lower end and the laminating of lower module two dimension multi-chip circuit board assemblies (3) upper end pressure, coaxial connector (5) is welded in upper module hardware (2), it is achieved the vertical circuit between upper module two dimension multi-chip circuit board assemblies (1) and lower module two dimension multi-chip circuit board assemblies (3) connects, the probe (54) of hair button (53) coaxially connected stepped cylindrical body structure, probe (54) small end exceeds cylindrical insulating barrier (52), touching lower module two dimension multi-chip circuit board assemblies (3).
2. the radio frequency of two dimension millimeter wave intermodule according to claim 1 vertically connects circuit, it is characterized in that: described two dimension multi-chip circuit board assemblies is Multilayer Structure, surface, radio frequency junction makes contact weld pad, contact weld pad is coaxial configuration, and described contact weld pad is connected by pressure touching with coaxial connector (5).
3. the radio frequency of two dimension millimeter wave intermodule according to claim 1 vertically connects circuit, it is characterised in that: described two dimension multi-chip circuit board assemblies is connected by array metal through hole positive and negatively.
4. the radio frequency of two dimension millimeter wave intermodule according to claim 1 vertically connects circuit, it is characterised in that: described lower module two dimension multi-chip circuit board assemblies (3) thickness 0.05��0.15mm more than the sagging blind slot degree of depth of lower module hardware (4); The upper end face of lower module two dimension multi-chip circuit board assemblies (3) is ground, is fitted and connected by pressure and upper module hardware (2) lower end describedly; The transfer strip line of lower module two dimension multi-chip circuit board assemblies (3) is in Multilayer Structure intermediate layer.
5. the radio frequency of a two dimension millimeter wave intermodule according to claim 1 vertically connects circuit, it is characterized in that: described probe (54) is stepped cylindrical body, consistent with hair button (53) diameter near probe (54) one end diameter of hair button (53), probe other end diameter is little; Described cylindrical insulating barrier (52) is internal is step through-hole, and bore dia mates with the stepped cylindrical shape of probe (54), fixes probe (54) and hair button (53); Described cylindrical insulating barrier (52) is outside is stepped cylindrical body, and the diameter held at probe (54) is little, set metal set (51).
6. the radio frequency of two dimension millimeter wave intermodule according to claim 1 vertically connects circuit, it is characterized in that: described cylindrical insulating barrier (52) depends on the dielectric constant of a mao button (53) diameter and insulating barrier at the external diameter that hair button (53) is held, by 50 �� impedance matchings; Cylindrical insulating barrier (52) depends on the dielectric constant of probe (54) end diameter and insulating barrier at the external diameter that probe (54) is held, by 50 �� impedance matchings; The external diameter that described metallic sheath (51) internal diameter is held at probe (54) with cylindrical insulating barrier (52) is consistent, and the external diameter that metallic sheath (51) external diameter is held at hair button (53) with cylindrical insulating barrier (52) is consistent.
7. the radio frequency of two dimension millimeter wave intermodule according to claim 1 vertically connects circuit, it is characterized in that: for ensureing internal vertical circuit and two dimension multi-chip circuit board assemblies good contact, length �� 80% under length=probe (54) length of described cylindrical insulating barrier (52)+hair button (53) free state.
8. the radio frequency of two dimension millimeter wave intermodule according to claim 1 vertically connects circuit, it is characterized in that: described upper module hardware (2) is provided with step through-hole, big nose end is in the lower end of upper module hardware (2), in order to pile up solder; The total length of described step through-hole is identical with cylindrical insulating barrier (52) length of described coaxial connector (5); Being installed by described coaxial connector (5) in the step through-hole of upper module hardware (2), coaxial connector (5) probe (54) end is arranged on the lower end of upper module hardware (2); Step through-hole soldering by the metallic sheath (51) of the outer ring of described coaxial connector (5) Yu described upper module hardware (2).
9. the radio frequency of two dimension millimeter wave intermodule according to claim 1 vertically connects circuit, it is characterised in that: described hair button (53) is resiliency compressible adapter, the copper cash of surface gold-plating uniformly work out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610015093.4A CN105634536A (en) | 2016-01-11 | 2016-01-11 | Radio-frequency vertical connection circuit between two-dimensional millimeter wave modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610015093.4A CN105634536A (en) | 2016-01-11 | 2016-01-11 | Radio-frequency vertical connection circuit between two-dimensional millimeter wave modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105634536A true CN105634536A (en) | 2016-06-01 |
Family
ID=56049139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610015093.4A Pending CN105634536A (en) | 2016-01-11 | 2016-01-11 | Radio-frequency vertical connection circuit between two-dimensional millimeter wave modules |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105634536A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106356604A (en) * | 2016-11-03 | 2017-01-25 | 合肥工业大学 | Passive circuit suitable for microwave and millimeter-wave integrated system |
| CN106505345A (en) * | 2016-12-16 | 2017-03-15 | 贵州航天计量测试技术研究所 | A kind of foam metal contact coaxial radio-frequency electric connector |
| CN106532319A (en) * | 2016-12-16 | 2017-03-22 | 贵州航天计量测试技术研究所 | Electric connector of foam metal contact part |
| CN109921156A (en) * | 2019-04-03 | 2019-06-21 | 中国电子科技集团公司第二十九研究所 | A kind of three-dimensional tile type microwave components |
| CN110514935A (en) * | 2019-09-11 | 2019-11-29 | 上海航天科工电器研究院有限公司 | A kind of test device of radio frequency active Surface Mount plate |
| CN111805082A (en) * | 2020-07-14 | 2020-10-23 | 大连藏龙光电子科技有限公司 | Surface mounting and welding method for controlling tracking error of coaxial optical device |
| CN114583477A (en) * | 2022-05-05 | 2022-06-03 | 中国电子科技集团公司第二十九研究所 | Pressing strip structure for center contact of crimping connector |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101982903A (en) * | 2010-09-15 | 2011-03-02 | 华为技术有限公司 | Circuit board connector and communication equipment |
| CN104678230A (en) * | 2015-03-25 | 2015-06-03 | 中国电子科技集团公司第二十九研究所 | Three-dimensional microwave assembly testing device |
| CN204424416U (en) * | 2015-03-25 | 2015-06-24 | 中国电子科技集团公司第二十九研究所 | A kind of radio frequency vertical transition circuit based on hair button |
| CN104733824A (en) * | 2015-03-25 | 2015-06-24 | 中国电子科技集团公司第二十九研究所 | Radio-frequency vertical transformation circuit based on fuzz button |
| CN105098542A (en) * | 2015-07-03 | 2015-11-25 | 华为技术有限公司 | Radio-frequency coaxial connector and board-to-board radio-frequency coaxial connector combination |
-
2016
- 2016-01-11 CN CN201610015093.4A patent/CN105634536A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101982903A (en) * | 2010-09-15 | 2011-03-02 | 华为技术有限公司 | Circuit board connector and communication equipment |
| CN104678230A (en) * | 2015-03-25 | 2015-06-03 | 中国电子科技集团公司第二十九研究所 | Three-dimensional microwave assembly testing device |
| CN204424416U (en) * | 2015-03-25 | 2015-06-24 | 中国电子科技集团公司第二十九研究所 | A kind of radio frequency vertical transition circuit based on hair button |
| CN104733824A (en) * | 2015-03-25 | 2015-06-24 | 中国电子科技集团公司第二十九研究所 | Radio-frequency vertical transformation circuit based on fuzz button |
| CN105098542A (en) * | 2015-07-03 | 2015-11-25 | 华为技术有限公司 | Radio-frequency coaxial connector and board-to-board radio-frequency coaxial connector combination |
Non-Patent Citations (1)
| Title |
|---|
| DAVID CARTER: "‘Fuzz Button’ interconnects at microwave and mm-wave frequencies", 《IEE SEMINAR ON PACKAGING AND INTERCONNECTS AT MICROWAVE AND MM-WAVE FREQUENCIES》 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106356604A (en) * | 2016-11-03 | 2017-01-25 | 合肥工业大学 | Passive circuit suitable for microwave and millimeter-wave integrated system |
| CN106356604B (en) * | 2016-11-03 | 2019-07-16 | 合肥工业大学 | Passive circuit suitable for microwave and millimeter wave integrated system |
| CN106505345A (en) * | 2016-12-16 | 2017-03-15 | 贵州航天计量测试技术研究所 | A kind of foam metal contact coaxial radio-frequency electric connector |
| CN106532319A (en) * | 2016-12-16 | 2017-03-22 | 贵州航天计量测试技术研究所 | Electric connector of foam metal contact part |
| CN109921156A (en) * | 2019-04-03 | 2019-06-21 | 中国电子科技集团公司第二十九研究所 | A kind of three-dimensional tile type microwave components |
| CN110514935A (en) * | 2019-09-11 | 2019-11-29 | 上海航天科工电器研究院有限公司 | A kind of test device of radio frequency active Surface Mount plate |
| CN111805082A (en) * | 2020-07-14 | 2020-10-23 | 大连藏龙光电子科技有限公司 | Surface mounting and welding method for controlling tracking error of coaxial optical device |
| CN111805082B (en) * | 2020-07-14 | 2022-07-08 | 大连藏龙光电子科技有限公司 | Surface mounting and welding method for controlling tracking error of coaxial optical device |
| CN114583477A (en) * | 2022-05-05 | 2022-06-03 | 中国电子科技集团公司第二十九研究所 | Pressing strip structure for center contact of crimping connector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105634536A (en) | Radio-frequency vertical connection circuit between two-dimensional millimeter wave modules | |
| US6417747B1 (en) | Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards | |
| US6953348B2 (en) | IC socket | |
| US7766662B2 (en) | Surface mount coaxial connector assembly | |
| US6039580A (en) | RF connector having a compliant contact | |
| JP4883084B2 (en) | Circuit board device, wiring board connection method, and circuit board module device | |
| JP7169989B2 (en) | Socket for electrical connection | |
| CN104733824A (en) | Radio-frequency vertical transformation circuit based on fuzz button | |
| EP2876748A1 (en) | Millimeter wave connector and band conductor | |
| US20130330944A1 (en) | Spring-loaded blind-mate electrical interconnect | |
| JP2003520473A (en) | Vertical interconnect between coaxial or GCPW circuit and airline with compressible center conductor | |
| CN205429219U (en) | Hair button inter -plate radio frequency connector | |
| CN204424416U (en) | A kind of radio frequency vertical transition circuit based on hair button | |
| CN106374279B (en) | Integrated attachment radio frequency insertion connector | |
| CN111048959A (en) | Connection switching device | |
| CN104678230A (en) | Three-dimensional microwave assembly testing device | |
| CN221305035U (en) | Multi-channel radio frequency connector based on FPC | |
| CN204536433U (en) | A kind of three-dimensional microwave component test device | |
| CN116845551A (en) | Antenna board assembly and communication equipment | |
| CN208109945U (en) | A kind of circuit board and antenna measurement tooling for auxiliary antenna test | |
| CN205231285U (en) | Adopt foam metallic interconnect's microwave vertical interconnect test structure | |
| CN109655733A (en) | The method of non-destructive testing millimeter wave bga component | |
| TWI651028B (en) | Pad structure for RF testing | |
| US11114778B2 (en) | Cable connector to PCB interconnect | |
| CN113725641A (en) | Cable connecting device, connecting assembly and manufacturing method of connecting assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160601 |