CN205231285U - Adopt foam metallic interconnect's microwave vertical interconnect test structure - Google Patents
Adopt foam metallic interconnect's microwave vertical interconnect test structure Download PDFInfo
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- CN205231285U CN205231285U CN201521095475.XU CN201521095475U CN205231285U CN 205231285 U CN205231285 U CN 205231285U CN 201521095475 U CN201521095475 U CN 201521095475U CN 205231285 U CN205231285 U CN 205231285U
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- foam metal
- circuit board
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- dielectric
- test structure
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Abstract
The utility model discloses an adopt foam metallic interconnect's microwave vertical interconnect test structure, the medium body, test circuit board and the supporter casing that include the electrically conductive foamed metal of elasticity, insulation, test circuit board fixed mounting and is surveyed and to be equipped with the medium body between the microwave device in the supporter casing, the internal foamed metal that is provided with of medium, the foamed metal is connected the test circuit board perpendicularly and is surveyed microwave device, and both ends are supported and are leaned on at the test circuit board with by the connection pad on surveying microwave device. The utility model discloses a reliable, signal transmission dependable performance, repeatedly usable have been realized connecting by the electrically conductive foamed metal circuit board and the connection of measured device of elasticity, have reduced equipment manufacturing cost, do not have simultaneously that the welding is easily dismantled and the cost is lower, and the foamed metal has good contact elasticity and electrical property and has good microwave transmission performance, and the utility model discloses it connects characteristics not fragile, the handling ease still to have simple structure, device.
Description
Technical field
The utility model belongs to electric connector contact, relates to a kind of microwave perpendicular interconnection test structure adopting foam metal to connect.
Background technology
Along with electronic equipment is to miniaturized, integrative development, the use of microwave circuit module, microwave device is developed to three-dimensional perpendicular interconnection structure by two-dimensional structure more and more, simultaneously when microwave circuit module and microwave device test, traditional welding joint method of testing, is difficult to meet testing requirement.General needs adopt crimping mode at the match circuit plate designed, and usually have two kinds of modes to crimp measured device or circuit, a kind of is that measured piece pin is directly pressed on the circuit of circuit board firmly, and reliability is low, measured piece may be caused to damage simultaneously; Another kind of mode by a kind of medium, device pin is connected, the flexible contact pin of medium, conducting resinl, hair button etc., but microwave test media material requires very high, and design difficulty of processing is comparatively large, and price is relatively costly.
Summary of the invention
The technical problems to be solved in the utility model is: provide a kind of microwave perpendicular interconnection test structure adopting foam metal to connect, structure is simple, cost is low, easy to process, connect reliable and secure, signal transmission performance is good, solves the test of traditional welding joint and does not meet the problems such as device damage that microwave device testing requirement and existing crimping mode exist, materials processing difficulty are large, expensive.
The technical scheme that the utility model is taked is: a kind of microwave perpendicular interconnection test structure adopting foam metal to connect, comprise the foam metal of elastic conduction, the dielectric of insulation, testing circuit board and supporter housing, described testing circuit board is fixedly mounted in supporter housing, and be provided with dielectric between tested microwave device, foam metal is provided with in described dielectric, described foam metal vertical connecting test circuit board and tested microwave device, two ends are resisted against the connection pad on testing circuit board and tested microwave device.
Preferably, above-mentioned foam metal is set to Step Shaft structure, and upper end is smaller diameter end, is mounted to the step through-hole in dielectric.
Preferably, above-mentioned foam metal is the foam metal copper of gold-plated process.
Preferably, above-mentioned dielectric is polytetrafluoroethylene.
Preferably, the little 10%-20% of thickness of the Thickness Ratio foam metal of above-mentioned dielectric.
The beneficial effects of the utility model: compared with prior art, the utility model adopts the foam metal realizing circuit plate of elastic conduction and the connection of measured device, achieve and connect reliably, signal transmission performance is reliable, reusable, reduce device fabrication cost, simultaneously welding is easy to dismounting and cost is lower, foam metal has good contact resilient and electrical property, the vertical checkout interconnection between tested Microwave Devices & Circuits plate is realized by foam metal, there is good microwave transmission performance, effectively solve the test of traditional welding joint and do not meet the device damage that microwave device testing requirement and existing crimping mode exist, materials processing difficulty is large, expensive problem, and it is simple that the utility model also has structure, device connects not fragile, the feature of handling ease.
Accompanying drawing explanation
Fig. 1 is microwave perpendicular interconnection test structure schematic diagram (when loading tested microwave device) described in the utility model;
Fig. 2 is microwave perpendicular interconnection test structure schematic diagram (when not loading tested microwave device) described in the utility model.
In figure: the tested microwave device of 1-, 2-foam metal, 3-dielectric, 4-testing circuit board, 5-supporter housing.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, utility model is described further.
As shown in Fig. 1 ~ Fig. 2, a kind of microwave perpendicular interconnection test structure adopting foam metal to connect, comprise the foam metal 2 of elastic conduction, the dielectric 3 of insulation, testing circuit board 4 and supporter housing 5, testing circuit board 4 is fixedly mounted in supporter housing 5, and be provided with dielectric 3 between tested microwave device 1, foam metal 2 is provided with in dielectric 3, the vertical connecting test circuit board 4 of foam metal 2 and tested microwave device 1, two ends are resisted against the connection pad on testing circuit board 4 and tested microwave device 1, foam metal 2 is set to Step Shaft structure, upper end is smaller diameter end, be mounted to the step through-hole 6 in dielectric 3, foam metal 2 is the foam metal copper of gold-plated process, dielectric 3 is polytetrafluoroethylene, the little 10%-20% of thickness of the Thickness Ratio foam metal 2 of dielectric 3.
Testing circuit board 4, designs corresponding control circuit, radiofrequency signal match circuit and desired signal according to the device property of tested microwave device 1 and connects pad and appropriate design cabling; The position of opening of dielectric 3 connects pad just to projection by the signal on lower floor's testing circuit board 4, and the signal on testing circuit board 4 connects pad locations and determines according to the pin positions of tested microwave device; The foam metal copper with certain contact resilient selected by foam metal 2, and increase signal transmission characteristics through gold-plated process, dielectric 3 perforate vertically put into from below to up by foam metal 2, and after above dielectric 3 testing circuit board 4 lamination assembling, encapsulation is with in supporter housing 5.
As shown in Figure 2, foam metal 2 Thickness Ratio dielectric 3 thickness exceeds 10%, utilizes the mechanical property of foam metal 2 itself, when tested microwave device puts into compression, ensures effective reliable contacts; Between being conducive to microwave transmission, foam metal 2 thickness is less than 3mm; Foam metal 2 adopts step shape to insert dielectric 3 perforate from bottom to top, without the need to being welded to connect, and difficult drop-off after installing.
The above; be only embodiment of the present utility model; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; change can be expected easily or replace; all should be encompassed within protection range of the present utility model, therefore, protection range of the present utility model should be as the criterion with the protection range of described claim.
Claims (5)
1. the microwave perpendicular interconnection test structure adopting foam metal to connect, it is characterized in that: the foam metal (2) comprising elastic conduction, the dielectric (3) of insulation, testing circuit board (4) and supporter housing (5), described testing circuit board (4) is fixedly mounted in supporter housing (5), and be provided with dielectric (3) between tested microwave device (1), foam metal (2) is provided with in described dielectric (3), the vertical connecting test circuit board (4) of described foam metal (2) and tested microwave device (1), two ends are resisted against the connection pad on testing circuit board (4) and tested microwave device (1).
2. a kind of microwave perpendicular interconnection test structure adopting foam metal to connect according to claim 1, it is characterized in that: described foam metal (2) is set to Step Shaft structure, upper end is smaller diameter end, is mounted to the step through-hole (6) in dielectric (3).
3. a kind of microwave perpendicular interconnection test structure adopting foam metal to connect according to claim 1, is characterized in that: the foam metal copper that described foam metal (2) is gold-plated process.
4. a kind of microwave perpendicular interconnection test structure adopting foam metal to connect according to claim 1, is characterized in that: described dielectric (3) is polytetrafluoroethylene.
5. a kind of microwave perpendicular interconnection test structure adopting foam metal to connect according to claim 1, is characterized in that: the little 10%-20% of thickness of the Thickness Ratio foam metal (2) of described dielectric (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521095475.XU CN205231285U (en) | 2015-12-24 | 2015-12-24 | Adopt foam metallic interconnect's microwave vertical interconnect test structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521095475.XU CN205231285U (en) | 2015-12-24 | 2015-12-24 | Adopt foam metallic interconnect's microwave vertical interconnect test structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205231285U true CN205231285U (en) | 2016-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521095475.XU Active CN205231285U (en) | 2015-12-24 | 2015-12-24 | Adopt foam metallic interconnect's microwave vertical interconnect test structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205231285U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106099453A (en) * | 2016-05-31 | 2016-11-09 | 中航光电科技股份有限公司 | Hair button adapter and insulator and hair button |
| CN109037974A (en) * | 2018-06-26 | 2018-12-18 | 中国电子科技集团公司第二十九研究所 | A kind of contact wide band radio-frequency interconnecting method and structure |
-
2015
- 2015-12-24 CN CN201521095475.XU patent/CN205231285U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106099453A (en) * | 2016-05-31 | 2016-11-09 | 中航光电科技股份有限公司 | Hair button adapter and insulator and hair button |
| CN109037974A (en) * | 2018-06-26 | 2018-12-18 | 中国电子科技集团公司第二十九研究所 | A kind of contact wide band radio-frequency interconnecting method and structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |