CN109037974A - A kind of contact wide band radio-frequency interconnecting method and structure - Google Patents
A kind of contact wide band radio-frequency interconnecting method and structure Download PDFInfo
- Publication number
- CN109037974A CN109037974A CN201810665645.5A CN201810665645A CN109037974A CN 109037974 A CN109037974 A CN 109037974A CN 201810665645 A CN201810665645 A CN 201810665645A CN 109037974 A CN109037974 A CN 109037974A
- Authority
- CN
- China
- Prior art keywords
- radio frequency
- motherboard
- radio
- wide band
- frequency component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Abstract
The present invention provides a kind of contact wide band radio-frequency interconnecting method and structures, including flexible conducting material, are fixedly installed between radio frequency component and radio frequency motherboard, contact respectively with radio frequency component and radio frequency motherboard as electric signal transmission medium；It further include crimping fixed structure, pressing radio frequency component, flexible conducting material and radio frequency motherboard, to guarantee the stability connected between the flexible conducting material and radio frequency component and radio frequency motherboard.Relative to existing BGA interconnection scheme, can be released effectively during high/low temperature due to the thermal stress that material thermal expansion coefficient is different and generates between radio frequency component and radio frequency motherboard, and then improve the reliability in component use process.In addition, no-welding characteristic such as can significantly improve module testing, assemble and reprocess at the efficiency in stages, can Rapid Popularization it is integrated applied to other products.
Description
Technical field
The present invention relates to a kind of contact wide band radio-frequency interconnecting method and structures, are related to wide band radio-frequency interconnection field.
Background technique
It is next-generation microwave product mainstream form based on radio frequency component+radio frequency mother matrix plate micro-system, broadband is penetrated at present
Frequency component mostly uses greatly ceramic material, and component mostly uses the ball array similar with digital device (BGA) greatly with the interconnection of motherboard
Packing forms, the interconnection of signal is realized by the welding of BGA ball and radio frequency motherboard, and signal transmission frequencies range can reach DC-
40GHz。
In typical radio frequency component BGA interconnection mode, radio frequency component substrate uses low-temperature co-fired ceramics (LTCC) material,
By being punched on LTCC, and it is implanted into and radio frequency component is welded on and is penetrated by Reflow Soldering by the BGA soldered ball of prime cost of tin
On frequency motherboard, realize that signal high speed interconnects.
But there are the following problems for the BGA interconnection mode that current radio frequency component uses:
1) there are thermal mismatching between the ceramic substrate material (such as LTCC, HTCC) and radio frequency mother matrix material that radio frequency component uses,
Under high/low temperature condition, larger thermal stress can be generated, product reliability is influenced.
2) radio frequency mother matrix high density mounts radio frequency component, and integrated and Rework Technics difficulty is big, yield rate is low；
3) the radio frequency component non-destructive testing method missing based on BGA package.
Based on problem above, other plate grade interconnection techniques need to be developed.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of contact wide band radio-frequency interconnecting method and structures, can be full
While sufficient radio frequency component high-frequency transmission demand, effectively improve the reliability of component and motherboard interconnection, at the same improve component can
Maintainability and testability.
The technical solution adopted by the invention is as follows:
A kind of contact wide band radio-frequency interconnecting method, specific method includes, using flexible conducting material as signal transmission medium；
Signal transmission is realized by flexible conducting material between radio frequency component and radio frequency motherboard, rf frequency is greater than 50GHz.
The flexible conducting material is conductive silicon rubber.
The method also includes realizing consolidating for radio frequency component and radio frequency motherboard using screw thread crimping mode on radio frequency component
Fixed contact.
The method also includes being arranged insulation support plate between radio frequency component and radio frequency motherboard, by the shape of electric silica gel
Pole-changing limit limits within the acceptable range.
The insulation support plate is tenon sheet.
A kind of contact wide band radio-frequency interconnection structure, it is characterised in that:
It including flexible conducting material, is fixedly installed between radio frequency component and radio frequency motherboard, distinguishes as electric signal transmission medium
It is contacted with radio frequency component and radio frequency motherboard.
It further include crimping fixed structure, pressing radio frequency component, flexible conducting material and radio frequency motherboard, to guarantee the flexibility
The stability connected between conductive material and radio frequency component and radio frequency motherboard.
Further include insulation support plate, is arranged between radio frequency component and radio frequency motherboard；It is provided on the insulation support plate
Through-hole, so that the flexible conducting material can pass through the through-hole.
The through-hole includes two or more.
The flexible conducting material is conductive silicon rubber.
The crimping fixed structure is that screw thread crimps fixed structure.
The insulation support plate is tenon sheet.
Compared with prior art, the beneficial effects of the present invention are: relative to existing BGA interconnection scheme, what the present invention designed
Contact wide band radio-frequency interconnection scheme can be released effectively during high/low temperature between radio frequency component and radio frequency motherboard due to material
The thermal stress that thermal expansion coefficient is different and generates, and then improve the reliability in component use process.In addition, the interconnection scheme band
The no-welding characteristic come such as can significantly improve module testing, assemble and reprocess at the efficiency in stages, can Rapid Popularization be applied to it
His product is integrated.
Detailed description of the invention
Fig. 1 is the contact radio frequency interconnection structure schematic diagram of a wherein embodiment of the invention.
Fig. 2 is the insulation support plate structural schematic diagram of a wherein embodiment of the invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention.
Any feature disclosed in this specification (including abstract and attached drawing) unless specifically stated can be equivalent by other
Or the alternative features with similar purpose are replaced.That is, unless specifically stated, each feature is a series of equivalent or class
Like an example in feature.
A kind of contact wide band radio-frequency interconnecting method, specific method include being transmitted using flexible conducting material as signal
Medium；Signal transmission is realized by flexible conducting material between radio frequency component and radio frequency motherboard, rf frequency is greater than 50GHz.
The present invention program is interconnected using flexible conducting material as contact, is realized signal transmission, can be released effectively height
Due to the thermal stress that material thermal expansion coefficient is different and generates between radio frequency component and motherboard in chilling process, and then improve component
Reliability in use process.Meanwhile compared with traditional BGA interconnection mode, integrates and Rework Technics difficulty is small, yield rate
It is high.
As one embodiment of the present invention, the flexible conducting material is conductive silicon rubber.
As one embodiment of the present invention, the method also includes crimping mode using screw thread on radio frequency component
The fixed contact for realizing radio frequency component and radio frequency motherboard, to ensure that the stability of connection.
As one embodiment of the present invention, the method also includes being arranged between radio frequency component and radio frequency motherboard
The deformation limit of electric silica gel is limited the pressure that ensure that screw thread crimping generates within the acceptable range by insulation support plate
Power is no more than the pressure-bearing limit of flexible conducting material.
As one embodiment of the present invention, the insulation support plate is tenon sheet.
A kind of contact wide band radio-frequency interconnection structure, including flexible conducting material, are fixedly installed on radio frequency component and radio frequency
Between motherboard, contacted respectively with radio frequency component and radio frequency motherboard as electric signal transmission medium.
Specific embodiment as shown in Figure 1, radio frequency chip 6 are arranged on ltcc substrate 2, ltcc substrate and radio frequency motherboard 1
Between by flexible conducting material 4 realize contact interconnection.In this embodiment, the flexible conducting material is conductive silicon
Rubber.Conductive silicon rubber one contacts with the ltcc substrate 2 of radio frequency component, and other end is contacted with radio frequency motherboard 1, realization > 50GHz
Radio frequency interconnection.
As shown in Figure 1, as an implementation, further including crimping fixed structure, pressing radio frequency component, compliant conductive material
Material and radio frequency motherboard, to guarantee the stability connected between the flexible conducting material and radio frequency component and radio frequency motherboard.
In this embodiment, crimping fixed structure uses screw thread buckle 5, and screw thread buckle 5 is downwardly against from 2 upper surface of ltcc substrate
The surrounding of ltcc substrate 2, it is by screw that ltcc substrate 2 and radio frequency motherboard 1 is fixed, it provides and continues downward uniform pressure,
It is in close contact conductive silicon rubber and radio frequency motherboard 1, realizes reliable high-frequency signal interconnection.
The inner surface 51 of screw thread buckle requires the depth of parallelism with higher of upper surface 11 with radio frequency motherboard, it is ensured that Suo Youcheng
The conductive silicon rubber of array arrangement has consistent decrement.Due to using contact and interconnection, during high/low temperature, LTCC base
Thermal stress between plate 2 and radio frequency motherboard 1 can be discharged completely by flexible conductive silicon rubber, will not be to chip reliability
It impacts
Further include insulation support plate, is arranged between radio frequency component and radio frequency motherboard；It is provided with through-hole on the insulation support plate,
So that the flexible conducting material can pass through the through-hole.
As depicted in figs. 1 and 2, as a kind of specific embodiment, insulation support plate 3 is in ltcc substrate 2 and radio frequency substrate 1
Between, have through-hole 31 in the position that conductive silicon rubber passes through, to play a part of in conductive silicon rubber compression process limit decrement,
Guarantee that the pressure of the crimping generation of screw thread buckle 5 is no more than the pressure-bearing limit of conductive silicon rubber.
In this embodiment, as shown in Fig. 2, the insulation support plate is tenon sheet, polytetrafluoroethylene (PTFE)
It is provided with multiple through-holes on thin plate, makes uniform force.
Claims (10)
1. a kind of contact wide band radio-frequency interconnecting method, specific method include, is transmitted and be situated between as signal using flexible conducting material
Matter；Signal transmission is realized by flexible conducting material between radio frequency component and radio frequency motherboard, rf frequency is greater than 50GHz.
2. contact wide band radio-frequency interconnecting method according to claim 1, the flexible conducting material is conductive silicon rubber.
3. contact wide band radio-frequency interconnecting method according to claim 1, the method also includes adopting on radio frequency component
The fixed contact of radio frequency component and radio frequency motherboard is realized with screw thread crimping mode.
4. contact wide band radio-frequency interconnecting method according to claim 1, the method also includes, radio frequency component with penetrate
Insulation support plate is set between frequency motherboard, the deformation limit of electric silica gel is limited within the acceptable range.
5. contact wide band radio-frequency interconnecting method according to claim 4, the insulation support plate is that polytetrafluoroethylene (PTFE) is thin
Plate.
6. a kind of contact wide band radio-frequency interconnection structure, it is characterised in that:
It including flexible conducting material, is fixedly installed between radio frequency component and radio frequency motherboard, distinguishes as electric signal transmission medium
It is contacted with radio frequency component and radio frequency motherboard.
7. contact wide band radio-frequency interconnection structure according to claim 6, it is characterised in that: further include crimping fixed knot
Structure, pressing radio frequency component, flexible conducting material and radio frequency motherboard, to guarantee the flexible conducting material and radio frequency component and radio frequency
The stability connected between motherboard.
8. contact wide band radio-frequency interconnection structure according to claim 6, it is characterised in that: it further include insulation support plate,
It is arranged between radio frequency component and radio frequency motherboard；It is provided with through-hole on the insulation support plate, so that the flexible conducting material
The through-hole can be passed through.
9. contact wide band radio-frequency interconnection structure according to claim 8, it is characterised in that: the through-hole include two with
On.
10. contact wide band radio-frequency interconnection structure according to claim 7, it is characterised in that: the crimping fixed structure
Fixed structure is crimped for screw thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810665645.5A CN109037974B (en) | 2018-06-26 | 2018-06-26 | Contact type broadband radio frequency interconnection method and structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810665645.5A CN109037974B (en) | 2018-06-26 | 2018-06-26 | Contact type broadband radio frequency interconnection method and structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109037974A true CN109037974A (en) | 2018-12-18 |
| CN109037974B CN109037974B (en) | 2020-09-01 |
Family
ID=64610466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810665645.5A Active CN109037974B (en) | 2018-06-26 | 2018-06-26 | Contact type broadband radio frequency interconnection method and structure |
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| Country | Link |
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| CN (1) | CN109037974B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109935949A (en) * | 2019-04-02 | 2019-06-25 | 中国电子科技集团公司第三十八研究所 | Gold wire bonding Broadband Matching structure and its design method in a kind of microwave multilayer circuit |
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| CN205231285U (en) * | 2015-12-24 | 2016-05-11 | 贵州航天计量测试技术研究所 | Adopt foam metallic interconnect's microwave vertical interconnect test structure |
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Patent Citations (9)
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| US20090189269A1 (en) * | 2008-01-24 | 2009-07-30 | Lap-Wai Lydia Leung | Electronic Circuit Package |
| CN103869327A (en) * | 2012-12-13 | 2014-06-18 | 北京天中磊智能科技有限公司 | Integrated satellite navigation chip and manufacture method thereof |
| CN105452877A (en) * | 2013-07-24 | 2016-03-30 | 株式会社Isc | Conductive connector and manufacturing method therefor |
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| CN107301982A (en) * | 2017-05-11 | 2017-10-27 | 西安空间无线电技术研究所 | CGA integrative packagings structure and its implementation based on LTCC |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109935949A (en) * | 2019-04-02 | 2019-06-25 | 中国电子科技集团公司第三十八研究所 | Gold wire bonding Broadband Matching structure and its design method in a kind of microwave multilayer circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109037974B (en) | 2020-09-01 |
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