CN203466320U - Electric connector - Google Patents

Electric connector Download PDF

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Publication number
CN203466320U
CN203466320U CN201320580018.4U CN201320580018U CN203466320U CN 203466320 U CN203466320 U CN 203466320U CN 201320580018 U CN201320580018 U CN 201320580018U CN 203466320 U CN203466320 U CN 203466320U
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CN
China
Prior art keywords
cavity volume
electric connector
elastic
electronic component
melting
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Expired - Fee Related
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CN201320580018.4U
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Chinese (zh)
Inventor
朱德祥
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Lotes Guangzhou Co Ltd
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Lotes Guangzhou Co Ltd
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Priority to CN201320580018.4U priority Critical patent/CN203466320U/en
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Publication of CN203466320U publication Critical patent/CN203466320U/en
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Abstract

The utility model discloses an electric connector for electrical connection of a first electronic element to a second electronic element. The first electronic element includes a plurality of protruding conducting portions. The electric connector comprises an insulation body, a plurality of conducting connection bodies, elastic electric conductors, and liquid low-melting point metals. To be specific, a plurality of accommodation holes are arranged in the insulation body in a penetrating mode. The plurality of conducting connection bodies are correspondingly assembled into the accommodation holes; accommodation cavities with opened top ends and sealed bottoms are formed in the conducting connection bodies; and the bottoms of the conducting connection bodies are arranged downwardly so as to realize compressing and contacting with the second electronic element. The elastic electronic conductors are arranged in the accommodation cavities; and the bottoms of the elastic electronic conductors compress the bottoms of the accommodation cavities. The liquid low-melting point metals are arranged in the accommodation cavities and enable at least parts of the elastic electronic conductors to be immersed. When the first electronic element is pressed down, the conducting portions enter the accommodation cavities and compress the top ends of the elastic electric conductors; and at least parts of the conducting portions go down the liquid levels of the liquid low-melting point metals. According to the utility model, the contact resistance can be reduced; and non-instantaneous disconnected circuit conduction of the first electronic element and the second electronic element can be maintained, thereby ensuring the good electric transport.

Description

Electric connector
Technical field
The utility model relates to a kind of electric connector, refers in particular to the electric connector of a kind of electric connection one chip module to circuit board.
Background technology
Electric connector is generally used for realizing the signal transmission between two electronic components that are not directly electrically connected, for example, the chip module of ball-shaped grid array (BGA) packing forms and the transmission of the signal between circuit board realize by BGA electric connector, electric connector comprises insulating body and is located at the terminal in insulating body, itself is provided with elastic contact part terminal, the tin ball of chip module be crimped on terminal elastic contact part, that terminal lower end is crimped to circuit board is in electrical contact to realize.Along with the accumulation of time, terminal itself may cause its impedance significantly to raise because of reasons such as friction or oxidations, and then causes the contact impedance between terminal and tin ball to increase, and easily affects the signal transmission between chip module and circuit board.In addition, in the situation that chip module or electric connector are subject to external force to produce vibrations, between the tin ball of the elastic contact part of described terminal and chip module, easily there is the phenomenon that moment opens circuit between described terminal and circuit board.
Therefore, be necessary to design a kind of new electric connector, to overcome the problems referred to above.
Summary of the invention
Creation object of the present utility model is to provide a kind of electric connector, and it can improve the phenomenon of hit between electronic component and electric connector, improves the stability of the two electric connection and signal transmission.
In order to achieve the above object, the utility model adopts following technical scheme:
The utility model provides a kind of electric connector, and in order to be electrically connected one first electronic component and one second electronic component, described the first electronic component has a plurality of outstanding conductive parts, comprising: insulating body, and described insulating body provides a plurality of accepting holes; A plurality of bodies that connect, correspondence is assembled in described accepting hole, described in connect the cavity volume that is formed with top end opening, bottom lock in body, described in connect body bottom downwards to contact with described the second electronic element press connection; Elastic electric conductor, is located in described cavity volume, and described elastic electric conductor bottom is crimped on the bottom of described cavity volume; Liquid low-melting-point metal, is placed in described cavity volume and is submerged to elastic electric conductor described in small part; When described the first electronic component presses down, described conductive part enters the top that described cavity volume is crimped on described elastic electric conductor, and described conductive part enters below described liquid low-melting-point metal liquid level at least partly.
Wherein, before described the first electronic component presses down, more than the top of described elastic electric conductor is revealed in described liquid low-melting-point metal liquid level.
As another kind of execution mode, before described the first electronic component presses down, described liquid low-melting-point metal also can submergence described in the top of elastic electric conductor.
Further, described in connect the upper surface that body upwards exceeds described insulating body, and there is shoulder block in the upper surface of described insulating body.The described body that connects is positioned at the part of described accepting hole and the hole wall matched in clearance of described accepting hole.The described bottom that connects body extends beyond the lower surface of described insulating body downwards.
Further, described insulating body is that flexible material is made.Described elastic electric conductor is helical spring.Described cavity volume comprises the first cavity volume and the second cavity volume that is positioned at described the first cavity volume below, and the diameter of described the first cavity volume coordinates with the external diameter of described conductive part, and the diameter of described the second cavity volume coordinates with described helical spring external diameter.The diameter of described the first cavity volume is greater than the diameter of described the second cavity volume.
Compared with prior art, the utility model, by the described cavity volume that connects body, described liquid low-melting-point metal being set, can reduce contact impedance, guarantees good electrically transmission; When the first electronic component is subject to exterior vibration and produces distance element and beat, described elastic electric conductor can keep certain positive force, makes described the first electronic component maintain the not circuit turn-on of hit in described the second electronic component.
[accompanying drawing explanation]
Fig. 1 is the schematic perspective view of the utility model electric connector;
Fig. 2 is the cutaway view of Fig. 1;
Fig. 3 is the schematic diagram of chip module while not pressing down;
Fig. 4 is the schematic diagram after chip module presses down;
Fig. 5 is the partial enlarged drawing of Fig. 4.
The drawing reference numeral explanation of embodiment:
Electric connector 100 Chip module 200 Circuit board 300
Conductive part (tin ball) 20 Insulating body 1 Accepting hole 10
Connect body 4 Shoulder 40 The first cavity volume 41
The second cavity volume 42 Liquid low-melting-point metal 5 Elastic electric conductor (helical spring) 6
Conducting strip 30 Fixture 700 ? ?
[embodiment]
For ease of better understanding the purpose of this utility model, structure, feature and effect etc., existing the utility model is described in further detail with embodiment by reference to the accompanying drawings.
As Fig. 1 to Fig. 3, electric connector 100 of the present utility model, in order to be electrically connected chip module 200 to one circuit boards 300, described chip module 200 bottoms have a plurality of outstanding conductive parts 20, in the present embodiment, described conductive part 20 is tin ball 20, and in other embodiments, described conductive part 20 can be also other shape and other material of for example copper post.
As shown in Figure 1, described electric connector 100 comprises insulating body 1, can be flexible material and makes, and it is flexible distortion when pressurized.Described insulating body 1 is provided with a plurality of accepting holes 10 and runs through its upper and lower surface.Described in each, the interior corresponding activity of accepting hole 10 contains one and connects body 4, the described body 4 that connects is roughly cylindric, its bottom exceeds the lower surface of described insulating body 1 downwards, to contact with described circuit board 300 crimping, describedly connect the upper surface that body 4 upwards exceeds described insulating body 1, and there are shoulder 40 blocks in the upper surface of described insulating body 1, described in connect body 4 be positioned at described shoulder more than 40 part external diameter be greater than the external diameter that it is positioned at accepting hole 10 parts.For convenience of described in connect body 4 and be assembled in described accepting hole 10 and described in making and connect body 4 distance element activity up and down, describedly connect the aperture that its external diameter of part that body 4 is positioned at described accepting hole 10 is slightly less than described accepting hole 10, to realize matched in clearance with the hole wall of described accepting hole 10.
Described in each, connect the cavity volume that is formed with top end opening, bottom lock in body 4, described cavity volume comprises the first cavity volume 41 and is positioned at the second cavity volume 42 of described the first cavity volume 41 belows, wherein, the diameter of described the first cavity volume 41 is greater than the diameter of described the second cavity volume 42, the slightly larger in diameter of described the first cavity volume 41, in the external diameter of described tin ball 20, can enter for described tin ball 20.
In described cavity volume, be provided with liquid low-melting-point metal 5.Described liquid low-melting-point metal 5 has compared with low melting point and can conduct electricity, and it is at room temperature in a liquid state, for example, can be that indium, gallium, tin a kind of element wherein forms, and can be also by wherein two kinds or three kinds of alloys that element forms.In the present embodiment, adopt the gallium of proper proportion and the indium gallium alloy that indium can form low melting point, as the gallium alloy containing 25% indium, just in the time of 16 ℃, melt, if temperature is on fusing point, just can automatically form alloy when gallium and indium mixed grinding.
The in-built elastic electric conductor 6 that is also provided with of cavity volume described in each.The present embodiment is as optimum execution mode, and described elastic electric conductor 6 is helical spring 6, and described helical spring 6 is at least partly by described liquid low-melting-point metal 5 submergences.As shown in Figure 2,3, the bottom of described helical spring 6 is crimped on the bottom of described cavity volume, its top according to the number of the amount of liquid low-melting-point metal 5 correspondingly in diverse location, in the present embodiment, more than top one circle of described helical spring 6 is revealed in described liquid low-melting-point metal 5 liquid levels.In other embodiments, when the amount of liquid low-melting-point metal 5 is enough, the top of described helical spring 6 also may be positioned at below described liquid low-melting-point metal 5 liquid levels.Wherein, about equally, described helical spring 6 can be at the interior upper and lower stretching motion of described the second cavity volume 42 for the diameter of the external diameter of described helical spring 6 and described the second cavity volume 42.
Electric connector 100 of the present utility model, for preventing that described liquid low-melting-point metal 5 from overflowing or flowing out because of external force inclination etc., can on body 4, paste mylar film (not shown) described connecting, with by the opening sealing of described the first cavity volume 41, when to be used, described mylar film is removed.
As shown in Figure 4 and Figure 5, use state for the utility model electric connector 100, described chip module 200 is crimped on described electric connector 100 tops, described electric connector 100 is crimped on described circuit board 300, between described chip module 200 and described circuit board 300, be also provided with fixture 700, to strengthen the crimping strength between described chip module 200 and described electric connector 100 and described circuit board 300.When described chip module 200 presses down, described tin ball 20 all enters in described the first cavity volume 41 substantially, and more than half part of described tin ball 20 enters below described liquid low-melting-point metal 5 liquid levels and by described liquid low-melting-point metal 5 submergences; Top part that the lower semisphere of described tin ball 20 is crimped on described helical spring 6 enter in the bore on described helical spring 6 tops.
Between conducting strip 30 on described tin ball 20 and described circuit board 300 by described liquid low-melting-point metal 5 and described in connect body 4 bottom formed a good conductive path.Compare the described helical spring 6 of simple use and between described chip module 200 and described circuit board 300, form the mode of conductive path, the liquid low-melting-point metal 5 of this employing is as the mode of conductive path, can significantly reduce described tin ball 20 and reduce with the contact impedance of electric connector 100, guarantee the good signal transmission between described chip module 200 and described circuit board 300.
In addition, described helical spring 6 is subject to the compressed elastic-restoring force of accumulating of described tin ball 20 downforce to guarantee the positive force between described tin ball 20 and described helical spring 6, and the bottom of described helical spring 6 connects body 4 bottoms described in strength is further passed to, described in making, connecting can well compressed between the conducting strip 30 on body 4 and described circuit board 300.When described chip module 200 is subject to exterior vibration and produces distance element and beat, described helical spring 6 can keep and the positive force of 20, described tin ball by stretching or compressing, described in guaranteeing, connect the crimp force between body 4 bottoms and described circuit board 300 simultaneously, thus make between described chip module 200 and described circuit board 300 by described liquid low-melting-point metal 5 and described in connect body 4 and maintain the not circuit turn-on of hit.
In addition, described tin ball 20 enters the part of described liquid low-melting-point metal below 5 because of isolated by described liquid low-melting-point metal 5, cannot contact with extraneous air, thus can be not oxidized, further guarantee the well compressed between described tin ball 20 and described spring, stopped hit phenomenon.
When there is difference of height in a plurality of conducting strips 30 on described circuit board 300, the corresponding described helical spring 6 of described tin ball 20 compacting makes helical spring 6 decrements in different accepting holes 10 different, the pressure that connects body 4 bottoms described in 6 pairs of described helical springs is also different, thereby can guarantee in each accepting hole 10 described in connect body 4 and all can touch with the certain crimping of each conducting strip 30, guaranteed electric signal transmission complete between described chip module 200 and described circuit board 300.
More than describing in detail is only the explanation of the preferred embodiment of the utility model, non-thus limitation the utility model the scope of the claims, so all this creation of utilization specifications and diagramatic content institute for it equivalence techniques change, and are all contained in the scope of the claims of this creation.

Claims (10)

1. an electric connector, in order to be electrically connected one first electronic component to the second electronic component, described the first electronic component bottom has a plurality of outstanding conductive parts, it is characterized in that, comprising:
Insulating body, described insulating body provides a plurality of accepting holes;
A plurality of bodies that connect, correspondence is assembled in described accepting hole, described in connect the cavity volume that is formed with top end opening, bottom lock in body, described in connect body bottom downwards to contact with described the second electronic element press connection;
Elastic electric conductor, is located in described cavity volume, and described elastic electric conductor bottom is crimped on the bottom of described cavity volume;
Liquid low-melting-point metal, is placed in described cavity volume and is submerged to elastic electric conductor described in small part;
When described the first electronic component presses down, described conductive part enters the top that described cavity volume is crimped on described elastic electric conductor, and described conductive part enters below described liquid low-melting-point metal liquid level at least partly.
2. electric connector as claimed in claim 1, is characterized in that: before described the first electronic component presses down, more than the top of described elastic electric conductor is revealed in described liquid low-melting-point metal liquid level.
3. electric connector as claimed in claim 1, is characterized in that: before described the first electronic component presses down, and the top of elastic electric conductor described in described liquid low-melting-point metal submergence.
4. electric connector as claimed in claim 1, is characterized in that: described in connect the upper surface that body upwards exceeds described insulating body, and there is shoulder block in the upper surface of described insulating body.
5. electric connector as claimed in claim 1, is characterized in that: described in connect body and be positioned at the part of described accepting hole and the hole wall matched in clearance of described accepting hole.
6. electric connector as claimed in claim 1, is characterized in that: described in connect body bottom extend beyond the lower surface of described insulating body downwards.
7. electric connector as claimed in claim 1, is characterized in that: described insulating body is that flexible material is made.
8. electric connector as claimed in claim 1, is characterized in that: described elastic electric conductor is helical spring.
9. electric connector as claimed in claim 8, it is characterized in that: described cavity volume comprises the first cavity volume and is positioned at the second cavity volume of described the first cavity volume below, the diameter of described the first cavity volume coordinates with the external diameter of described conductive part, and the diameter of described the second cavity volume coordinates with described helical spring external diameter.
10. electric connector as claimed in claim 9, is characterized in that: the diameter of described the first cavity volume is greater than the diameter of described the second cavity volume.
CN201320580018.4U 2013-09-20 2013-09-20 Electric connector Expired - Fee Related CN203466320U (en)

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Application Number Priority Date Filing Date Title
CN201320580018.4U CN203466320U (en) 2013-09-20 2013-09-20 Electric connector

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Application Number Priority Date Filing Date Title
CN201320580018.4U CN203466320U (en) 2013-09-20 2013-09-20 Electric connector

Publications (1)

Publication Number Publication Date
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9927398B2 (en) 2007-12-19 2018-03-27 Oxford Nanopore Technologies Ltd. Formation of layers of amphiphilic molecules
CN109212274A (en) * 2017-07-04 2019-01-15 日本电产理德股份有限公司 Contact terminal, gauging fixture and check device
US10215768B2 (en) 2007-02-20 2019-02-26 Oxford Nanopore Technologies Ltd. Lipid bilayer sensor system
US10338056B2 (en) 2012-02-13 2019-07-02 Oxford Nanopore Technologies Ltd. Apparatus for supporting an array of layers of amphiphilic molecules and method of forming an array of layers of amphiphilic molecules
US10549274B2 (en) 2014-10-17 2020-02-04 Oxford Nanopore Technologies Ltd. Electrical device with detachable components
US10814298B2 (en) 2012-10-26 2020-10-27 Oxford Nanopore Technologies Ltd. Formation of array of membranes and apparatus therefor
CN113544519A (en) * 2019-03-11 2021-10-22 日本麦可罗尼克斯股份有限公司 Electrical connection device
US11596940B2 (en) 2016-07-06 2023-03-07 Oxford Nanopore Technologies Plc Microfluidic device
US11789006B2 (en) 2019-03-12 2023-10-17 Oxford Nanopore Technologies Plc Nanopore sensing device, components and method of operation
US12121894B2 (en) 2017-11-29 2024-10-22 Oxford Nanopore Technologies Plc Microfluidic device

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10215768B2 (en) 2007-02-20 2019-02-26 Oxford Nanopore Technologies Ltd. Lipid bilayer sensor system
US9927398B2 (en) 2007-12-19 2018-03-27 Oxford Nanopore Technologies Ltd. Formation of layers of amphiphilic molecules
US12140563B2 (en) 2007-12-19 2024-11-12 Oxford Nanopore Technologies Plc Formation of layers of amphiphilic molecules
US11898984B2 (en) 2007-12-19 2024-02-13 Oxford Nanopore Technologies Plc Nanopore arrays for sequencing nucleic acids
US10416117B2 (en) 2007-12-19 2019-09-17 Oxford Nanopore Technologies Ltd. Formation of layers of amphiphilic molecules
US11561216B2 (en) 2012-02-13 2023-01-24 Oxford Nanopore Technologies Plc Apparatus for supporting an array of layers of amphiphilic molecules and method of forming an array of layers of amphiphilic molecules
US10338056B2 (en) 2012-02-13 2019-07-02 Oxford Nanopore Technologies Ltd. Apparatus for supporting an array of layers of amphiphilic molecules and method of forming an array of layers of amphiphilic molecules
US11913936B2 (en) 2012-02-13 2024-02-27 Oxford Nanopore Technologies Plc Apparatus for supporting an array of layers of amphiphilic molecules and method of forming an array of layers of amphiphilic molecules
US10814298B2 (en) 2012-10-26 2020-10-27 Oxford Nanopore Technologies Ltd. Formation of array of membranes and apparatus therefor
US10549274B2 (en) 2014-10-17 2020-02-04 Oxford Nanopore Technologies Ltd. Electrical device with detachable components
US11596940B2 (en) 2016-07-06 2023-03-07 Oxford Nanopore Technologies Plc Microfluidic device
CN109212274A (en) * 2017-07-04 2019-01-15 日本电产理德股份有限公司 Contact terminal, gauging fixture and check device
US12121894B2 (en) 2017-11-29 2024-10-22 Oxford Nanopore Technologies Plc Microfluidic device
CN113544519A (en) * 2019-03-11 2021-10-22 日本麦可罗尼克斯股份有限公司 Electrical connection device
US12244083B2 (en) 2019-03-11 2025-03-04 Kabushiki Kaisha Nihon Micronics Electrical connecting apparatus
US11789006B2 (en) 2019-03-12 2023-10-17 Oxford Nanopore Technologies Plc Nanopore sensing device, components and method of operation

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Granted publication date: 20140305

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