TWI423103B - Molded case with anti - electromagnetic interference and capacitive track plate and its preparation method - Google Patents
Molded case with anti - electromagnetic interference and capacitive track plate and its preparation method Download PDFInfo
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Description
本發明係關於一種軌跡板與塑殼一體成型之設計,特別是關於一種兼具防制電磁干擾及電容式軌跡板功能的塑殼及其製備方法。The invention relates to a design of a track plate and a molded case integrally formed, in particular to a molded case which has the functions of preventing electromagnetic interference and a capacitive track plate and a preparation method thereof.
在現今科技發展迅速的時代,無論是筆記型電腦、手機或是其他可攜式電子裝置,利用軌跡板(觸控板)進行操作已經是一種必然的趨勢。然而,就筆記型電腦的生產而言,都是將軌跡板模組化後再行組裝於筆記型電腦之機殼上。惟此種作法具有許多缺點,例如組裝後所產生的隙縫會使其在防污及防潑水的部分即比較難達成,或者需另外增加防污防潑水設計或組裝程序,無論採用何種作法,皆會使其成本增加,且不一定會完全解決防污及防潑水的問題。同時,軌跡板模組還必須考量符合防制電磁波干擾(EMI)的相關標準。若沒有防制電磁波干擾(Electro-Magnetic Interference;EMI)的措施,不僅會影響其他電子設備的運作,本身也容易受到其他電子設備干擾。目前防電磁干擾的工法包括金屬鐵片、噴塗導電漆、電鍍、鎂鋁合金及真空濺鍍等方式。然而,其中的真空濺鍍工法可鍍出較薄且平均的金屬薄膜,相對防制EMI效果也較其他工法更佳。在環保上來說,相較金屬鐵片、電鍍及導電漆需使用大量化學藥劑,真空濺鍍工法利用物理原理,將金屬原子鍍在塑膠機殼表面,製程較為環保,在成本方面也較其他工法低2~3成,是未來較具潛力的技術。In today's fast-developing technology era, whether it is a notebook computer, mobile phone or other portable electronic devices, it is an inevitable trend to operate with a trackpad (touchpad). However, in the production of a notebook computer, the trackpad is modularized and assembled on the case of the notebook computer. However, this method has many shortcomings. For example, the seam generated after assembly will make it difficult to achieve in the anti-fouling and water-repellent parts, or an additional anti-fouling and water-repellent design or assembly procedure, no matter what method is used. Both will increase the cost and will not completely solve the problem of anti-fouling and water repellent. At the same time, the trackpad module must also consider the relevant standards for preventing electromagnetic interference (EMI). If there is no measures to prevent Electro-Magnetic Interference (EMI), it will not only affect the operation of other electronic devices, but also be susceptible to interference from other electronic devices. At present, the anti-electromagnetic interference method includes metal iron sheet, spray conductive paint, electroplating, magnesium alloy and vacuum sputtering. However, the vacuum sputtering method can coat a thin and average metal film, and the relative anti-EMI effect is better than other methods. In terms of environmental protection, a large amount of chemical agents are required for metal iron sheets, electroplating and conductive paints. The vacuum sputtering method uses physical principles to plate metal atoms on the surface of plastic casings. The process is more environmentally friendly, and the cost is also better than other methods. Low 2~30% is a technology with more potential in the future.
為了達到防污、防潑水以及防制電磁波干擾的需求,並且在組裝程序及相關製程上的複雜度、以及成本控制等問題,在本發明中提出了一種塑殼和軌跡板為一體成型之發明概念。In order to achieve the anti-fouling, water-repellent and anti-electromagnetic interference requirements, and the complexity of the assembly process and related processes, as well as cost control, the present invention proposes an invention in which a molded case and a track plate are integrally formed. concept.
緣此,本發明之一目的即是提供一種兼具防制電磁干擾及電容式軌跡板功能的塑殼。Accordingly, it is an object of the present invention to provide a molded case that has both electromagnetic interference prevention and capacitive trackpad functions.
本發明之另一目的即是提供一種兼具防制電磁干擾及電容式軌跡板功能的塑殼之製備方法。Another object of the present invention is to provide a method for preparing a molded case which has both the function of preventing electromagnetic interference and the function of a capacitive track plate.
本發明為解決習知技術之問題所採用之技術手段係為一種兼具防制電磁干擾及電容式軌跡板功能的塑殼,包括:一基材,具有一第一表面及一第二表面,該第一表面定義有一觸控操作區,且在該基材之觸控操作區之預定位置開設有複數個第一貫孔及第二貫孔,且該第一貫孔及該第二貫孔之孔壁分布有一導電區段;一第一電極層,形成於該基材之第一表面之觸控操作區,該第一電極層包括有一第一電極圖形及一第二電極圖形,其中該第一電極圖形係電性連接於該各第一貫孔之導電區段,而該第二電極圖形係電性連接於該各第二貫孔之導電區段;一第二電極層,形成於該基材之第二表面,該第二電極層包括有一第一線路及一第二線路,該第一線路係電性連接於該第一貫孔之導電區段以電性連接該第一電極層之第一電極圖形,而該第二線路係電性連接於該第二貫孔之導電區段以電性連接該第一電極層之第二電極圖形;以及一接地層,形成於該基材之至少第一表面或第二表面。The technical means adopted by the present invention to solve the problems of the prior art is a molded case having both the function of preventing electromagnetic interference and the capacitive track plate, comprising: a substrate having a first surface and a second surface, The first surface defines a touch operation area, and a plurality of first through holes and second through holes are formed at predetermined positions of the touch operation area of the substrate, and the first through holes and the second through holes are a first conductive layer is formed on the first surface of the substrate; the first electrode layer includes a first electrode pattern and a second electrode pattern, wherein the first electrode layer is disposed on the first surface of the substrate The first electrode pattern is electrically connected to the conductive segments of the first through holes, and the second electrode pattern is electrically connected to the conductive segments of the second through holes; a second electrode layer is formed on a second surface of the substrate, the second electrode layer includes a first line and a second line, the first line is electrically connected to the conductive portion of the first through hole to electrically connect the first electrode a first electrode pattern of the layer, and the second line is electrically connected to The second conductive section of the through hole to be electrically connected to the first electrode pattern layer, the second electrode; and a ground layer formed on at least the first or second surface of the substrate.
上述兼具防制電磁干擾及電容式軌跡板功能的塑殼,其製備方法包括;(a)提供一基材;(b)在該基材上開設複數個貫孔;(c)進行一薄膜製程,係分別在該基材之第一表面形成該第一電極層,在第二表面形成該第二電極層,同時在該基材之至少第一表面或第二表面形成該接地層;(d)導通該基材之各個貫孔,使該第一電極層及該第二電極層電性連接。The above-mentioned plastic shell having the functions of preventing electromagnetic interference and capacitive track plate includes: (a) providing a substrate; (b) opening a plurality of through holes on the substrate; and (c) performing a film The process comprises: forming the first electrode layer on the first surface of the substrate, and forming the second electrode layer on the second surface, and forming the ground layer on at least the first surface or the second surface of the substrate; d) conducting through holes of the substrate to electrically connect the first electrode layer and the second electrode layer.
經由本發明所採用之技術手段,可同時兼具電腦機殼及電容式軌跡板之作用,利用其軌跡板直接形成於塑殼表面之一體成型設計,以及接地層之形成,可兼具防污、防潑水以及防制電磁波干擾之功能,且不會在組裝及製程上使成本增加。在製程上可僅利用濺鍍即達到上、下兩面電路的導通,避免填充銀膠或其他導電膠之步驟,可達到降低產品不良率之功效。Through the technical means adopted by the invention, the function of the computer casing and the capacitive track plate can be simultaneously combined, and the track plate is directly formed on the surface of the molded case body and the formation of the ground layer, and the anti-fouling can be combined , water repellent and anti-electromagnetic interference, and will not increase the cost of assembly and process. In the process, only the sputtering can be used to achieve the conduction of the upper and lower circuits, and the steps of filling the silver glue or other conductive glue can be avoided, thereby reducing the defect rate of the product.
本發明所採用的具體實施例,將藉由以下之實施例及附呈圖式作進一步之說明。The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.
請同時參閱第一~三圖,其分別為本發明塑殼之第一實施例立體圖、上視圖及局部剖視圖。如圖所示,本發明兼具防制電磁干擾及電容式軌跡板功能的塑殼100包括有一基材1,具有一第一表面11及一第二表面12,在第一表面11上定義有一觸控操作區111,且在基材1之觸控操作區111之預定位置開設有複數個第一貫孔131及第二貫孔132。在基材1之第一表面11之觸控操作區111形成有第一電極層2,而在基材1之第二表面12形成有第二電極層3(參第四圖)。且基材1之第一貫孔131及第二貫孔132之孔壁分布有一導電區段14(例如可以為銀膠,或以濺鍍方式使導電區段14形成於孔壁上),用以電性連接第一電極層2及第二電極層3。Please also refer to the first to third figures, which are respectively a perspective view, a top view and a partial cross-sectional view of the first embodiment of the molded case of the present invention. As shown in the figure, the molded case 100 of the present invention having both the function of preventing electromagnetic interference and the capacitive track plate comprises a substrate 1 having a first surface 11 and a second surface 12, and a first surface 11 is defined The touch operation area 111 is provided with a plurality of first through holes 131 and second through holes 132 at predetermined positions of the touch operation area 111 of the substrate 1 . A first electrode layer 2 is formed on the touch operation area 111 of the first surface 11 of the substrate 1, and a second electrode layer 3 is formed on the second surface 12 of the substrate 1 (refer to FIG. 4). And the first through hole 131 and the second through hole 132 of the substrate 1 are provided with a conductive portion 14 (for example, silver paste or a conductive portion 14 formed on the hole wall by sputtering). The first electrode layer 2 and the second electrode layer 3 are electrically connected.
第一電極層2包括有一第一電極圖形21及一第二電極圖形22。其中第一電極圖形21恰接觸於各第一貫孔131之導電區段14,而第二電極圖形22恰接觸於各第二貫孔132之導電區段14。本實施例中,第一電極圖形21係作為電容式觸控板之X軸電極,而第二電極圖形22係作為Y軸電極,其形狀在本實施例中皆為方形,但並非僅限於此。The first electrode layer 2 includes a first electrode pattern 21 and a second electrode pattern 22. The first electrode pattern 21 is in contact with the conductive segments 14 of the first through holes 131, and the second electrode patterns 22 are in contact with the conductive segments 14 of the second through holes 132. In this embodiment, the first electrode pattern 21 is used as the X-axis electrode of the capacitive touch panel, and the second electrode pattern 22 is used as the Y-axis electrode. The shape of the second electrode pattern is square in this embodiment, but is not limited thereto. .
另外,在基材1之第一表面11且避開觸控操作區111之部分形成有一接地層23,係為具有電磁干擾防制功能之材質。In addition, a ground layer 23 is formed on the first surface 11 of the substrate 1 and away from the touch operation area 111, and is a material having an electromagnetic interference prevention function.
請同時參閱第四~五圖,其分別為本發明塑殼之第一實施例立體圖及下視圖。如圖所示,第二電極層3包括有一第一線路31及一第二線路32,第一線路31係接觸於該第一貫孔131之導電區段14,以電性連接第一電極層2之第一電極圖形21,而第二線路32係接觸於第二貫孔132之導電區段14,以電性連接第一電極層2之第二電極圖形22。圖中所示之第二線路32除包括延伸出來的長段線路外,亦包括將各個相鄰之第二貫孔132電性連結之短線路部分。Please also refer to the fourth to fifth figures, which are respectively a perspective view and a bottom view of the first embodiment of the molded case of the present invention. As shown in the figure, the second electrode layer 3 includes a first line 31 and a second line 32. The first line 31 is in contact with the conductive portion 14 of the first through hole 131 to electrically connect the first electrode layer. The first electrode pattern 21 of the second electrode 32 is in contact with the conductive portion 14 of the second through hole 132 to electrically connect the second electrode pattern 22 of the first electrode layer 2. The second line 32 shown in the figure includes a short line portion electrically connecting each adjacent second through hole 132 in addition to the extended long line.
相似地,在基材1之第二表面12上避開第二電極層3之第一線路31及第二線路32之部分,形成有另一接地層33,同樣為具有電磁干擾防制功能之材質。本實施例所述之接地層,可以僅形成於基材的單一表面(第一表面或第二表面)或兩表面(第一表面以及第二表面),而其所佔區域為部份或全部面積、位置、形狀等,皆可視產品需求而定,並非僅限於本實施例所述之方式。Similarly, a portion of the first line 31 and the second line 32 of the second electrode layer 3 is avoided on the second surface 12 of the substrate 1, and another ground layer 33 is formed, which is also provided with an electromagnetic interference prevention function. Material. The ground layer described in this embodiment may be formed only on a single surface (first surface or second surface) or both surfaces (first surface and second surface) of the substrate, and the occupied area is part or all The area, position, shape, and the like may be determined according to the needs of the product, and are not limited to the manner described in this embodiment.
另外,在基材1之第二表面12之預定位置形成有一連接器4,可將集成的第一線路31及一第二線路32連接至電路板。本實施例所述之塑殼100具有防制電磁干擾之功能,同時具有電容式軌跡板之功能,較佳為可應用作為筆記型電腦之軌跡板(觸控板),但並非僅限於此。Further, a connector 4 is formed at a predetermined position of the second surface 12 of the substrate 1, and the integrated first line 31 and a second line 32 can be connected to the circuit board. The molded case 100 described in this embodiment has the function of preventing electromagnetic interference, and has the function of a capacitive track board, and is preferably applied as a track board (touch pad) of a notebook computer, but is not limited thereto.
就製程上而言,塑殼100之第一電極層2、第二電極層3及接地層23、33之薄膜製程可利用濺鍍製程(sputtering)所製成,例如在基材1之第一表面11及第二表面12分別濺鍍形成金屬薄膜(銅或不銹鋼+銅)。而其第一電極圖形21及第二電極圖形22之圖型化製程,可利用如光罩(Mask)製程或雷射雕刻製程所製成。例如光罩製程可在未實施薄膜製程時先實施負片的圖形化光罩製程,而雷射雕刻製程係在實施薄膜製程後再實施雷雕製程的圖形化,關於兩種製程之細節部份將於後述製程部分說明。In terms of process, the thin film process of the first electrode layer 2, the second electrode layer 3, and the ground layers 23, 33 of the molded case 100 can be made by sputtering, for example, at the first of the substrate 1. The surface 11 and the second surface 12 are respectively sputtered to form a metal thin film (copper or stainless steel + copper). The patterning process of the first electrode pattern 21 and the second electrode pattern 22 can be performed by a process such as a mask process or a laser engraving process. For example, the mask process can implement the patterned mask process of the negative film when the film process is not implemented, and the laser engraving process is performed after the film process is performed, and the details of the two processes will be described. This will be explained in the process section described later.
參閱第六圖,係為本發明塑殼應用於筆記型電腦之示意圖。如圖所示,將本發明之塑殼100應用於筆記型電腦5,可同時兼具電腦機殼及電容式軌跡板之作用,利用其一體成型之設計,可兼具防污、防潑水以及防制電磁波干擾之功能。Referring to the sixth figure, it is a schematic diagram of the molded case of the present invention applied to a notebook computer. As shown in the figure, the molded case 100 of the present invention is applied to the notebook computer 5, and can simultaneously function as a computer case and a capacitive track plate, and the integrated molding design can simultaneously have antifouling and water repellent resistance. The function of preventing electromagnetic interference.
參閱第七圖,其係為本發明塑殼之製備方法流程圖。請同時配合參閱第八A-八E圖,其係為本發明塑殼製備方法之第二實施例剖視圖。Referring to the seventh figure, it is a flow chart of the preparation method of the molded case of the present invention. Please also refer to the eighth embodiment of the present invention, which is a cross-sectional view of a second embodiment of the method for preparing a molded case of the present invention.
首先,提供一基材(步驟101)。基材1具有一第一表面11及一第二表面12,如第八A圖所示。First, a substrate is provided (step 101). The substrate 1 has a first surface 11 and a second surface 12 as shown in FIG.
在基材上開設複數個貫孔(步驟102)。在圖中僅以一個貫孔133為例,如第八B圖所示。貫孔133之形成包括可在射出成型時一併完成,或在射出後再鑽孔加工製作。射出成型可依據設計需求,將貫孔於開模時先行設定孔位及孔徑,一次射出成型後即形成符合需求的貫孔。若是以鑽孔加工的方式,可在射出成型後依據設定的孔位及孔徑進行鑽孔加工。A plurality of through holes are formed in the substrate (step 102). In the figure, only one through hole 133 is taken as an example, as shown in the eighth B. The formation of the through holes 133 includes that it can be completed at the time of injection molding, or can be drilled after the injection. According to the design requirements, the injection molding can first set the hole position and the hole diameter when the through hole is opened, and form a through hole that meets the requirements after one injection molding. If it is drilled, it can be drilled according to the set hole position and hole diameter after injection molding.
進行前處理(步驟103),包括粗化、預洗、貫孔微蝕、基材清洗、風刀除水及烘烤等前處理步驟,以利後續步驟的進行。Pre-treatment (step 103), including roughing, pre-washing, through-hole micro-etching, substrate cleaning, air knife water removal and baking, etc., to facilitate the subsequent steps.
進行薄膜製程(步驟104),以分別在基材1之第一表面11形成第一電極層2(如第八C圖),同時在基材1之第一表面11上避開第一電極層2之部分,以濺鍍或塗佈等方式形成接地層23。接著,在第二表面12形成第二電極層3(如第八D圖),同時在基材1之第二表面12上避開第二電極層3之部分,以相同方式形成接地層33。其中,電極層之形成在作法上包括可利用遮罩製程或雷射雕刻製程。而接地層之形成可視需要,僅形成於基材的單一表面(第一表面或第二表面)或兩表面(第一表面以及第二表面),其中在第一表面11所形成的接地層23主要與觸控干擾訊號防制有關,而第二表面12所形成的接地層33與電磁波防制有關,惟兩者皆是利用其接地之原理達成,而其所佔區域為部份或全部面積、位置、形狀等,皆可視產品需求而定,並非僅限於本實施例所述之方式。Performing a thin film process (step 104) to form a first electrode layer 2 on the first surface 11 of the substrate 1 (as shown in FIG. 8C) while avoiding the first electrode layer on the first surface 11 of the substrate 1. In part 2, the ground layer 23 is formed by sputtering or coating. Next, a second electrode layer 3 is formed on the second surface 12 (as shown in FIG. 8D) while the portion of the second electrode layer 3 is avoided on the second surface 12 of the substrate 1, and the ground layer 33 is formed in the same manner. Wherein, the formation of the electrode layer includes, in practice, a mask process or a laser engraving process. The formation of the ground layer may be formed only on a single surface (first surface or second surface) or both surfaces (first surface and second surface) of the substrate, wherein the ground layer 23 formed on the first surface 11 Mainly related to touch interference signal prevention, and the ground layer 33 formed by the second surface 12 is related to electromagnetic wave prevention, but both are achieved by the principle of grounding, and the occupied area is part or all of the area. The position, shape, and the like may be determined according to the needs of the product, and are not limited to the manner described in this embodiment.
採用遮罩製程時,可在濺鍍前先製作遮罩(mask),例如以光阻塗佈或網版印刷方式進行,將兩面進行薄膜鍍製作業,並於濺鍍完成後進行遮罩脫膜作業(剝除或洗除皆可)。When using the mask process, a mask can be made before sputtering, for example, by photoresist coating or screen printing, and the two sides are subjected to a film coating operation, and after the sputtering is completed, the mask is removed. Membrane operation (extraction or washing).
採用雷射雕刻製程時,可將基材1進行雙面薄膜鍍製作業後,以雷射雕刻將兩面依據所需電極圖形雕刻後將碎屑清除。In the laser engraving process, the substrate 1 can be subjected to double-sided film plating, and the two sides are engraved according to the desired electrode pattern by laser engraving to remove the debris.
導通基材上的各個貫孔(步驟105),使第一電極層2及第二電極層3電性連接,本實施例的作法係將導電膠(銀膠)/漿材覆蓋印刷覆有遮罩之基材表面,使導電膠/漿材灌入貫孔133中,再進行烘烤,最終在貫孔133之孔壁上形成導電區段14。熟習該領域技藝者當知,亦可在進行步驟104前先實施此步驟。也就是先將導電膠/漿材灌入貫孔133中後,再進行步驟104之薄膜製程,同樣具有使第一電極層2及第二電極層3電性連接之功效。Each of the through holes on the substrate is turned on (step 105), and the first electrode layer 2 and the second electrode layer 3 are electrically connected. In this embodiment, the conductive paste (silver glue)/pulp material is covered with a printed cover. The surface of the substrate of the cover is filled with the conductive paste/slurry into the through hole 133, and then baked, and finally the conductive portion 14 is formed on the hole wall of the through hole 133. Those skilled in the art will recognize that this step can also be performed prior to performing step 104. That is, after the conductive paste/slurry is poured into the through hole 133, the film process of the step 104 is performed, and the first electrode layer 2 and the second electrode layer 3 are electrically connected.
同時,在完成上述步驟後,更可視需要在塑殼適當位置結合一連接器(圖未示),以將基板上的電路予以集成。At the same time, after the above steps are completed, it is more necessary to incorporate a connector (not shown) at a suitable position of the molded case to integrate the circuits on the substrate.
參閱第九A-九D圖,其係為本發明塑殼製備方法之第三實施例剖視圖。本實施例之製備過程與第二實施例相似,故相似之處在此不再重複說明。參閱第九C圖,其中主要差異點在於本實施例在進行薄膜製程(步驟104)時,使第一電極層2部分地延伸分布至各貫孔133之孔璧。接著,如第九D圖所示,再使第二電極層3部分地延伸分布至貫孔133之孔璧,使第一電極層2及第二電極層3接觸並電性連接。以此作法,不需要填充導電膠或其他導電材料即可達成上、下兩面電路的導通。至於其他步驟則與第二實施例相似,不再贅述。Referring to Figures 9A-IXD, which are cross-sectional views of a third embodiment of the method of making a molded case of the present invention. The preparation process of this embodiment is similar to that of the second embodiment, so the similarities are not repeated here. Referring to the ninth C, the main difference is that in the embodiment, when the thin film process (step 104) is performed, the first electrode layer 2 is partially extended to the apertures of the through holes 133. Next, as shown in the ninth D, the second electrode layer 3 is partially extended to the aperture of the through hole 133, and the first electrode layer 2 and the second electrode layer 3 are contacted and electrically connected. In this way, it is not necessary to fill the conductive paste or other conductive material to achieve the conduction of the upper and lower circuits. The other steps are similar to the second embodiment and will not be described again.
由以上之實施例可知,本發明所提供之兼具防制電磁干擾及電容式軌跡板功能的塑殼及其製備方法確具產業上之利用價值,惟以上之敘述僅為本發明之較佳實施例說明,凡精於此項技藝者當可依據上述之說明而作其它種種之改良,惟這些改變仍屬於本發明之精神及以下所界定之專利範圍中。It can be seen from the above embodiments that the molded case and the preparation method thereof, which have the functions of preventing electromagnetic interference and capacitive track plate, have industrial value, but the above description is only preferred of the present invention. It is to be understood that those skilled in the art will be able to make various other modifications in accordance with the above description, but such changes are still within the spirit of the invention and the scope of the invention as defined below.
100...塑殼100. . . Molded case
1...基材1. . . Substrate
11...第一表面11. . . First surface
111...觸控操作區111. . . Touch operating area
12...第二表面12. . . Second surface
131...第一貫孔131. . . First consistent hole
132...第二貫孔132. . . Second through hole
133...貫孔133. . . Through hole
14...導電區段14. . . Conductive section
2...第一電極層2. . . First electrode layer
21...第一電極圖形twenty one. . . First electrode pattern
22...第二電極圖形twenty two. . . Second electrode pattern
23...接地層twenty three. . . Ground plane
3...第二電極層3. . . Second electrode layer
31...第一線路31. . . First line
32...第二線路32. . . Second line
33...接地層33. . . Ground plane
4...連接器4. . . Connector
5...筆記型電腦5. . . Notebook computer
第一圖為本發明塑殼之第一實施例立體圖,主要係顯示出位於塑殼之第一表面之第一電極層;The first figure is a perspective view of a first embodiment of a molded case of the present invention, mainly showing a first electrode layer on a first surface of the molded case;
第二圖為本發明塑殼之第一實施例上視圖,主要係顯示出位於塑殼之第一表面之第一電極層;2 is a top view of a first embodiment of a molded case of the present invention, mainly showing a first electrode layer on a first surface of the molded case;
第三圖為本發明塑殼之局部剖視圖;The third figure is a partial cross-sectional view of the molded case of the present invention;
第四圖為本發明塑殼之第一實施例立體圖,主要係顯示出位於塑殼之第二表面之第二電極層;4 is a perspective view of a first embodiment of a molded case of the present invention, mainly showing a second electrode layer on a second surface of the molded case;
第五圖為本發明塑殼之第一實施例下視圖,主要係顯示出位於塑殼之第二表面之第二電極層;Figure 5 is a bottom view of the first embodiment of the molded case of the present invention, mainly showing the second electrode layer on the second surface of the molded case;
第六圖為本發明塑殼應用於筆記型電腦之示意圖;Figure 6 is a schematic view showing the application of the molded case of the present invention to a notebook computer;
第七圖為本發明塑殼之製備方法流程圖;7 is a flow chart of a method for preparing a molded case of the present invention;
第八A-八E圖為製備本發明塑殼之第二實施例剖視圖;8A to 8E are cross-sectional views showing a second embodiment of preparing a molded case of the present invention;
第九A-九D圖為製備本發明塑殼之第三實施例剖視圖。The ninth A-ninth D is a cross-sectional view showing a third embodiment of the molded case of the present invention.
100...塑殼100. . . Molded case
1...基材1. . . Substrate
11...第一表面11. . . First surface
111...觸控操作區111. . . Touch operating area
12...第二表面12. . . Second surface
131...第一貫孔131. . . First consistent hole
132...第二貫孔132. . . Second through hole
2...第一電極層2. . . First electrode layer
21...第一電極圖形twenty one. . . First electrode pattern
22...第二電極圖形twenty two. . . Second electrode pattern
23...接地層twenty three. . . Ground plane
33...接地層33. . . Ground plane
Claims (12)
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TW99108205A TWI423103B (en) | 2010-03-19 | 2010-03-19 | Molded case with anti - electromagnetic interference and capacitive track plate and its preparation method |
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TW99108205A TWI423103B (en) | 2010-03-19 | 2010-03-19 | Molded case with anti - electromagnetic interference and capacitive track plate and its preparation method |
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TW201133316A TW201133316A (en) | 2011-10-01 |
TWI423103B true TWI423103B (en) | 2014-01-11 |
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CN103582329B (en) * | 2012-07-24 | 2016-08-03 | 富泰华工业(深圳)有限公司 | Housing and manufacture method thereof |
TWI494838B (en) * | 2012-11-07 | 2015-08-01 | Elan Microelectronics Corp | Capacitive touch panel and a manufacturing method thereof |
TWI651031B (en) * | 2013-02-07 | 2019-02-11 | 佳能企業股份有限公司 | Housing structure and electronic device using the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101101392A (en) * | 2006-07-04 | 2008-01-09 | 三星电子株式会社 | Liquid crystal display device |
TW200906276A (en) * | 2007-07-30 | 2009-02-01 | Gigabyte United Inc | Circuit board and manufacture method thereof |
TW200909915A (en) * | 2007-08-24 | 2009-03-01 | Mildex Optical Inc | Capacitive touch panel with high planarity |
CN201222242Y (en) * | 2008-06-11 | 2009-04-15 | 深圳市德普特光电显示技术有限公司 | Capacitance touch screen |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN101101392A (en) * | 2006-07-04 | 2008-01-09 | 三星电子株式会社 | Liquid crystal display device |
TW200906276A (en) * | 2007-07-30 | 2009-02-01 | Gigabyte United Inc | Circuit board and manufacture method thereof |
TW200909915A (en) * | 2007-08-24 | 2009-03-01 | Mildex Optical Inc | Capacitive touch panel with high planarity |
CN201222242Y (en) * | 2008-06-11 | 2009-04-15 | 深圳市德普特光电显示技术有限公司 | Capacitance touch screen |
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