201133316 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種執跡板與塑殼一體成型之設計，特別是關 於一種兼具防制電磁干擾及電容式執跡板功能的塑殼及其製備方 法0201133316 VI. Description of the Invention: [Technical Field] The present invention relates to a design of an integral structure of a track plate and a molded case, and more particularly to a molded case having both the function of preventing electromagnetic interference and the function of a capacitive track plate. Preparation method 0
【先前技術】 在現今科技發展迅速的時代，無論是筆記型電腦、手機或是 其他可攜式電子裝置’利用軌跡板(觸控板)進行操作已經是一種必 然的趨勢。然而，就筆記型電腦的生產而言，都是將執跡板模組 化後再行組裝於筆記型電腦之機殼上。惟此種作法具有許多缺 點，例如組裝後所產生的隙縫會使其在防污及防潑水的部分即比 較難達成，或者需另外增加防污防潑水設計或組裝程序，無論採[Prior Art] In today's rapidly evolving technology, it is a necessary trend to use a trackpad (touchpad) for notebook computers, mobile phones or other portable electronic devices. However, in the production of notebook computers, the trace boards are modularized and assembled on the case of the notebook computer. However, this method has many disadvantages. For example, the seam generated after assembly will make it more difficult to achieve in the anti-fouling and water-repellent parts, or an additional anti-fouling and water-repellent design or assembly procedure should be added.
用何種作法’皆會使其成本增加，且不—定會完全解決防污及防 潑水的問題。同時，軌跡板模組還必須考量符合防制電磁波干擾 ^MI)的相關標準。若沒有防制電磁波干擾fflectr〇 M哪咖 Interference ; EMI)的措施，不僅會影響其他電子設備的運作，本 身也容Μ職他電子讀干擾。目前防電磁谓缸法包括金 屬鐵片、噴塗導電漆、賴、合金及真空濺料枝。然而’， 其中的真空频卫法可鑛出㈣鮮均的金屬薄膜，相對防制 ΕΜ效果也較其他工法更佳。⑽保上來說，相較金屬鐵片、電 鑛及導電漆需使用大量化學_，真錢鍍工法利用物理原理， 將金屬原子職_機殼表面，製程較騎保，在成本方面也較 其他工法低2〜3成，是未來較具潛力的技術。 【發明内容】 201133316 . 為了達到防污、防潑水以及防制電磁波干擾的需求，並且在 組裝程序及相關製程上的複雜度、以及成本控制等問題，在本發 明中提出了一種塑殼和軌跡板為一體成型之發明概念。 緣此，本發明之一目的即是提供一種兼具防制電磁干擾及電 容式執跡板功能的塑殼。 本發明之另一目的即是提供一種兼具防制電磁干擾及電容式 軌跡板功能的塑殼之製備方法。 鲁 本發明為解決習知技術之問題所採用之技術手段係為一種兼 具防制電磁干擾及電容式軌跡板功能的塑殼，包括：一基材，具 ' 有第表面及一第二表面，該第一表面定義有一觸控操作區， -且j6亥基材之觸抱喿作區之預定位置開設有複數個第-貫孔及第 二孔且孩第一貝孔及該第二貫孔之孔壁分布有一導電區段； 一第電極層，开>成於該基材之第一表面之觸控操作區，該第一 電極層包括有一第一電極圖形及一第二電極圖形，其中該第一電 係電性連接於該各第—貫孔之導電區段，而該第二電極圖 性連接於該各第二貫孔之導電區段；—第二電極層，形成 線〜材之第二表面，該第二電極層包括有—第—線路及一第二 接^ °亥第—線路係電性連接於該第一貫孔之導電區段以電性連 第電極層之第一電極圖形’而該第二線路係電性連接於該 以:孔之導電區段以電性連接該第-電極層之第二電極圖形； 4 妾地層’形成於該基材之至少第—表面或第二表面。 方法S兼具防制電磁干擾及電容式執跡板功能的塑殼，其製備 .提供一基材；（b)在該基材上開設複數個貫孔；(c) 仃薄膜製程’係分別在該基材之第-表面形成該第-電極 4 201133316 層，在第二表面形成該第二電極層，同時在該基材之至少第一表 面或第二表面形成該接地層；（d) f通該基材之各個貫孔，使該 第-1：極層及该第二電極層電性連接。 =本發__之技财段，可同縣具電職殼及 :T=广其執跡板直接形成於塑殼表面之-體成型 5又5十以及接地層之觀，可兼肋污、歸水以及防制電磁波What kind of practice will increase the cost, and not - will completely solve the problem of anti-fouling and water-repellent. At the same time, the trackpad module must also consider the relevant standards for compliance with electromagnetic interference (MI). If there is no anti-electromagnetic interference, the EMI) measures will not only affect the operation of other electronic devices, but also the electronic reading interference. At present, the anti-electromagnetic pre-cylinder method includes metal iron sheets, sprayed conductive paint, Lai, alloy and vacuum spatter. However, the vacuum frequency method can mine (4) fresh metal film, and the effect of preventing cockroaches is better than other methods. (10) Baoshang said that compared with metal iron sheets, electric ore and conductive paints, a lot of chemistry is needed. _ The real money plating method uses the physical principle to make the metal atomic _ the surface of the casing, the process is better than riding, and the cost is also better than other The construction method is 2 to 30% lower, which is a technology with more potential in the future. SUMMARY OF THE INVENTION 201133316. In order to achieve the anti-fouling, water-repellent and anti-electromagnetic interference requirements, and the complexity of the assembly process and related processes, as well as cost control, a molded case and a trajectory are proposed in the present invention. The board is an invention concept. Accordingly, it is an object of the present invention to provide a molded case which has both the function of preventing electromagnetic interference and the function of a resistive track. Another object of the present invention is to provide a method of preparing a molded case which has both the function of preventing electromagnetic interference and the function of a capacitive track plate. The technical means adopted by Ruben in order to solve the problems of the prior art is a molded case which has the functions of preventing electromagnetic interference and capacitive track plate, and comprises: a substrate having a first surface and a second surface The first surface defines a touch operation area, and the predetermined position of the contact area of the j6 hai substrate is provided with a plurality of first through holes and second holes, and the first first hole and the second first The hole wall of the hole is distributed with a conductive portion; an electrode layer is opened to form a touch operation area on the first surface of the substrate, the first electrode layer includes a first electrode pattern and a second electrode pattern The first electrical system is electrically connected to the conductive segments of the first through holes, and the second electrode is electrically connected to the conductive segments of the second through holes; the second electrode layer forms a line a second surface of the material, the second electrode layer includes a first line and a second line, and the second conductive layer is electrically connected to the conductive portion of the first through hole to electrically connect the first electrode layer a first electrode pattern 'and the second line is electrically connected to the conductive segment of the hole Electrically connecting the second electrode pattern of the first electrode layer; 4 妾 formation ' is formed on at least the first surface or the second surface of the substrate. Method S has a molded case for preventing electromagnetic interference and a capacitive trace board, and is prepared by providing a substrate; (b) opening a plurality of through holes on the substrate; (c) preparing a thin film process Forming the first electrode 4 201133316 layer on the first surface of the substrate, forming the second electrode layer on the second surface, and forming the ground layer on at least the first surface or the second surface of the substrate; (d) f passing through each of the through holes of the substrate to electrically connect the first -1:pole layer and the second electrode layer. = The financial section of this hair __ can be combined with the county's electric power shell and: T = wide its own trace plate is directly formed on the surface of the molded case - body forming 5 and 50 and the ground layer view, can also be ribbed , returning water and preventing electromagnetic waves
干擾之功能’且不會在組裝及製程上使成本增加。在製程上可僅 利用續即達到上、下兩面電_導通，避免填充轉或盆 電膠之步驟，可達到降低產品不良率之姐。 、等 實施例及附呈圖 本發明所採用的具體實施例，將藉由以下之 式作進一步之說明。 【實施方式】 响同時彡閱第〜二圖’其分別為本發明塑殼之第—實施例立 體圖、上涵及局部剖湖。如圖所示，本發明兼具關電磁干 擾及電容式軌跡板功能_殼⑽包括有—基材丨，具有一第一表 面11及第—表面12’在第—表面u上定義有—觸控操作區 111且在紐1之觸控操作區m之敢位置開設有複數個第一 貫孔131及第二貫孔132。在基材i之第一表面u之觸控操作區 111形成有第-電極層2，而在基材1之第二表面12形成有第二 電極層3(參細圖）。^基材〗之第―貫孔i3i及第二貫孔132之 孔壁分布有-導電區段·如可以為銀膠，或以麟方式使導電 區段14形成於孔壁上)，用以電性連接第—電極層2及第二電極層 3 ° 形21及一第二電極圖形 第一電極層2包括有一第—電極圖 201133316 .=其中第-電極圖形21恰接觸於各第—貫孔ΐ3ι之 二圖形22恰接觸於各第二貫孔132之導電區段二 本只鉍例中，第一電極圖形21係作為電 而第二電極圖形22传作為Y麻μ # 控板軸電極， 形，但並非=於Γ電其做在本實_中皆為方 开卜it基材1之第—表面11且避開觸控操作區111之部分 ^成有-接地層23 ’係為具有電磁干擾防制功能之材質。 請同時參閱第四〜五圖，其分別為本 體圖及:視圖。如圖所示，第二電極層3包括二 層2之第一電極圖形21，而第二線路” 之第-雷^貝孔132之導電區段14，以電性連接第一電極層2 段示之第二線路32除包括延伸出來的長 ^路外，亦包括將各個相鄰之第二貫孔132電性連結之短線路 相m在基材1之第二表面12上避開第二電極層3之第一 $ 31及第二線路32之部分，形成有另—接地層％，同樣為具 有电磁干擾防制功能之材質。本實施例所述之接地層，可以僅形 成^基材的單-表面(第一表面或第二表面)或兩表面(第一表面以 及-表面）’而其所估區域為部份或全部面積、位置、形狀等， 皆可視產品f求而定’鱗迦於本實_所述之方式。 另外’在基材1之第二表面12之預雜置形成有—連接器心 可將集成的第-線路31及-第二線路32連接至電路^本實施 例所述之U〇G具有防制電磁干擾之功能，同時具有電容式轨 跡板之力月b卓乂佳為可應用作為筆記型電蹈之執跡板(觸控板），但⑶ 6 201133316 並非僅限於此。 就製程上而言，塑殼100之第一電極層2、第二電極層3及接 也層23 33之薄膜製程可利用錢鑛製程(sputter|ng)戶斤製成，例如The function of interference does not increase the cost in assembly and process. In the process, the upper and lower sides of the upper and lower sides can be used only to avoid the steps of filling or potting, and the sister who can reduce the product defect rate can be achieved. The present invention and the accompanying drawings will be further described by the following embodiments. [Embodiment] At the same time, the first to second figures are respectively referred to as the first embodiment of the molded case of the present invention, the upper culvert and the partial culvert. As shown, the present invention has both electromagnetic interference and capacitive trackpad functions. The housing (10) includes a substrate 丨 having a first surface 11 and a first surface 12' defined on the first surface u. A plurality of first through holes 131 and second through holes 132 are defined in the operation area 111 and in the dazzling position of the touch operation area m of the button 1 . A first electrode layer 2 is formed on the touch operation region 111 of the first surface u of the substrate i, and a second electrode layer 3 is formed on the second surface 12 of the substrate 1 (see the detail). The substrate wall of the first through hole i3i and the second through hole 132 is distributed with a conductive portion, such as silver paste, or the conductive portion 14 is formed on the hole wall in a lining manner. Electrically connecting the first electrode layer 2 and the second electrode layer 3° 21 and a second electrode pattern The first electrode layer 2 includes a first electrode pattern 201133316. The first electrode pattern 21 is in contact with each of the first The pattern of the aperture 2 之2 is in contact with the conductive section of each of the second through holes 132. In the example, the first electrode pattern 21 is used as the electricity and the second electrode pattern 22 is transmitted as the Y-axis of the control board. , shape, but not = Γ 其 其 其 其 其 其 其 其 it it it it it 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材Material with electromagnetic interference prevention function. Please also refer to the fourth to fifth figures, which are respectively the body diagram and the view. As shown, the second electrode layer 3 includes a first electrode pattern 21 of two layers 2, and the conductive portion 14 of the first-channel hole 132 of the second line is electrically connected to the first electrode layer 2 The second line 32 is shown to include a short line phase m electrically connecting each adjacent second through hole 132 on the second surface 12 of the substrate 1 to avoid the second surface. The first layer 31 of the electrode layer 3 and the portion of the second line 32 are formed with another layer of the ground layer, which is also a material having an electromagnetic interference prevention function. The ground layer described in this embodiment can only form a substrate. Single-surface (first surface or second surface) or two surfaces (first surface and - surface)' and the estimated area is part or all of area, position, shape, etc., depending on the product f' The method is described in the present invention. In addition, 'the pre-hybridization of the second surface 12 of the substrate 1 is formed--the connector core can connect the integrated first line 31 and the second line 32 to the circuit ^ The U〇G described in this embodiment has the function of preventing electromagnetic interference, and at the same time, the force of the capacitive track board is good. It is used as a trace board for touch-type electric circuits (touchpad), but (3) 6 201133316 is not limited to this. In terms of process, the first electrode layer 2, the second electrode layer 3 and the layer of the molded case 100 23 33 film process can be made using the money mining process (sputter|ng), for example
在基材1之第-表面n及第二表面12分別藏鑛形成金屬薄膜(鋼 或=錄鋼+銅）。而其第—電極圖形21及第二電極圖形22之圖型 化製程，可利用如光罩(Mask)製程或雷射雕刻製程所製成。例如 光軍製程可在未實施薄織辦先實施貞片的圖形化光罩製程， 而雷射雕賴㈣在實施薄膜製程後再實施雷雕製輯圖形化， 關於兩種製程之細節部份將於後述製程部分說明。 參閱第六® ’係為本發龍殼應用於筆記型電腦之示音圖。 如圖所示’將本發明之塑殼励應用於筆記型電腦5，可同日綠具 電知機殼及電容式執跡板之侧，彻其_體成型之設計，可兼 具防污、防潑水以及防制電磁波干擾之功能。 >閱第七® ’其係為本發殼之製備方法流程圖。請同時 5 >閱第八Α·/\Ε圖’其係為本發明塑殼製備方法之第二 例剖視圖。 、 首先’提供—基材(步驟1⑴）。基材1具有-第-表面11及 一第二表面12，如第八a圖所示。 在基材上開設複數個貫孔(步驟1〇2)。在圖中僅以一個貫孔 =為^如第八B圖所示。貫孔133之形成包括可在射出成型 兩併π成’或在射出後再鑽孔加工製作。射出成型可依據設計 二:二將貫孔於暖魏行設定孔位及孔徑，—摘出成型後即 符° #求的貝孔。^是以鑽孔加X的方式，可在射出成型後 依據設糾脉及錄進行航加X。 進行則處理(步驟103)，包括粗化、預洗、貫孔微触、基材清 7 201133316 洗、風刀除水及烘烤等前處理步驟，以利後續步驟的進行 進彳^職渺驟㈣，以相細彳丨之第 層2(如第八C,同時在基材1之第-表面η上避 之部分，以解礙佈等方式形成接地層23。接 1之第Γ 2軸第—1極層3(如第八；〇 W)，_在基材 之第-表面12上避開第二電極層3之部分，以相同方 =3製^巾，細撕她场侧賴程或雷 射。而接地層之形成可視需要，僅形成於基材的單一表 2 一表面或第二表面)或兩表面(第—表面以及第二表面），且中 面η所形成的接地層23主要與觸控干擾訊號防制有 表面12所形成的接地層33與電磁波防制有關，惟兩 =疋利用其接地之原理達成，而其所佔區域為部份或全部面 位置幵/狀等，皆可視產品需求而定，並非僅限於本實 所述之方式。 、 採用遮罩製程時’可在赠前絲作遮罩，例如以光阻 塗佈或網版印刷方式進行，將兩面進行薄贿製作業，並於賤鐘 元成後進行遮罩脫膜作業(剝除或洗除皆可）。 、知用f射闕製辨’可將基材丨進行雙面細賴作業後， μ雷射雕刻將兩面域所需雜卿雕職將觸清除。 導通基材上的各個貫孔(步驟1〇5)，使第一電極層2及第二電 極層3 f性連接’本實施例的作法係將導電膠(銀移)/襞材覆蓋印 ^覆有遮罩之紐表面’使導電膠/紐灌人貫孔⑶巾，再進行 =、烤二最終在貝孔133之孔壁上形成導電區段14。熟習該領域技 =者田知，亦可在進行步驟1〇4前先實施此步驟。也就是先將導 电膠/漿材灌人貫孔133中後’再進行步驟1(H之賴製程，同樣⑸ 8 201133316 具有使第-電極層2及第二_層3電性連接之功效。 ^時’在絲上述步職，更可·要在赌 -連接器(圖未示)，以將基板上的電料以集成。 ' 參閱第九A_九D®，其料本發明赌製備 =視圖。本實施例之製備過程與第二實關相似，故 再重複制。參閱第九c圖，射主要差異點在於本實施 1〇4)時，使第-_部分地延伸分布 ⑶之孔璧。接著’如第九D圖所示，再使第二電極層 / 分轻貫孔133之孔璧，使第一電極層2及第二電極 曰、3接觸亚電性連接。以此作法，不需要填充導電膠或其他導電 材料即可達成上、下兩面電路的導通。至於其他步侧與第二實 施例相似，不再贅述。 :由以上之貫施例可知，本發明所提供之兼具防制電磁干擾及 電容式執跡板魏的贿及其製備方法確具產業上之彻價值， 准以上之敘述僅為本㈣之紐實關說明，凡精於此項技藝者 當可依據上述之制*作其它種種之改良，惟這纽變仍屬於本 發明之精神及以下所界定之專利範圍中。 【圖式簡單說明】 第-圖為本發_殼之第—實施例立翻，主要係顯示出位於塑 殼之第一表面之第一電極層； 第-圖為本發明魏之第—實_上視圖，主要係顯示出位於塑 殼之第一表面之第一電極層； 第二圖為本發明塑殼之局部剖視圖； 第四圖為本發_殼之第—實關立翻，主要侧示出位於塑 9 201133316 殼之第二表面之第二電極層； 第五圖為本發明塑殼之第一實施例下視圖，主要係顯示出位於塑 设之第二表面之第二電極層； 第/、圖為本發明塑殼應用於筆記型電腦之示意圖； f七圖為本發明塑殼之製備方法流程圖； 八E圖為製備本發明塑殼之第二實施例剖視圖； Α-九D圖為製備本發_殼之第三實施例剖視圖。The first surface n and the second surface 12 of the substrate 1 are respectively deposited to form a metal thin film (steel or = steel + copper). The patterning process of the first electrode pattern 21 and the second electrode pattern 22 can be performed by, for example, a mask process or a laser engraving process. For example, the Guangjun process can be implemented without the implementation of a thin woven fabric to implement a patterned reticle process, while the laser lithography (4) is implemented after the film process, and the details of the two processes are detailed. It will be explained in the process section described later. Refer to the sixth ® ′ for the sounding diagram of the hairpin for notebook computers. As shown in the figure, 'the molded case of the present invention is applied to the notebook computer 5, which can be used on the side of the green-lighted case and the capacitive trace plate on the same day, and the design of the body can be combined with anti-fouling, Water repellent and anti-electromagnetic interference. > Read the seventh®' is a flow chart of the preparation method of the hair shell. Please also read the eighth Α·/\Ε图' which is a cross-sectional view of the second example of the method for preparing the molded case of the present invention. First, provide the substrate (step 1 (1)). The substrate 1 has a - surface - 11 and a second surface 12 as shown in Figure 8a. A plurality of through holes are formed in the substrate (step 1〇2). In the figure, only one through hole = ^ is shown in Figure 8B. The formation of the through holes 133 includes fabrication by injection molding and π formation or after drilling. Injection molding can be based on design 2: 2, the through hole is set in the warm Wei line and the hole diameter, and the hole is obtained after the molding. ^ It is a method of drilling and adding X. After injection molding, it can be set according to the setting pulse and recording. The processing is carried out (step 103), including pre-processing steps such as roughening, pre-washing, through-hole micro-touch, substrate cleaning 7 201133316 washing, air knife water removal and baking, etc., in order to facilitate the subsequent steps. In step (4), the second layer (for example, the eighth C, while avoiding the portion on the first surface η of the substrate 1 to form a ground layer 23 in a manner of obstructing the cloth, etc. Axis first-pole layer 3 (such as eighth; 〇W), _ avoiding the portion of the second electrode layer 3 on the first surface 12 of the substrate, and tearing the side of the field with the same square = 3 a process or a laser, and the formation of a ground layer may be formed only on a single surface 2 or a second surface of the substrate or both surfaces (the first surface and the second surface), and the intermediate surface η The ground layer 23 is mainly related to the grounding layer 33 formed by the surface 12 formed by the touch interference signal, and the electromagnetic wave is prevented, but the two sides are achieved by the principle of grounding, and the occupied area is part or all of the surface position. / shape, etc., depending on the needs of the product, not limited to the way described. When using the mask process, the mask can be used as a mask, for example, by photoresist coating or screen printing, and the two sides are thinly bribed, and the mask is removed after the 贱钟元成. Can be removed or washed). After knowing how to use the f-ray system to make the substrate 丨 双面 双面 双面 双面 μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ Conducting through holes on the substrate (step 1〇5), f-joining the first electrode layer 2 and the second electrode layer 3. The method of the present embodiment is to coat the conductive paste (silver shift)/coffin. The surface of the mask is covered with a conductive adhesive/new filler hole (3), and then the second and second conductive holes 14 are formed on the wall of the hole 133. You are familiar with the field of technology = Tian Tian, you can also implement this step before performing step 1〇4. That is, the conductive paste/slurry is first poured into the through hole 133, and then the step 1 is performed (the process of H is the same, and the same (5) 8 201133316 has the effect of electrically connecting the first electrode layer 2 and the second layer 3 ^ When 'the above-mentioned step in the wire, more can be gambling - connector (not shown) to integrate the electric material on the substrate. ' See ninth A_9 D®, which is the bet of the present invention Preparation = view. The preparation process of this embodiment is similar to the second implementation, so it is re-duplicated. Referring to the ninth c-figure, the main difference is that in the first embodiment, the first-_ partial extension distribution (3) The hole is 璧. Next, as shown in the ninth D diagram, the second electrode layer/minute light hole 133 is further bored, so that the first electrode layer 2 and the second electrode 曰, 3 are in contact with each other. In this way, it is not necessary to fill the conductive paste or other conductive material to achieve the conduction of the upper and lower circuits. The other step sides are similar to the second embodiment and will not be described again. It can be seen from the above examples that the bribe provided by the invention and having the anti-electromagnetic interference and the capacitive retracting board Wei and the preparation method thereof have the industrial value, and the above description is only the (4) New Shiguan stated that those who are skilled in this art can make other improvements according to the above-mentioned system, but this change is still within the spirit of the present invention and the patent scope defined below. [Simple description of the figure] The first figure is the first embodiment of the present invention. The first embodiment shows the first electrode layer on the first surface of the molded case. The first figure is the first of the present invention. _ top view, mainly showing the first electrode layer on the first surface of the molded case; the second figure is a partial cross-sectional view of the molded case of the present invention; The second electrode layer is located on the second surface of the plastic shell of the 201113316; the fifth view is a bottom view of the first embodiment of the molded case of the present invention, mainly showing the second electrode layer on the second surface of the plastic molding. Fig. 4 is a schematic view showing the application of the molded case of the present invention to a notebook computer; f is a flow chart of the preparation method of the molded case of the present invention; and Fig. 8E is a cross-sectional view showing the second embodiment of the molded case of the present invention; Figure 9 is a cross-sectional view showing a third embodiment of the present invention.
【主要元件符號說明】 100 11 111 12 131 132 133 14 2 21 22 23 3 31 32 塑殼 基材 第一表面 觸控操作區 第二表面 第一貫孔 第二貫孔 貫孔 導電區段 第一電極層 第一電極圖形 第二電極圖形 接地層 第二電極層 第一線路 第二線路 201133316 • 33 4 接地層 連接器 筆記型電腦 5[Main component symbol description] 100 11 111 12 131 132 133 14 2 21 22 23 3 31 32 Molded case substrate first surface touch operation area second surface first through hole second through hole through hole conductive section first Electrode layer first electrode pattern second electrode pattern ground layer second electrode layer first line second line 201133316 • 33 4 ground layer connector notebook computer 5