CN102625570A - Printed wiring board and addition process manufacturing method thereof - Google Patents
Printed wiring board and addition process manufacturing method thereof Download PDFInfo
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- CN102625570A CN102625570A CN2012101293937A CN201210129393A CN102625570A CN 102625570 A CN102625570 A CN 102625570A CN 2012101293937 A CN2012101293937 A CN 2012101293937A CN 201210129393 A CN201210129393 A CN 201210129393A CN 102625570 A CN102625570 A CN 102625570A
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Abstract
The invention relates to a printed wiring board. The printed wiring board comprises an insulating substrate, a first catalytic ink line layer and a first copper line layer, and preferably also comprises a second catalytic ink line layer and a second copper line layer, wherein the insulating substrate is provided with an upper surface and a lower surface; the first catalytic ink line layer is printed on the upper surface; the first copper line layer is coated on the first catalytic ink line layer; through holes which penetrate through the upper surface and the lower surface are formed in the insulating substrate; a catalytic ink layer and a copper layer are sequentially arranged in the through holes; the second catalytic ink line layer is printed on the lower surface; the second copper line layer is coated on the second catalytic ink line layer; the first catalytic ink line layer and the second catalytic ink line layer are connected by the catalytic ink layer; and the first copper line layer and the second copper line layer are connected by the copper layer. The invention also provides a relevant addition process manufacturing method. The printed wiring board is skillfully designed and has a simple structure; and the addition process manufacturing method of the printed wiring board has a simple process, is low in environment pollution and low in cost, and is suitable for large-scale popularization and application.
Description
Technical field
The present invention relates to the electronic component technical field, particularly the wiring board technical field specifically is meant a kind of printed wiring board and addition process manufacturing approach thereof.
Background technology
The conventional manufacturing process of printed circuit board is the Copper Foil etching method at present, also claims subtractive process.It is to use copper clad laminate to be substrate, forms line pattern against corrosion through screen painting or photo-imaging, obtains circuit by chemical etching; If two-sided or multi-layer PCB also will carry out hole metallization and plating, realize the interlayer circuit interconnection.Therefore, PCB complicate fabrication process, operation are many, certainly will consume a large amount of water and electricity, also can consume many copper and chemical material, produce a large amount of waste water and pollutant.
Therefore, the environment of PCB industry and resource problem and sustainable development have been swung to unprecedented strategic height.PCB in China flight industrial expansion must be strengthened administering, and makes it to go on the recycling economy track of cleaner production, and the PCB industry just can become resource-conserving, environmentally friendly industry.Therefore, PCB enterprise must quicken technological innovation and Industrial Revolution are carried out in traditional PCB production actively in the face of this situation, really realizes energy-saving and emission-reduction.
Therefore, a kind of printed wiring board and manufacturing approach thereof need be provided, this printed wiring board fabrication method flow process is simple, environmental pollution is little, with low cost.
Summary of the invention
The objective of the invention is to have overcome above-mentioned shortcoming of the prior art; A kind of printed wiring board and addition process manufacturing approach thereof are provided; Wherein the printed wiring board design is ingenious; Simple for structure, printed wiring board addition process manufacturing approach flow process is simple, environmental pollution is little, with low cost, be suitable for large-scale promotion application.
To achieve these goals, in first aspect of the present invention, a kind of printed wiring board is provided; Comprise insulated substrate; Be characterized in that said printed wiring board also comprises the first catalytic ink line layer and first copper wire layer, said insulated substrate has upper surface and lower surface; The said first catalytic ink line layer is printed on the said upper surface, and said first copper wire layer overlays on the said first catalytic ink line layer.
Preferably; Said printed wiring board also comprises the second catalytic ink line layer and second copper wire layer; Be provided with the via that runs through said upper surface and said lower surface in the said insulated substrate; Be disposed with catalytic ink layer and copper layer in the said via, the said second catalytic ink line layer is printed on the said lower surface, and said second copper wire layer overlays on the said second catalytic ink line layer; The said first catalytic ink line layer connects the said second catalytic ink line layer through said catalytic ink layer, and said first copper wire layer connects said second copper wire layer through said copper layer.
Preferably, said insulated substrate is PET (PET) plastic film insulated substrate, polyimides (PI) plastic film insulated substrate, ceramic thin plate or glass-epoxy (FR4) thin plate.
In second aspect of the present invention, a kind of addition process manufacturing approach of above-mentioned printed wiring board is provided, be characterized in, may further comprise the steps:
(1) on the upper surface of said insulated substrate, use catalytic ink to print out said first catalytic ink line layer, the baking-curing then;
(2) on the said first catalytic ink line layer, displace first thin copper layer;
(3) electro-coppering on said first thin copper layer, thus said first copper wire layer formed, baking then.
Preferably, in said step (1), the temperature of said baking-curing is 80～180 ℃, and the time is 20～120 minutes.
Preferably, in said step (2), on the said first catalytic ink line layer, displace said first thin copper layer thereby the said first catalytic ink line layer is immersed in copper-bath or the electro-coppering tank liquor.
More preferably, said copper-bath is to contain the solution that concentration is the copper sulphate of 1～100g/l.
Preferably, in said step (3), the temperature of said baking is 80～180 ℃, and the time is 20～120 minutes.
Preferably, in said step (1) before, also comprise step: on said insulated substrate, get out the via that runs through said upper surface and said lower surface, and use catalytic ink to irritate said via formation catalytic ink layer;
In said step (1), before said baking-curing, also comprise step: on the lower surface at said insulated substrate, use catalytic ink to print out the second catalytic ink line layer;
In said step (2), also comprise step: on said catalytic ink layer, displace thin copper layer, on the said second catalytic ink line layer, displace second thin copper layer;
In said step (3), before said baking, also comprise step: electro-coppering on said thin copper layer, thus form the copper layer, electro-coppering on said second thin copper layer, thus form second copper wire layer.
Beneficial effect of the present invention specifically is:
1, printed wiring board of the present invention comprises insulated substrate, the first catalytic ink line layer and first copper wire layer; Said insulated substrate has upper surface and lower surface; The said first catalytic ink line layer is printed on the said upper surface, and said first copper wire layer overlays on the said first catalytic ink line layer, designs ingenious; Simple for structure, be suitable for large-scale promotion application.
2, the addition process manufacturing approach of printed wiring board of the present invention comprises: (1) uses catalytic ink to print out said first catalytic ink line layer, the baking-curing then on the upper surface of said insulated substrate; (2) on the said first catalytic ink line layer, displace first thin copper layer; (3) electro-coppering on said first thin copper layer, thus said first copper wire layer formed, baking then, flow process is simple, environmental pollution is little, with low cost, is suitable for large-scale promotion application.
Description of drawings
Fig. 1 is the schematic top plan view of a specific embodiment of printed wiring board of the present invention.
Fig. 2 is the main sketch map of looking of analysing and observe of specific embodiment shown in Figure 1.
Embodiment
In order more to be expressly understood technology contents of the present invention, the special following examples of lifting specify.
See also shown in Fig. 1-2; Printed wiring board of the present invention comprises insulated substrate 1, the first catalytic ink line layer 2 and first copper wire layer 3; Said insulated substrate 1 has upper surface (not shown) and lower surface (not shown); The said first catalytic ink line layer 2 is printed on the said upper surface, and said first copper wire layer 3 overlays on the said first catalytic ink line layer 2.
In the time also need also having the conducting wire at the lower surface of insulated substrate 1; Preferably; Said printed wiring board also comprises the second catalytic ink line layer (not shown) and the second copper wire layer (not shown); Be provided with the via (not shown) that runs through said upper surface and said lower surface in the said insulated substrate 1; Be disposed with catalytic ink layer and copper layer in the said via, the said second catalytic ink line layer is printed on the said lower surface, and said second copper wire layer overlays on the said second catalytic ink line layer; The said first catalytic ink line layer 2 connects the said second catalytic ink line layer through said catalytic ink layer, and said first copper wire layer 3 connects said second copper wire layer through said copper layer.
Said insulated substrate 1 can adopt any suitable substrate; Preferably, said insulated substrate 1 is PET (PET) plastic film insulated substrate, polyimides (PI) plastic film insulated substrate, ceramic thin plate or glass-epoxy (FR4) thin plate.In specific embodiment of the present invention, said insulated substrate 1 is PET (PET) plastic film insulated substrate.
The addition process manufacturing approach of printed wiring board of the present invention may further comprise the steps:
(1) on the upper surface of said insulated substrate 1, use catalytic ink to print out said first catalytic ink line layer 2, the baking-curing then;
(2) on the said first catalytic ink line layer 2, displace first thin copper layer;
(3) electro-coppering on said first thin copper layer, thus said first copper wire layer 3 formed, baking then.
Catalytic ink is meant and contains the active metal particle, can replace the printing ink of last layer copper at copper-bath, and printing ink manufacturer can be German BASF or domestic printing ink producer.
The temperature and time of said baking-curing confirms that as required preferably, in said step (1), the temperature of said baking-curing is 80～180 ℃, and the time is 20～120 minutes.
On the said first catalytic ink line layer 2, displace first thin copper layer and can adopt any suitable method; Preferably; In said step (2), on the said first catalytic ink line layer 2, displace said first thin copper layer thereby the said first catalytic ink line layer 2 is immersed in copper-bath or the electro-coppering tank liquor.Can toast 80～180 ℃ after having soaked copper-bath, behind 20～120min, re-plating copper.
Said copper-bath can adopt any suitable copper-bath, and more preferably, said copper-bath is to contain the solution that concentration is the copper sulphate of 1～100g/l, can be copper electroplating solution.
The temperature and time of said baking confirms that as required preferably, in said step (3), the temperature of said baking is 80～180 ℃, and the time is 20～120 minutes.
In the time also need also having the conducting wire at the lower surface of insulated substrate 1; Preferably; In said step (1) before, also comprise step: on said insulated substrate 1, get out the via that runs through said upper surface and said lower surface, and use catalytic ink to irritate said via formation catalytic ink layer; In said step (1), before said baking-curing, also comprise step: on the lower surface of said insulated substrate 1, use catalytic ink to print out the second catalytic ink line layer; In said step (2), also comprise step: on said catalytic ink layer, displace thin copper layer, on the said second catalytic ink line layer, displace second thin copper layer; In said step (3), before said baking, also comprise step: electro-coppering on said thin copper layer, thus form the copper layer, electro-coppering on said second thin copper layer, thus form second copper wire layer.
Therefore; The flow process of the addition process manufacturing approach of printed wiring board of the present invention is on insulated substrate 1; Use catalytic ink print out desired line layer for example the first catalytic ink line layer 2 (if double sided board then needs the subdrilling via again with behind the catalytic ink grout formation catalytic ink layer; Republish the line layer for example first catalytic ink line layer 2 and the second catalytic ink line layer, the first catalytic ink line layer 2 connects the second catalytic ink line layer through the catalytic ink layer) and baking-curing, cure parameter is 80～180 ℃; 20～120min; Be that copper-bath (also can be directly at electro-coppering behaviour displacement copper) the thin copper of displacement one deck of 1～100g/l makes its conduction through working concentration then, re-plating copper makes it reach required thickness, promptly form copper wire layer for example first copper wire layer 3 (if double sided board then also forms the copper layer and second copper wire layer; First copper wire layer 3 connects second copper wire layer through the copper layer), toast again that 80～180 ℃, 20～120min improve line layer and substrate junction is made a concerted effort; Follow-up seal resistance weldering, surface treatment, moulding etc. all can be by conventional line plate processing methods.
Lift the addition process manufacturing approach that several embodiment explain printed wiring board of the present invention below.
Embodiment 1
Single face antenna traces board fabrication method uses catalytic ink to print out the first catalytic ink line layer 2 on the upper surface of pet substrate, and cure parameter is 80 ℃, 60min; Advance displacement of electro-coppering groove and electro-coppering again, obtain the about 20～30um antenna traces of copper facing thickness layer, thereby form first copper wire layer 3, the baking-curing parameter is 120 ℃, 120min; Through subsequent handlings such as printing resistance weldering, moulding, form single face circuit electronic product antenna again.
Single face antenna traces board fabrication method uses catalytic ink to print out the first catalytic ink line layer 2 on the upper surface of pet substrate, and the baking-curing parameter is 120 ℃, 120min; Advance displacement of electro-coppering groove and electro-coppering again, obtain the about 20～30um antenna traces of copper facing thickness layer, thereby form first copper wire layer 3, the baking parameter is 180 ℃, 20min; Through subsequent handlings such as printing resistance weldering, moulding, form single face circuit electronic product antenna again.
Single face antenna traces board fabrication method uses catalytic ink to print out the first catalytic ink line layer 2 on the upper surface of pet substrate, and the baking-curing parameter is 180 ℃, 20min; Advance displacement of electro-coppering groove and electro-coppering again, obtain the about 20～30um antenna traces of copper facing thickness layer, thereby form first copper wire layer 3, the baking parameter is 80 ℃, 60min; Through subsequent handlings such as printing resistance weldering, moulding, form single face circuit electronic product antenna again.
Embodiment 4
Two-sided antenna wiring board manufacturing approach; On pet substrate, bore via; Use the catalytic ink grout to form the catalytic ink layer; And on the upper and lower surfaces of pet substrate, use catalytic ink to print out the first catalytic ink line layer 2 and the second catalytic ink line layer, the baking-curing parameter is 80 ℃, 60min; Immerse concentration again and be 1g/l copper-bath displacement copper, the baking parameter is 120 ℃, 120min; Electro-coppering then obtains the about 20～30um antenna traces of copper facing thickness layer, thereby forms first copper wire layer 3 and second copper wire layer that connects through the copper layer, and the baking parameter is 180 ℃, 20min; Through subsequent handlings such as printing resistance weldering, moulding, form two-sided circuit electronic product antenna again.
Embodiment 5
Two-sided antenna wiring board manufacturing approach; On pet substrate, bore via; Use the catalytic ink grout to form the catalytic ink layer; And on the upper and lower surfaces of pet substrate, use catalytic ink to print out the first catalytic ink line layer 2 and the second catalytic ink line layer, the baking-curing parameter is 180 ℃, 20min; Immerse concentration again and be 100g/l copper-bath displacement copper, the baking parameter is 80 ℃, 20min; Electro-coppering then obtains the about 20～30um antenna traces of copper facing thickness layer, thereby forms first copper wire layer 3 and second copper wire layer that connects through the copper layer, and the baking parameter is 80 ℃, 60min; Through subsequent handlings such as printing resistance weldering, moulding, form two-sided circuit electronic product antenna again.
Embodiment 6
Two-sided antenna wiring board manufacturing approach; On pet substrate, bore via; Use the catalytic ink grout to form the catalytic ink layer; And on the upper and lower surfaces of pet substrate, use catalytic ink to print out the first catalytic ink line layer 2 and the second catalytic ink line layer, the baking-curing parameter is 120 ℃, 120min; Immerse concentration again and be 60g/l copper-bath displacement copper, the baking parameter is 180 ℃, 60min; Electro-coppering then obtains the about 20～30um antenna traces of copper facing thickness layer, thereby forms first copper wire layer 3 and second copper wire layer that connects through the copper layer, and the baking parameter is 120 ℃, 120min; Through subsequent handlings such as printing resistance weldering, moulding, form two-sided circuit electronic product antenna again.
Therefore; The present invention relates to a kind of method that adopts addition process to make wiring board; Specifically be a kind of through on insulated substrate, printing catalytic ink, form the wiring board manufacturing approach of conducting wire again through plating mode, it has manufacturing approach simple and fast, environmental protection, advantage such as with low cost.
To sum up, printed wiring board of the present invention design is ingenious, simple for structure, and printed wiring board addition process manufacturing approach flow process is simple, environmental pollution is little, with low cost, is suitable for large-scale promotion application.
In this specification, the present invention is described with reference to its certain embodiments.But, still can make various modifications and conversion obviously and not deviate from the spirit and scope of the present invention.Therefore, specification and accompanying drawing are regarded in an illustrative, rather than a restrictive.
Claims (9)
1. printed wiring board; Comprise insulated substrate; It is characterized in that said printed wiring board also comprises the first catalytic ink line layer and first copper wire layer, said insulated substrate has upper surface and lower surface; The said first catalytic ink line layer is printed on the said upper surface, and said first copper wire layer overlays on the said first catalytic ink line layer.
2. printed wiring board according to claim 1; It is characterized in that; Said printed wiring board also comprises the second catalytic ink line layer and second copper wire layer, is provided with the via that runs through said upper surface and said lower surface in the said insulated substrate, is disposed with catalytic ink layer and copper layer in the said via; The said second catalytic ink line layer is printed on the said lower surface; Said second copper wire layer overlays on the said second catalytic ink line layer, and the said first catalytic ink line layer connects the said second catalytic ink line layer through said catalytic ink layer, and said first copper wire layer connects said second copper wire layer through said copper layer.
3. printed wiring board according to claim 1 is characterized in that, said insulated substrate is PET plastic film insulated substrate, polyimide plastic film insulated substrate, ceramic thin plate or glass-epoxy thin plate.
4. the addition process manufacturing approach of a printed wiring board according to claim 1 is characterized in that, may further comprise the steps:
(1) on the upper surface of said insulated substrate, use catalytic ink to print out said first catalytic ink line layer, the baking-curing then;
(2) on the said first catalytic ink line layer, displace first thin copper layer;
(3) electro-coppering on said first thin copper layer, thus said first copper wire layer formed, baking then.
5. the addition process manufacturing approach of printed wiring board according to claim 4 is characterized in that, in said step (1), the temperature of said baking-curing is 80～180 ℃, and the time is 20～120 minutes.
6. the addition process manufacturing approach of printed wiring board according to claim 4; It is characterized in that; In said step (2), on the said first catalytic ink line layer, displace said first thin copper layer thereby the said first catalytic ink line layer is immersed in copper-bath or the electro-coppering tank liquor.
7. the addition process manufacturing approach of printed wiring board according to claim 6 is characterized in that, said copper-bath is to contain the solution that concentration is the copper sulphate of 1～100g/l.
8. the addition process manufacturing approach of printed wiring board according to claim 4 is characterized in that, in said step (3), the temperature of said baking is 80～180 ℃, and the time is 20～120 minutes.
9. the addition process manufacturing approach of printed wiring board according to claim 4; It is characterized in that; In said step (1) before; Also comprise step: on said insulated substrate, get out the via that runs through said upper surface and said lower surface, and use catalytic ink to irritate said via formation catalytic ink layer;
In said step (1), before said baking-curing, also comprise step: on the lower surface at said insulated substrate, use catalytic ink to print out the second catalytic ink line layer;
In said step (2), also comprise step: on said catalytic ink layer, displace thin copper layer, on the said second catalytic ink line layer, displace second thin copper layer;
In said step (3), before said baking, also comprise step: electro-coppering on said thin copper layer, thus form the copper layer, electro-coppering on said second thin copper layer, thus form second copper wire layer.
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| CN2012101293937A CN102625570A (en) | 2012-04-27 | 2012-04-27 | Printed wiring board and addition process manufacturing method thereof |
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| CN2012101293937A CN102625570A (en) | 2012-04-27 | 2012-04-27 | Printed wiring board and addition process manufacturing method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102833941A (en) * | 2012-09-04 | 2012-12-19 | 上海蓝沛新材料科技股份有限公司 | Novel slide and preparation method thereof |
| CN103426776A (en) * | 2013-07-09 | 2013-12-04 | 上海百嘉电子有限公司 | Smart card carrier tape manufacturing method |
| CN103442519A (en) * | 2013-08-14 | 2013-12-11 | 上海淞渡电子有限公司 | Method for manufacturing printed wiring board by means of addition process |
| CN105338760A (en) * | 2014-08-06 | 2016-02-17 | 上海信维蓝沛新材料科技有限公司 | Manufacturing method of NFC antenna circuit board |
| CN105576357A (en) * | 2014-10-11 | 2016-05-11 | 上海蓝沛新材料科技股份有限公司 | NFC antenna integrated on ferrite and preparation method thereof |
| CN114765923A (en) * | 2021-05-20 | 2022-07-19 | 上海贺鸿电子科技股份有限公司 | Three-layer circuit board of 5G base station isolator and preparation method thereof |
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| CN102573313A (en) * | 2012-02-13 | 2012-07-11 | 苏州晶讯科技股份有限公司 | Method for utilizing base metal catalytic ink to manufacture printed circuit |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102833941A (en) * | 2012-09-04 | 2012-12-19 | 上海蓝沛新材料科技股份有限公司 | Novel slide and preparation method thereof |
| CN102833941B (en) * | 2012-09-04 | 2016-03-16 | 上海安缔诺科技有限公司 | A kind of Novel slide and preparation method thereof |
| CN103426776A (en) * | 2013-07-09 | 2013-12-04 | 上海百嘉电子有限公司 | Smart card carrier tape manufacturing method |
| CN103442519A (en) * | 2013-08-14 | 2013-12-11 | 上海淞渡电子有限公司 | Method for manufacturing printed wiring board by means of addition process |
| CN105338760A (en) * | 2014-08-06 | 2016-02-17 | 上海信维蓝沛新材料科技有限公司 | Manufacturing method of NFC antenna circuit board |
| CN105576357A (en) * | 2014-10-11 | 2016-05-11 | 上海蓝沛新材料科技股份有限公司 | NFC antenna integrated on ferrite and preparation method thereof |
| CN114765923A (en) * | 2021-05-20 | 2022-07-19 | 上海贺鸿电子科技股份有限公司 | Three-layer circuit board of 5G base station isolator and preparation method thereof |
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Application publication date: 20120801 |