CN202603036U - Printed wiring board - Google Patents
Printed wiring board Download PDFInfo
- Publication number
- CN202603036U CN202603036U CN 201220187285 CN201220187285U CN202603036U CN 202603036 U CN202603036 U CN 202603036U CN 201220187285 CN201220187285 CN 201220187285 CN 201220187285 U CN201220187285 U CN 201220187285U CN 202603036 U CN202603036 U CN 202603036U
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- catalytic ink
- line layer
- copper
- ink line
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Abstract
The utility model relates to a printed writing board which comprises an insulation baseboard, a first catalytic ink line layer and a first copper line layer, wherein the insulation baseboard is provided with an upper surface and a lower surface, the first catalytic ink line layer is printed on the upper surface, and the first copper line layer is covered on the first catalytic ink line layer. Preferably, the printed wiring board also comprises a second catalytic ink line layer and a second copper line layer, a guide through hole penetrating through the upper surface and the lower surface is arranged in the insulation baseboard, a catalytic ink line layer and a copper layer are sequentially arranged in the guide through hole, the second catalytic ink line layer is printed on the lower surface, the second copper line layer is covered on the second catalytic ink line layer, the first catalytic ink line layer is connected with the second catalytic ink line layer through the catalytic ink line layer, and the first copper line layer is connected with the second copper line layer through the copper layer. The printed writing board has the advantages of ingenious design, simple structure, simple process of an addition process manufacture method, small environment pollution and low cost, and is suitable for large-scale popularization and application.
Description
Technical field
The utility model relates to the electronic component technical field, and particularly the wiring board technical field specifically is meant a kind of printed wiring board.
Background technology
The conventional manufacturing process of printed circuit board is the Copper Foil etching method at present, also claims subtractive process.It is to use copper clad laminate to be substrate, forms line pattern against corrosion through screen painting or photo-imaging, obtains circuit by chemical etching; If two-sided or multi-layer PCB also will carry out hole metallization and plating, realize the interlayer circuit interconnection.Therefore, PCB complicate fabrication process, operation are many, certainly will consume a large amount of water and electricity, also can consume many copper and chemical material, produce a large amount of waste water and pollutant.
Therefore, the environment of PCB industry and resource problem and sustainable development have been swung to unprecedented strategic height.PCB in China flight industrial expansion must be strengthened administering, and makes it to go on the recycling economy track of cleaner production, and the PCB industry just can become resource-conserving, environmentally friendly industry.Therefore, PCB enterprise must quicken technological innovation and Industrial Revolution are carried out in traditional PCB production actively in the face of this situation, really realizes energy-saving and emission-reduction.
Therefore, a kind of printed wiring board need be provided, the design of this printed wiring board is ingenious, simple for structure, and its manufacturing approach flow process is simple, environmental pollution is little, with low cost.
The utility model content
The purpose of the utility model is to have overcome above-mentioned shortcoming of the prior art; A kind of printed wiring board is provided, and this printed wiring board design is ingenious, simple for structure; Its addition process manufacturing approach flow process is simple, environmental pollution is little, with low cost, be suitable for large-scale promotion application.
To achieve these goals; The printed wiring board of the utility model comprises insulated substrate, is characterized in; Said printed wiring board also comprises the first catalytic ink line layer and first copper wire layer; Said insulated substrate has upper surface and lower surface, and the said first catalytic ink line layer is printed on the said upper surface, and said first copper wire layer overlays on the said first catalytic ink line layer.
Preferably; Said printed wiring board also comprises the second catalytic ink line layer and second copper wire layer; Be provided with the via that runs through said upper surface and said lower surface in the said insulated substrate; Be disposed with catalytic ink layer and copper layer in the said via, the said second catalytic ink line layer is printed on the said lower surface, and said second copper wire layer overlays on the said second catalytic ink line layer; The said first catalytic ink line layer connects the said second catalytic ink line layer through said catalytic ink layer, and said first copper wire layer connects said second copper wire layer through said copper layer.
Preferably, said insulated substrate is PET (PET) plastic film insulated substrate, polyimides (PI) plastic film insulated substrate, ceramic thin plate or glass-epoxy (FR4) thin plate.
The beneficial effect of the utility model specifically is:
1, the printed wiring board of the utility model comprises insulated substrate, the first catalytic ink line layer and first copper wire layer; Said insulated substrate has upper surface and lower surface; The said first catalytic ink line layer is printed on the said upper surface, and said first copper wire layer overlays on the said first catalytic ink line layer, designs ingenious; Simple for structure, be suitable for large-scale promotion application.
2, the addition process manufacturing approach of the printed wiring board of the utility model comprises: (1) uses catalytic ink to print out said first catalytic ink line layer, the baking-curing then on the upper surface of said insulated substrate; (2) on the said first catalytic ink line layer, displace first thin copper layer; (3) electro-coppering on said first thin copper layer, thus said first copper wire layer formed, baking then, flow process is simple, environmental pollution is little, with low cost, is suitable for large-scale promotion application.
Description of drawings
Fig. 1 is the schematic top plan view of a specific embodiment of the printed wiring board of the utility model.
Fig. 2 is the main sketch map of looking of analysing and observe of specific embodiment shown in Figure 1.
Embodiment
In order more to be expressly understood the technology contents of the utility model, the special following examples of lifting specify.
See also shown in Fig. 1-2; The printed wiring board of the utility model comprises insulated substrate 1, the first catalytic ink line layer 2 and first copper wire layer 3; Said insulated substrate 1 has upper surface (not shown) and lower surface (not shown); The said first catalytic ink line layer 2 is printed on the said upper surface, and said first copper wire layer 3 overlays on the said first catalytic ink line layer 2.
In the time also need also having the conducting wire at the lower surface of insulated substrate 1; Preferably; Said printed wiring board also comprises the second catalytic ink line layer (not shown) and the second copper wire layer (not shown); Be provided with the via (not shown) that runs through said upper surface and said lower surface in the said insulated substrate 1; Be disposed with catalytic ink layer and copper layer in the said via, the said second catalytic ink line layer is printed on the said lower surface, and said second copper wire layer overlays on the said second catalytic ink line layer; The said first catalytic ink line layer 2 connects the said second catalytic ink line layer through said catalytic ink layer, and said first copper wire layer 3 connects said second copper wire layer through said copper layer.
Said insulated substrate 1 can adopt any suitable substrate; Preferably, said insulated substrate 1 is PET (PET) plastic film insulated substrate, polyimides (PI) plastic film insulated substrate, ceramic thin plate or glass-epoxy (FR4) thin plate.In specific embodiment of the present invention, said insulated substrate 1 is PET (PET) plastic film insulated substrate.
The addition process manufacturing approach of the printed wiring board of the utility model may further comprise the steps:
(1) on the upper surface of said insulated substrate 1, use catalytic ink to print out said first catalytic ink line layer 2, the baking-curing then;
(2) on the said first catalytic ink line layer 2, displace first thin copper layer;
(3) electro-coppering on said first thin copper layer, thus said first copper wire layer 3 formed, baking then.
Catalytic ink is meant and contains the active metal particle, can replace the printing ink of last layer copper at copper-bath, and printing ink manufacturer can be German BASF or domestic printing ink producer.
The temperature and time of said baking-curing confirms that as required preferably, in said step (1), the temperature of said baking-curing is 80～180 ℃, and the time is 20～120 minutes.
On the said first catalytic ink line layer 2, displace first thin copper layer and can adopt any suitable method; Preferably; In said step (2), on the said first catalytic ink line layer 2, displace said first thin copper layer thereby the said first catalytic ink line layer 2 is immersed in copper-bath or the electro-coppering tank liquor.Can toast 80～180 ℃ after having soaked copper-bath, behind 20～120min, re-plating copper.
Said copper-bath can adopt any suitable copper-bath, and more preferably, said copper-bath is that concentration is the copper-bath of 1～100g/l.
The temperature and time of said baking confirms that as required preferably, in said step (3), the temperature of said baking is 80～180 ℃, and the time is 20～120 minutes.
In the time also need also having the conducting wire at the lower surface of insulated substrate 1; Preferably; In said step (1) before, also comprise step: on said insulated substrate 1, get out the via that runs through said upper surface and said lower surface, and use catalytic ink to irritate said via formation catalytic ink layer; In said step (1), before said baking-curing, also comprise step: on the lower surface of said insulated substrate 1, use catalytic ink to print out the second catalytic ink line layer; In said step (2), also comprise step: on said catalytic ink layer, displace thin copper layer, on the said second catalytic ink line layer, displace second thin copper layer; In said step (3), before said baking, also comprise step: electro-coppering on said thin copper layer, thus form the copper layer, electro-coppering on said second thin copper layer, thus form second copper wire layer.
Therefore; The flow process of the addition process manufacturing approach of the printed wiring board of the utility model is on insulated substrate 1; Use catalytic ink print out desired line layer for example the first catalytic ink line layer 2 (if double sided board then needs the subdrilling via again with behind the catalytic ink grout formation catalytic ink layer; Republish the line layer for example first catalytic ink line layer 2 and the second catalytic ink line layer; The first catalytic ink line layer 2 connects the second catalytic ink line layer through the catalytic ink layer) and baking-curing; Cure parameter is 80～180 ℃, and 20～120min is that copper-bath (also can be directly at electro-coppering behaviour displacement copper) the thin copper of displacement one deck of 10～100g/l makes its conduction through working concentration then; Re-plating copper makes it reach required thickness; Promptly form for example first copper wire layer 3 (if double sided board then also forms the copper layer and second copper wire layer, first copper wire layer 3 connects second copper wire layer through the copper layer) of copper wire layer, toast again that 80～180 ℃, 20～120min improve line layer and substrate junction is made a concerted effort; Follow-up seal resistance weldering, surface treatment, moulding etc. all can be by conventional line plate processing methods.
Lift the addition process manufacturing approach that several embodiment explain the printed wiring board of the utility model below.
Single face antenna traces board fabrication method uses catalytic ink to print out the first catalytic ink line layer 2 on the upper surface of pet substrate, and cure parameter is 80 ℃, 60min; Advance displacement of electro-coppering groove and electro-coppering again, obtain the about 20～30um antenna traces of copper facing thickness layer, thereby form first copper wire layer 3, the baking-curing parameter is 120 ℃, 120min; Through subsequent handlings such as printing resistance weldering, moulding, form single face circuit electronic product antenna again.
Single face antenna traces board fabrication method uses catalytic ink to print out the first catalytic ink line layer 2 on the upper surface of pet substrate, and the baking-curing parameter is 120 ℃, 120min; Advance displacement of electro-coppering groove and electro-coppering again, obtain the about 20～30um antenna traces of copper facing thickness layer, thereby form first copper wire layer 3, the baking parameter is 180 ℃, 20min; Through subsequent handlings such as printing resistance weldering, moulding, form single face circuit electronic product antenna again.
Single face antenna traces board fabrication method uses catalytic ink to print out the first catalytic ink line layer 2 on the upper surface of pet substrate, and the baking-curing parameter is 180 ℃, 20min; Advance displacement of electro-coppering groove and electro-coppering again, obtain the about 20～30um antenna traces of copper facing thickness layer, thereby form first copper wire layer 3, the baking parameter is 80 ℃, 60min; Through subsequent handlings such as printing resistance weldering, moulding, form single face circuit electronic product antenna again.
Embodiment 4
Two-sided antenna wiring board manufacturing approach; On pet substrate, bore via; Use the catalytic ink grout to form the catalytic ink layer; And on the upper and lower surfaces of pet substrate, use catalytic ink to print out the first catalytic ink line layer 2 and the second catalytic ink line layer, the baking-curing parameter is 80 ℃, 60min; Immerse concentration again and be 1g/l copper-bath displacement copper, the baking parameter is 120 ℃, 120min; Electro-coppering then obtains the about 20～30um antenna traces of copper facing thickness layer, thereby forms first copper wire layer 3 and second copper wire layer that connects through the copper layer, and the baking parameter is 180 ℃, 20min; Through subsequent handlings such as printing resistance weldering, moulding, form two-sided circuit electronic product antenna again.
Embodiment 5
Two-sided antenna wiring board manufacturing approach; On pet substrate, bore via; Use the catalytic ink grout to form the catalytic ink layer; And on the upper and lower surfaces of pet substrate, use catalytic ink to print out the first catalytic ink line layer 2 and the second catalytic ink line layer, the baking-curing parameter is 180 ℃, 20min; Immerse concentration again and be 100g/l copper-bath displacement copper, the baking parameter is 80 ℃, 20min; Electro-coppering then obtains the about 20～30um antenna traces of copper facing thickness layer, thereby forms first copper wire layer 3 and second copper wire layer that connects through the copper layer, and the baking parameter is 80 ℃, 60min; Through subsequent handlings such as printing resistance weldering, moulding, form two-sided circuit electronic product antenna again.
Embodiment 6
Two-sided antenna wiring board manufacturing approach; On pet substrate, bore via; Use the catalytic ink grout to form the catalytic ink layer; And on the upper and lower surfaces of pet substrate, use catalytic ink to print out the first catalytic ink line layer 2 and the second catalytic ink line layer, the baking-curing parameter is 120 ℃, 120min; Immerse concentration again and be 60g/l copper-bath displacement copper, the baking parameter is 180 ℃, 60min; Electro-coppering then obtains the about 20～30um antenna traces of copper facing thickness layer, thereby forms first copper wire layer 3 and second copper wire layer that connects through the copper layer, and the baking parameter is 120 ℃, 120min; Through subsequent handlings such as printing resistance weldering, moulding, form two-sided circuit electronic product antenna again.
Therefore, the utility model relates to a kind of printed wiring board, and it is through printing catalytic ink on insulated substrate, forms the conducting wire through plating mode again and makes, and it has manufacturing approach simple and fast, environmental protection, advantage such as with low cost.
To sum up, the printed wiring board of the utility model design is ingenious, simple for structure, and its addition process manufacturing approach flow process is simple, environmental pollution is little, with low cost, is suitable for large-scale promotion application.
In this specification, the utility model is described with reference to its certain embodiments.But, still can make various modifications and conversion obviously and not deviate from the spirit and the scope of the utility model.Therefore, specification and accompanying drawing are regarded in an illustrative, rather than a restrictive.
Claims (3)
1. printed wiring board; Comprise insulated substrate; It is characterized in that said printed wiring board also comprises the first catalytic ink line layer and first copper wire layer, said insulated substrate has upper surface and lower surface; The said first catalytic ink line layer is printed on the said upper surface, and said first copper wire layer overlays on the said first catalytic ink line layer.
2. printed wiring board according to claim 1; It is characterized in that; Said printed wiring board also comprises the second catalytic ink line layer and second copper wire layer, is provided with the via that runs through said upper surface and said lower surface in the said insulated substrate, is disposed with catalytic ink layer and copper layer in the said via; The said second catalytic ink line layer is printed on the said lower surface; Said second copper wire layer overlays on the said second catalytic ink line layer, and the said first catalytic ink line layer connects the said second catalytic ink line layer through said catalytic ink layer, and said first copper wire layer connects said second copper wire layer through said copper layer.
3. printed wiring board according to claim 1 is characterized in that, said insulated substrate is PET plastic film insulated substrate, polyimide plastic film insulated substrate, ceramic thin plate or glass-epoxy thin plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220187285 CN202603036U (en) | 2012-04-27 | 2012-04-27 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220187285 CN202603036U (en) | 2012-04-27 | 2012-04-27 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202603036U true CN202603036U (en) | 2012-12-12 |
Family
ID=47320539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220187285 Expired - Lifetime CN202603036U (en) | 2012-04-27 | 2012-04-27 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202603036U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102625570A (en) * | 2012-04-27 | 2012-08-01 | 上海贺鸿电子有限公司 | Printed wiring board and addition process manufacturing method thereof |
-
2012
- 2012-04-27 CN CN 201220187285 patent/CN202603036U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102625570A (en) * | 2012-04-27 | 2012-08-01 | 上海贺鸿电子有限公司 | Printed wiring board and addition process manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201518, Hongguang Road, 8001 dry Lane, Shanghai, Jinshan District Patentee after: Shanghai he Hong electronic Polytron Technologies Inc Address before: 201518, Hongguang Road, 8001 dry Lane, Shanghai, Jinshan District Patentee before: Shanghai H-Fast Electronic Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121212 |