CN202587595U - Copper-based conductive-ink all-printing printed circuit board - Google Patents

Abstract

The utility model relates to a copper-based conductive-ink all-printing printed circuit board. The printed circuit board comprises an insulation substrate, a conductive ink layer which is printed on the insulation substrate through screen printing and a metal copper layer electroplated on the conductive ink layer. The conductive ink layer comprises a silver-coated copper particle, a resin adhesive and a solvent. By using the printed circuit board, consumption of a large amount of the copper is avoided; energy is saved and production efficiency is increased; environmental pollution and discharge caused by traditional printed circuit board production are reduced.

Description

Copper base electrically conductive ink all print printed circuit board

Technical field

The utility model relates to a kind of printed circuit board (PCB).

Background technology

China produces printed circuit board at present and all adopts the subtractive process production technology; The raw material that use are to adopt copper-clad plate as the base material of producing printed circuit board; Through technologies such as exposure, development, etchings; On the copper-clad plate surface, form circuitous pattern, etch away a considerable amount of Copper Foils through chemical method again and form conductive pattern.The technical process that subtractive process is produced printed circuit board (PCB) has not only consumed a large amount of copper metals resources, has also consumed a large amount of energy simultaneously and has produced the three wastes, need carry out environmental protection treatment.The printed circuit board (PCB) of subtractive process production at present is a kind of industry of labour's highly dense, and its step is various, and needs certain manual intervention, and these have all increased the production cost of traditional printing board production.At present, the technology that more existing abroad units research ink-jet printing process are made printed circuit board (PCB)s, but because its used equipment and electrocondution slurry costliness, the processing cost that causes printed circuit board is too high and be difficult to apply.

The utility model content

For overcoming the deficiency of prior art, the purpose of the utility model provides a kind of copper base electrically conductive ink all print printed circuit board, and this printed circuit board (PCB) production cost is low, can prevent contaminated environment.

For realizing above-mentioned purpose, the utility model is realized through following technical scheme:

A kind of copper base electrically conductive ink all print printed circuit board, it comprises insulated substrate, silk screen printing is at the conductive ink layer on the insulated substrate and electroplate the metal copper layer on electrically conductive ink, this conductive ink layer comprises silver-colored copper-clad particle, resin binder and solvent.

Said solvent comprises dispersant, slipping agent and coupling agent.

Said resin binder is selected epoxy resin or alkyd resins for use, and silver-colored copper-clad conductive particle and resin binder account for total amount 70%, and solvent accounts for total amount 30%.

Compared with prior art, the beneficial effect of the utility model is:

Through adopting method for printing screen on insulated substrate, to print conductive ink layer, and on conductive ink layer plated metal copper layer, this printed circuit board (PCB) has reduced problem of environmental pollution, has reduced the loss of a large amount of copper, and then reduces production cost.

Description of drawings

Fig. 1 is the structural representation of the utility model copper base electrically conductive ink all print printed circuit board.

Among the figure: insulated substrate 1, conductive ink layer 2, metal copper layer 3.

Embodiment

Below in conjunction with accompanying drawing structure and the manufacture method of the utility model in concrete work described in further detail.

See Fig. 1; The utility model copper base electrically conductive ink all print printed circuit board comprises insulated substrate 1, silk screen printing is at the conductive ink layer on the insulated substrate 12 and electroplate the metal copper layer 3 on electrically conductive ink 2, and this conductive ink layer 2 comprises silver-colored copper-clad particle, resin binder and solvent.Said solvent comprises dispersant, slipping agent and coupling agent.Said resin binder is selected epoxy resin or alkyd resins for use, and silver-colored copper-clad conductive particle and resin binder account for total amount 70%, and solvent accounts for total amount 30%.

The manufacture method of all print printed circuit board of the utility model may further comprise the steps:

1) at first select for use a nothing to cover the epoxy of Copper Foil or the insulated substrate of alkyd resins material; According to circuit diagram; On this insulated substrate, carry out multiple membrane process successively, adopt numerical control drilling machine processing via, utilize the electroless copper plating method to make through hole realize metallization, reach and remove the multiple film of residue, wherein then adopt flow extruding electroless copper plating method for micro hole;

2) adopt the method for photo-imaging silk screen mask directly the line pattern in the circuit diagram to be printed on the insulated substrate, wherein then:

Select earlier that silk footpath detailed catalogue number is many for use, the stainless steel material of dimensionally stable is as web material, it is 28 microns that present embodiment is selected the silk footpath for use, the detailed catalogue number is 325 orders, opening and distinguishing area percentage is 41.2%;

Silk screen printing is to adopt electrically conductive ink to bite on insulated substrate, to form the line pattern thick film then; This electrically conductive ink comprises resin binder that better conductivity silver copper-clad metallic conduction particle, employing epoxy or alkyd resins make and the solvent that adds as required; This solvent comprises additive, dispersant, slipping agent, coupling agent; The silver-colored copper-clad particle and the resin binder of present embodiment account for 70% of total amount, and this wherein silver-colored copper-clad particle accounts for the overwhelming majority, and the amount of resin binder seldom; All the other 30% are solvents; The electrically conductive ink of making by above-mentioned prescription has good printing characteristic; Be in particular in thixotropy and flowability, thixotropy can guarantee that electrically conductive ink is easy to the district that opens through the silk screen mask, on substrate, obtains the higher thick film figure of resolution; Thixotropy has significant effects to the thick film of conducting wire formation and the compactness of thick film dielectric simultaneously; Carry out in the screen printing process with electrically conductive ink, adopt different pressure angle and motive force, can realize that coating is even, thickness is consistent;

3) then to the line pattern thick film of the insulated substrate behind the wire mark dry, sintering; Wherein oven dry is in order to remove the organic solvent in the electrically conductive ink; Figure is finalized the design; Present embodiment was chosen in 80 ℃ of temperature dry 10 minutes down, and this technology is the important step of control circuit figure typing, generation bubble when preventing that figure from polluting with sintering; After oven dry finishes; Carry out sintering immediately; The sintering process process is in the temperature automatically controlled sintering furnace of full chain type, to carry out, and temperature is controlled in 85 ℃～150 ℃ scopes, heats by the sintering curre of setting; Sintering process is directly connected to the thermal stress between thick film layers and the substrate, help to realize MULTILAYER COMPOSITE be one and have＞the higher circuit tension of 1.5N/cm2 takes off the printed circuit board (PCB) of strength capabilities;

4), on line pattern and at through hole and line pattern junction plated metal copper layer, so just form the conducting wire according to circuit diagram;

5), when needing the wire mark character graphics, on insulated substrate, adopt the hot curing green oil successively to conducting wire wire mark resistance weldering, cleaning, drying, wire mark character graphics and curing according to circuit diagram;

6) according to circuit diagram, electric elements are welded on the insulated substrate, carry out the smooth processing of hot blast again, can improve anti-immersed solder property like this;

7) clean at last, dry, carry out electric break-make and detect, accomplish final inspection.

Utilize the parameter area of the printed circuit board (PCB) that said method makes following: thick film thickness＞50 μ m; Conductor width＞0.8mm; Wire pitch＞0.8mm; Live width precision >=0.2mm.

The utility model can be widely used in the single face of various microelectronics, communication and portable type electronic product, the printed circuit board (PCB) of two-sided, multilayer; This addition process manufacture craft has avoided utilizing traditional subtractive process to produce the consumption of a large amount of metallic coppers that printed circuit board (PCB) causes; Both saved the energy, and improved production efficiency again, production process does not have the three wastes; Reduce traditional printing board production pollution on the environment and discharging, helped ecological protection and sustainable development project.

Claims (3)

1. copper base electrically conductive ink all print printed circuit board; It is characterized in that; Comprise insulated substrate, silk screen printing in conductive ink layer on the insulated substrate and the metal copper layer of plating on electrically conductive ink, this conductive ink layer comprises silver-colored copper-clad particle, resin binder and solvent.

2. a kind of copper base electrically conductive ink all print printed circuit board according to claim 1 is characterized in that said solvent comprises dispersant, slipping agent and coupling agent.

3. a kind of copper base electrically conductive ink all print printed circuit board according to claim 1 is characterized in that said resin binder is selected epoxy resin or alkyd resins for use, and silver-colored copper-clad conductive particle and resin binder account for total amount 70%, and solvent accounts for total amount 30%.