CN106612609B - Light thin black conductive adhesive film - Google Patents
Light thin black conductive adhesive film Download PDFInfo
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- CN106612609B CN106612609B CN201510701450.8A CN201510701450A CN106612609B CN 106612609 B CN106612609 B CN 106612609B CN 201510701450 A CN201510701450 A CN 201510701450A CN 106612609 B CN106612609 B CN 106612609B
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- Prior art keywords
- conductive ink
- ink layer
- layer
- black
- thin
- Prior art date
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000011889 copper foil Substances 0.000 claims abstract description 29
- 239000002245 particle Substances 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 120
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 239000005083 Zinc sulfide Substances 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 239000004927 clay Substances 0.000 claims description 3
- 229910052570 clay Inorganic materials 0.000 claims description 3
- 229920002313 fluoropolymer Polymers 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 3
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 238000004880 explosion Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 238000009423 ventilation Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The invention discloses a light and thin black conductive adhesive film, which comprises an upper conductive ink layer, a thin copper foil layer and a lower conductive ink layer, wherein the thin copper foil layer is a copper foil layer with the thickness of 0.1-3 mu m, the upper conductive ink layer and the lower conductive ink layer are both black conductive ink layers, the thin copper foil layer is positioned between the upper conductive ink layer and the lower conductive ink layer, the lower conductive ink layer contains a plurality of large conductive particles with the particle size larger than the thickness of the lower conductive ink layer, and the large conductive particles pierce the lower conductive ink layer. The light and thin black conductive adhesive film has the circuit shielding function, the high electromagnetic wave shielding function and the high conductivity, and large conductive particles therein have the piercing effect, so that the grounding effect can be perfectly realized when no grounding hole exists, and ventilation holes can be formed, the problem of SMT post-explosion plates is effectively solved, and the processing operation of a downstream FPC factory is easy.
Description
Technical Field
The invention belongs to the technical field of conductive adhesive for printed circuit boards, and particularly relates to black conductive adhesive with high electromagnetic wave shielding function and high conductivity.
Background
The rapid development of the electronic information industry has increased demands for miniaturization and miniaturization of electronic components and high density and high integration of printed circuit boards, and has been functionally required to transmit signals at higher and higher speeds. The improvement of the circuit density and the working bandwidth, together with the poor circuit layout in the actual operation, the problem of electromagnetic interference (Electromagnetic Interference, EMI) in the electronic industry is more and more serious, so that it is significant to develop a material or component capable of effectively avoiding electromagnetic interference and ensuring the normal signal transmission effect.
The existing conductive adhesive or conductive material in the market has the problem that the processing operation of a downstream FPC factory is difficult due to unstable adhesive overflow. In addition, similar conductive materials which are circulated in the market at present have the problem of SMT post-explosion plates.
Disclosure of Invention
In order to solve the technical problems, the present invention provides a light and thin black conductive film, which has a circuit shielding function, a high electromagnetic wave shielding function and a high conductivity; and the large conductive particles have a piercing effect, so that the grounding effect can be perfectly realized when the grounding hole is not formed, and the vent hole can be formed, thereby effectively solving the problem of SMT post-explosion plates.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the utility model provides a light and thin type black conductive adhesive film, includes conductive ink layer, thin copper foil layer and lower conductive ink layer, thin copper foil layer is the copper foil layer of thickness 0.1 mu m to 3 mu m, go up conductive ink layer with lower conductive ink layer is black conductive ink layer, thin copper foil layer is located between conductive ink layer and the lower conductive ink layer, contain a plurality of particle diameter and be greater than the big conductive particle of lower conductive ink layer thickness in the conductive ink layer down, big conductive particle pierces through conductive ink layer down.
The invention adopts the further technical scheme for solving the technical problems that:
further, the upper conductive ink layer has a thickness ranging from 2 μm to 8 μm.
Further, the thickness of the lower conductive ink layer ranges from 5 μm to 15 μm.
Further, each of the upper conductive ink layer and the lower conductive ink layer contains 3 to 7% by weight of black body.
Further, the surfaces of the upper conductive ink layer and the lower conductive ink layer are respectively black bright surfaces with the glossiness being more than 50 degrees or black foggy surfaces with the glossiness being less than 20 degrees. Further, when the surfaces of the upper conductive ink layer and the lower conductive ink layer are black foggy surfaces, a foggy surface agent is added in each of the upper conductive ink layer and the lower conductive ink layer, and the foggy surface agent is at least one of calcium sulfate, silicon dioxide, titanium dioxide, zinc sulfide, zirconium oxide, calcium carbonate and clay.
Further, the upper conductive ink layer and the lower conductive ink layer each contain 25-75% by weight of a conductive material selected from at least one of silver powder, copper powder, zinc powder, nickel powder, aluminum powder, gold-coated copper powder, gold-coated nickel powder, silver-coated copper powder, silver-coated nickel powder, alloy powder and graphite.
Further, the thin copper foil layer is a carrier copper foil.
Further, the copper foil further comprises a release layer, wherein the lower conductive ink layer is positioned between the thin copper foil layer and the release layer, and the thickness of the release layer ranges from 25 mu m to 55 mu m.
Preferably, the release layer is a PET fluoroplastic release film, a PET silicone oil release film, a PET matte release film or a PE release film.
Preferably, the release layer is a double-sided release film.
Preferably, the color of the release layer is pure white, milky white or transparent, preferably pure white or milky white.
The beneficial effects of the invention are as follows: the thin and light black conductive adhesive film has the advantages that the thin copper foil layer with the thickness of 0.1-3 mu m is clamped between the upper conductive ink layer and the lower conductive ink layer, and the lower conductive ink layer contains large conductive particles penetrating through the lower conductive ink layer, so that the production process is simple, the thin and light black conductive adhesive film has a circuit shielding function, a high electromagnetic wave shielding function and high conductivity, and the large conductive particles have penetrating effects, so that the grounding effect can be perfectly realized when no grounding hole exists, ventilation holes can be formed, the problem of SMT post-explosion plates is effectively solved, and the processing operation of a downstream FPC factory is easy.
Drawings
FIG. 1 is a schematic view of a light and thin black conductive film according to the present invention;
fig. 2 is a schematic structural diagram of the light and thin black conductive film of the present invention after the release layer is peeled off.
Detailed Description
The following specific embodiments of the invention are described in order to provide a thorough understanding of the advantages and capabilities of the invention, as will be readily apparent to those skilled in the art from the present disclosure. The invention can be embodied in other different forms, i.e., with various modifications and alterations being possible without departing from the scope of the invention as disclosed.
Examples: as shown in fig. 1, the light and thin black conductive adhesive film comprises an upper conductive ink layer 101, a thin copper foil layer 102 and a lower conductive ink layer 103, wherein the Bao Tongbo layer 102 is a copper foil layer with a thickness of 0.1-3 μm, the upper conductive ink layer 101 and the lower conductive ink layer 103 are both black conductive ink layers, the Bao Tongbo layer 102 is located between the upper conductive ink layer 101 and the lower conductive ink layer 103, the lower conductive ink layer 103 contains a plurality of large conductive particles with a particle size larger than the thickness of the lower conductive ink layer, the large conductive particles pierce the lower conductive ink layer, the thickness of the upper conductive ink layer 101 ranges from 2 μm to 8 μm, the thickness of the lower conductive ink layer 103 ranges from 5 μm to 15 μm, the release layer 104 is located between the Bao Tongbo layer 102 and the release layer 104, and the thickness of the release layer 104 ranges from 25 μm to 55 μm.
The upper conductive ink layer and the lower conductive ink layer respectively contain 3-7% of black color bodies in parts by weight and are used for shielding circuits and beautifying appearance. The black body may be an inorganic pigment or an organic pigment.
The surfaces of the upper conductive ink layer and the lower conductive ink layer are each a black bright surface with a Gloss (Gloss) of greater than 50 ° or a black hazy surface with a Gloss (Gloss) of less than 20 °. When the surfaces of the upper conductive ink layer and the lower conductive ink layer are black foggy surfaces, foggy agents are respectively added in the upper conductive ink layer and the lower conductive ink layer, and the foggy agents are at least one of calcium sulfate, silicon dioxide, titanium dioxide, zinc sulfide, zirconium oxide, calcium carbonate and clay.
The upper conductive ink layer and the lower conductive ink layer respectively contain 25-75% of conductive materials by weight, and the conductive materials can be at least one selected from silver powder, copper powder, zinc powder, nickel powder, aluminum powder, gold-coated copper powder, gold-coated nickel powder, silver-coated copper powder, silver-coated nickel powder and alloy powder or at least one selected from conductive compounds such as graphite and the like and mixtures thereof. The conductive material comprises the large conductive particles, the EMI ink layer connected with the conductive material is pierced by utilizing the piercing effect of the large conductive particles and is communicated with the EMI conductive layer, the purpose of grounding conduction is achieved, and a step of punching a grounding hole on the FPC can be omitted.
The thin copper foil layer is a carrier copper foil.
The release layer is a PET fluoroplastic release film, a PET silicone oil release film, a PET matte release film or a PE release film, and is used for keeping the viscosity of the adhesive layer and facilitating subsequent use.
The release layer is a double-sided release film, so that the phenomenon of adhesion of the product during winding can be effectively avoided.
The release layer is pure white, milky white or transparent, preferably pure white or milky white. The pure white or milky white release film has no reflection light problem, and when the numerical control automatic equipment is used for engraving a line, the infrared induction can be rapidly and accurately positioned, meanwhile, the recognition function is realized, and the artificial leakage and tearing can be effectively prevented during processing operation.
The light and thin type black conductive adhesive film can be prepared by the following method: and forming an upper conductive ink layer on the surface of the copper foil layer by a coating method, enabling the conductive ink layer to be in a B-stage (semi-polymerization and semi-hardening) state, forming a lower conductive ink layer on the other surface of the copper foil layer by a coating method, and finally attaching a release film to form the light and thin black conductive adhesive film.
And (3) conducting analysis and test are carried out on the light and thin black conductive adhesive film (shown in figure 2) after the double-sided release film is peeled off: the conductivity analysis test was performed by using a high-bridge tester, after the nickel-plated steel sheet and the single-sided board were respectively pseudo-pasted on both sides of the upper and lower conductive ink layers, the conductivity resistance data before and after the test sample pieces were subjected to reflow soldering was press-cured, the test performed by the present invention was used as an example, the conductivity of other conductive adhesives was tested by the same method as a comparative example, and the measured conductivity results were recorded in table 1.
Table 1:
as can be seen from the above table, the light and thin black conductive film of the present invention has good piercing effect, conductive effect and electromagnetic wave shielding property.
The foregoing description and examples are merely illustrative of the principles and functions of the present invention, and are not intended to be limiting. Any composition falling within the scope of the claims of the present invention is intended to be within the scope of the present invention.
Claims (10)
1. A light and thin black conductive adhesive film is characterized in that: the copper foil comprises an upper conductive ink layer, a thin copper foil layer and a lower conductive ink layer, wherein the thin copper foil layer is a copper foil layer with the thickness of 0.1-3 mu m, the upper conductive ink layer and the lower conductive ink layer are both black conductive ink layers, the thin copper foil layer is positioned between the upper conductive ink layer and the lower conductive ink layer, the lower conductive ink layer contains a plurality of large conductive particles with the particle size larger than the thickness of the lower conductive ink layer, the large conductive particles pierce the lower conductive ink layer, each of the upper conductive ink layer and the lower conductive ink layer contains 3-7% of black body by weight, each of the upper conductive ink layer and the lower conductive ink layer contains 25-75% of conductive material by weight, and the conductive material is at least one selected from silver powder, copper powder, zinc powder, nickel powder, aluminum powder, gold-coated copper powder, gold-coated nickel powder, silver-coated copper powder, silver-coated nickel powder, alloy powder and graphite.
2. The lightweight, thin, black, conductive film according to claim 1, wherein: the upper conductive ink layer has a thickness ranging from 2 μm to 8 μm.
3. The lightweight, thin, black, conductive film according to claim 1, wherein: the thickness of the lower conductive ink layer ranges from 5 μm to 15 μm.
4. The lightweight, thin, black, conductive film according to claim 1, wherein: the surfaces of the upper conductive ink layer and the lower conductive ink layer are respectively black bright surfaces with the glossiness being more than 50 degrees or black foggy surfaces with the glossiness being less than 20 degrees.
5. The light and thin black conductive film according to claim 4, wherein: when the surfaces of the upper conductive ink layer and the lower conductive ink layer are black foggy surfaces, foggy agents are respectively added in the upper conductive ink layer and the lower conductive ink layer, and the foggy agents are at least one of calcium sulfate, silicon dioxide, titanium dioxide, zinc sulfide, zirconium oxide, calcium carbonate and clay.
6. The lightweight, thin, black, conductive film according to claim 1, wherein: the thin copper foil layer is a carrier copper foil.
7. The lightweight, thin, black, conductive film according to claim 1, wherein: the copper foil comprises a copper foil layer, a release layer, a lower conductive ink layer and a protective layer, wherein the lower conductive ink layer is positioned between the copper foil layer and the release layer, and the thickness of the release layer ranges from 25 mu m to 55 mu m.
8. The lightweight, thin, black, conductive film according to claim 7, wherein: the release layer is a PET fluoroplastic release film, a PET silicone oil release film, a PET matte release film or a PE release film.
9. The lightweight, thin, black, conductive film according to claim 7, wherein: the release layer is a double-sided release film.
10. The lightweight, thin, black, conductive film according to claim 7, wherein: the release layer is pure white, milky white or transparent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510701450.8A CN106612609B (en) | 2015-10-26 | 2015-10-26 | Light thin black conductive adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510701450.8A CN106612609B (en) | 2015-10-26 | 2015-10-26 | Light thin black conductive adhesive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106612609A CN106612609A (en) | 2017-05-03 |
| CN106612609B true CN106612609B (en) | 2024-03-26 |
Family
ID=58612373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510701450.8A Active CN106612609B (en) | 2015-10-26 | 2015-10-26 | Light thin black conductive adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106612609B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108099358B (en) * | 2017-12-28 | 2020-11-24 | 广州云普电子科技有限公司 | Copper-clad plate processing method capable of improving electrical performance |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102387656A (en) * | 2010-08-30 | 2012-03-21 | 富葵精密组件(深圳)有限公司 | Circuit board with grounding shield structure and manufacturing method thereof |
| CN102510712A (en) * | 2011-11-14 | 2012-06-20 | 广州方邦电子有限公司 | Paper-thin screened film with extremely high screening efficiency and manufacturing method therefor |
| CN202587595U (en) * | 2012-04-01 | 2012-12-05 | 鞍山市正发电路有限公司 | Copper-based conductive-ink all-printing printed circuit board |
| CN204305452U (en) * | 2014-10-08 | 2015-04-29 | 广州方邦电子有限公司 | Free ground film and comprise the shielded line plate of free ground film |
| CN205124243U (en) * | 2015-10-26 | 2016-03-30 | 昆山雅森电子材料科技有限公司 | Light and thin type black conductive film |
-
2015
- 2015-10-26 CN CN201510701450.8A patent/CN106612609B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102387656A (en) * | 2010-08-30 | 2012-03-21 | 富葵精密组件(深圳)有限公司 | Circuit board with grounding shield structure and manufacturing method thereof |
| CN102510712A (en) * | 2011-11-14 | 2012-06-20 | 广州方邦电子有限公司 | Paper-thin screened film with extremely high screening efficiency and manufacturing method therefor |
| CN202587595U (en) * | 2012-04-01 | 2012-12-05 | 鞍山市正发电路有限公司 | Copper-based conductive-ink all-printing printed circuit board |
| CN204305452U (en) * | 2014-10-08 | 2015-04-29 | 广州方邦电子有限公司 | Free ground film and comprise the shielded line plate of free ground film |
| CN205124243U (en) * | 2015-10-26 | 2016-03-30 | 昆山雅森电子材料科技有限公司 | Light and thin type black conductive film |
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| Publication number | Publication date |
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| CN106612609A (en) | 2017-05-03 |
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