CN104363715A - Solder-resisting treatment method of metal substrate aluminum face and metal substrate aluminum face - Google Patents
Solder-resisting treatment method of metal substrate aluminum face and metal substrate aluminum face Download PDFInfo
- Publication number
- CN104363715A CN104363715A CN201410688743.2A CN201410688743A CN104363715A CN 104363715 A CN104363715 A CN 104363715A CN 201410688743 A CN201410688743 A CN 201410688743A CN 104363715 A CN104363715 A CN 104363715A
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- welding resistance
- processing method
- coupling agent
- face
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
Abstract
The invention provides a solder-resisting treatment method of a metal substrate aluminum face and the metal substrate aluminum face. The solder-resisting treatment method comprises the steps of conducting pre-welding treatment on a metal substrate according to a normal process, and coating a layer of certain-thickness coupling agent on the basic face of the metal substrate through a coating machine; cutting the coated metal substrate; applying FR-4 double-faced silk-screen ink after the coupling agent is cured; treating the metal substrate according to the normal process after solder resistance conducted on the metal substrate. The quality problem that the bonding force between the ink and the metal substrate is insufficient and accordingly the ink on the basic face of the metal substrates formed in various modes falls off is solved, scrap rate is reduced, and quality is improved. In addition, compared with existing methods for increasing the bonding force of the ink and the metal substrates, the solder-resisting treatment method is simple in process operation and low in production cost.
Description
Technical field
The present invention relates to printed wiring board manufacture technology field, in particular a kind of welding resistance processing method of metal substrate aluminium face and metal substrate aluminium face.
Background technology
Along with the development of electronic technology, metal substrate is widely used because of its good radiating effect and base tool processing characteristics, therefore client to the processing method of metal substrate and processing request also more and more higher, wherein metal basal plane edge purposes silk-screen solder mask of leaving no room for manoeuvre also is one of the requirement of client of getting more and more in recent years, aluminium face silk solder mask is for the easy type oil of stamping shaping production plate, particularly have the aluminium base that R angle is designed, the adhesion therefore how improving aluminium face ink and aluminium becomes one of difficult problem solving this technology.
How to improve ink and metal substrate adhesion method rule of thumb all can be done roughening treatment to metal basal plane or improve exposure energy to achieve the goal, common alligatoring mode has employing: nog plate, brush version, sandblasting and the comprehensive alligatoring of microetch etc., and the super alligatoring mode of one chemistry emerging in the industry: carry out super alligatoring by special liquid medicine.But there is following shortcoming in above method:
1. common alligatoring mode: its Ra value is about 0.3um, uniformity is difficult to ensure, the ink of shaping middle metal basal plane has and comes off, and shaping rear 3M gummed paper and thermal shock test ink come off;
2. the super alligatoring mode of chemistry; Its Ra value is about 0.5um, uniformity is good, but liquid medicine cost is high, common plate does not need super alligatoring, so a horizontal line again need be purchased, area occupied, production cost increase and mainly develop in the industry liquid medicine copper being surpassed to alligatoring, and the super alligatoring liquid medicine as aluminium base, iron-based, stainless steel substrate is all in development, and process conditions are immature;
3. improve exposure energy: add production cost, easily cause ill-exposed causing to scrap.
Therefore, prior art haves much room for improvement and improves.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of welding resistance processing method and metal substrate aluminium face of metal substrate aluminium face, be intended to solve the problems such as metal basal plane solder mask easily comes off, production efficiency is low, production cost is high, flow process is loaded down with trivial details existed in the welding resistance processing method in existing metal substrate aluminium face.
Technical scheme of the present invention is as follows:
The welding resistance processing method in metal substrate aluminium face, wherein, comprises the following steps:
S1, metal substrate finish welding resistance pre-treatment according to normal flow, are coated with the certain thickness coupling agent of last layer when described metallic plate basal plane crosses coating machine;
S2, described coated metallic plate to be cured;
FR-4 double-surface screen printing ink is carried out after the solidification of S3, described coupling agent;
After S4, described metal substrate welding resistance, according to normal flow process.
The welding resistance processing method in described metal substrate aluminium face, wherein, the coupling agent THICKNESS CONTROL of described coating is at below 5um.
The welding resistance processing method in described metal substrate aluminium face, wherein, described metallic plate cure parameter is set as 150 DEG C of * 3min.
The welding resistance processing method in described metal substrate aluminium face, wherein, setting Metal Substrate to be windowed monolateral increasing 2mil in the face of the film needed for the exposure of position is designed to the shaping limit of metal basal plane.
A kind of metal substrate aluminium face, wherein, comprises the welding resistance processing method in the metal substrate aluminium face described in above any one.
The welding resistance processing method in metal substrate aluminium face provided by the present invention and metal substrate aluminium face, the certain thickness coupling agent of last layer is coated with when metallic plate basal plane crosses coated base, due to coupling agent and ink compatibility good, adhesive effect can be played and improve the infiltrating effect of bonding force, the quality problem that the adhesion deficiency solving ink and Metal Substrate causes the ink of the metal basal plane of various molding mode to come off, reduces to scrap and turn improves quality; Meanwhile, with existing increase ink compared with the method for Metal Substrate adhesion, flow operations of the present invention is simple, production cost is low.
Accompanying drawing explanation
Fig. 1 is the preferred embodiment flow chart of the welding resistance processing method in metal substrate aluminium face of the present invention.
Fig. 2 is schematic diagram after the coating coupling agent solidification in metal substrate aluminium face of the present invention.
Fig. 3 is schematic diagram after the welding resistance Graphic transitions in metal substrate aluminium face of the present invention.
Embodiment
The invention provides a kind of welding resistance processing method and metal substrate aluminium face of metal substrate aluminium face, for making object of the present invention, technical scheme and effect clearly, clearly, developing simultaneously referring to accompanying drawing, the present invention is described in more detail for embodiment.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to Fig. 1, it is the preferred embodiment flow chart of the welding resistance processing method in metal substrate aluminium face of the present invention.As shown in the figure, the welding resistance processing method in described metal substrate aluminium face comprises the following steps:
S1, metal substrate finish welding resistance pre-treatment according to normal flow, are coated with the certain thickness coupling agent of last layer when described metallic plate basal plane crosses coating machine;
Described coupling agent is the material that a class has two heterogeneity functional groups, and the maximum feature of its molecular structure is two groups different containing chemical property in molecule, and one is the group of parent without substrate, easily with without the surperficial chemically reactive of substrate; Another is the group that parent has substrate, or can generate hydrogen bond and is dissolved in wherein with synthetic resin or other polymer generation chemical reaction.Therefore coupling agent is referred to as " molecular bridge ", in order to improve without substrate and to have interface interaction between substrate, thus greatly improves the performance of composite material, as physical property, electrical property, hot property, optical property etc.Coupling agent effect be in the composite it can with some radical reaction on reinforcing material surface, can react with matrix resin again, a boundary layer is formed between reinforcing material and resin matrix, boundary layer can transmit stress, thus the bonding strength enhanced between reinforcing material and resin, improve the performance of composite material, other medium can also be prevented to contacting permeation simultaneously, improve interface state, be conducive to ageing-resistant, proof stress and the electrical insulation capability of goods.
In detail, Fig. 2 is referred to.Fig. 2 is schematic diagram after the coating coupling agent solidification in metal substrate aluminium face of the present invention, and wherein label 1 is circuit, and label 2 is dielectric layer, and label 3 is metal substrate, and label 4 is coupling agent.Metal substrate 3 tears the diaphragm of metal substrate 3 after finishing line pattern transfer according to normal flow, cross welding resistance front through nog plate, blasting treatment, be coated with the evenly very thin coupling agent of last layer 4 at metallic plate basal plane 3 when crossing coating machine, THICKNESS CONTROL is at below 5um.On the one hand, coupling agent price is 200 yuan/kilogram, dilutes 20 times of uses, and namely 10 yuan/kilogram 1 kilogram can be coated with 40 square meters, and therefore the technology used in the present invention production cost is lower; Another fermentation, the problem that the adhesion deficiency also efficiently solving ink and Metal Substrate causes the metal basal plane ink of various molding mode to come off.
S2, described coated metallic plate to be cured;
FR-4 double-surface screen printing ink is carried out after the solidification of S3, described coupling agent;
After S4, described metal substrate welding resistance, according to normal flow process.
In the embodiment of the present invention, be placed in by described coated metallic plate on thousand layers of frame and be cured, setting described cure parameter is 150 DEG C of * 3min; FR-4 double-surface screen printing ink flow path is carried out after described coupling agent solidification.Setting Metal Substrate to be windowed monolateral increasing 2mil in the face of the film needed for the exposure of position is designed to the shaping limit of metal basal plane, the uneven and bit errors needed for contraposition of edges of boards ink when avoiding shaping; Character afterwards, boring, punching all carry out according to the flow process of common metal substrate.
In detail, Fig. 3 is referred to.Fig. 3 is schematic diagram after the welding resistance Graphic transitions in metal substrate aluminium face of the present invention, and wherein label 5 is solder mask.The invention provides good insulation property, return the rate of penetrating etc., and ink thickness all there will not be between 10-50um shaping fall oil, ink the phenomenon such as to come off; Pull with 3M before and after boring, gong plate, punching and come off without ink, without quality abnormal after thermal shock.
In sum, the welding resistance processing method in metal substrate aluminium face provided by the present invention and metal substrate aluminium face, first, metal substrate tears the diaphragm of metal substrate after finishing line pattern transfer according to normal flow, cross welding resistance front through nog plate, blasting treatment, when crossing coating machine, be coated with the evenly very thin coupling agent of last layer at metallic plate basal plane; Then, described coated metallic plate is placed on thousand layers of frame is cured; Finally, FR-4 double-surface screen printing ink is carried out after described coupling agent solidification.The quality problem that the adhesion deficiency that the invention solves ink and Metal Substrate causes the ink of the metal basal plane of various molding mode to come off, reduces to scrap and turn improves quality; Meanwhile, with existing increase ink compared with the method for Metal Substrate adhesion, flow operations of the present invention is simple, production cost is low.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (5)
1. the welding resistance processing method in metal substrate aluminium face, is characterized in that, comprise the following steps:
S1, metal substrate finish welding resistance pre-treatment according to normal flow, are coated with the certain thickness coupling agent of last layer when described metallic plate basal plane crosses coating machine;
S2, described coated metallic plate to be cured;
FR-4 double-surface screen printing ink is carried out after the solidification of S3, described coupling agent;
After S4, described metal substrate welding resistance, according to normal flow process.
2. the welding resistance processing method in metal substrate aluminium face according to claim 1, is characterized in that, the coupling agent THICKNESS CONTROL of described coating is at below 5um.
3. the welding resistance processing method in metal substrate aluminium face according to claim 2, is characterized in that, described metallic plate cure parameter is set as 150 DEG C of * 3min.
4. the welding resistance processing method in metal substrate aluminium face according to claim 1, is characterized in that, setting Metal Substrate to be windowed monolateral increasing 2mil in the face of the film needed for the exposure of position is designed to the shaping limit of metal basal plane.
5. a metal substrate aluminium face, is characterized in that, comprises the welding resistance processing method in the metal substrate aluminium face described in any one of Claims 1-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410688743.2A CN104363715A (en) | 2014-11-26 | 2014-11-26 | Solder-resisting treatment method of metal substrate aluminum face and metal substrate aluminum face |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410688743.2A CN104363715A (en) | 2014-11-26 | 2014-11-26 | Solder-resisting treatment method of metal substrate aluminum face and metal substrate aluminum face |
Publications (1)
| Publication Number | Publication Date |
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| CN104363715A true CN104363715A (en) | 2015-02-18 |
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| CN201410688743.2A Pending CN104363715A (en) | 2014-11-26 | 2014-11-26 | Solder-resisting treatment method of metal substrate aluminum face and metal substrate aluminum face |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111770642A (en) * | 2020-06-11 | 2020-10-13 | 珠海斗门超毅实业有限公司 | Application method of bonding agent in surface treatment of circuit board and circuit board |
| CN112566382A (en) * | 2019-09-10 | 2021-03-26 | 深南电路股份有限公司 | Novel resistance welding pretreatment processing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101340785A (en) * | 2007-07-04 | 2009-01-07 | 深圳富泰宏精密工业有限公司 | Outer casing of electronic product |
| CN101855304A (en) * | 2007-09-25 | 2010-10-06 | 丰田自动车株式会社 | Antirust treated metal |
| CN202587595U (en) * | 2012-04-01 | 2012-12-05 | 鞍山市正发电路有限公司 | Copper-based conductive-ink all-printing printed circuit board |
| CN103717011A (en) * | 2014-01-06 | 2014-04-09 | 广东生益科技股份有限公司 | Method for relieving copper printed circuit board solder resist cracking |
| CN104066283A (en) * | 2013-03-21 | 2014-09-24 | 深圳富泰宏精密工业有限公司 | Housing and manufacture method thereof |
-
2014
- 2014-11-26 CN CN201410688743.2A patent/CN104363715A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101340785A (en) * | 2007-07-04 | 2009-01-07 | 深圳富泰宏精密工业有限公司 | Outer casing of electronic product |
| CN101855304A (en) * | 2007-09-25 | 2010-10-06 | 丰田自动车株式会社 | Antirust treated metal |
| CN202587595U (en) * | 2012-04-01 | 2012-12-05 | 鞍山市正发电路有限公司 | Copper-based conductive-ink all-printing printed circuit board |
| CN104066283A (en) * | 2013-03-21 | 2014-09-24 | 深圳富泰宏精密工业有限公司 | Housing and manufacture method thereof |
| CN103717011A (en) * | 2014-01-06 | 2014-04-09 | 广东生益科技股份有限公司 | Method for relieving copper printed circuit board solder resist cracking |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566382A (en) * | 2019-09-10 | 2021-03-26 | 深南电路股份有限公司 | Novel resistance welding pretreatment processing method |
| CN111770642A (en) * | 2020-06-11 | 2020-10-13 | 珠海斗门超毅实业有限公司 | Application method of bonding agent in surface treatment of circuit board and circuit board |
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Application publication date: 20150218 |
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