CN103717011A - Method for relieving copper printed circuit board solder resist cracking - Google Patents
Method for relieving copper printed circuit board solder resist cracking Download PDFInfo
- Publication number
- CN103717011A CN103717011A CN201410005747.6A CN201410005747A CN103717011A CN 103717011 A CN103717011 A CN 103717011A CN 201410005747 A CN201410005747 A CN 201410005747A CN 103717011 A CN103717011 A CN 103717011A
- Authority
- CN
- China
- Prior art keywords
- thick copper
- copper
- base material
- silane coupler
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for relieving copper printed circuit board solder resist cracking. According to the method, before the press fit of copper foil and a substrate in the production process of a copper-clad plate, the combined interface of thick copper and a substrate is roughened first, and then a silane coupling agent coating is arranged on the combined interface of the thick copper and the substrate. According to the method, the silane coupling agent coating is arranged on the combined interface of the thick copper with thickness of 20z or more and the substrate in a coating mode, the combined force of the thick copper and the substrate is ensured, the problem of insufficient rigidity, caused by the traditional technology, of the substrate is solved, and the thick copper printed circuit board solder resist cracking is relieved.
Description
Technical field
The invention belongs to printed circuit board technology field, be specifically related to a kind of method of improving thick copper printed circuit board welding resistance cracking.
Background technology
On PCB, except solder joint, other parts plate face all needs to cover one deck welding resistance ink as permanent protection coating.Welding resistance ink (Solder Mask) has the multiple colors such as red, blue, green, purple, white, black, because green is the most conventional, and is commonly called as green oil.Welding resistance ink is thickness state before use, by printing, preliminary drying, contraposition, exposure, development, the rear work flow such as solidify, the position that need to weld or assemble at terminal client is all out exposed, and not needing base material, the Copper Foil position of welding or assembling all with welding resistance ink, to cover, such one deck solder mask has the performances such as good acid and alkali-resistance, resistance to solvent, high temperature resistance.The Main Function of welding resistance ink is to prevent that Copper Foil is exposed at oxidation and the upper tin of prevention in air.
For thick copper printed circuit board, while particularly using thick copper (6oz or more than) the rolled copper foil copper-clad plate of CEM-3 to make circuit board plate, be easy to occur the green oil problem of Cracking between circuit after welding resistance ink solidification.Except and the rigidity of copper-clad plate material own, pcb board thick copper circuit between outside the Pass space factor large and welding resistance ink itself has, also relevant with the production process of this copper-clad plate.
In copper-clad plate production process, because the thick copper rolled copper foil itself without any processing is very poor with the caking property of base material, for improving the adhesion of Copper Foil and base material, make it reach the making requirement of printed circuit board, first the interface that can be combined with base material to rolled copper foil sprays one deck thermoplastic resin and processes, and then carries out high-temperature laminating and obtain copper-clad plate.After pressing, thick Copper Foil and base material part have general 10～30 μ m thermoplastic resins, although the thermoplastic resin of this layer can improve the adhesion of rolled copper foil and base material, guarantee that peel strength of copper foil meets the demands, but also can bring counter productive, sheet material is felt like jelly, after being heated in the PCB course of processing, be easy to produce distortion, cause welding resistance ink coating cracking, i.e. the generation of green oil problem of Cracking.Thereby affect the problem of the insulating properties between circuit board line.
Summary of the invention
Especially use the thick copper printed circuit board welding resistance ink solidification of CEM-3 in order to solve thick copper printed circuit board after, easily because of the distortion of base material, there is the welding resistance ink cracking phenomena between circuit, thereby affect the problem of the insulating properties between circuit board line, the object of the present invention is to provide a kind of method of improving thick copper printed circuit board welding resistance cracking.
In order to achieve the above object, the present invention has adopted following technical scheme:
A kind of method of improving thick copper printed circuit board welding resistance cracking, described method by pressing Copper Foil and base material in copper-clad plate production process before, first the combination interface of thick copper and base material is carried out to roughening treatment, then the combination interface at thick copper and base material arranges the realization of silane coupler coating.
Preferably, before coating silane coupler, first the combination interface of thick copper and base material is carried out to machinery and/or chemical roughen processing.
Alligatoring refers to, by Mechanical Method or chemical method, surface of the work is processed to (mechanical wear or chemical corrosion), thereby at the combination interface of thick copper and base material, obtains a kind of structure of micro-rough, to improve the interface binding power of thick copper and base material.
Preferably, the mode that at the combination interface of thick copper and base material silane coupler coating is set comprises coating, spraying or electroplates.
Preferably, described silane coupler is cyano-containing silane coupler.Silane coupler is the low molecule organo-silicon compound that a class has special construction, has the reactive group that can combine with different materials, can between interface, erect molecular bridge, and the material of two kinds of different in kinds is coupled at together, improves the adhesion strength of boundary layer.Therefore, can be by be widely used in glass surface treatment with silane coupler, the surface treatment of inorganic filler is to improve the adhesion of glass or filler and resin and the mechanical property of material and anti-hydrolytic performance are increased.In Ge functional group, cyano group has the characteristic that polarity is larger, and adding of cyano group, can improve the polarity of silane coupler itself on the one hand; Can improve on the other hand the adhesive property of various base materials (as glass, concrete, building stones, alloy etc.), especially with metal base.Therefore, by the combination interface coating cyanoalkysilane coupling agent at thick copper and base material, make to roll thick copper and can follow well resin-bonded, because this layer of cyano-containing silane coupler applying is very thin, almost can ignore thickness, the combination of therefore rolling thick copper and resin is just similar to the mode of electrolytic copper foil and resin-bonded, thereby when guaranteeing the adhesion between thick copper and base material, can also avoid prior art by the problem of the sheet material temperature distortion that applies thermoplastic resin and cause, improve the welding resistance cracking phenomena of thick copper printed circuit board.
Preferably, the thickness of described silane coupler coating is 0.001～0.010mm, for example 0.002mm, 0.003mm, 0.004mm, 0.005mm, 0.006mm, 0.007mm, 0.008mm or 0.009mm.
Thick copper of the present invention means the Copper Foil that thickness is 2oz or above thickness, and preferred thickness is the Copper Foil of 6oz or above thickness.
Compared with prior art, the present invention has following beneficial effect:
Thick copper and base material combination interface at 2oz or above thickness carry out mechanical roughening treatment, then silane coating coupling agent coating, in the adhesion guaranteeing between thick copper and base material, also avoid traditional handicraft to cause the problem of substrate rigidity deficiency, improved the problem that thick copper printed circuit board welding resistance ftractures.
Compared with prior art, the present invention both can meet copper-clad plate material and roll thick copper and the requirement of base material adhesion, in PCB manufacturing process, can also avoid the sheet material problem that deforms, and improved the welding resistance ink cracking phenomena of printed circuit board.The present invention can allow the thick copper of calendering effectively use on CEM-3 and FR-4 sheet material, has reduced the manufacturing cost of sheet material on the basis that keeps sheet material proper property simultaneously, has promoted the competitiveness of product.
Embodiment
For the present invention is described better, be convenient to understand technical scheme of the present invention, typical but non-limiting embodiment of the present invention is as follows:
Embodiment 1
A kind of method of improving thick copper printed circuit board welding resistance cracking, described method is by pressing Copper Foil and base material in copper-clad plate production process, first the combination interface of thick copper and base material is carried out to roughening treatment, then the combination interface at thick copper and base material adopts the method for coating that the realization of silane coupler coating is set.
Wherein, described silane coupler is cyano-containing silane coupler, and the thickness of described silane coupler coating is 0.005mm.
Embodiment 2
A kind of method of improving thick copper printed circuit board welding resistance cracking, described method is by pressing Copper Foil and base material in copper-clad plate production process, first the combination interface of thick copper and base material is carried out to roughening treatment, then the combination interface at thick copper and base material adopts the method for spraying that the realization of silane coupler coating is set.
Wherein, described silane coupler is cyano-containing silane coupler, and the thickness of described silane coupler coating is 0.01mm.
Embodiment 3
A kind of method of improving thick copper printed circuit board welding resistance cracking, described method is by pressing Copper Foil and base material in copper-clad plate production process, first the combination interface of thick copper and base material is carried out to roughening treatment, then the combination interface at thick copper and base material adopts the mode of electroplating that the realization of silane coupler coating is set.
Wherein, described silane coupler is cyano-containing silane coupler, and the thickness of described silane coupler coating is 0.008mm.
Embodiment 4
A kind of method of improving thick copper printed circuit board welding resistance cracking, described method is by pressing Copper Foil and base material in copper-clad plate production process, first the combination interface of thick copper and base material is carried out to roughening treatment, then the combination interface at thick copper and base material adopts the mode of coating that the realization of silane coupler coating is set.
Wherein, described silane coupler is cyano-containing silane coupler, and the thickness of described silane coupler coating is 0.003mm.
Embodiment 5
A kind of method of improving thick copper printed circuit board welding resistance cracking, described method is by pressing Copper Foil and base material in copper-clad plate production process, first the combination interface of thick copper and base material is carried out to roughening treatment, then the combination interface at thick copper and base material adopts the mode of electroplating that the realization of silane coupler coating is set.
Wherein, described silane coupler is cyano-containing silane coupler, and the thickness of described silane coupler coating is 0.001mm.
Applicant's statement, the present invention illustrates detailed method of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned detailed method, does not mean that the present invention must rely on above-mentioned detailed method and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to the selection of the interpolation of the equivalence replacement of each raw material of product of the present invention and auxiliary element, concrete mode etc., within all dropping on protection scope of the present invention and open scope.
Claims (5)
1. one kind is improved the method that thick copper printed circuit board welding resistance ftractures, it is characterized in that, described method by pressing Copper Foil and base material in copper-clad plate production process before, first the combination interface of thick copper and base material is carried out to roughening treatment, then the combination interface at thick copper and base material arranges the realization of silane coupler coating.
2. the method for claim 1, is characterized in that, before coating silane coupler, first the combination interface of thick copper and base material is carried out to machinery and/or chemical roughen processing.
3. method as claimed in claim 1 or 2, is characterized in that, the mode that silane coupler coating is set at the combination interface of thick copper and base material comprises coating, spraying or electroplates.
4. the method as described in one of claim 1-3, is characterized in that, described silane coupler is cyano-containing silane coupler.
5. the method as described in one of claim 1-4, is characterized in that, the thickness of described silane coupler coating is 0.001～0.010mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410005747.6A CN103717011A (en) | 2014-01-06 | 2014-01-06 | Method for relieving copper printed circuit board solder resist cracking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410005747.6A CN103717011A (en) | 2014-01-06 | 2014-01-06 | Method for relieving copper printed circuit board solder resist cracking |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103717011A true CN103717011A (en) | 2014-04-09 |
Family
ID=50409438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410005747.6A Pending CN103717011A (en) | 2014-01-06 | 2014-01-06 | Method for relieving copper printed circuit board solder resist cracking |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103717011A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104363715A (en) * | 2014-11-26 | 2015-02-18 | 景旺电子科技(龙川)有限公司 | Solder-resisting treatment method of metal substrate aluminum face and metal substrate aluminum face |
| CN108990262A (en) * | 2018-03-20 | 2018-12-11 | 东莞市若美电子科技有限公司 | The manufacture craft of two-sided thick copper circuit board |
| CN111586989A (en) * | 2020-04-28 | 2020-08-25 | 珠海杰赛科技有限公司 | Solder mask manufacturing method of thick copper circuit board |
| CN111757609A (en) * | 2020-06-22 | 2020-10-09 | 深圳市板明科技股份有限公司 | PCB ink printing method |
| CN112566382A (en) * | 2019-09-10 | 2021-03-26 | 深南电路股份有限公司 | Novel resistance welding pretreatment processing method |
| CN113584467A (en) * | 2021-08-02 | 2021-11-02 | 四会富仕电子科技股份有限公司 | Method for improving smooth copper binding force |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145221A (en) * | 1991-11-20 | 1993-06-11 | Matsushita Electric Ind Co Ltd | Manufacture of printed circuit board |
| CN101840904A (en) * | 2010-05-07 | 2010-09-22 | 深圳丹邦科技股份有限公司 | Chip on film and manufacturing method thereof |
| JP2011219790A (en) * | 2010-04-06 | 2011-11-04 | Fukuda Metal Foil & Powder Co Ltd | Treated copper foil for copper-clad laminated board and copper-clad laminated board obtained by adhering the treated copper foil onto insulating resin substrate, and printed circuit board using the copper-clad laminated board |
-
2014
- 2014-01-06 CN CN201410005747.6A patent/CN103717011A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145221A (en) * | 1991-11-20 | 1993-06-11 | Matsushita Electric Ind Co Ltd | Manufacture of printed circuit board |
| JP2011219790A (en) * | 2010-04-06 | 2011-11-04 | Fukuda Metal Foil & Powder Co Ltd | Treated copper foil for copper-clad laminated board and copper-clad laminated board obtained by adhering the treated copper foil onto insulating resin substrate, and printed circuit board using the copper-clad laminated board |
| CN101840904A (en) * | 2010-05-07 | 2010-09-22 | 深圳丹邦科技股份有限公司 | Chip on film and manufacturing method thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104363715A (en) * | 2014-11-26 | 2015-02-18 | 景旺电子科技(龙川)有限公司 | Solder-resisting treatment method of metal substrate aluminum face and metal substrate aluminum face |
| CN108990262A (en) * | 2018-03-20 | 2018-12-11 | 东莞市若美电子科技有限公司 | The manufacture craft of two-sided thick copper circuit board |
| CN108990262B (en) * | 2018-03-20 | 2021-07-09 | 东莞市若美电子科技有限公司 | Manufacturing process of double-sided thick copper circuit board |
| CN112566382A (en) * | 2019-09-10 | 2021-03-26 | 深南电路股份有限公司 | Novel resistance welding pretreatment processing method |
| CN111586989A (en) * | 2020-04-28 | 2020-08-25 | 珠海杰赛科技有限公司 | Solder mask manufacturing method of thick copper circuit board |
| CN111757609A (en) * | 2020-06-22 | 2020-10-09 | 深圳市板明科技股份有限公司 | PCB ink printing method |
| CN111757609B (en) * | 2020-06-22 | 2022-07-08 | 深圳市板明科技股份有限公司 | PCB ink printing method |
| CN113584467A (en) * | 2021-08-02 | 2021-11-02 | 四会富仕电子科技股份有限公司 | Method for improving smooth copper binding force |
| CN113584467B (en) * | 2021-08-02 | 2024-05-07 | 四会富仕电子科技股份有限公司 | Method for improving binding force of smooth copper |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103717011A (en) | Method for relieving copper printed circuit board solder resist cracking | |
| CN101702869B (en) | Method for directly manufacturing circuit board by insulating substrate without copper cladding | |
| CN103397342B (en) | A kind of high heat-resisting electrolytic copper foil and preparation method thereof | |
| CN103118496B (en) | A kind of method improving thick copper printed circuit board welding resistance cracking | |
| CN106535508A (en) | Multi-layer board flexible circuit board built-in golden finger exposure process | |
| CN102427673B (en) | Machining method of blind hole PCB (Printed Circuit Board) | |
| CN103374307A (en) | Gummed copper foil, production method for same, multilayer flexible circuit board and production method for same | |
| CN109183018A (en) | A kind of copper foil chromium-free passivation liquid and preparation method thereof | |
| CN105177535A (en) | Manufacturing method of resistance copper foil | |
| KR20090060958A (en) | Surface treatment copper foil and circuit board | |
| CN202218478U (en) | Composite metal connecting piece capable of being mounted on PCB | |
| CN202679786U (en) | Multilayer printed circuit board stitching structure | |
| CN104441831B (en) | A low dielectric constant double-sided flexible copper clad laminate | |
| CN102529262B (en) | High temperature resistant coating-type black matt polyimide film | |
| CN105530754B (en) | A kind of Rigid Flex | |
| CN203167427U (en) | Plated-through hole carbon film plate of paper base material | |
| CN210491346U (en) | Control structure for improving asymmetric pressing circuit board warping | |
| CN205167730U (en) | Tectorial membrane metal sheet | |
| CN108060443A (en) | A kind of preparation method of the melanism composite bed on extruded metal paper tinsel surface | |
| CN204442822U (en) | A kind of electromagnetic wave shielding coverlay with obstruct and function of shielding | |
| EP1595978A3 (en) | Process for the production of coated substrates | |
| CN102975425A (en) | Polyimide film with transitional bonding layer and method for preparing same | |
| CN104760350A (en) | Copper foil composite plate | |
| CN206616182U (en) | A kind of red U.S. adhesive tape of high temperature | |
| CN111038030A (en) | Tung oil modified phenolic epoxy glass cloth coated base light-shielding single-sided copper-clad plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140409 |
|
| RJ01 | Rejection of invention patent application after publication |