CN111757609A - PCB ink printing method - Google Patents
PCB ink printing method Download PDFInfo
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- CN111757609A CN111757609A CN202010572697.5A CN202010572697A CN111757609A CN 111757609 A CN111757609 A CN 111757609A CN 202010572697 A CN202010572697 A CN 202010572697A CN 111757609 A CN111757609 A CN 111757609A
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000007767 bonding agent Substances 0.000 claims abstract description 30
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 17
- 239000012528 membrane Substances 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 238000007788 roughening Methods 0.000 claims description 18
- 230000003746 surface roughness Effects 0.000 claims description 15
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 229910020487 SiO3/2 Inorganic materials 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 5
- 230000001680 brushing effect Effects 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 229920001558 organosilicon polymer Polymers 0.000 claims description 4
- 125000003396 thiol group Chemical class [H]S* 0.000 claims description 4
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910020388 SiO1/2 Inorganic materials 0.000 claims description 2
- 230000002378 acidificating effect Effects 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- 150000001335 aliphatic alkanes Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 150000004982 aromatic amines Chemical class 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 229910001651 emery Inorganic materials 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 2
- 238000002791 soaking Methods 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000000976 ink Substances 0.000 description 58
- 230000000052 comparative effect Effects 0.000 description 16
- 238000009792 diffusion process Methods 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 238000007517 polishing process Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 235000019441 ethanol Nutrition 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 2
- TVUSEIXGYNMYOE-UHFFFAOYSA-N CC(CC1=NC(OCCC[Si](OC)(OC)OC)=CN1)O Chemical compound CC(CC1=NC(OCCC[Si](OC)(OC)OC)=CN1)O TVUSEIXGYNMYOE-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RSIHJDGMBDPTIM-UHFFFAOYSA-N ethoxy(trimethyl)silane Chemical group CCO[Si](C)(C)C RSIHJDGMBDPTIM-UHFFFAOYSA-N 0.000 description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical class [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012445 acidic reagent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Methods (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a PCB ink printing method, which comprises the following steps: coarsening the surface of the substrate to be printed to obtain a coarsened substrate to be printed; treating the roughened substrate to be printed by using a bonding agent to form a hydrophobic film layer on the surface of the roughened substrate to be printed; printing ink on the hydrophobic membrane layer. According to the embodiment of the invention, the method of combining coarsening and the bonding agent is adopted, so that the adhesive force of the printing ink is improved, the oil is prevented from falling, the surface of the substrate to be printed is rendered hydrophobic through the bonding agent, the ink boundary is prevented from diffusing, and the printing ink can be accurately positioned at the position to be printed.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a PCB ink printing method.
Background
When the solder mask ink is printed on the copper surface of the PCB substrate, the problem of serious diffusion of the solder mask ink is easily caused due to the higher surface energy of copper, so that the boundary pattern is irregular, and the distinction and the subsequent post-treatment and welding performance are influenced. In addition, the solder resist ink diffusion causes the ink edge to be thin, and the phenomenon of oil dropping is easy to occur in the subsequent treatment, such as tin melting, nickel melting and gold melting.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a PCB ink printing method, so that ink can be accurately positioned at a position to be printed, and ink diffusion is prevented.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a PCB ink printing method comprises the following steps:
roughening the printing surface of the substrate to be printed to obtain a roughened substrate to be printed;
treating the roughened substrate to be printed by using a bonding agent to form a hydrophobic film layer on the surface of the substrate to be printed;
printing ink on the hydrophobic membrane layer.
The embodiment of the invention has the following beneficial effects:
according to the embodiment of the invention, the method of combining coarsening and the bonding agent is adopted, so that the adhesive force of the printing ink is improved, the oil is prevented from falling, the surface of the substrate to be printed is rendered hydrophobic through the bonding agent, the ink boundary is prevented from diffusing, and the printing ink can be accurately positioned at the position to be printed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Wherein:
FIG. 1 is an image of the contact angle of the solder mask ink with the copper surface as measured by the contact angle measuring instrument in example 5.
FIG. 2 is an image of the shape of the solder mask ink on a copper side having a hydrophobic film layer in example 5.
FIG. 3 is an image of the contact angle of the solder mask ink to the copper surface as measured by the contact angle measuring instrument in comparative example 5.
Fig. 4 is a shape image of the solder resist ink on the copper surface in comparative example 5.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention discloses a PCB ink printing method, which comprises the following steps:
1) and roughening the printing surface of the substrate to be printed to obtain a roughened substrate to be printed.
In the step, the surface of the substrate to be printed is coarsened, so that the specific surface area of the surface is increased, and the bonding force between the substrate to be printed and the bonding agent is improved.
Preferably, the surface roughness of the roughened substrate to be printed is 0.2-0.5.
Preferably, the printing surface of the substrate to be printed may be roughened by any one of an etchant etching process including sodium persulfate and sulfuric acid, an etchant etching process including sulfuric acid and hydrogen peroxide, an etchant etching process including hydrogen peroxide, a scrub polishing process, a diamond dust polishing process, and a pozzolan scrub polishing process.
Specifically, when the surface of the substrate to be printed is roughened by adopting an etching process of an etchant containing sodium persulfate and sulfuric acid, the surface roughness of the roughened substrate to be printed is 0.2-0.3.
Specifically, when the surface of the substrate to be printed is roughened by an etchant etching process containing sulfuric acid and hydrogen peroxide, namely a super-roughening process, the surface roughness of the obtained substrate to be printed after roughening is 0.4-0.5.
Specifically, when the surface of the substrate to be printed is roughened by adopting an etching process of an etchant containing hydrogen peroxide, namely a medium roughening process, the surface roughness of the roughened substrate to be printed is 0.3-0.4.
Specifically, when the grinding and brushing process is adopted, the used grinding brush can be a nylon brush or a woven fabric brush, and the surface roughness of the obtained roughened substrate to be printed is 0.2-0.3.
Specifically, when the emery polishing process is adopted, the surface roughness of the obtained roughened substrate to be printed is 0.2-0.3.
Specifically, when the volcanic ash brushing and polishing process is adopted, the volcanic ash is driven by the brushing to rub the substrate to be printed, and the surface roughness of the obtained roughened substrate to be printed is 0.2-0.3.
Of course, a combination of the various roughening processes described above may be used to achieve the preferred range of surface roughness.
Before roughening the surface of the substrate to be printed, the method also comprises the step of cleaning the surface of the substrate to be printed by using an acidic reagent so as to remove oily impurities on the surface of the substrate to be printed.
2) And treating the roughened substrate to be printed by using a bonding agent to form a hydrophobic film layer on the surface of the roughened substrate to be printed.
The bonding agent combines the ink layer and the substrate to be printed together through chemical bonds, provides reinforced bonding force, can be effectively matched with various roughening processes, ensures the combination of the ink and the substrate to be printed, and does not drop oil. Even through the subsequent tin and nickel gold melting steps, the ink can not fall off, and the thinner ink layer (for example, the thickness of the ink is less than 10 microns) is more suitable to be combined, so that the thinner ink layer is ensured not to fall off. In addition, the hydrophobic film layer formed on the substrate to be printed after the bonding agent treatment enables the contact angle of the ink to be larger than or equal to 85 degrees, and the ink can be effectively prevented from diffusing.
Preferably, the bonding agent comprises a silicone polymer, a water-soluble alcohol and water, the silicone polymer having the general chemical formula: (R)3SiO1/2)a(R1SiO3/2)b(R2SiO3/2)c(R3SiO3/2)dWherein R is an alkyl group having 1 to 2 carbon atoms; r1Is a mercapto-containing aliphatic group or a mercapto-containing aromatic group; r2Is an aliphatic group containing arylamine or nitrogen-containing heterocycle; r3An aliphatic group containing one of a vinyl group, an acrylate group and a methacrylate group; and a is 0 to 0.8, b + c + d is 0.2 to 0.98, c is 0.2 to 0.88, and d is 0.02-0.4, wherein a + b + c + d is 1, and in the bonding agent, the mass percent of the organosilicon polymer is 2-3%, the mass percent of the water-soluble alcohol is 50-95%, and the mass percent of the water is 3-50%.
Preferably, the above silicone polymer is R3SiOX、R1Si(OX)3、R2Si(OX)3And R3Si(OX)3The mixture is hydrolyzed under an acidic condition to obtain a product, wherein X is an alkane group with 1-6 carbon atoms.
Preferably, R3SiOx is trimethylethoxysilane, R1Si(OX)3Is gamma-mercaptopropyltriethoxysilane, R2Si(OX)3Is 3- (trimethoxysilyl) -propoxy-2-hydroxypropyl-1, 3-diazole, R3Si(OX)3Is gamma-methacryloxypropyltriethoxysilane.
Preferably, the water-soluble alcohol is one of methanol, ethanol, isopropanol, and ethylene glycol.
After the substrate to be printed is coarsened and treated by the bonding agent, the process of water washing and drying is also included.
3) Printing ink on the hydrophobic membrane layer.
Preferably, the ink may be printed or coated on the hydrophobic membrane layer.
When printing ink on the hydrophobic film layer, the printing ink is directly printed on the PCB by a printer according to the final pattern, so that the process flow and the equipment requirement are greatly shortened, the production process of the PCB is simplified, and the production period is shortened. The viscosity of the ink used for printing is low, preferably in the range of 1cP to 100 cP.
When the ink is coated on the hydrophobic membrane layer, the ink is also directly printed on the PCB in the final pattern by coating printing. The viscosity of the ink used for coating is high, and preferably, the viscosity of the ink is in the range of 5000cP to 20000 cP.
The method is suitable for the substrate to be printed with the metal layer on the surface, particularly suitable for the substrate to be printed with the copper layer, and coarsening the copper surface.
The method of the invention described above is suitable for printing or applying solder mask ink, but is also suitable for printing or applying other inks, such as etching ink or photoresist.
Example 1
1) And (3) arranging a copper layer on the surface of the printed substrate, and carrying out super-roughening treatment on the copper layer to enable the surface roughness to be 0.45.
2) Cleaning a substrate to be printed with water, acid and water in sequence, and fully removing an etching agent, impurities and the like on the surface of the substrate to be printed;
3) preparing a bonding agent, uniformly mixing 0.8g of trimethylethoxysilane, 4.8g of gamma-mercaptopropyltriethoxysilane, 18.5g of 3- (trimethoxysilyl) -propoxy-2-hydroxypropyl-1, 3-diazole and 2.5g of gamma-methacryloxypropyltriethoxysilane, adding the mixture into 100mL of absolute ethyl alcohol, then dropwise adding 10mL of hydrochloric acid with the mass fraction of 5% by using a constant-pressure dropping funnel at 30 ℃ for hydrolytic condensation, continuing to react at 30 ℃ for half an hour after the dropwise adding of the hydrochloric acid is finished, then heating to 70 ℃ for reaction for 4 hours to fully hydrolyze the silane, neutralizing the excessive hydrochloric acid by using a saturated sodium bicarbonate solution until the pH reaches about 7, evaporating part of the solvent, removing the generated inorganic salt by filtering, adjusting the mass concentration of the prepared organic silicon polymer to 2% by using a mixed solvent of ethyl alcohol and water with the mass ratio of 3:1, obtaining the bonding agent.
And (3) soaking the substrate to be printed obtained in the step 2) in the bonding agent for 45 s.
4) Washing the substrate to be printed obtained in the step 3) with water, removing the bonding agent and drying.
5) Coating general solder resist ink with the viscosity of 5000-20000 cP on the copper surface of the substrate to be printed obtained in the step 3).
Example 2
The difference between the embodiment 2 and the embodiment 1 is that roughening treatment is carried out by adopting a grinding brush, and the surface roughness of the substrate to be printed after roughening is 0.25; and printing the solder mask ink for printing on the copper surface of the substrate to be printed, wherein the viscosity of the solder mask ink is 1cP-100 cP.
Example 3
The difference between the embodiment 3 and the embodiment 2 is that the volcanic rock is driven by the grinding brush to be roughened, and the surface roughness of the substrate to be printed after roughening is 0.3.
Example 4
The difference between the embodiment 4 and the embodiment 2 is that the surface roughness of the substrate to be printed after coarsening is 0.35 by adopting the medium coarsening process.
Example 5
The difference between the embodiment 5 and the embodiment 2 is that the super-roughening process is adopted, and the surface roughness of the substrate to be printed after roughening is 0.45.
Comparative example 1
Comparative example 1 is different from example 1 only in that no bonding agent is used.
Comparative example 2
Comparative example 2 is different from example 2 only in that no bonding agent is used.
Comparative example 3
Comparative example 3 is compared to example 3 with the only difference that no bonding agent is used.
Comparative example 4
Comparative example 4 is different from example 4 only in that no bonding agent is used.
Comparative example 5
Comparative example 5 is different from example 5 only in that no bonding agent is used.
The diffusion phenomenon of the solder resist ink obtained in the examples 1 to 5 and the comparative examples 1 to 5 was observed, the diffusion phenomenon was not observed, the quality was qualified, the diffusion phenomenon was observed, the quality was unqualified, and the subsequent nickel-gold and tin melting process was continued on the PCB without the diffusion phenomenon, and the results are shown in table 1, and it can be seen from table 1: when the general solder mask ink is used for printing the ink in a coating mode, the viscosity of the ink is high, the ink is not easy to diffuse, and when the coarsening and the bonding agent are combined, the solder mask ink has stronger bonding force with the copper surface.
It can also be seen from table 1: when the printing ink is printed by adopting the printing solder mask ink in a printing mode, the ink has low viscosity and is easy to diffuse, a method of combining coarsening and a bonding agent is needed to be adopted to accurately position the ink without diffusion, and meanwhile, the solder mask ink has stronger bonding force with a copper surface.
It can also be seen from table 1: the roughening treatment is carried out by adopting a super-roughening process, and the effect is optimal, namely the surface roughness is in a range of 0.4-0.5.
Table 1: parameter and Effect data for examples 1-5 and comparative examples 1-5
The contact angle of the solder resist ink of example 5 with the copper surface was measured using a contact angle measuring instrument, and the contact angle of the solder resist ink of comparative example 5 with the copper surface was measured, referring to fig. 1 to 4, and as a result, the contact angle of the solder resist ink with the copper surface was 72 ° in example 5, while the contact angle of the solder resist ink with the copper surface was 21 ° in comparative example 5, it was seen that the bonding agent reduced the surface energy of the copper surface, and therefore, the printing solder resist ink did not spread.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A PCB ink printing method is characterized by comprising the following steps:
roughening the printing surface of the substrate to be printed to obtain a roughened substrate to be printed;
treating the roughened substrate to be printed by using a bonding agent to form a hydrophobic film layer on the surface of the substrate to be printed;
printing ink on the hydrophobic membrane layer.
2. The PCB ink printing method of claim 1, wherein the roughened substrate to be printed has a surface roughness of 0.2-0.5.
3. The PCB ink printing method of claim 2, wherein the roughening treatment of the printing surface of the substrate to be printed is etching the printing surface of the substrate to be printed with an etchant containing sodium persulfate and sulfuric acid, etching the printing surface of the substrate to be printed with an etchant containing sulfuric acid and hydrogen peroxide, etching the printing surface of the substrate to be printed with an etchant containing hydrogen peroxide, polishing the printing surface of the substrate to be printed with a grinding brush, polishing the printing surface of the substrate to be printed with emery, or polishing the printing surface of the substrate to be printed with volcanic ash driven by the grinding brush.
4. A method of printing ink on a PCB as recited in claim 1, wherein the bonding agent comprises a silicone polymer, a water soluble alcohol and water, the silicone polymer having the general chemical formula: (R)3SiO1/2)a(R1SiO3/2)b(R2SiO3/2)c(R3SiO3/2)dWherein R is an alkyl group having 1 to 2 carbon atoms; r1Is a mercapto-containing aliphatic group or a mercapto-containing aromatic group; r2Is an aliphatic group containing arylamine or nitrogen-containing heterocycle; r3An aliphatic group containing one of a vinyl group, an acrylate group and a methacrylate group; and a is 0 to 0.8, b + c + d is 0.2 to 0.98, c is 0.2 to 0.88, d is 0.02 to 0.4, a + b + c + d is 1; in the bonding agent, the mass percent of the organic silicon polymer is 2-3%, the mass percent of the water-soluble alcohol is 50-95%, and the mass percent of the water is 3-50%.
5. The PCB ink print of claim 4The brushing method is characterized in that the organic silicon polymer is R3SiOX、R1Si(OX)3、R2Si(OX)3And R3Si(OX)3The mixture is hydrolyzed under an acidic condition to obtain a product, wherein X is an alkane group with 1-6 carbon atoms.
6. The PCB ink printing method of claim 4, wherein the process of treating the roughened substrate to be printed with a bonding agent is: and placing the substrate to be printed with the coarsening into the bonding agent, and soaking for 0.5-1 min.
7. The PCB ink printing method of claim 1, wherein the printing surface of the substrate to be printed is a copper layer.
8. The PCB ink printing method of claim 1, wherein the ink is a solder mask ink.
9. The PCB ink printing method of claim 1, wherein the printing of ink on the hydrophobic layer is: printing ink on the hydrophobic layer.
10. The PCB ink printing method of claim 9, wherein the viscosity of the printed ink is 1cP-100 cP.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010572697.5A CN111757609B (en) | 2020-06-22 | 2020-06-22 | PCB ink printing method |
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|---|---|---|---|
| CN202010572697.5A CN111757609B (en) | 2020-06-22 | 2020-06-22 | PCB ink printing method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473713A (en) * | 2021-06-07 | 2021-10-01 | 福州瑞华印制线路板有限公司 | Be used for three quick-witted wiring silk screen printing machine consent location structures |
| CN113939102A (en) * | 2021-08-27 | 2022-01-14 | 江苏博敏电子有限公司 | Method for manufacturing PCB solder mask graph |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103717011A (en) * | 2014-01-06 | 2014-04-09 | 广东生益科技股份有限公司 | A Method for Improving Soldering Cracking of Thick Copper Printed Circuit Board |
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| CN104066274A (en) * | 2013-03-21 | 2014-09-24 | 元杰企业有限公司 | A copper foil surface modification method for printed circuit board manufacturing process |
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| CN105780002A (en) * | 2016-03-11 | 2016-07-20 | 昆山市板明电子科技有限公司 | Copper surface coarsening micro-etching liquid and application method thereof |
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| CN113473713A (en) * | 2021-06-07 | 2021-10-01 | 福州瑞华印制线路板有限公司 | Be used for three quick-witted wiring silk screen printing machine consent location structures |
| CN113473713B (en) * | 2021-06-07 | 2022-08-30 | 福州瑞华印制线路板有限公司 | Be used for three quick-witted wiring silk screen printing machine consent location structures |
| CN113939102A (en) * | 2021-08-27 | 2022-01-14 | 江苏博敏电子有限公司 | Method for manufacturing PCB solder mask graph |
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| CN111757609B (en) | 2022-07-08 |
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