CN207720519U - A kind of High density of PCB harden structure being easy to interconnection - Google Patents
A kind of High density of PCB harden structure being easy to interconnection Download PDFInfo
- Publication number
- CN207720519U CN207720519U CN201820038851.9U CN201820038851U CN207720519U CN 207720519 U CN207720519 U CN 207720519U CN 201820038851 U CN201820038851 U CN 201820038851U CN 207720519 U CN207720519 U CN 207720519U
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- Prior art keywords
- insulating
- pcb
- high density
- ring
- easy
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model system provides a kind of High density of PCB harden structure being easy to interconnection, including plate body, and plate body includes several insulating layer and line layer being arranged alternately, and plate body is equipped with conductive column through there is several intercommunicating pores in each intercommunicating pore；The outer wall of conductive column is fixed with several conducting rings being continuously arranged and insulating ceramics ring, the outer diameter of conducting ring and insulating ceramics ring is R, conducting ring matches setting with line layer, and insulating ceramics ring matches setting with insulating layer or line layer, and insulating ceramics ring is connect with conductive column by insulating bond.The utility model can flexibly connect different line layers, conductive pillar structure is provided with smooth outer surface, it can effectively ensure to act when installing or removing conductive pillar structure smooth, easy to operate, to effectively improve the efficiency of installation or removal conductive pillar structure, while High density of PCB plate or conductive column can be effectively prevent to be damaged because of installation, dismounting.
Description
Technical field
The utility model is related to High density of PCB plates, specifically disclose a kind of High density of PCB harden structure being easy to interconnection.
Background technology
PCB (Printed Circuit Board, i.e. printed circuit board) is at least attached there are one conductive pattern thereon, and cloth
There is hole slot to realize the interconnection between electronic component, the basis of almost all electronic products.It is, in general, that if
There is electronic component in some equipment, then they are integrated on the pcb board of different sizes.Electronic component is increasingly light
The mode of thinning, multifunction and Integration Design, pcb board generally use laminated multi-layer circuit realizes highdensity integrate.
Existing High density of PCB plate, common interconnection mode be between each layer circuit by way of drilling in interlayer
The medium holes being connected with each other are formed, then by forming the electroplated layer conducted in medium holes, this interconnection procedure of processing is complicated,
It is of high cost, and can not flexibly connect different line layers；Also interconnection is realized in part using line column through High density of PCB plate,
Line column is arranged simultaneously has recess flexibly to connect different line layers to realize, but when being removed and inserted into line column, high
Each layer of density pcb board blocks recess, and line column is caused to be inserted into or take out with can not be successfully, and installing and dismounting is inconvenient,
It is also easy to the structure of damage line column or each layer of High density of PCB plate simultaneously, influences the performance of High density of PCB plate.
Utility model content
Based on this, it is necessary to it is directed to prior art problem, a kind of High density of PCB harden structure being easy to interconnection is provided, it can
Different line layers is flexibly connected, the action for installing or removing conductive pillar structure is smooth, easy to operate, can effectively prevent highly dense
Degree pcb board or conductive pillar structure are damaged because of installation, dismounting.
To solve prior art problem, the utility model discloses a kind of High density of PCB harden structure being easy to interconnection, including plate
Body, plate body include several insulating layers and line layer being arranged alternately, and plate body, which runs through, several intercommunicating pores, a diameter of R of intercommunicating pore,
It is equipped with conductive column in each intercommunicating pore；
The outer wall of conductive column is fixed with several conducting rings being continuously arranged and insulating ceramics ring, conducting ring and insulating ceramics ring
Outer diameter be R, conducting ring matches setting with line layer, and insulating ceramics ring matches setting, insulation pottery with insulating layer or line layer
Ceramic ring is connect with conductive column by insulating bond.
Further, conductive column is metal copper post.
Further, conducting ring is metallic silver ring.
Further, insulating bond is heat conduction silicone.
Further, the both ends of conductive column are equipped with limit screw hole, and each limit in screw hole is threaded with limit spiral shell
Silk.
Further, limited screw is insulating screw.
The beneficial effects of the utility model are：The utility model discloses a kind of High density of PCB harden structure being easy to interconnection, if
Special conductive pillar structure is set, can flexibly connect different line layers, and conductive pillar structure is provided with smooth outer surface, energy
It is enough effectively ensure to act when installing or removing conductive pillar structure it is smooth, easy to operate, it is conductive to effectively improve installation or removal
The efficiency of rod structure, while High density of PCB plate or conductive column can be effectively prevent to be damaged because of installation, dismounting, so that it is guaranteed that
The performance of High density of PCB plate.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the structure enlargement diagram of A in Fig. 1.
Reference numeral is：Plate body 10, line layer 12, intercommunicating pore 13, conductive column 20, limit screw hole 201, is led at insulating layer 11
Electric ring 21, insulating ceramics ring 22, insulating bond 221, limited screw 23.
Specific implementation mode
For that can further appreciate that the feature, technological means and the specific purposes reached, function of the utility model, below
The utility model is described in further detail with specific implementation mode in conjunction with attached drawing.
With reference to figure 1, Fig. 2.
The utility model embodiment discloses a kind of High density of PCB harden structure being easy to interconnection, including plate body 10, and plate body 10 wraps
Include several insulating layers 11 being arranged alternately and line layer 12, plate body 10 through there is several intercommunicating pores 13, intercommunicating pore 13 it is a diameter of
R is equipped with conductive column 20 in each intercommunicating pore 13；
The outer wall of conductive column 20 is fixed with several conducting rings 21 being continuously arranged and insulating ceramics ring 22, insulating ceramics ring 22
The heat dissipation performance of High density of PCB plate entirety can be effectively improved, conducting ring 21 and the outer diameter of insulating ceramics ring 22 are R, conductive
A smooth surface is collectively formed in ring 21 and the outer wall of insulating ceramics ring 22, can effectively reduce installation or removal conductive column 20
Resistance, prevent conductive column 20 to be stuck, to effectively improve installation or removal conductive column 20 efficiency, prevent High density of PCB
Plate is damaged, and conducting ring 21 matches setting with line layer 12, and insulating ceramics ring 22 matches setting with insulating layer 11 or line layer 12,
I.e. conducting ring 21 is arranged according to interconnection demand and is interconnected with corresponding line layer 12, outer wall of the conductive column 20 in addition to equipped with conducting ring 21
It is respectively and fixedly provided with insulating ceramics ring 22, insulating ceramics ring 22 is connect with conductive column 20 by insulating bond 221.
Special conductive pillar structure is arranged in the utility model, can flexibly connect different line layers 12, and conductive column knot
Structure is provided with smooth outer surface, can effectively ensure install or remove conductive pillar structure when act it is smooth, easy to operate, to
The efficiency of installation or removal conductive pillar structure is effectively improved, while High density of PCB plate or conductive column 30 can be effectively prevent because of peace
Dress is dismantled and is damaged, so that it is guaranteed that the performance of High density of PCB plate.
To reduce production cost, based on above-described embodiment, conductive column 20 is metal copper post, and copper is common conductive metal,
It conducts electricity very well, and at low cost.
To improve the reliability interconnected between line layer 12, based on any of the above-described embodiment, conducting ring 21 is metallic silver ring,
The resistance of metallic silver is low, perfect heat-dissipating, can further increase the reliability of interconnection structure between line layer 12.
To improve the heat dissipation performance of conductive column 20, it is based on any of the above-described embodiment, insulating bond 221 is heat conductive silica gel
Layer, heat conductive silica gel are high-end heat conduction compounds, have remarkable cold-and-heat resistent alternation performance, ageing-resistant performance and electrical insulating property
Can, have good caking property, heat conductivility better than general resin most metals and nonmetallic materials.
It is set to the stability of High density of PCB plate for raising conductive column 20, is based on any of the above-described embodiment, conductive column 20
Both ends are equipped with limit screw hole 201, and each limit in screw hole 201 is threaded with limited screw 23.
Two surfaces of usual plate body 10 are line layer 12, are based on above-described embodiment, and limited screw 23 is insulating screw,
Insulating screw can effectively prevent the internal wiring of outermost line layer 12 that short circuit occurs.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (6)
1. a kind of High density of PCB harden structure being easy to interconnection, including plate body (10), the plate body (10) includes several is arranged alternately
Insulating layer (11) and line layer (12), which is characterized in that the plate body (10) is through having several intercommunicating pores (13), the connection
A diameter of R in hole (13) is each equipped with conductive column (20) in the intercommunicating pore (13)；
The outer wall of the conductive column (20) is fixed with several conducting rings (21) being continuously arranged and insulating ceramics ring (22), described to lead
The outer diameter of electric ring (21) and the insulating ceramics ring (22) is R, and the conducting ring (21) matches with the line layer (12) to be set
It sets, the insulating ceramics ring (22) matches setting, the insulating ceramics ring with the insulating layer (11) or the line layer (12)
(22) it is connect by insulating bond (221) with the conductive column (20).
2. a kind of High density of PCB harden structure being easy to interconnection according to claim 1, which is characterized in that the conductive column
(20) it is metal copper post.
3. a kind of High density of PCB harden structure being easy to interconnection according to claim 1 or 2, which is characterized in that the conduction
Ring (21) is metallic silver ring.
4. a kind of High density of PCB harden structure being easy to interconnection according to claim 1, which is characterized in that the insulating sticky
It is heat conduction silicone to tie layer (221).
5. a kind of High density of PCB harden structure being easy to interconnection according to claim 1, which is characterized in that the conductive column
(20) both ends are equipped with limit screw hole (201), and limited screw is threaded in each limit screw hole (201)
(23)。
6. a kind of High density of PCB harden structure being easy to interconnection according to claim 5, which is characterized in that the limit spiral shell
Silk (23) is insulating screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820038851.9U CN207720519U (en) | 2018-01-08 | 2018-01-08 | A kind of High density of PCB harden structure being easy to interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820038851.9U CN207720519U (en) | 2018-01-08 | 2018-01-08 | A kind of High density of PCB harden structure being easy to interconnection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207720519U true CN207720519U (en) | 2018-08-10 |
Family
ID=63055288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820038851.9U Expired - Fee Related CN207720519U (en) | 2018-01-08 | 2018-01-08 | A kind of High density of PCB harden structure being easy to interconnection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207720519U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040640A (en) * | 2020-09-16 | 2020-12-04 | 广州深卓信息科技有限公司 | Multilayer PCB circuit board and assembly device thereof |
| WO2022141586A1 (en) * | 2020-12-31 | 2022-07-07 | 华为技术有限公司 | Signal switching structure and hardware-in-loop simulation testing system |
-
2018
- 2018-01-08 CN CN201820038851.9U patent/CN207720519U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040640A (en) * | 2020-09-16 | 2020-12-04 | 广州深卓信息科技有限公司 | Multilayer PCB circuit board and assembly device thereof |
| CN112040640B (en) * | 2020-09-16 | 2021-11-26 | 宁波市国华光电科技有限公司 | Multilayer PCB circuit board and assembly device thereof |
| WO2022141586A1 (en) * | 2020-12-31 | 2022-07-07 | 华为技术有限公司 | Signal switching structure and hardware-in-loop simulation testing system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180810 Termination date: 20210108 |