CN203632962U - Graphene-based conductive ink all-printing printed circuit board - Google Patents
Graphene-based conductive ink all-printing printed circuit board Download PDFInfo
- Publication number
- CN203632962U CN203632962U CN201320431458.3U CN201320431458U CN203632962U CN 203632962 U CN203632962 U CN 203632962U CN 201320431458 U CN201320431458 U CN 201320431458U CN 203632962 U CN203632962 U CN 203632962U
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- Prior art keywords
- graphene
- conductive ink
- circuit board
- printed circuit
- based conductive
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 39
- 238000007639 printing Methods 0.000 title abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 238000007641 inkjet printing Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229920000180 alkyd Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000002699 waste material Substances 0.000 abstract description 4
- 239000010970 precious metal Substances 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 16
- 239000010410 layer Substances 0.000 description 16
- 238000005516 engineering process Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000002113 nanodiamond Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The utility model relates to a Graphene-based conductive ink all-printing printed circuit board, which comprises an insulating substrate, a Graphene-based conductive ink layer and a metal copper layer, and is characterized in that the Graphene-based conductive ink layer is printed on the insulating substrate via an ink jet printing addition method, and the metal copper layer is electroplated on the Graphene-based conductive ink layer. According to the printed circuit board, waste of a large amount of precious metal can be avoided, energy is saved, the production efficiency is improved, and pollution to the environment and emission during the production of the traditional printed circuit board can be reduced.
Description
Technical field
The utility model relates to printed circuit board technology field, relates in particular to a kind of high-performance, graphene-based electrically conductive ink all-print printed circuit board cheaply.
Background technology
Conventional printed circuit board (pcb) is to adopt copper-clad plate as the base material of producing printed circuit board, by techniques such as exposure, development, etchings, on copper-clad plate surface, form circuitous pattern, then etch away a considerable amount of Copper Foils by chemical method and form conductive pattern.This subtractive process technique exists that material consumption is high, production process is many, discharging of waste liquid is large, the environmental protection pressure shortcomings such as heavily.Ink-jet printed addition process, owing to manufacturing fast, the significant advantage such as technique is brief, environmental friendliness, with low cost, diverse in function, is just obtaining emphasis research and development and application rapidly in the electron trade of western developed country.This technology can not only be without mask, non-contactly organic and inorganic functional material is directly printed on to PCB surface, form high-precision conducting wire, conductive pattern, welding resistance and character, welding flux interconnected etc., can also disposable printing and the functional unit such as integrated transistor, electric capacity, resistance, battery, thus the production efficiency of product greatly improved.
Replacing the allprint technology of etching technique making circuit with electrically conductive ink is the developing direction of modern printed circuit manufacturing technology, and allprint is one of key technology of printed electronics, and its key is to prepare high-performance conductive ink.In electrically conductive ink, most important part is nanometer conductive material, and studying at present more is Nano Silver ink, but expensive price is high, is difficult to large-scale industrial production.Therefore, need exploitation can substitute the ink material of Nano Silver, make its electric conductivity close with silver or higher than silver, but cost can significantly reduce.Graphene is a kind of monolayer carbon atomic plane material separating from graphite material, is the two-dimensional structure of carbon, is a kind of " super material ", and its thermal conductivity reaches as high as 5000 W/mK, higher than carbon nano-tube and diamond, and resistivity only approximately 10
-6Ω cm, lower than copper or silver, be the material of the current rate of thermal conductivity maximum resistance in the world minimum.These performance guarantees of Graphene the electrically conductive ink prepared by Graphene in the situation that adding a small amount of Graphene, can reach the similar effect of present widely used Nano Silver ink, and made up the original defect of Nano Silver ink, comprise the weak points such as Nano Silver consumption is large, conductivity reduction.
Summary of the invention
The purpose of this utility model is to provide a kind of graphene-based electrically conductive ink all-print printed circuit board, and this printed circuit board (PCB) has reduced problem of environmental pollution, has reduced the loss of a large amount of copper, and then reduces production cost.
For achieving the above object, the utility model is achieved through the following technical solutions:
A kind of graphene-based electrically conductive ink all-print printed circuit board, is made up of insulated substrate, graphene-based conductive ink layer and metal copper layer.It is characterized in that, described graphene-based conductive ink layer is to be printed on above insulated substrate by inkjet printing addition process, and described metal copper layer is to electroplate on graphene-based conductive ink layer.
The graphene-based electrically conductive ink all-print printed circuit board of one described in the utility model, described insulated substrate is the insulated substrate that nothing is covered epoxy, polyurethane or the alkyd resins material of Copper Foil.
The graphene-based electrically conductive ink all-print printed circuit board of one described in the utility model, described metal copper layer thickness is 35-200 μ m.
Compared with prior art, the beneficial effects of the utility model are:
By adopting inkjet printing addition process to be printed on the graphene-based conductive ink layer on insulated substrate, and on graphene-based conductive ink layer plated metal copper layer, this printed circuit board (PCB) reduces printed board production process, avoid the series of processes such as dry film, development, etching in traditional lithographic method, reduce production costs, reduce power consumption, do not produce the three wastes, have more high flexibility; And can, it being solidified lower than 200 ℃, can be used in thermally sensitive material and maybe cannot weld etc. on material.Simultaneously, graphene-based electrically conductive ink used, in the situation that adding a small amount of Graphene, can reach the similar effect of present widely used Nano Silver ink, and made up the original defect of Nano Silver ink, comprise the weak points such as Nano Silver consumption is large, conductivity reduction.
Accompanying drawing explanation
Fig. 1 is the part section enlarged diagram of the graphene-based electrically conductive ink all-print printed circuit board of the utility model.
Label declaration:
1. graphene-based conductive ink layer 3. metal copper layer of insulated substrate 2..
Embodiment
Referring to shown in Fig. 1, is graphene-based electrically conductive ink all-print printed circuit board of the present utility model, and it comprises insulated substrate 1, graphene-based conductive ink layer 2, metal copper layer 3.Described metal copper layer 3 is to electroplate on electrically conductive ink 2, and described graphene-based conductive ink layer 2 is printed on insulated substrate 1 by inkjet printing addition process.In the utility model: described insulated substrate is the insulated substrate that nothing is covered epoxy, polyurethane or the alkyd resins material of Copper Foil; Described graphene-based conductive ink layer is compared Nano Silver ink, has the following advantages:
One, electric conductivity is better, and the resistivity of Graphene only has an appointment 10
-6Ω cm, lower than silver, be the current material of resistivity minimum in the world.
Two, high temperature resistant: the fusing point of Graphene, up to 3850 ℃, can not decline along with sintering temperature difference causes conductivity.
Graphene-based electrically conductive ink all-print printed circuit board described in the utility model is the super-low resistivity that utilizes this grapheme material, the advantage such as lightweight, high temperature resistant, provides a kind of easy to use conducting electricity very well simple in structure to be applicable to the one side of various microelectronics, communication and portable type electronic product, the printed circuit board (PCB) of two-sided, multilayer.This printed circuit board (PCB) reduces printed board production process, has avoided in traditional lithographic method the series of processes such as dry film, development, etching, reduces production costs, and reduces power consumption, does not produce the three wastes, has more high flexibility; Simultaneously, graphene-based electrically conductive ink used is in the situation that adding a small amount of Graphene, can reach the similar effect of present widely used Nano Silver ink, and make up the original defect of Nano Silver ink, comprise the weak points such as Nano Silver consumption is large, conductivity reduction.
The foregoing is only preferred embodiment of the present utility model, be not restricted to the utility model, all how revising, being equal to of doing within spirit of the present utility model and principle are replaced and are improved, within all should being included in protection range of the present utility model.
Claims (3)
1. a graphene-based electrically conductive ink all-print printed circuit board, formed by insulated substrate, graphene-based conductive ink layer and metal copper layer, it is characterized in that, described graphene-based conductive ink layer is to be printed on above insulated substrate by inkjet printing addition process, and described metal copper layer is to electroplate on graphene-based conductive ink layer.
2. the graphene-based electrically conductive ink all-print printed circuit board of one according to claim 1, is characterized in that, described insulated substrate is the insulated substrate that nothing is covered epoxy, polyurethane or the alkyd resins material of Copper Foil.
3. the graphene-based electrically conductive ink all-print printed circuit board of one according to claim 1, is characterized in that, described metal copper layer thickness is 35-200 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320431458.3U CN203632962U (en) | 2013-07-19 | 2013-07-19 | Graphene-based conductive ink all-printing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320431458.3U CN203632962U (en) | 2013-07-19 | 2013-07-19 | Graphene-based conductive ink all-printing printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN203632962U true CN203632962U (en) | 2014-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320431458.3U Expired - Fee Related CN203632962U (en) | 2013-07-19 | 2013-07-19 | Graphene-based conductive ink all-printing printed circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472881A (en) * | 2015-12-08 | 2016-04-06 | 南通金源智能技术有限公司 | 3D printed graphene circuit board |
| CN105472899A (en) * | 2015-12-08 | 2016-04-06 | 南通金源智能技术有限公司 | Manufacturing method for graphene printed circuit board |
| CN106973517A (en) * | 2017-05-10 | 2017-07-21 | 山东金宝科创股份有限公司 | A kind of method that utilization addition process prepares circuit board |
| CN108099358A (en) * | 2017-12-28 | 2018-06-01 | 广州云普电子科技有限公司 | A kind of copper-clad plate processing method that can improve electric property |
| WO2018185759A1 (en) * | 2017-04-03 | 2018-10-11 | Creative Ic3D Ltd | Process for producing three dimensional structures |
| CN111031664A (en) * | 2018-10-10 | 2020-04-17 | Bgt材料有限公司 | Flexible circuit board and manufacturing method thereof |
| CN111050496A (en) * | 2019-03-28 | 2020-04-21 | 苏州经纬通电子科技有限公司 | Circuit board preparation process |
-
2013
- 2013-07-19 CN CN201320431458.3U patent/CN203632962U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472881A (en) * | 2015-12-08 | 2016-04-06 | 南通金源智能技术有限公司 | 3D printed graphene circuit board |
| CN105472899A (en) * | 2015-12-08 | 2016-04-06 | 南通金源智能技术有限公司 | Manufacturing method for graphene printed circuit board |
| WO2018185759A1 (en) * | 2017-04-03 | 2018-10-11 | Creative Ic3D Ltd | Process for producing three dimensional structures |
| US11305488B2 (en) | 2017-04-03 | 2022-04-19 | Creative Ic3D Ltd. | Process for producing three dimensional structures |
| CN106973517A (en) * | 2017-05-10 | 2017-07-21 | 山东金宝科创股份有限公司 | A kind of method that utilization addition process prepares circuit board |
| CN108099358A (en) * | 2017-12-28 | 2018-06-01 | 广州云普电子科技有限公司 | A kind of copper-clad plate processing method that can improve electric property |
| CN108099358B (en) * | 2017-12-28 | 2020-11-24 | 广州云普电子科技有限公司 | Copper-clad plate processing method capable of improving electrical performance |
| CN111031664A (en) * | 2018-10-10 | 2020-04-17 | Bgt材料有限公司 | Flexible circuit board and manufacturing method thereof |
| CN111050496A (en) * | 2019-03-28 | 2020-04-21 | 苏州经纬通电子科技有限公司 | Circuit board preparation process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140604 Termination date: 20180719 |