CN105472899A - Manufacturing method for graphene printed circuit board - Google Patents
Manufacturing method for graphene printed circuit board Download PDFInfo
- Publication number
- CN105472899A CN105472899A CN201510894592.0A CN201510894592A CN105472899A CN 105472899 A CN105472899 A CN 105472899A CN 201510894592 A CN201510894592 A CN 201510894592A CN 105472899 A CN105472899 A CN 105472899A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- graphene
- circuit board
- pcb
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
Abstract
The invention discloses a manufacturing method for a graphene printed circuit board. According to the method, the graphene printed circuit board is obtained through the processes of coating a prefabricated template with a graphene conductive coating (paste) in a blade-coating manner, drying, hardening and the like on an aluminum substrate treated with an insulation layer. The graphene printed circuit board manufactured with the method has the advantages of simple and convenient preparation process, little pollution, environmental friendliness, high bonding strength of a graphene printed circuit and a substrate, and the like, and has wide application prospects in the fields of high-power LED substrate preparation, flat-panel displays, solar cell panels and the like.
Description
Technical field
The present invention relates to the preparation method of printed circuit, be specially a kind of Graphene printed circuit board (PCB) preparation method.
Background technology
The invention of printed circuit board (PCB) and development always with and promote the development of information industry.Traditional printed circuit board (PCB) is covering on copper insulated substrate, prepared by techniques such as press mold, exposure, development, etching, striping, flushings, whole preparation technology's long flow path and complexity, requires high to equipment etc.Because the cost of copper is high, cause the price of copper printed circuit board (PCB) also higher, meanwhile, the recovery of a large amount of copper-containing etching waste solutions produced in Copper Foil etching process and process are also the key factors increasing production cost and cause latency environment to pollute.Along with the raising day by day that development and the energy-conserving and environment-protective of information industry require, the demand of high connductivity, low cost, low environmental impact printed circuit board (PCB) is gone up day by day.
Graphene is as new carbon, and the two-dimension nano materials only with 1 atomic layer level thickness be made up of with sp2 hybridized orbit carbon atom, its room temperature resistivity is 10
-6Ω cm, the argent minimum than resistivity during room temperature is also low, and the current density patience of Graphene is good, reaches 0.2 × 10
9a/cm
2(being 100 times of copper).Therefore, Graphene possesses the great potential replacing copper as wire in printed circuit board (PCB).As patent of invention CN104194455A and CN103895139A individually discloses the method adopting the method applying and spray of Graphene coating to prepare grapheme conductive film, but these methods only relate to the preparation of simple grapheme conductive film.
Because Graphene is in the starting stage as the research of electric conducting material, at present, be only limitted to the preparation of conductive film more than the research of open source information, the research of the Graphene printed circuit board (PCB) needed for information industry is not yet related to.
Summary of the invention
For the blank that current Graphene exists in printed circuit board (PCB) preparation field, for expanding the application of grapheme material in printed circuit board (PCB) preparation field, Development of New Generation high-performance, low cost Graphene printed circuit board (PCB), the invention provides a kind of preparation method of Graphene printed circuit board (PCB).
For achieving the above object, be achieved through the following technical solutions, its step is as follows:
(1) spread printed circuit template in the insulating barrier side through insulating barrier process aluminium base, conductive graphene coating (cream) is bitten after on aluminium base through printed circuit template, removes printed circuit template;
(2) by step 1) in the aluminium base of the band conductive graphene coating (cream) obtained insert in the heating furnace of inert atmosphere, keep the time of setting in the temperature of setting, after cooling, Graphene printed circuit board (PCB) can be obtained.
Preferably, the inert atmosphere in heating furnace is nitrogen.
Preferably, the aluminium base of band conductive graphene coating (cream) is in heating furnace, and the heating-up temperature of setting is 50 ~ 150 DEG C, and the heating time of setting is 0.5 ~ 12h.
With immediate prior art ratio, the preparation method of Graphene printed circuit board (PCB) provided by the invention takes full advantage of the high conduction performance of Graphene, overcome the deficiencies such as existing copper printed circuit board (PCB) preparation flow complexity simultaneously, whole preparation process equipment and environmental requirement is low, technological process is simple, low cost of manufacture, environmental pollution are little, has the field of demand to have wide development prospect at great power LED, flat-panel monitor, solar panel etc. to high connductivity, low cost printed circuit board (PCB).
Accompanying drawing illustrates:
Fig. 1 is Graphene printed circuit board (PCB) sectional structure chart.
Embodiment
Below in conjunction with accompanying drawing embodiment, be clearly and completely described technical scheme of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment 1:
Preparation process:
1) spread printed circuit template in the insulating barrier side through insulating barrier process aluminium base, conductive graphene coating (cream) is bitten after on aluminium base through printed circuit template, removes printed circuit template; (as shown in Figure 1)
2) by step 1) in the aluminium base of the band conductive graphene coating (cream) obtained insert in the heating furnace of nitrogen atmosphere, heating-up temperature is 50 DEG C, and heating time is 12h, namely obtains Graphene printed circuit board (PCB) after cooling.
The Graphene printed circuit board (PCB) obtained, the adhesive force grade of its Graphene printed circuit on aluminium base is 0 grade.
Embodiment 2:
Preparation process:
1) spread printed circuit template in the insulating barrier side through insulating barrier process aluminium base, conductive graphene coating (cream) is bitten after on aluminium base through printed circuit template, removes printed circuit template; (as shown in Figure 1)
2) by step 1) in the aluminium base of the band conductive graphene coating (cream) obtained insert in the heating furnace of nitrogen atmosphere, heating-up temperature is 80 DEG C, and heating time is 10h, namely obtains Graphene printed circuit board (PCB) after cooling.
The Graphene printed circuit board (PCB) obtained, the adhesive force grade of its Graphene printed circuit on aluminium base is 0 ~ 1 grade.
Embodiment 3:
Preparation process:
1) spread printed circuit template in the insulating barrier side through insulating barrier process aluminium base, conductive graphene coating (cream) is bitten after on aluminium base through printed circuit template, removes printed circuit template; (as shown in Figure 1)
2) by step 1) in the aluminium base of the band conductive graphene coating (cream) obtained insert in the heating furnace of nitrogen atmosphere, heating-up temperature is 150 DEG C, and heating time is 0.5h, namely obtains Graphene printed circuit board (PCB) after cooling.
The Graphene printed circuit board (PCB) obtained, the adhesive force grade of its Graphene printed circuit on aluminium base is 1 grade.
Embodiment 4:
Preparation process:
1) spread printed circuit template in the insulating barrier side through insulating barrier process aluminium base, conductive graphene coating (cream) is bitten after on aluminium base through printed circuit template, removes printed circuit template; (as shown in Figure 1)
2) by step 1) in the aluminium base of the band conductive graphene coating (cream) obtained insert in the heating furnace of nitrogen atmosphere, heating-up temperature is 110 DEG C, and heating time is 2h, can obtain Graphene printed circuit board (PCB) after cooling.
The Graphene printed circuit board (PCB) obtained, the adhesive force grade of its Graphene printed circuit on aluminium base is 1 grade.
Above embodiment is only in order to illustrate that technical scheme of the present invention is not intended to limit; those of ordinary skill in the field are to be understood that; can modify to the specific embodiment of the present invention with reference to above-described embodiment or equivalent to replace, these do not depart from any amendment of spirit and scope of the invention or equivalently to replace within the claims that all awaits the reply in application.
Claims (3)
1. a preparation method for Graphene printed circuit board (PCB), is characterized in that, described preparation method comprises following steps:
(1) printed circuit template is spread in the aluminium-base plate insulating layer side after insulating barrier process, is bitten after on aluminium base by conductive graphene coating, remove master die through printed circuit template;
(2) aluminium base of the band conductive graphene coating obtained in described step (1) is inserted in the heating furnace of inert atmosphere, keep the time of setting in the temperature of setting, after cooling, Graphene printed circuit board (PCB) can be obtained.
2. the preparation method of Graphene printed circuit board (PCB) according to claim 1, is characterized in that, described inert atmosphere is nitrogen.
3. the preparation method of Graphene printed circuit board (PCB) according to claim 1, is characterized in that, in described step (2), the heating-up temperature of setting is 50 ~ 150 DEG C, and the time is 0.5 ~ 12h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510894592.0A CN105472899A (en) | 2015-12-08 | 2015-12-08 | Manufacturing method for graphene printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510894592.0A CN105472899A (en) | 2015-12-08 | 2015-12-08 | Manufacturing method for graphene printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105472899A true CN105472899A (en) | 2016-04-06 |
Family
ID=55610020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510894592.0A Pending CN105472899A (en) | 2015-12-08 | 2015-12-08 | Manufacturing method for graphene printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105472899A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106954348A (en) * | 2017-05-10 | 2017-07-14 | 山东金宝科创股份有限公司 | A kind of method that utilization impact system prepares graphene wiring board |
| CN106973517A (en) * | 2017-05-10 | 2017-07-21 | 山东金宝科创股份有限公司 | A kind of method that utilization addition process prepares circuit board |
| CN110519931A (en) * | 2019-08-28 | 2019-11-29 | 内蒙古民族大学 | A kind of production method of circuit board |
| CN111613709A (en) * | 2020-05-27 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | Mini light-emitting diode backlight module, manufacturing method thereof and display device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090050359A1 (en) * | 2007-08-23 | 2009-02-26 | Phoenix Precision Technology Corporation | Circuit board having electrically connecting structure and fabrication method thereof |
| CN102612269A (en) * | 2012-04-01 | 2012-07-25 | 鞍山市正发电路有限公司 | All-printed circuit board |
| CN102842354A (en) * | 2011-06-20 | 2012-12-26 | 中国科学院上海硅酸盐研究所 | Graphene-based back electrode material with three-dimensional network structure and preparation method thereof |
| CN203632962U (en) * | 2013-07-19 | 2014-06-04 | 上海悦达墨特瑞新材料科技有限公司 | Graphene-based conductive ink all-printing printed circuit board |
| CN104292984A (en) * | 2013-07-16 | 2015-01-21 | 安炬科技股份有限公司 | Graphene ink and method for manufacturing graphene circuit |
-
2015
- 2015-12-08 CN CN201510894592.0A patent/CN105472899A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090050359A1 (en) * | 2007-08-23 | 2009-02-26 | Phoenix Precision Technology Corporation | Circuit board having electrically connecting structure and fabrication method thereof |
| CN102842354A (en) * | 2011-06-20 | 2012-12-26 | 中国科学院上海硅酸盐研究所 | Graphene-based back electrode material with three-dimensional network structure and preparation method thereof |
| CN102612269A (en) * | 2012-04-01 | 2012-07-25 | 鞍山市正发电路有限公司 | All-printed circuit board |
| CN104292984A (en) * | 2013-07-16 | 2015-01-21 | 安炬科技股份有限公司 | Graphene ink and method for manufacturing graphene circuit |
| CN203632962U (en) * | 2013-07-19 | 2014-06-04 | 上海悦达墨特瑞新材料科技有限公司 | Graphene-based conductive ink all-printing printed circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106954348A (en) * | 2017-05-10 | 2017-07-14 | 山东金宝科创股份有限公司 | A kind of method that utilization impact system prepares graphene wiring board |
| CN106973517A (en) * | 2017-05-10 | 2017-07-21 | 山东金宝科创股份有限公司 | A kind of method that utilization addition process prepares circuit board |
| CN110519931A (en) * | 2019-08-28 | 2019-11-29 | 内蒙古民族大学 | A kind of production method of circuit board |
| CN111613709A (en) * | 2020-05-27 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | Mini light-emitting diode backlight module, manufacturing method thereof and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105472899A (en) | Manufacturing method for graphene printed circuit board | |
| CN105489388A (en) | Lithium-ion capacitor electrode and preparation method thereof | |
| KR20140008607A (en) | Method using sacrificial substrate for manufacturing flexible substrate with buried metal trace and flexible substrate manufactured thereby | |
| CN204897813U (en) | Heat dissipation sticky tape | |
| CN103429011A (en) | Conduction process method of substrate | |
| CN104617213B (en) | A kind of method that aluminium nitride film is generated on aluminium sheet | |
| CN105592578A (en) | Flexible fit-type nanometer electric heating film | |
| CN202931664U (en) | Double-faced aluminium circuit board with ultrahigh heat conductivity | |
| CN102740591A (en) | Double-sided aluminum base circuit board with super-high thermal conductivity and preparation method thereof | |
| CN104064336B (en) | graphite coil planar pulse transformer | |
| CN101711090A (en) | Method for manufacturing double-sided hollow flexible circuit board | |
| CN106119795A (en) | Utilize the method that vacuum magnetron sputtering coating film technology prepares lithium battery C Si negative pole coating | |
| CN204497951U (en) | A kind of small power module power source | |
| CN202178915U (en) | Blind hole double-face heat conducting circuit board | |
| CN104451818A (en) | Insulating metal plate and preparation method thereof | |
| CN107645839A (en) | A kind of preparation method of thermoelectricity separate circuit boards | |
| CN101298675B (en) | Manufacturing method of insulation heat-conducting metal substrate | |
| CN211588036U (en) | Self-adhesion copper foil instrument that flattens | |
| CN106449890A (en) | Preparation method for solar photovoltaic welding strip | |
| CN101777621A (en) | High-heat-conductivity basal plate used for packaging high-power LED and preparation method | |
| CN206775816U (en) | A kind of insulating radiation plastic circuit board | |
| CN104470226A (en) | Circuit board manufacturing method | |
| CN204482159U (en) | A kind of Novel aluminum base plate | |
| CN105462447A (en) | Graphene conductive coating and preparation method thereof | |
| CN105280741A (en) | Solar cell module welding strip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160406 |
|
| RJ01 | Rejection of invention patent application after publication |