CN104470226A - Circuit board manufacturing method - Google Patents
Circuit board manufacturing method Download PDFInfo
- Publication number
- CN104470226A CN104470226A CN201410731188.7A CN201410731188A CN104470226A CN 104470226 A CN104470226 A CN 104470226A CN 201410731188 A CN201410731188 A CN 201410731188A CN 104470226 A CN104470226 A CN 104470226A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- circuit board
- copper foil
- foil layer
- resin flake
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention relates to the field of PCB manufacturing, in particular to a circuit board manufacturing method. The method comprises the steps of (1) conducting microetching on the surface of a metal heat dissipation substrate, and spraying carbon powder onto one surface of the metal heat dissipation substrate; (2) attaching the surface, sprayed with the carbon powder, of the metal heat dissipation substrate to a resin flake in an aligned mode; (3) attaching a copper foil layer to the resin flake correspondingly; (4) arranging steel plates on the two sides of the sequentially attached copper foil layer, resin flake and metal heat dissipation substrate and placing the whole piece into a hot press for hot-pressing fixation; (5) manufacturing a required circuit on the copper foil layer through etching. A circuit board obtained with the method is good in heat dissipation effect, requirements for heat dissipation of a high-density circuit product are met, and the quality of the finished board is reliable.
Description
Technical field
The present invention relates to PCB and manufacture field, be specifically related to a kind of method for manufacturing circuit board with good heat radiating function.
Background technology
Along with electronic product is day by day to miniaturized, integrated direction development, the power density of printed wiring board is also increasing, makes heat radiation become a great problem.In wiring board manufacturing, define a kind of wiring board with good heat radiating function, it adopts metal composite substrate and PP sheet, Copper Foil, steel plate pressing to make, this wiring board relies on the thermal conductive resin of metal composite substrate to realize heat radiation, is applicable to the wiring board demand occasion that the little circuit of volume is intensive.But in this wiring board processing procedure, often in conjunction with bad, often there is the phenomenon of plate bursting or layering in metal composite substrate and the pressing of PP sheet, and not satisfactory for the local radiating effect that cooling requirements is high in subsequent production.
Summary of the invention
For the problems referred to above, the object of this invention is to provide a kind of method for manufacturing circuit board effectively avoiding the problems referred to above.
For solving the problem, the technical scheme that the present invention takes is: a kind of method for manufacturing circuit board, comprises the following steps:
(1) heat dissipation metal substrate surface is carried out microetch process, then at heat dissipation metal substrate one surface spraying carbon dust;
(2) the heat dissipation metal substrate surface and resin flake contraposition that are coated with carbon dust are fitted;
(3) corresponding laminating copper foil layer on resin flake;
(4) copper foil layer contraposition successively posted, resin flake, heat dissipation metal substrate both sides arrange steel plate and put into hot press hot pressing and fix;
(5) required circuit is produced by etching mode at copper foil layer.
Concrete, adopt metal aluminum sheet in step (1).
Concrete, microetch process described in step (1) be specially adopt concentration be the hydrochloric acid solution of 3 g/l to metal composite substrate surface spraying 10-12 minute, spray pressure is 1.0-1.5kg/cm
2.
Preferably, the peracetic acid soln that concentration is 5-8% is added in described hydrochloric acid solution.
Preferred, spray described in step (1) and carry out in sealed vacuum environment.
Method for manufacturing circuit board of the present invention adopts Copper Foil to add on the basis of resin sheet making substrate in tradition, increase metal substrate as radiator, and metal substrate and resin sheet are fitted, Copper Foil of fitting on resin sheet again makes circuit, before metal composite substrate and resin sheet are fitted, first process is carried out to metallic substrate surfaces and make it increase heat dispersion and can be combined well with resin sheet; Method for manufacturing circuit board cost of the present invention is low, effective.
Embodiment
For the ease of the understanding of those skilled in the art, below the present invention is further described in detail.
Method for manufacturing circuit board described in the present invention adopts the good metal substrate of heat dispersion as a part for circuit board substrate, generally selects aluminium sheet, Copper Foil of fitting thereon, then on Copper Foil printed wire.
In order to strengthen the heat dispersion of aluminium sheet, surface of aluminum plate is carried out microetch process, and the surface of aluminum plate spraying carbon dust processed, the fine particle of carbon dust is made to embed surface of aluminum plate after microetch, to fit successively on this surface again PP resin sheet and Copper Foil, three is put into hot press high-temperature laminating in the usual way.Finally produce required circuit at copper foil layer and form wiring board.
Surface of aluminum plate is through microetch process, and its surface forms scraggly sunken hole, not only can hold carbon powder particle, be conducive to the combination with PP sheet simultaneously.In addition, the heat conductivility of carbon is good, after being combined, can assist the heat conduction between PP resin sheet and aluminium sheet with aluminium sheet, strengthens the heat dispersion of wiring board.The scraggly sunken hole that another surface of aluminium sheet is formed is equivalent to some small radiating fins, adds area of dissipation.
The process of surface of aluminum plate microetch adopt concentration be the hydrochloric acid solution of 3 g/l to metal composite substrate surface spraying 10-12 minute, spray pressure is 1.0-1.5kg/cm
2.Also can add the peracetic acid soln that concentration is 5-8% in hydrochloric acid solution, peracetic acid soln has the effect strengthening oxidation, to improve microetch effect.The proportioning of two kinds of solution is 1:1.Described spray carries out in sealed vacuum environment.
Before microetch process, after process, all can carry out clean to surface of aluminum plate, the general clear water that adopts rinses.
In practical operation, regulate concentration of hydrochloric acid and peracetic acid soln concentration, the effect of the Parameter adjustable such as spray pressure and spray time joint surface of aluminum plate microetch, carries out under general normal temperature, preferably above state modulator.
The part of concrete introduction in the present invention and operation, all can adopt this area common method.
Above-described embodiment is only the preferably execution mode of the method for the invention, and in addition, the present invention can also have other implementations.That is, under the prerequisite not departing from the present invention's design, any apparent replacement and minor variations all should fall within protection scope of the present invention.
Claims (5)
1. a method for manufacturing circuit board, comprises the following steps:
Heat dissipation metal substrate surface is carried out microetch process, then at heat dissipation metal substrate one surface spraying carbon dust;
The heat dissipation metal substrate surface and resin flake contraposition that are coated with carbon dust are fitted;
Corresponding laminating copper foil layer on resin flake;
Copper foil layer contraposition successively posted, resin flake, heat dissipation metal substrate both sides arrange steel plate and put into hot press hot pressing and fix;
Required circuit is produced at copper foil layer by etching mode.
2. method for manufacturing circuit board according to claim 1, is characterized in that: adopt metal aluminum sheet in step (1).
3. method for manufacturing circuit board according to claim 1, it is characterized in that: microetch process described in step (1) is specially the aluminium matter surface spraying 10-12 minute of hydrochloric acid solution to metal composite substrate that employing concentration is 3 g/l, and spray pressure is 1.0-1.5kg/cm
2.
4. method for manufacturing circuit board according to claim 3, is characterized in that: add the peracetic acid soln that concentration is 5-8% in described hydrochloric acid solution.
5. method for manufacturing circuit board according to claim 4, is characterized in that: spray described in step (1) and carry out in sealed vacuum environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410731188.7A CN104470226A (en) | 2014-12-05 | 2014-12-05 | Circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410731188.7A CN104470226A (en) | 2014-12-05 | 2014-12-05 | Circuit board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104470226A true CN104470226A (en) | 2015-03-25 |
Family
ID=52915366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410731188.7A Withdrawn CN104470226A (en) | 2014-12-05 | 2014-12-05 | Circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104470226A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304504A (en) * | 2015-09-21 | 2016-02-03 | 杰群电子科技（东莞）有限公司 | Manufacturing method for substrate used for semiconductor device |
| CN106113803A (en) * | 2016-06-16 | 2016-11-16 | 常州市超顺电子技术有限公司 | A kind of aluminum-based copper-clad plate and application thereof and preparation method |
-
2014
- 2014-12-05 CN CN201410731188.7A patent/CN104470226A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304504A (en) * | 2015-09-21 | 2016-02-03 | 杰群电子科技（东莞）有限公司 | Manufacturing method for substrate used for semiconductor device |
| CN106113803A (en) * | 2016-06-16 | 2016-11-16 | 常州市超顺电子技术有限公司 | A kind of aluminum-based copper-clad plate and application thereof and preparation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20150325 |
|
| WW01 | Invention patent application withdrawn after publication |