CN105576357A - NFC antenna integrated on ferrite and preparation method thereof - Google Patents
NFC antenna integrated on ferrite and preparation method thereof Download PDFInfo
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- CN105576357A CN105576357A CN201410535238.4A CN201410535238A CN105576357A CN 105576357 A CN105576357 A CN 105576357A CN 201410535238 A CN201410535238 A CN 201410535238A CN 105576357 A CN105576357 A CN 105576357A
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Abstract
The invention discloses an NFC antenna integrated on ferrite and a preparation method thereof. Through drilling on the ferrite, the front surface and the back surface of the ferrite are communicated. Then catalyzed ink printing and copper electroplating are performed on the front surface and the back surface of the ferrite, and solder mask is printed for protecting a line. Because NFC is directly implanted on the ferrite, production efficiency is greatly improved and an efficiency advantage is realized. Furthermore a traditional flexible circuit board manufacturing process and a ferrite adhesion process are saved, thereby realizing a cost advantage. Furthermore smaller thickness of an NFC product can be realized, thereby further reducing the mechanism space of a client and obtaining smaller thickness of the product.
Description
Technical field
The invention belongs to antenna preparation technology, be specifically related to a kind of integrated NFC antenna on the ferrite and preparation method thereof.
Background technology
NFC antenna is used for launching or receiving electromagnetic parts in wireless device, and it changes the guided wave of transmission above-the-line promotion the electromagnetic wave propagated in unbounded medium (normally free space) into, or carry out contrary conversion.The engineering systems such as radio communication, broadcast, TV, radar, navigation, electronic countermeasures, remote sensing, radio astronomy, every electromagnetic wave that utilizes carrys out transmission of information, all relies on antenna to carry out work.In addition, transmitting in energy with electromagnetic wave, the energy emission of non-signal also needs antenna.
Refer to shown in Fig. 1, antenna is generally made up of the Ferrite Material of wiring board and antijamming capability, traditional NFC antenna manufacture method adopts wiring board and ferrite substrate processing and fabricating respectively usually, wherein need to pass through a series of manufacturing procedures such as boring-black holes-copper facing-pad pasting-exposure-development-etching-striping-printing-gold-plated shaping for wiring board, and then be combined into module together in shaping ferrite substrate, the defects such as therefore there is the process-cycle long, thickness is thicker, and production efficiency is lower.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of integrated NFC antenna on the ferrite and preparation method thereof, directly can implant NFC on the ferrite, simplifies operation, enhances productivity, and reduces product thickness.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme:
On the one hand, a kind of integrated NFC antenna on the ferrite, it comprises the first copper electroplating layer from top to bottom successively, first catalyzed oil layer of ink, ferrite layer, second catalyzed oil layer of ink, second copper electroplating layer, solder mask layer, layers of two-sided, and several longitudinal hole also offered by antenna, longitudinal hole upper end open is in the first copper electroplating layer upper surface, lower end is to solder mask layer upper surface, and longitudinal hole both sides laterally comprise the 3rd copper electroplating layer and the 3rd catalyzed oil layer of ink from outside to inside all successively, and the 3rd copper electroplating layer and first, second copper electroplating layer is connected, 3rd catalyzed oil layer of ink and first, second catalyzed oil layer of ink is connected.
The thickness of described ferrite layer is 80 ~ 200 μm, the thickness of the first catalyzed oil layer of ink is 4 ~ 10 μm, the thickness of the first copper electroplating layer is 2 ~ 35 μm, the thickness of solder mask layer is 10 ~ 20 μm, the thickness of the second catalyzed oil layer of ink is 4 ~ 10 μm, the thickness of the second copper electroplating layer is 2 ~ 35 μm, and the thickness of the 3rd copper electroplating layer is 2 ~ 35 μm, and the thickness of the 3rd catalyzed oil layer of ink is 4 ~ 10 μm.
The diameter of described longitudinal hole is 0.3 ~ 0.5mm.
On the other hand, a kind of preparation method of integrated NFC antenna on the ferrite, holes on the ferrite and makes its positive and negative through; Then on ferrite positive and negative, print catalytic ink respectively, and make also to be coated with catalytic ink in boring; Carry out electro-coppering again, make the catalytic ink in tow sides and boring is all coated with copper facing; And then in the copper facing of reverse side solder-mask printing ink; Finally sticking two-faced adhesive tape on anti-solder ink.
The controling parameters of described boring is as follows: feed number is 0.8 ~ 0.9 m/min, withdrawing number is 10 ~ 11 ms/min, drilling speed is 4 ~ 50,000 revs/min, and bore diameter is 0.3 ~ 0.5mm, and boring before need pad below ferrite establish sheeting caps, above stacked aluminium flake.
Described printing catalytic ink parameter is as follows: catalytic ink mixing time is 20 ~ 30min, ink viscosity is 200 ~ 260/dPa.s, scraper angle is 60 ~ 70 °, and machine scales is 20 ~ 30 °, is 4 ~ 6mm from version height, scraper pressure is 4 ~ 6Kg, scraper speed is 160 ~ 260mm/s, and mesh is 300 orders, and thickness is 8 ~ 12 μm, print thickness is 4 ~ 10 μm, and after printing, baking-curing is 120 DEG C, 100 minutes.
Described electro-coppering parameter is as follows: the solution composition that electro-coppering adopts comprises cupric sulfate pentahydrate 200 ~ 250g/l, sulfuric acid 30 ~ 40ml/l, chloride ion 60 ~ 80mg/l, high speed brightening agent for acid copper electroplating 1 ~ 3mg/l, the sour copper of high speed fill and lead up agent 3 ~ 7mg/l, current density is 20ASD, electroplating time is 15min, electroplating temperature is 40 ~ 50 DEG C, baking 80 DEG C, 60 minutes after plating.
Described solder-mask printing Ink parameters is as follows: anti-solder ink mixing time is 20 ~ 30min, ink viscosity is 180 ~ 220/dPa.s, scraper angle is 60 ~ 70 °, and machine scales is 20 ~ 30 °, is 6 ~ 8mm from version height, scraper pressure is 4 ~ 6Kg, scraper speed is 80 ~ 150mm/s, and mesh is 200 orders, and thickness is 10 ~ 15 μm, print thickness is 10 ~ 20 μm, and after printing, baking-curing is 120 DEG C, 60 minutes.
Described electrogilding step comprises: pickling, microetch, activation, nickel plating, gold-plated, and gold plating thickness is at 0.1 ~ 0.3 μm, and nickel plating thickness is 2 ~ 6 μm.
Described pickling adopts the sulfamic acid of 2 ~ 4%, and pickling temperature is room temperature; Described micro-corrosion liquid composition comprises the sulfuric acid of 50 ~ 90g/l, persulfuric acid receives 40 ~ 60g/l, copper ion≤25g/l, and microetch temperature is room temperature; The sulfamic acid of described activation employing 1 ~ 3%, activation temperature is room temperature; The plating solution that described nickel plating adopts comprises nickel sulfamic acid 380 ~ 430g/l, nickel chloride 8 ~ 12g/l, boric acid 30 ~ 40g/l, additive 1 ~ 3ml/l, wetting agent 0.5 ~ 1.5ml/l, plating solution pH value is 3.8 ~ 4.2, current density is 2ASD, plating time is 6min, and nickel plating temperature is 50 ~ 60 DEG C; Described gold-plated plating solution comprises gold 0.5 ~ 2g/l, cobalt 0.2 ~ 0.6g/l, and plating solution pH value is 4 ~ 4.6, and current density is 1ASD, and gold-plated temperature is 40 ~ 50 DEG C, and the gold-plated time is 2min.
Described additive is asccharin, and wetting agent is dodecyl sodium sulfate.
Adopt technique scheme, this on the ferrite integrated NFC antenna and preparation method thereof has following advantage:
1, directly implant NFC on the ferrite, production efficiency is greatly improved, and has odds for effectiveness;
2, eliminate the making of traditional adagio and ferritic bonding process, there is cost advantage;
That 3, the product of NFC can be done is thinner, saves the mechanism space of client further, and what product was become is more slim.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail:
Fig. 1 is the FB(flow block) of the preparation method of the NFC antenna of prior art;
Fig. 2 is the structure chart of integrated NFC antenna on the ferrite of the present invention;
Fig. 3 is the FB(flow block) of the preparation method of integrated NFC antenna on the ferrite of the present invention.
Embodiment
Integrated NFC antenna on the ferrite of the present invention as shown in Figure 1, it comprises the first copper electroplating layer 1 from top to bottom successively, first catalyzed oil layer of ink 2, ferrite layer 3, second catalyzed oil layer of ink 4, second copper electroplating layer 5, solder mask layer 6, layers of two-sided 7, and antenna is also offered several longitudinal hole 8, longitudinal hole 8 upper end open is in the first copper electroplating layer 1 upper surface, lower end is to solder mask layer 6 upper surface, and longitudinal hole 8 both sides laterally comprise the 3rd copper electroplating layer 9 and the 3rd catalyzed oil layer of ink 10 from outside to inside all successively, and the 3rd copper electroplating layer 9 and first, second copper electroplating layer 1, 5 are connected, 3rd catalyzed oil layer of ink 10 and first, second catalytic ink 2, 4 layers are connected.
Wherein, the thickness of described ferrite layer 3 is 80 ~ 200 μm, the thickness of the first catalyzed oil layer of ink 2 is 4 ~ 10 μm, the thickness of the first copper electroplating layer 1 is 2 ~ 35 μm, the thickness of solder mask layer 6 is 10 ~ 20 μm, and the thickness of the second catalyzed oil layer of ink 4 is 4 ~ 10 μm, and the thickness of the second copper electroplating layer 5 is 2 ~ 35 μm, the thickness of the 3rd copper electroplating layer 9 is 2 ~ 35 μm, and the thickness of the 3rd catalyzed oil layer of ink 10 is 4 ~ 10 μm.
Further, be 0.3 ~ 0.5mm by the diameter design of described longitudinal hole, preferred 0.4mm.
The preparation method of integrated NFC antenna on the ferrite of the present invention as shown in Figure 3, adopts following steps: first hole on the ferrite several, hole and make its positive and negative through; Then on ferrite positive and negative, print catalytic ink respectively, and make also to be coated with catalytic ink in boring; Carry out electro-coppering again, make the catalytic ink in tow sides and boring is all coated with copper facing; And then in the copper facing of reverse side solder-mask printing ink; Last on anti-solder ink sticking two-faced adhesive tape, shaping, to obtain the NFC antenna of structure in Fig. 2.
In described boring procedure, the controling parameters of described boring is as follows: feed number is 0.8 ~ 0.9 m/min, and withdrawing number is 10 ~ 11 ms/min, and drilling speed is 4 ~ 50,000 revs/min, bore diameter is 0.3 ~ 0.5mm, and boring before need pad below ferrite establish sheeting caps, above stacked aluminium flake.
In described printing catalytic ink process, the design parameter of printing catalytic ink is as follows: catalytic ink mixing time is 20 ~ 30min, and ink viscosity is 200 ~ 260/dPa.s, and scraper angle is 60 ~ 70 °, machine scales is 20 ~ 30 °, be 4 ~ 6mm from version height, scraper pressure is 4 ~ 6Kg, and scraper speed is 160 ~ 260mm/s, mesh is 300 orders, thickness is 8 ~ 12 μm, and print thickness is 4 ~ 10 μm, and after printing, baking-curing is 120 DEG C, 100 minutes.
In described electro-coppering process, electro-coppering parameter is as follows: the solution composition that electro-coppering adopts comprises cupric sulfate pentahydrate 200 ~ 250g/l, sulfuric acid 30 ~ 40ml/l, chloride ion 60 ~ 80mg/l, high speed brightening agent for acid copper electroplating 1 ~ 3mg/l, the sour copper of high speed fill and lead up agent 3 ~ 7mg/l, current density is 20ASD, electroplating time is 15min, electroplating temperature is 40 ~ 50 DEG C, baking 80 DEG C, 60 minutes after plating.
In described solder-mask printing ink process, solder-mask printing Ink parameters is as follows: anti-solder ink mixing time is 20 ~ 30min, and ink viscosity is 180 ~ 220/dPa.s, and scraper angle is 60 ~ 70 °, machine scales is 20 ~ 30 °, be 6 ~ 8mm from version height, scraper pressure is 4 ~ 6Kg, and scraper speed is 80 ~ 150mm/s, mesh is 200 orders, thickness is 10 ~ 15 μm, and print thickness is 10 ~ 20 μm, and after printing, baking-curing is 120 DEG C, 60 minutes.
In described electrogilding process, electrogilding step comprises: pickling, microetch, activation, nickel plating, gold-plated, and gold plating thickness is at 0.1 ~ 0.3 μm, and nickel plating thickness is 2 ~ 6 μm.
Wherein, described pickling adopts the sulfamic acid of 2 ~ 4%, and pickling temperature is room temperature;
Described micro-corrosion liquid composition comprises the sulfuric acid of 50 ~ 90g/l, persulfuric acid receives 40 ~ 60g/l, copper ion≤25g/l, and microetch temperature is room temperature; The sulfamic acid of described activation employing 1 ~ 3%, activation temperature is room temperature;
The plating solution that described nickel plating adopts comprises nickel sulfamic acid 380 ~ 430g/l, nickel chloride 8 ~ 12g/l, boric acid 30 ~ 40g/l, additive 1 ~ 3ml/l, wetting agent 0.5 ~ 1.5ml/l, plating solution pH value is 3.8 ~ 4.2, current density is 2ASD, plating time is 6min, nickel plating temperature is 50 ~ 60 DEG C, above-mentioned additive can select asccharin, and wetting agent can select dodecyl sodium sulfate;
Described gold-plated plating solution comprises gold 0.5 ~ 2g/l, cobalt 0.2 ~ 0.6g/l, and plating solution pH value is 4 ~ 4.6, and current density is 1ASD, and gold-plated temperature is 40 ~ 50 DEG C, and the gold-plated time is 2min.
In sum, adopt integrated NFC antenna on the ferrite of the present invention and preparation method thereof, there is following advantage:
1, directly implant NFC on the ferrite, production efficiency is greatly improved, and has odds for effectiveness;
2, eliminate the making of traditional adagio and ferritic bonding process, there is cost advantage;
That 3, the product of NFC can be done is thinner, saves the mechanism space of client further, and what product was become is more slim.
But; those skilled in the art will recognize that; above-mentioned embodiment is exemplary; to better enable those skilled in the art understand this patent; can not be interpreted as it is restriction to this patent protection range; as long as according to this patent disclose any equivalent change done or the modification of spirit, all fall into the scope of this patent protection.
Claims (10)
1. an integrated NFC antenna on the ferrite, it is characterized in that, comprise the first copper electroplating layer successively from top to bottom, first catalyzed oil layer of ink, ferrite layer, second catalyzed oil layer of ink, second copper electroplating layer, solder mask layer, layers of two-sided, and several longitudinal hole also offered by antenna, longitudinal hole upper end open is in the first copper electroplating layer upper surface, lower end is to solder mask layer upper surface, and longitudinal hole both sides laterally comprise the 3rd copper electroplating layer and the 3rd catalyzed oil layer of ink from outside to inside all successively, and the 3rd copper electroplating layer and first, second copper electroplating layer is connected, 3rd catalyzed oil layer of ink and first, second catalyzed oil layer of ink is connected.
2. integrated NFC antenna on the ferrite according to claim 1, is characterized in that:
The thickness of described ferrite layer is 80 ~ 200 μm, the thickness of the first catalyzed oil layer of ink is 4 ~ 10 μm, the thickness of the first copper electroplating layer is 2 ~ 35 μm, the thickness of solder mask layer is 10 ~ 20 μm, the thickness of the second catalyzed oil layer of ink is 4 ~ 10 μm, the thickness of the second copper electroplating layer is 2 ~ 35 μm, and the thickness of the 3rd copper electroplating layer is 2 ~ 35 μm, and the thickness of the 3rd catalyzed oil layer of ink is 4 ~ 10 μm.
3. integrated NFC antenna on the ferrite according to claim 1, is characterized in that: the diameter of described longitudinal hole is 0.3 ~ 0.5mm.
4. a preparation method for integrated NFC antenna on the ferrite, is characterized in that: hole on the ferrite and make its positive and negative through; Then on ferrite positive and negative, print catalytic ink respectively, and make also to be coated with catalytic ink in boring; Carry out electro-coppering again, make the catalytic ink in tow sides and boring is all coated with copper facing; And then in the copper facing of reverse side solder-mask printing ink; Finally sticking two-faced adhesive tape on anti-solder ink.
5. the preparation method of integrated NFC antenna on the ferrite according to claim 4, it is characterized in that: the controling parameters of described boring is as follows: feed number is 0.8 ~ 0.9 m/min, withdrawing number is 10 ~ 11 ms/min, drilling speed is 4 ~ 50,000 revs/min, bore diameter is 0.3 ~ 0.5mm, and boring before need pad below ferrite establish sheeting caps, above stacked aluminium flake.
6. the preparation method of integrated NFC antenna on the ferrite according to claim 4, it is characterized in that: described printing catalytic ink parameter is as follows: catalytic ink mixing time is 20 ~ 30min, ink viscosity is 200 ~ 260/dPa.s, scraper angle is 60 ~ 70 °, machine scales is 20 ~ 30 °, be 4 ~ 6mm from version height, scraper pressure is 4 ~ 6Kg, scraper speed is 160 ~ 260mm/s, mesh is 300 orders, thickness is 8 ~ 12 μm, and print thickness is 4 ~ 10 μm, and after printing, baking-curing is 120 DEG C, 100 minutes.
7. the preparation method of integrated NFC antenna on the ferrite according to claim 4, it is characterized in that: described electro-coppering parameter is as follows: the solution composition that electro-coppering adopts comprises cupric sulfate pentahydrate 200 ~ 250g/l, sulfuric acid 30 ~ 40ml/l, chloride ion 60 ~ 80mg/l, high speed brightening agent for acid copper electroplating 1 ~ 3mg/l, the sour copper of high speed fill and lead up agent 3 ~ 7mg/l, current density is 20ASD, electroplating time is 15min, electroplating temperature is 40 ~ 50 DEG C, baking 80 DEG C, 60 minutes after plating.
8. the preparation method of integrated NFC antenna on the ferrite according to claim 4, it is characterized in that: described solder-mask printing Ink parameters is as follows: anti-solder ink mixing time is 20 ~ 30min, ink viscosity is 180 ~ 220/dPa.s, scraper angle is 60 ~ 70 °, machine scales is 20 ~ 30 °, be 6 ~ 8mm from version height, scraper pressure is 4 ~ 6Kg, scraper speed is 80 ~ 150mm/s, mesh is 200 orders, thickness is 10 ~ 15 μm, and print thickness is 10 ~ 20 μm, and after printing, baking-curing is 120 DEG C, 60 minutes.
9. the preparation method of integrated NFC antenna on the ferrite according to claim 4, it is characterized in that: described electrogilding step comprises: pickling, microetch, activation, nickel plating, gold-plated, and gold plating thickness is at 0.1 ~ 0.3 μm, nickel plating thickness is 2 ~ 6 μm.
10. the preparation method of integrated NFC antenna on the ferrite according to claim 9, is characterized in that: described pickling adopts the sulfamic acid of 2 ~ 4%, and pickling temperature is room temperature; Described micro-corrosion liquid composition comprises the sulfuric acid of 50 ~ 90g/l, persulfuric acid receives 40 ~ 60g/l, copper ion≤25g/l, and microetch temperature is room temperature; The sulfamic acid of described activation employing 1 ~ 3%, activation temperature is room temperature; The plating solution that described nickel plating adopts comprises nickel sulfamic acid 380 ~ 430g/l, nickel chloride 8 ~ 12g/l, boric acid 30 ~ 40g/l, additive 1 ~ 3ml/l, wetting agent 0.5 ~ 1.5ml/l, plating solution pH value is 3.8 ~ 4.2, current density is 2ASD, plating time is 6min, and nickel plating temperature is 50 ~ 60 DEG C; Described gold-plated plating solution comprises gold 0.5 ~ 2g/l, cobalt 0.2 ~ 0.6g/l, and plating solution pH value is 4 ~ 4.6, and current density is 1ASD, and gold-plated temperature is 40 ~ 50 DEG C, and the gold-plated time is 2min.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107969091A (en) * | 2016-10-20 | 2018-04-27 | 上海光线新材料科技有限公司 | Graphite based on addition process covers copper heat dissipation film and preparation method thereof |
| CN113825307A (en) * | 2021-09-27 | 2021-12-21 | 中芯(深圳)精密电路科技有限公司 | Multilayer PCB magnetic antenna |
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| CN102625570A (en) * | 2012-04-27 | 2012-08-01 | 上海贺鸿电子有限公司 | Printed wiring board and addition process manufacturing method thereof |
| WO2012144482A1 (en) * | 2011-04-18 | 2012-10-26 | 株式会社村田製作所 | Antenna device and communication terminal device |
| CN204205040U (en) * | 2014-10-11 | 2015-03-11 | 上海蓝沛新材料科技股份有限公司 | A kind of integrated NFC antenna on the ferrite |
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- 2014-10-11 CN CN201410535238.4A patent/CN105576357A/en active Pending
Patent Citations (4)
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| CN101501930A (en) * | 2006-08-14 | 2009-08-05 | 泰科电子瑞侃株式会社 | Antenna element and method for manufacturing same |
| WO2012144482A1 (en) * | 2011-04-18 | 2012-10-26 | 株式会社村田製作所 | Antenna device and communication terminal device |
| CN102625570A (en) * | 2012-04-27 | 2012-08-01 | 上海贺鸿电子有限公司 | Printed wiring board and addition process manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107969091A (en) * | 2016-10-20 | 2018-04-27 | 上海光线新材料科技有限公司 | Graphite based on addition process covers copper heat dissipation film and preparation method thereof |
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