KR100984039B1 - Method of mounting of a insert mold antenna to inside of a case - Google Patents

Abstract

PURPOSE: An IMA(Insert Mold Antenna) mounting method is provided to make better use of a space of a mobile case by mounting an antenna sheet on the inner surface of a mobile case through an insert injection molding process. CONSTITUTION: A first non-conductive resin film is laminated on the upper surface of a bonding sheet(S10). An electrode hole is formed by passing through the bonding sheet and the first non-conductive resin film(S20). An antenna pattern is formed in the lower surface of the bonding sheet(S30). A protection film is printed in order to protect the antenna pattern(S40). A plating layer is formed on the surface of the antenna pattern(S50). The antenna sheet is the foaming(S60). The antenna sheet is mounted on the inner surface of the mobile case with an insert injection molding process(S70).

Description

METAOD OF MOUNTING OF A INSERT MOLD ANTENNA TO INSIDE OF A CASE}

The present invention relates to a method for mounting an IMA (Insert Mold Antenna) inside a phone case to implement a plurality of antenna functions such as M-Commerce, 3G, WiFi, GPS, DMB, Bluetooth, and FM radio. will be.

An antenna is a high-frequency device that converts an electric signal containing information into a radio wave and sends it to the air or receives an information wave from the air and converts it into an electric signal. An interface between an internal circuit of a wireless communication terminal and an external space Play a role.

Conventionally, an Intenna electrode is formed by inserting an Intenna sheet into a mold and ejecting from the rear surface. However, in this case, there are many difficulties in forming the electrode, and the electrode insertion method is complicated. have.

In addition, the conventional antenna has a problem that the radiation efficiency is lowered, the bandwidth is narrow, and the antenna gain is small. However, even though the electrical performance of these existing antennas is deteriorated, miniaturization, multifunction, and high performance are constantly required in the mobile communication terminal market.

In this regard, the trend of the recent mobile communication terminal has increased the application rate of the built-in antenna instead of the external antenna protruding to the outside as the importance of the design is highlighted. Built-in antennas have many difficulties in obtaining high gains due to limited space and electrical components on the PCB.

As a related art related to the case integrated antenna of the present invention, Korean Patent Laid-Open Publication No. 10-2009-0079720 (published Jul. 22, 2009) 'Portable terminal having an external case integrated broadcast receiving antenna', Republic of Korea Patent Registration 10- 0905858 (Registration date June 25, 2009) 'Case integrated antenna and its manufacturing method', Republic of Korea Patent 10-0910161 (Registration date July 24, 2009) 'Integrated antenna integrated portable terminal case and its manufacturing method' Although it is proposed, as described above, most of the prior arts have a lot of difficulties in forming the electrode, and there is a problem in that the electrode insertion method is complicated.

Republic of Korea Patent Publication 10-2009-0079720 (published July 22, 2009) Republic of Korea Patent Registration 10-0905858 (Registration date June 25, 2009) Republic of Korea Patent Registration 10-0910161 (Registration date July 24, 2009)

In order to solve the above problem, the copper thin film is etched to form an antenna pattern, a protective film is printed on the antenna pattern, or a conductive paint is printed or deposited on a nonconductive resin film to form an antenna pattern. By forming the antenna sheet formed with the antenna pattern in the insert injection molding on the inner surface of the case, a plurality of antenna functions such as M-Commerce, 3G, WiFi, GPS, DMB, Bluetooth, and FM radio can be realized. An object of the present invention is to provide a method of mounting an IMA on an inner surface of a mobile phone case so that a plurality of antenna functions can be easily formed and have a minimizing effect of a defective rate.

In order to achieve the above object,

The present invention comprises the step of laminating the first non-conductive resin film to the upper surface of the bonding sheet (Bonding Sheet) (S10),

Forming an electrode hole penetrating the bonding sheet and the first non-conductive resin film (S20);

Forming an antenna pattern on a lower surface of the bonding sheet (S30);

Printing a protective film to protect the antenna pattern (S50),

An electrode plating step (S60) of forming a plating layer by plating with nickel or gold on the surface of the antenna pattern adjacent to the electrode hole;

Forming an antenna sheet manufactured through the electrode plating step (S70);

After inserting the formed antenna sheet into a mold, by injection molding the mobile phone case to the front of the formed antenna sheet, the M-Commerce antenna through the insert injection molding step (S80) to mount the antenna sheet on the inner surface of the mobile phone case The main technical configuration is to mount the IMA on the inner surface of the mobile phone case to have a plurality of antenna functions such as 3G antenna, DMB antenna, WiFi antenna, Bluetooth antenna, and FM radio.

The laminating step is to laminate the first non-conductive resin film having a thickness of 100 μm to a temperature of 110 to 130 ° C. and a pressure of 0.7 to 1.5 kg / cm 2 to an upper portion of a 35 μm-thick bonding sheet.

The antenna pattern is formed by laminating a 175 μm thick Cu foil at a temperature of 150 to 170 ° C. and a pressure of 18 to 23 kg / cm 2 on a lower surface of a bonding sheet, and then etching the copper thin film. Alternatively, the second nonconductive resin film formed by printing or depositing conductive paint on the second nonconductive resin film, and the antenna pattern formed as described above, replaces both the antenna pattern and the protective film formed by etching the copper thin film, thereby bonding the bonding sheet. The lamination is characterized in that the lamination.

In addition, the protective film is formed by screen printing a viscosity of 30,000 ~ 50,000 (cps) urethane to the top of the antenna pattern, the screen printing is spaced between the screen plate and the film having a stainless mesh mesh opening (mesh opening) 200mesh To print at a distance of 2mm, squeegee angle 80 °, squeegee speed 160mm / s, printing pressure 4.0kg / ㎠,

In the electrode plating step, nickel is first plated to a thickness of 8 μm to 20 μm, and then a second plating is performed on the nickel plated layer to a thickness of 100 μs to 200 μs to form a plating layer. It is characterized by.

As described above, the method of mounting the IMA on the inner surface of the mobile phone case to implement a plurality of antenna functions according to the present invention does not need to separately consider a space for mounting various antennas in the mobile phone design, Less variation and less constraints on the design of the outer design of many cell phone cases with antenna functions. In addition, the manufacturing cost for implementing one or more antennas is significantly reduced, and since the insert is formed in the mobile phone case by injection molding, the internal space of the mobile phone is increased, and the M-Commerce antenna, 3G antenna, DMB antenna, WiFi antenna, Bluetooth, FM radio You can install multiple antennas, which are antennas, to make various functions work in your phone.

In addition, since the electrode formation is simple and does not affect the electrode during the injection process, by dropping the defective rate significantly, it is difficult to form the electrode because the insert injection into the surface where the conventional electrode is formed, and the electrode insertion method is complicated. It has the advantage of solving the problem that the defective rate is high.

1 is a flow chart illustrating a method for mounting an IMA on the inner surface of a mobile phone case to implement a plurality of antenna functions according to the present invention.
Figure 2 is a cross-sectional view showing the structure of an antenna sheet according to a first embodiment of the present invention.
3 is a cross-sectional view showing the structure of an antenna sheet according to a second embodiment of the present invention.
4 is a cross-sectional view showing that the antenna sheet of the present invention is injected to be mounted on the inner surface of the mobile phone case.
Figure 5 is a front view showing an example in which a plurality of antennas are configured in the antenna sheet according to the present invention.

Looking at the specific content of the above technical configuration with the drawings as follows.

1 is a flow chart illustrating a method for mounting an IMA on the inner surface of the mobile phone case to implement a plurality of antenna functions according to the present invention, the IMA on the inner surface of the mobile phone case together with the antenna sheet shown in Figures 2 and 3 Let's look at how to implement it.

First, the method of mounting the IMA on the inner surface of the mobile phone case of the present invention is made by the following process.

Laminating the first non-conductive resin film 20 to the top surface 101 of the bonding sheet 10, S10;

Forming an electrode hole 100 penetrating the bonding sheet 10 and the first non-conductive resin film 20 (S20);

Forming an antenna pattern 30 on the bottom surface 102 of the bonding sheet 10 (S30);

Printing the protective film 50 to protect the antenna pattern 30 (S40),

An electrode plating step (S50) of forming a plating layer 40 by plating nickel or gold on the surface of the antenna pattern 30 adjacent to the electrode hole 100;

Forming the antenna sheet (1) manufactured through the electrode plating step (S60) and (S60),

Insert injection molding step of inserting the formed antenna sheet into the mold 200 and injection molding the mobile phone case to the front surface 11 of the formed antenna sheet, so that the antenna sheet 1 is mounted on the inner surface of the mobile phone case. Through (S70) to have a plurality of antenna functions such as M-Commerce antenna, 3G antenna, DMB antenna, WiFi antenna, Bluetooth antenna, FM radio.

First non-conductive resin film laminating step (S10)

Laminating of the first non-conductive resin film 20 is the upper portion 101 of the 35 μm-thick bonding sheet (Bonding Sheet) (10) of 100 μm thick first non-conductive resin film 20 110 ~ 130 ℃ By applying a temperature of 0.7 ~ 1.5kg / ㎠.

If the temperature is less than 110 ℃ lamination is not made well, if it exceeds 130 ℃ can give a chemical change to the bonding sheet, the laminating temperature is preferably maintained in the temperature range of 110 ~ 130 ℃ Do.

In addition, when the pressure is less than 0.7kg / ㎠, laminating is not made well, when it exceeds 1.5kg / ㎠ it is meaningless to apply more pressure than necessary, the pressure is in the range of 0.7 ~ 1.5kg / ㎠ It is desirable to maintain.

As said laminating conditions, more specific temperature and pressure are 120 degreeC and 1 kg / cm <2>.

Electrode hole forming step (S20)

By going through the laminating step, the electrode hole 100 is formed to penetrate the integrated bonding sheet 10 and the first non-conductive resin film 20, and the electrode hole 100 has an antenna pattern 30. It is formed to provide a passage that can be connected to the ground wire.

Antenna pattern forming step (S30)

The antenna pattern is first laminated with a copper thin film, and then the copper thin film is etched to form an antenna pattern, or a conductive pattern is printed or deposited on a second nonconductive resin film to form an antenna pattern.

The antenna pattern 30 by the copper thin film laminates a 75 μm thick copper foil at a temperature of 150 to 170 ° C. and a pressure of 18 to 23 kg / cm 2 on the bottom surface 102 of the bonding sheet 10. After that, the copper thin film is formed by etching.

When the thickness of the copper thin film is out of 175 μm, there may be a problem of antenna pattern formation and antenna functionality. Therefore, the thickness of the copper thin film is preferably maintained at 175 μm.

And, if the laminating temperature is less than 150 ℃ lamination is not made well, if it exceeds 170 ℃ may give a modification to the first polycarbonate film, the laminating temperature is 150 ~ 170 ℃ temperature range It is desirable to maintain.

In addition, in the case of the pressure, if less than 18kg / ㎠ laminating is not made well, if it exceeds 23kg / ㎠ it is meaningless to apply more pressure than necessary, the pressure is within the range of 18 ~ 23kg / ㎠ It is desirable to maintain. As the laminating conditions, specific temperature and pressure are 160 ° C. and 20 kg / cm 2.

The etching process uses an etching solution formed by adding a corrosion inhibitor and an insoluble powder to the iron chloride solution in order to prevent corrosion of the antenna pattern 30 and a high quality pattern.

Iron chloride is known as iron (III) iron (II) chloride, a chloride containing divalent and trivalent iron in addition to iron (II) chloride and iron (III). Ferric chloride (II), also called ferrous chloride, exists as a Lorentzite with nickel chloride in natural iron or volcanic fumes, and has a melting point of 672 ° C, a boiling point of 1,023.4 ° C and a specific gravity of 2.99 (18 ° C).

Ferric chloride (III), also known as ferric chloride, is found in volcanic eruptions or meteorites and has a melting point of 300 ° C, a boiling point of 317 ° C and a specific gravity of 2.804 (11 ° C).

Looking at the etching mechanism using the iron chloride is shown in Scheme 1.

Scheme 1

FeCl ₃ + Cu → FeCl ₂ + CuCl

As in Scheme 1, iron ions oxidize copper to produce ferrous chloride and cupric chloride.

Scheme 2

FeCl ₃ + CuCl → FeCl ₂ + CuCl ₂

As in Scheme 2, cuprous chloride produced in Scheme 1 further oxidizes copper to produce ferrous chloride and cupric chloride.

The etching solution uses a corrosion inhibitor and an insoluble powder to prevent the antenna pattern corrosion failure and to obtain a strong physical etching effect.

The corrosion inhibitor uses Benzotriazole.

The amount of the corrosion inhibitor is 0.40mM to 0.45mM / L with respect to the entire etching solution. If the corrosion inhibitor is less than 0.40mM / L, the probability of corrosion of the antenna pattern is high. Since there is a problem that is not made, the corrosion inhibitor is preferably used in the range of 0.40mM to 0.45mM / L with respect to the etching solution.

And, the temperature used by the addition of the corrosion inhibitor is 40 ~ 50 ℃, when the temperature used by adding the corrosion inhibitor is less than 40 ℃ that the activity is lowered and the function of the corrosion inhibitor is added to the etching is not made If the temperature exceeds 50 ° C., the etching rate is high and the etching proceeds excessively. Therefore, it is preferable to maintain the temperature at 40 to 50 ° C. by using the corrosion inhibitor.

The insoluble powder is 0.5 ~ 1㎛ TiO2, 0.25mM ~ 0.30mM / L is used for the entire etching solution. If the particle size of the insoluble powder is less than 0.5㎛ it is difficult to expect a physical etching effect, if it exceeds 1㎛ it may interfere with the spraying of the powder clustering, the particle size of the insoluble powder is 0.5 It is used in the range of ˜1 μm.

When the insoluble powder is less than 0.25mM with respect to the entire etching solution, it is difficult to expect a physical etching effect, and when the insoluble powder exceeds 0.30mM / L, the powder may interfere with the flow of the etching solution to prevent smooth etching. Since the insoluble powder may be used in an amount of 0.25 mM to 0.30 mM / L based on the total etching solution.

In addition to the method of etching the copper thin film, as an antenna pattern forming method, an antenna pattern is formed by printing or depositing conductive paint on the second nonconductive resin film 20 '. As such, when the conductive pattern is formed by printing or depositing the conductive paint on the second nonconductive resin film 20 ', the protective film 20 need not be printed.

The conductive paint is a composition of 35wt% poly (3,4-ethylenedioxythiophene) aqueous solution, 15wt% urethane, 20wt% dimethyl sulfoxide, 30wt% isopropyl alcohol, in the case of printing screen printing method It is printed using a thickness of 175㎛, and in the case of deposition so that the thickness of the deposition layer is 175㎛.

The second nonconductive resin film 20 ′ may have a plurality of functions by independently forming a plurality of conductors by depositing conductive paint.

As the first nonconductive resin film 20 and the second nonconductive resin film 20 ', any non-conductive resin can be used, and more specific examples thereof include polycarbonate, polyamide, polyacetal, and polybutyl. Any one or more selected from lene terephthalate and polyphenylene oxide are used.

By the antenna formation by the above method, it is shown in Figure 5 that a plurality of antennas are configured in the antenna sheet.

Protective film printing step (S40)

Protective film printing is to protect the antenna pattern, the protective printing by printing with a viscosity of 30,000 ~ 50,000 (cps) urethane for the protection of the antenna pattern.

Screen printing is performed on the film-formed upper portion of the antenna pattern using the urethane. The screen printing is a distance of 2 mm between the screen plate and the film having a stainless mesh having a mesh opening of 200 mesh, a squeegee angle of 80 ° and a squeegee. Screen printing is performed at a speed of 160 mm / s and a printing pressure of 4.0 kg / cm 2.

Electrode Plating Step (S50)

As a step of forming a plating layer 40 by plating with a nickel and gold to the surface of the antenna pattern 30 adjacent to the electrode hole 100,

The plating layer 40 is formed by first plating nickel to a thickness of 8 μm to 20 μm, and then secondarily plating gold to a thickness of 100 μs to 200 μm over the nickel plating layer.

The nickel primary plating process is to compensate for this because the manufacturing cost is significantly increased during the entire gold plating, nickel plating in a thickness range of 8㎛ ~ 20㎛ to gold plating with a minimum thickness.

As described above, the gold secondary plating is plated with a thickness of 100 μs to 200 μm in order to minimize the cost, and when the thickness is lower than 100 μs, the reliability of the gold secondary plating is reduced. In consideration of the cost and electrode reliability, it is desirable to maintain a thickness of 100 kPa to 200 kPa.

Antenna sheet forming step (S60)

After the plating process, the manufacture of the antenna sheet 1 is completed, and the same shape as the inner surface of the mobile phone case is formed by press forming a bent edge to mount the antenna sheet on the inner surface of the mobile phone case to be injection-molded. Will have

Insert Injection Molding Step (S70)

The formed antenna sheet is inserted into the mold 200 and then injection molded into the front surface 11 of the formed antenna sheet so that the antenna sheet 1 is mounted on the inner surface of the mobile phone case.

The front surface 11 of the antenna sheet 1 is a surface on which the protective film 20 or the second nonconductive resin film 20 'is formed, and the rear surface 12 has an antenna pattern 30 having an electrode hole 100. It is a surface formed so that it can be grounded, and has a low defect rate because it does not affect the electrode during the injection molding of the mobile phone case, and has a low defect rate by simplifying the existing complicated electrode formation process because the electrode formation is simple. It can have high productivity.

The insert injection is made in the state of maintaining the mold temperature at 55 ℃, the insert injection is a general form, it may be used to create a case through one injection, but in order to minimize the failure rate through the injection secondary Injection methods over may be applied.

In other words, after forming the antenna sheet, a 0.3mm ~ 1mm thickness of the thin film injection to the antenna sheet as a primary, and then the injection molding of the thin film injection once again.

The reason why the two injection processes are performed is because, when the antenna sheet is injected into the mobile phone case at once, the injection may rise on the thin antenna sheet due to the injection pressure, so as to improve such a defective rate. By performing the second insert injection after the second thin film injection, it is possible to improve the failure of the injection on the top of the sheet.

After mounting the IMA on the inner surface of the mobile phone case by insert injection as described above, in order to improve antenna performance, an absorber or a reflector is applied to the rear surface 12 of the antenna sheet 1 or an absorber film or a reflector film is applied. I can attach it.

The absorber is an electromagnetic wave absorber that can cause electromagnetic wave attenuation in order to solve the electromagnetic wave problem in a wireless communication product, and in the case of an absorber film, one selected from sanddust (Fe-Si-Al) or carbonyl iron (Fe-C) One kind of soft magnetic metal powder, which is mixed with silicon rubber, is added to 4 Mpa at 160 ° C. using a hot press equipment to produce a film having a thickness of 1 to 2 mm.

The reflector uses a PEDOT (Poly (3,4-ethylenedioxythiophene)) film having a thickness of 1.4 μm to block and partially absorb interference signals from the outside, and to compensate the gain of the antenna.

The method of mounting the IMA on the inner surface of the mobile phone case to implement a plurality of antenna functions according to the present invention is easy to form the electrode of the built-in antenna, since the price is lowered by implementing a plurality of antennas in the case, and arranged in the outer case As size of can be made smaller, industrial applicability is high by using for phone cases.

1: antenna sheet
10: Bonding Sheet
20: first non-conductive resin film
20 ': second non-conductive resin film
30: antenna pattern
40: plating layer
50: protective film
100: electrode hole

Claims (8)

Laminating the first non-conductive resin film 20 to the top surface 101 of the bonding sheet 10, S10;
Forming an electrode hole 100 penetrating the bonding sheet 10 and the first non-conductive resin film 20 (S20);
Forming an antenna pattern 30 on the bottom surface 102 of the bonding sheet 10 (S30);
Printing the protective film 50 to protect the antenna pattern 30 (S40),
An electrode plating step (S50) of forming a plating layer 40 by plating nickel or gold on the surface of the antenna pattern 30 adjacent to the electrode hole 100;
Forming the antenna sheet (1) manufactured through the electrode plating step (S60) and (S60),
Insert injection molding step of inserting the formed antenna sheet into the mold 200 and injection molding the mobile phone case to the front surface 11 of the formed antenna sheet, so that the antenna sheet 1 is mounted on the inner surface of the mobile phone case. IMA on the inside of the mobile phone case to implement a plurality of antenna functions, characterized in that the M-Commerce antenna, 3G antenna, DMB antenna, WiFi antenna, Bluetooth antenna, FM antenna is manufactured to have a plurality of antenna functions through (S70) How to mount it.
The method according to claim 1,
The laminating step is the upper portion 101 of the bonding sheet 10 having a thickness of 35 μm and the first non-conductive resin film 20 having a thickness of 100 μm with a temperature of 110 to 130 ° C. and a temperature of 0.7 to 1.5 kg / cm 2. The method of mounting the IMA on the inner surface of the mobile phone case to implement a plurality of antenna functions, characterized in that the laminating by pressure.
The method according to claim 1,
The antenna pattern 30 laminates a copper foil having a thickness of 175 μm to a lower surface 102 of the bonding sheet 10 at a temperature of 150 to 170 ° C. and a pressure of 18 to 23 kg / cm 2. A method of mounting an IMA on the inner surface of a mobile phone case to implement a plurality of antenna functions, characterized in that formed by etching a thin film.
The method according to claim 1,
The antenna pattern 30 is formed by printing or depositing a conductive paint on the second nonconductive resin film 20 ', and thus the second nonconductive resin film 20' having the antenna pattern is etched on a copper thin film. Method of mounting the IMA on the inner surface of the mobile phone case to implement a plurality of antenna functions, characterized in that the laminated on the bottom surface 102 of the bonding sheet 10 by replacing all the formed antenna pattern and the protective film (50).
The method according to claim 1,
The protective film 50 is formed by screen printing a viscosity of 30,000 to 50,000 (cps) urethane onto the antenna pattern 30. The screen printing is a screen plate and film having a stainless mesh having a mesh opening of 200 mesh. Method of mounting the IMA on the inner surface of the mobile phone case to implement a plurality of antenna functions, characterized in that the printing distance of 2mm, squeegee angle 80 °, squeegee speed 160mm / s, printing pressure 4.0kg / ㎠.
The method according to claim 1,
In the electrode plating step, nickel is first plated to a thickness of 8 μm to 20 μm, and second plating is performed on the nickel plated layer to a thickness of 100 μs to 200 μs to form a plating layer 40. Method of mounting the IMA on the inner surface of the mobile phone case to implement a plurality of antenna functions, characterized in that forming.
The method according to claim 1,
Insert injection molding step (S70) is a 0.3mm ~ 1mm thickness of the thin film injection to the molded antenna sheet as a primary to make a thin film injection, by insert injection molding the thin film injection again, the antenna sheet (1) ) Is mounted on the inner surface of the mobile phone case to implement a plurality of antenna functions, characterized in that to be mounted.
The method according to claim 1,
After bonding the IMA to the inner surface of the mobile phone case, the bonding sheet 10 may apply an absorber or reflector or attach an absorber film or reflector film to the rear surface 12 of the antenna sheet 1 in order to improve antenna performance. Method of mounting the IMA on the inner surface of the mobile phone case to implement a plurality of antenna functions, characterized in that.

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