CN104466368A - Manufacturing method of antenna and electronic device - Google Patents
Manufacturing method of antenna and electronic device Download PDFInfo
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- CN104466368A CN104466368A CN201310422155.XA CN201310422155A CN104466368A CN 104466368 A CN104466368 A CN 104466368A CN 201310422155 A CN201310422155 A CN 201310422155A CN 104466368 A CN104466368 A CN 104466368A
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Abstract
The invention discloses a manufacturing method of an antenna and an electronic device. The manufacturing method includes the following steps that: the surface of a shell material for manufacturing the antenna is covered with a laser activated plastic layer, and M micro holes are formed in the laser activated plastic layer, wherein M is an integer not smaller than 2; laser is controlled to activate the laser activated plastic layer according to a preset path, so that metal ions in the laser activated plastic layer can be released and aggregated on the laser activated plastic layer, so that a preset antenna pattern can be formed, wherein the preset antenna pattern has at least two layers of structures; and metallization processing is performed on the preset antenna pattern and the M micro holes, so that the at least two layers of structures can be communicated with each other through the M micro holes, and therefore, the antenna can be formed.
Description
Technical field
The application relates to antenna and makes field, particularly a kind of manufacture method of antenna and electronic equipment.
Background technology
Along with the fast development of electronic technology, the function of various electronic equipment and pattern are all changing thereupon, existing portable electric appts (such as smart mobile phone, notebook computer, panel computer etc.) all pursuit gentlier, thinner.At present, be subject to the design requirement that smart mobile phone is ultra-thin, and user is to the outward appearance demand of mobile phone, the free space of antenna is limited, therefore traditional FPC(Flexible Printed Circuit) antenna, can not meet the demand of smart mobile phone thin design.
In order to solve the problem, existing sky Wiring technology all adopts and is directly arranged in mobile phone shell by antenna pattern by radium-shine mode, such as, adopt LDS(laser direct structuring technique) technique, wherein, LDS technique adopts directly to adopt LDS proprietary material make or adopt LDS proprietary material first to make support whole handset shell, and then look on shaping support, adopts laser to go out the pattern of antenna.
But, the technique of existing making antenna, there is the technical problem of complex procedures, this is because prior art LDS antenna all has sandwich construction, in order to realize the conducting between sandwich construction, the mode of perforate or fluting on shell material is needed to realize, and when follow-up process, LDS antenna position is needed to carry out sealant pouring and sealing process, to improve the performance of described smart mobile phone, such as, after LDS being set on phone housing, when installing sound chamber, LDS antenna position is needed to carry out sealant pouring and sealing process, to improve the audio effect in described sound chamber, so, prior art is caused to carry out perforate or slot treatment due to needs, and add sealant pouring and sealing operation, thus there is the problem of complex procedures.
Summary of the invention
By providing a kind of manufacture method and electronic equipment of antenna, in order to solve the technique of existing making antenna, there is the technical problem of complex procedures in the embodiment of the present application.
The embodiment of the present application provides a kind of manufacture method of antenna, and have laser active plastic layer in the surface coverage of shell material being used for making antenna, described method comprises: on described laser active plastic layer, arrange M micropore, wherein, M be not less than 2 integer; Control laser according to laser active plastic layer described in the line activation preset, make the Metal ion release in described laser active plastic layer and be aggregated on described laser active plastic layer, the metal ion after being polymerized is made to form default antenna pattern, wherein, described default antenna pattern at least has double-layer structure; Metalized is carried out to described default antenna pattern and a described M micropore, with described in making at least double-layer structure by described M micropore conducting, form described antenna, wherein, described default antenna pattern is through at least two micropores in a described M micropore.
Optionally, describedly on described laser active plastic layer, be provided with M micropore, specifically comprise: by laser, a described M micropore is set on described laser active plastic layer, a described M micropore penetrates described laser active plastic layer, wherein, the diameter of each micropore in a described M micropore is 0.1mm-0.3mm.
Optionally, the diameter of each micropore in a described M micropore is 0.2mm.
Optionally, describedly by laser, a described M micropore is set on described laser active plastic layer, also comprises: the Part I plastic layer determining arranging at described laser active plastic layer a described M micropore from described laser active plastic layer; Subtract glue process to described Part I plastic layer, wherein, the first thickness of described Part I plastic layer is less than the thickness of the Part II plastic layer of described laser active plastic layer except described Part I plastic layer; Described Part I plastic layer arranges a described M micropore.
Optionally, after subtracting glue process to described Part I plastic layer, described first thickness of described Part I plastic layer is 0.3mm-0.5mm.
Optionally, after subtracting glue process to described Part I plastic layer, described first thickness of described Part I plastic layer is 0.4mm.
Optionally, described control laser is according to laser active plastic layer described in the line activation preset, make the Metal ion release in described laser active plastic layer and be aggregated on described laser active plastic layer, the metal ion after being polymerized is made to form default antenna pattern, specifically comprise: control laser and carry out radium-shine according to the tow sides of described default circuit to described laser active plastic layer, make the Metal ion release in described laser active plastic layer and be aggregated on the tow sides of described laser active plastic layer, described default antenna pattern is formed at described tow sides.
Optionally, described metalized is carried out to described default antenna pattern and a described M micropore, with described in making at least double-layer structure by described M micropore conducting, form described antenna, specifically comprise: to described carrying out of laser active plastics plating, to cover layer of metal layer again on described double-edged default antenna pattern, and in a described M micropore filled conductive metal, form conducting wire, to enable described double-edged default antenna pattern by described M micropore conducting, thus form the antenna of double-side conduction.
Optionally, described, metalized is carried out to described default antenna pattern and a described M micropore, described in making, at least double-layer structure is by described M micropore conducting, and after forming described antenna, described method also comprises: to spray paint process to described laser active plastic layer.
The application another embodiment still provides a kind of electronic equipment, comprising: housing, comprise laser active plastic layer; Circuit board, is arranged in described housing; Process chip, is arranged on described circuit board; Antenna, is arranged on described laser active plastic layer, and is electrically connected described circuit board.
The one or more technical schemes provided in the embodiment of the present application, at least have following technique effect or advantage:
One, because the embodiment of the present application arranges M micropore on laser active plastic layer, then by laser active plastic layer described in laser active, form default antenna pattern, because described default antenna pattern is by a described M micropore, make when carrying out metalized to described default antenna pattern and a described M micropore, make to form conducting wire in a described M micropore, impel described default antenna pattern to realize by described conducting wire at least double-layer structure that described default antenna pattern comprises and carry out conducting, thus form described antenna, and then without the need to carrying out perforate or fluting on shell material, make the sealing property of described shell material intact, make when shell material carries out the subsequent handling of installing sound chamber, without the need to carrying out sealant pouring and sealing process to described LDS antenna, the operation making antenna is reduced, thus solve the technique of existing making antenna, there is the technical problem of complex procedures, and then achieve minimizing operation technique effect.
They are two years old, because the embodiment of the present application is the Part I plastic layer determining arranging at described laser active plastic layer a described M micropore from described laser active plastic layer, and glue process is subtracted to described Part I plastic layer, the first thickness due to described Part I plastic layer is less than the thickness of the Part II plastic layer of described laser active plastic layer except described Part I plastic layer, so, when making to arrange conductive metal sheet on described Part I plastic layer, make described conductive metal sheet can not evagination, and then reduce the impaired probability of described conductive metal sheet.
Three, because the embodiment of the present application is to described carrying out of laser active plastics plating, to form metal level at described double-edged default antenna pattern, and in a described M micropore filled conductive metal, form conducting wire, to enable described double-edged default antenna pattern by described M micropore conducting, thus form the antenna of double-side conduction, thus realize the technique effect to double-edged antenna pattern conducting connection.
Four, because the embodiment of the present application carries out metalized described to described default antenna pattern and a described M micropore, with described in making at least double-layer structure by described M micropore conducting, after forming described antenna, also described laser active plastic layer is sprayed paint process, make the aperture of a described M micropore less, make the sealing of the miscellaneous part of described laser active plastic layer and described shell material higher, also make the outward appearance of described shell material more attractive in appearance simultaneously.
Accompanying drawing explanation
Fig. 1 is the method flow diagram of the manufacture method of antenna in the embodiment of the present application;
Fig. 2 is the structure chart of a radium-shine M micropore on the embodiment of the present application mesochite material;
Fig. 3 is the structure chart of electronic equipment in the embodiment of the present application.
Embodiment
By providing a kind of manufacture method and electronic equipment of antenna, in order to solve the technique of existing making antenna, there is the technical problem of complex procedures in the embodiment of the present application.
The technical scheme of the embodiment of the present application is the problem solving above-mentioned technology, and general thought is as follows:
Because the embodiment of the present application arranges M micropore on laser active plastic layer, then by laser active plastic layer described in laser active, form default antenna pattern, because described default antenna pattern is by a described M micropore, make when carrying out metalized to described default antenna pattern and a described M micropore, make to form conducting wire in a described M micropore, impel described default antenna pattern to realize by described conducting wire at least double-layer structure that described default antenna pattern comprises and carry out conducting, thus form described antenna, and then without the need to carrying out perforate or fluting on shell material, make the sealing property of described shell material intact, make when shell material carries out the subsequent handling of installing sound chamber, without the need to carrying out sealant pouring and sealing process to described LDS antenna, the operation making antenna is reduced, thus solve the technique of existing making antenna, there is the technical problem of complex procedures, and then achieve minimizing operation technique effect.
In order to better understand technique scheme, below in conjunction with Figure of description and concrete execution mode, technique scheme is described in detail, the specific features being to be understood that in the embodiment of the present application and embodiment is the detailed description to technical scheme, instead of the restriction to technical scheme, when not conflicting, the technical characteristic in the embodiment of the present application and embodiment can combine mutually.
The method of the making antenna provided in the embodiment of the present application, the electronic equipment be applied to mainly refers to the electronic equipment needing to be produced on by antenna on housing, such as, smart mobile phone, notebook computer, panel computer, intelligent television etc., by being arranged on housing by antenna, the space availability ratio of electronic equipment can be increased, and electronic equipment fuselage is acquired a certain degree slim.In order to the method for the making antenna that the application provides clearly can be set forth, below just illustrate for modal smart mobile phone.
As shown in Figure 1, the method for the making antenna that the embodiment of the present application provides, has laser active plastic layer in the surface coverage of shell material being used for making antenna, specifically comprises step:
Step 101: M micropore is set on described laser active plastic layer, wherein, M be not less than 2 integer;
Step 102: control laser according to laser active plastic layer described in the line activation preset, make the Metal ion release in described laser active plastic layer and be aggregated on described laser active plastic layer, the metal ion after being polymerized is made to form default antenna pattern, wherein, described default antenna pattern at least has double-layer structure;
Step 103: metalized is carried out to described default antenna pattern and a described M micropore, with described in making at least double-layer structure by described M micropore conducting, form described antenna, wherein, described default antenna pattern is through at least two micropores in a described M micropore.
Wherein, in a step 101, described laser active plastic layer arranges M micropore, wherein, M be not less than 2 integer.In specific implementation process, the setting position of a described M micropore carries out arranging according to the default antenna pattern be arranged on described laser active plastic layer, to make in follow-up technique, the conducting of described default antenna pattern can be made by a described M micropore.
Specifically, by laser, a described M micropore can be set on described laser active plastic layer, a described M micropore penetrates described laser active plastic layer, wherein, the diameter of each micropore in a described M micropore is 0.1mm-0.3mm, namely show that the diameter of a micropore in a described M micropore can be 0.1mm, also can be 0.3mm, it can also be other value between 0.1mm to 0.3mm, the diameter of such as, a micropore in a described M micropore is such as be 0.2mm, 0.15mm, 0.25mm are equivalent.
Diameter due to each micropore in a described M micropore is 0.1mm-0.3mm, during to carry out chemical plating to a described M micropore, the liquid medicine changing plating can pass through a described M micropore permeation, making filled conductive metal in a described M micropore, cause the aperture of a described M micropore can become less, and then make the sealing property of described laser active plastic layer comparatively large, and then make when shell material carries out the subsequent handling of installing sound chamber, without the need to carrying out sealant pouring and sealing process to described LDS antenna.
Such as, see Fig. 2, the inner side of the shell 20 of smart mobile phone is provided with laser active plastic layer 21, according to default antenna pattern on described laser active plastic layer 21, relevant position on laser active plastic layer 21 arranges M micropore 22, wherein, the diameter of each micropore in M micropore 22 is 0.2mm.
Following execution step 102, in this step, control laser according to laser active plastic layer described in the line activation preset, make the Metal ion release in described laser active plastic layer and be aggregated on described laser active plastic layer, the metal ion after being polymerized is made to form default antenna pattern, wherein, described default antenna pattern at least has double-layer structure.
In specific implementation process, can be undertaken radium-shine by the tow sides of laser to described laser active plastic layer, and pre-set antenna pattern, described laser is activated according to the circuit corresponding with described antenna pattern, and then by the Metal ion release in described laser active plastic layer, and described metal ion is aggregated on the tow sides of described laser active plastic layer, and then the metal ion after being polymerized is made to form described default antenna pattern at the tow sides of described laser active plastic layer.
When described default antenna pattern is the tow sides being arranged on described laser active plastic layer, if described default antenna pattern is not a complete loop, at this moment, need to make to be arranged on double-edged described default antenna pattern by a micropore and form a complete loop, at this moment also need two micropores that described default antenna pattern is connected with power supply, therefore, need at least 3 micropores, namely M is not little and 3 integers.When described default antenna pattern is the tow sides being arranged on described laser active plastic layer, if described default antenna pattern is two complete loops, at this moment, only need two micropores that described default antenna pattern just can be made to be connected with power supply, therefore, need at least 2 micropores, namely M is not little and 2 integers.
Certainly, described default antenna pattern setting described laser active plastic layer double-edged while, on two sides that can also be arranged on described laser active plastic layer or a side, described default antenna pattern is made to have a three-dimensional structure, make described default antenna pattern form a complete loop, only just need can make described default antenna conducting by 2 micropores.
Concrete, described laser active plastic layer is made up of the modified plastics including organometallic compounds, after laser irradiates, organometallic compounds wherein discharges metallic, described metal ion is polymerized mutually, form described default antenna pattern, the organometallic compounds in described modified plastics has following characteristic: insulating properties; Anti-visible-light; Can be dispersed in plastic substrate; Laser can discharge metallic after irradiating; High temperature resistant, chemical resistance etc., make antenna pattern so adopt on the modified plastics containing this organometallic compounds, selection best beyond doubt.
Fetch lower execution step 103, in this step, metalized is carried out to described default antenna pattern and a described M micropore, with described in making at least double-layer structure by described M micropore conducting, form described antenna, wherein, described default antenna pattern is through at least two micropores in a described M micropore.
In specific implementation process, to described carrying out of laser active plastics plating, to plate layer of metal layer again on described double-edged described default antenna pattern, to make the metal forming described default antenna pattern more, the performance of reception and/or transmitting data is better, and when carrying out is plated can in a described M micropore filled conductive metal, form conducting wire, to enable described double-edged described default antenna pattern by described M micropore conducting, thus form the antenna of double-side conduction.
Specifically, can be by plating carrying out of shell material, with the forming metal layer on surface of the antenna pattern in radium-shine formation, make it have metallicity, radiation can be produced, and in a described M micropore filled conductive metal, form conducting wire, to enable described double-edged described default antenna pattern by described M micropore conducting, thus form the antenna of double-side conduction, specializing plated journey is: utilize strong reductant containing in the solution of metal ion, reducing metal ions is become metal and is deposited on antenna pattern surface formation close coating, it can be chemical silvering that chemical plating commonly uses solution, nickel plating, copper facing, cobalt plating, nickel plating phosphorus liquid, nickel plating phosphorus boron liquid etc., and, change the also right antenna manufacturing process of plated journey and serve a clean effect.
In specific implementation process, described, metalized is carried out to described default antenna pattern and a described M micropore, described in making, at least double-layer structure is by described M micropore conducting, and after forming described antenna, described method also comprises: to spray paint process to described laser active plastic layer.
Specifically, after to shaping having carried out of shell material plating step, according to the outward appearance needs to shell material, process of can once spraying paint again, by antenna pattern covering, and makes the housing that completes more attractive in appearance.
Specifically, the antenna manufacturing method that the embodiment of the present application provides, antenna pattern can be produced on any part of shell material, only need the relevant position be arranged at the described laser active plastic layer arranging antenna pattern on described shell material, first on described laser active plastic layer radium-shine go out a described M micropore, diameter is 0.2mm, and then the tow sides of described laser active plastic layer radium-shine go out antenna pattern, when antenna pattern is all radium-shine complete after, just to described carrying out of laser active plastic layer plating, all metal level is formed on the surface of double-edged antenna pattern, the antenna pattern on two sides is made to produce radiation, simultaneously, the liquid medicine changing plating can pass through a described M micropore permeation, also metal level is formed on the surface of a described M micropore, to form conducting wire, thus make the connection switched on of double-edged antenna pattern, because the diameter of a described M micropore is very little, so when diameter after change plating can be less, later stage is without the need to sealant pouring and sealing again, finally by the step such as to spray paint to housing, namely micro through-hole disappears.
In another embodiment, describedly by laser, a described M micropore is set on described laser active plastic layer, the Part I plastic layer that a described M micropore is set at described laser active plastic layer can also be determined from described laser active plastic layer; Subtract glue process to described Part I plastic layer, wherein, the first thickness of described Part I plastic layer is less than the thickness of the Part II plastic layer of described laser active plastic layer except described Part I plastic layer; Described Part I plastic layer arranges a described M micropore.
Further, after glue process is subtracted to described Part I plastic layer, described first thickness of described Part I plastic layer is 0.3mm-0.5mm, described first thickness of described Part I plastic layer is that 0.3mm-0.5mm refers to that described first thickness of described Part I plastic layer can be 0.3mm, also can be 0.5mm, and other value between 0.3mm to 0.5mm, such as described first thickness can also be 0.4mm, 0.45mm, 0.35mm are equivalent.
Specifically, in order to being connected with power supply of making that described antenna can be more stable, usual meeting arranges conductive metal sheet on described laser active plastic layer, if do not enter to subtract glue process to described Part I plastic layer, described conductive metal sheet evagination will inevitably be caused, and then make when using described shell material, have larger probability to go to touch described conductive metal sheet, and then the infringement probability of described conductive metal sheet is increased, useful life reduces, for this reason, can by subtracting glue process to described Part I plastic layer, described conductive metal sheet is made to be arranged on described Part I plastic layer, described first thickness due to described Part I plastic layer is less than the thickness of described Part II plastic layer, and then can make described conductive metal sheet can not evagination, and then reduce the impaired probability of described conductive metal sheet, such as, the thickness of described Part II plastic layer is 1.0mm, and described first thickness of described Part I plastic layer is when being 0.4mm, the thickness of described conductive metal sheet can be set to 0.1mm-0.6mm, and then can make described conductive metal sheet can not evagination.
The embodiment of the present application additionally provides a kind of electronic equipment, and described electronic equipment is such as the electronic equipments such as smart mobile phone, panel computer, notebook computer.
See Fig. 3, described electronic equipment comprises: housing 301, comprises laser active plastic layer 302; Circuit board 303, is arranged in housing 301; Process chip 304, is arranged on circuit board 303; Antenna 305, is arranged on laser active plastic layer 302, and is electrically connected circuit board 303.
Wherein, circuit board 303 is the mainboard of described electronic equipment, and further, process chip 304 can be independent process chip, also can be within a processor integrated.
Further, antenna 305 is by arranging M micropore on laser active plastic layer 302, wherein, M be not less than 2 integer, control laser again according to laser active plastic layer described in the line activation preset, make the Metal ion release in described laser active plastic layer and be aggregated on described laser active plastic layer, the metal ion after being polymerized is made to form default antenna pattern, wherein, described default antenna pattern at least has double-layer structure, and metalized is carried out to described default antenna pattern and a described M micropore, with described in making at least double-layer structure formed by described M micropore conducting, wherein, described default antenna pattern is through at least two micropores in a described M micropore.
Further, a described M micropore arranges a described M micropore by laser and is formed on described laser active plastic layer, wherein, a described M micropore penetrates described laser active plastic layer, and the diameter of each micropore in a described M micropore is 0.1mm-0.3mm.
Further, the diameter of each micropore in a described M micropore is 0.2mm.
Further, a described M micropore is arranged on the Part I plastic layer in described laser active plastic layer, first thickness of wherein said Part I plastic layer is less than the thickness of the Part II plastic layer of described laser active plastic layer except described Part I plastic layer, glue process can be subtracted to described Part I plastic layer, and then make described first thickness be less than the thickness of described Part II plastic layer.
Further, described first thickness is 0.3mm-0.5mm.
Further, described first thickness of described Part I plastic layer is 0.4mm.
Further, described default antenna pattern is undertaken radium-shine by the tow sides of laser to described laser active plastic layer, is separated by the metal ion in described laser active plastic layer, forms described default antenna pattern at described tow sides with plastics.
Further, described metalized is carried out to described default antenna pattern and a described M micropore, with described in making at least double-layer structure by described M micropore conducting, form described antenna, specifically comprise: to described carrying out of laser active plastics plating, to form metal level at described double-edged default antenna pattern, and in a described M micropore filled conductive metal, form conducting wire, to enable described double-edged default antenna pattern by described M micropore conducting, thus form the antenna of double-side conduction.
Further, can also to spray paint process to described laser active plastic layer.
The one or more technical schemes provided in the embodiment of the present application, at least have following technique effect or advantage:
One, because the embodiment of the present application arranges M micropore on laser active plastic layer, then by laser active plastic layer described in laser active, form default antenna pattern, because described default antenna pattern is by a described M micropore, make when carrying out metalized to described default antenna pattern and a described M micropore, make to form conducting wire in a described M micropore, impel described default antenna pattern to realize by described conducting wire at least double-layer structure that described default antenna pattern comprises and carry out conducting, thus form described antenna, and then without the need to carrying out perforate or fluting on shell material, make the sealing property of described shell material intact, make when shell material carries out the subsequent handling of installing sound chamber, without the need to carrying out sealant pouring and sealing process to described LDS antenna, the operation making antenna is reduced, thus solve the technique of existing making antenna, there is the technical problem of complex procedures, and then achieve minimizing operation technique effect.
They are two years old, because the embodiment of the present application is the Part I plastic layer determining arranging at described laser active plastic layer a described M micropore from described laser active plastic layer, and glue process is subtracted to described Part I plastic layer, the first thickness due to described Part I plastic layer is less than the thickness of the Part II plastic layer of described laser active plastic layer except described Part I plastic layer, so, when making to arrange conductive metal sheet on described Part I plastic layer, make described conductive metal sheet can not evagination, and then reduce the impaired probability of described conductive metal sheet.
Three, because the embodiment of the present application is to described carrying out of laser active plastics plating, to form metal level at described double-edged default antenna pattern, and in a described M micropore filled conductive metal, form conducting wire, to enable described double-edged default antenna pattern by described M micropore conducting, thus form the antenna of double-side conduction, thus realize the technique effect to double-edged antenna pattern conducting connection.
Four, because the embodiment of the present application carries out metalized described to described default antenna pattern and a described M micropore, with described in making at least double-layer structure by described M micropore conducting, after forming described antenna, also described laser active plastic layer is sprayed paint process, make the aperture of a described M micropore less, make the sealing of the miscellaneous part of described laser active plastic layer and described shell material higher, also make the outward appearance of described shell material more attractive in appearance simultaneously.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. a manufacture method for antenna, is characterized in that, have laser active plastic layer in the surface coverage of shell material being used for making antenna, described method comprises:
Described laser active plastic layer arranges M micropore, wherein, M be not less than 2 integer;
Control laser according to laser active plastic layer described in the line activation preset, make the Metal ion release in described laser active plastic layer and be aggregated on described laser active plastic layer, the metal ion after being polymerized is made to form default antenna pattern, wherein, described default antenna pattern at least has double-layer structure;
Metalized is carried out to described default antenna pattern and a described M micropore, with described in making at least double-layer structure by described M micropore conducting, form described antenna, wherein, described default antenna pattern is through at least two micropores in a described M micropore.
2. the method for claim 1, is characterized in that, describedly on described laser active plastic layer, is provided with M micropore, specifically comprises:
On described laser active plastic layer, arrange a described M micropore by laser, a described M micropore penetrates described laser active plastic layer, and wherein, the diameter of each micropore in a described M micropore is 0.1mm-0.3mm.
3. method as claimed in claim 2, it is characterized in that, the diameter of each micropore in a described M micropore is 0.2mm.
4. the method for claim 1, is characterized in that, describedly on described laser active plastic layer, arranges a described M micropore by laser, also comprises:
The Part I plastic layer that a described M micropore is set at described laser active plastic layer is determined from described laser active plastic layer;
Subtract glue process to described Part I plastic layer, wherein, the first thickness of described Part I plastic layer is less than the thickness of the Part II plastic layer of described laser active plastic layer except described Part I plastic layer;
Described Part I plastic layer arranges a described M micropore.
5. method as claimed in claim 4, it is characterized in that, after subtracting glue process to described Part I plastic layer, described first thickness of described Part I plastic layer is 0.3mm-0.5mm.
6. method as claimed in claim 4, it is characterized in that, after subtracting glue process to described Part I plastic layer, described first thickness of described Part I plastic layer is 0.4mm.
7. the method for claim 1, it is characterized in that, described control laser is according to laser active plastic layer described in the line activation preset, make the Metal ion release in described laser active plastic layer and be aggregated on described laser active plastic layer, make the metal ion after being polymerized form default antenna pattern, specifically comprise:
Controlling laser carries out radium-shine according to the tow sides of described default circuit to described laser active plastic layer, make the Metal ion release in described laser active plastic layer and be aggregated on the tow sides of described laser active plastic layer, forming described default antenna pattern at described tow sides.
8. method as claimed in claim 7, is characterized in that, describedly carries out metalized to described default antenna pattern and a described M micropore, with described in making at least double-layer structure by described M micropore conducting, form described antenna, specifically comprise:
To described carrying out of laser active plastics plating, to cover layer of metal layer again on described double-edged default antenna pattern, and in a described M micropore filled conductive metal, form conducting wire, to enable described double-edged default antenna pattern by described M micropore conducting, thus form the antenna of double-side conduction.
9. the method for claim 1, it is characterized in that, described, metalized is carried out to described default antenna pattern and a described M micropore, with described in making at least double-layer structure by described M micropore conducting, after forming described antenna, described method also comprises:
Described laser active plastic layer is sprayed paint process.
10. an electronic equipment, is characterized in that, comprising:
Housing, comprises laser active plastic layer;
Circuit board, is arranged in described housing;
Process chip, is arranged on described circuit board;
The antenna that method as described in claim arbitrary in claim 1 ~ 9 makes, is arranged on described laser active plastic layer, and is electrically connected described circuit board.
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| CN201310422155.XA CN104466368A (en) | 2013-09-16 | 2013-09-16 | Manufacturing method of antenna and electronic device |
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| CN201310422155.XA CN104466368A (en) | 2013-09-16 | 2013-09-16 | Manufacturing method of antenna and electronic device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105722347A (en) * | 2016-04-05 | 2016-06-29 | 东莞劲胜精密组件股份有限公司 | Electronic product shell with built-in antenna and production method of electronic product shell |
| US10268236B2 (en) | 2016-01-27 | 2019-04-23 | Apple Inc. | Electronic devices having ventilation systems with antennas |
| CN112277240A (en) * | 2019-07-23 | 2021-01-29 | Oppo广东移动通信有限公司 | Housing, method for manufacturing housing, and electronic apparatus |
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| CN105722347A (en) * | 2016-04-05 | 2016-06-29 | 东莞劲胜精密组件股份有限公司 | Electronic product shell with built-in antenna and production method of electronic product shell |
| CN112277240A (en) * | 2019-07-23 | 2021-01-29 | Oppo广东移动通信有限公司 | Housing, method for manufacturing housing, and electronic apparatus |
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