CN107969091A - Graphite based on addition process covers copper heat dissipation film and preparation method thereof - Google Patents

Graphite based on addition process covers copper heat dissipation film and preparation method thereof Download PDF

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Publication number
CN107969091A
CN107969091A CN201610914686.4A CN201610914686A CN107969091A CN 107969091 A CN107969091 A CN 107969091A CN 201610914686 A CN201610914686 A CN 201610914686A CN 107969091 A CN107969091 A CN 107969091A
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China
Prior art keywords
ink
thickness
copper
graphite
oil layer
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CN201610914686.4A
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Chinese (zh)
Inventor
刘春雷
杨恺
吴长和
郭庆文
李家洪
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SHANGHAI LANPEI NEW MATERIAL TECHNOLOGY Co.,Ltd.
Shenzhen Sunway Communication Co Ltd
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Shanghai Guangxian New Material Technology Co Ltd
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Priority to CN201610914686.4A priority Critical patent/CN107969091A/en
Publication of CN107969091A publication Critical patent/CN107969091A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/14—Printing or colouring
    • B32B38/145—Printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/26—Printing on other surfaces than ordinary paper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Abstract

A kind of graphite based on addition process covers copper heat dissipation film, including graphite flake, the both sides of the graphite flake are respectively provided with catalyzed oil layer of ink, copper plate is respectively provided with the outside of two catalyzed oil layer of ink, the thickness of the graphite flake is 5 50um, the thickness of the catalyzed oil layer of ink is 2 5um, and the thickness of the copper plate is 2 35um.The configuration of the present invention is simple, easily manufactured, copper is contacted with graphite flake, adds heat conductivility, and realizes that graphite flake covers copper using addition process, is reduced the thickness of product, is saved material cost, adapts to the development trend of electronic product " light and short " now.

Description

Graphite based on addition process covers copper heat dissipation film and preparation method thereof
Technical field
The present invention relates to heat conduction technical field, more particularly to a kind of graphite based on addition process to cover copper heat dissipation film and its preparation Method.
Background technology
In recent years, with the fast development of electronic apparatus technology, with high-capacity LED communication apparatus and personal electric product Gradually tend to miniaturization, high power, high fever direction are developed, so as to influence stability and speed that equipment is run, battery capacity Also because heat is limited, service life of equipment is reduced；Especially for chip, with the increase of its speed of service, its caloric value is in Geometry level increases.The heat dissipation of early stage is eliminated using active heat dissipation, such as fan since volume is larger；Present master Wanting method is conducted heat to using heat-conducting glue and thermal grease conduction on the metal heat sink of outside, but because the thermal conductivity of heat-conducting glue Than relatively low (being less than 5W/mK), and metal heat sink is distant apart from heat generating spot, so heat sinking function cannot be realized well.Cause How this effectively distributes the heat of chip, has become an electronic radiation field key problem urgently to be resolved hurrily.
Chinese patent CN201310630175.6 provides a kind of copper-clad plate with heat sinking function and production method, and in State patent CN20120402243.4 provides a kind of graphite composite heat-conducting glued membrane and graphite composition metal base copper-clad plate.It is above-mentioned to cover Copper coin has good capacity of heat transmission and electrical property, but it is higher as the thickness of heat conducting base material, it is difficult to adapts to electric now The development trend of sub- product " light and short ".
The content of the invention
Based on this, for above-mentioned technical problem, there is provided a kind of graphite based on addition process covers copper heat dissipation film and its preparation side Method.
In order to solve the above technical problems, the present invention adopts the following technical scheme that：
A kind of graphite based on addition process covers copper heat dissipation film, including graphite flake, and the both sides of the graphite flake are respectively provided with catalysis Ink layer, is respectively provided with copper plate on the outside of two catalyzed oil layer of ink, and the thickness of the graphite flake is 5-50um, the catalytic ink The thickness of layer is 2-5um, and the thickness of the copper plate is 2-35um.
There is through hole on the graphite flake, catalyzed oil layer of ink and copper plate.
This programme further relates to a kind of graphite based on addition process and covers copper heat dissipation film, including graphite flake, and the one of the graphite flake Side has catalyzed oil layer of ink, and opposite side is fixed with copper foil layer by glue-line, and the outside of the catalyzed oil layer of ink has copper plate, institute The thickness for stating graphite flake is 5-50um, and the thickness of the catalyzed oil layer of ink is 2-5um, and the thickness of the copper plate is 2-35um, The thickness of the copper foil layer is 7-50um, and the thickness of the glue-line is 2-15um.
There is through hole on the graphite flake, catalyzed oil layer of ink, glue-line and copper plate.
This programme further relates to the preparation method that a kind of graphite covers copper heat dissipation film, including：
First, catalytic ink is printed：
A, catalyzed oil layer of ink is printed in the both sides of graphite flake, the thickness of the graphite flake is 5-50um, the catalytic ink The thickness of layer is 2-5um, and the mixing time of catalytic ink is 20-30min, ink viscosity 200-260/dPa.s, scraper angle For 60-70 °, machine scales are 20-30 °, are highly 4-6mm, scraper pressure 4-6Kg, scraper speed 160- from version 260mm/s, mesh are 300 mesh, thickness 8-12m, 4-10 μm of print thickness；
B, baking-curing, 120 DEG C of temperature, 100 minutes time；
2nd, copper plate is electroplated in the outside of catalyzed oil layer of ink, the thickness of the copper plate is 2-35um, and plating solution composition includes Cupric sulfate pentahydrate 200-250g/l, sulfuric acid 30-40ml/l, chlorion 60-80mg/l, high speed brightening agent for acid copper electroplating 1-3mg/l and Sour copper fills and leads up agent 3-7mg/l, current density 20ASD, electroplating time 15min at a high speed, and electroplating temperature is 40-50 DEG C.
This programme also includes making through hole on the graphite flake before step 1.
This programme further relates to the preparation method that a kind of graphite covers copper heat dissipation film, including：
First, by glue-line in the side of graphite flake heat rolling copper foil, formation copper foil layer, hot 160 DEG C of rolling temperatures, speed 1 M/min；
2nd, catalyzed oil layer of ink is printed：
A, catalyzed oil layer of ink is printed in the opposite side of the graphite flake, the thickness of the graphite flake is 5-50um, described to urge The thickness of carburetion layer of ink is 2-5um, and the mixing time of catalytic ink is 20-30min, and ink viscosity 200-260/dPa.s, is scraped Nose angle degree is 60-70 °, and machine scales are 20-30 °, are highly 4-6mm from version, scraper pressure 4-6Kg, and scraper speed is 160-260mm/s, mesh are 300 mesh, thickness 8-12m, 4-10 μm of print thickness；
B, baking-curing, 120 DEG C of temperature, 100 minutes time；
3rd, copper plate is electroplated in the outside of catalyzed oil layer of ink, the thickness of the copper plate is 2-35um, and plating solution composition includes Cupric sulfate pentahydrate 200-250g/l, sulfuric acid 30-40ml/l, chlorion 60-80mg/l, high speed brightening agent for acid copper electroplating 1-3mg/l and Sour copper fills and leads up agent 3-7mg/l, current density 20ASD, electroplating time 15min at a high speed, and electroplating temperature is 40-50 DEG C.
This programme also includes making through hole on the graphite flake before step 1.
The configuration of the present invention is simple, easily manufactured, copper is contacted with graphite flake, adds heat conductivility, and use addition process Realize that graphite flake covers copper, reduce the thickness of product, save material cost, adapt to electronic product " light and short " now Development trend.
Brief description of the drawings
The present invention is described in detail with reference to the accompanying drawings and detailed description：
A kind of graphite based on addition process that Fig. 1 is the present invention covers the structural representation of copper heat dissipation film in one embodiment Figure；
A kind of graphite based on addition process that Fig. 2 is the present invention covers the preferred solution of copper heat dissipation film in one embodiment Structure diagram；
A kind of graphite based on addition process that Fig. 3 is the present invention covers the structural representation of copper heat dissipation film in another embodiment Figure；
A kind of graphite based on addition process that Fig. 4 is the present invention covers the preferred solution of copper heat dissipation film in another embodiment Structure diagram.
Embodiment
In one embodiment, as shown in Figure 1, a kind of graphite based on addition process covers copper heat dissipation film, including graphite flake 110, the both sides of graphite flake 110 are respectively provided with catalyzed oil layer of ink 120, and the outside of two catalyzed oil layer of ink 120 is respectively provided with copper plate 130, the thickness of graphite flake 110 is 5-50um, and the thickness of catalyzed oil layer of ink 120 is 2-5um, and the thickness of copper plate 130 is 2- 35um。
Preferably, as shown in Fig. 2, having through hole A, graphite on graphite flake 110, catalyzed oil layer of ink 120 and copper plate 130 The cohesive force of itself is very low, easily layering, is that the layers of copper of levels is connected in the purpose of increase hole on graphite, graphite is had more Good cohesive force, reliability are stronger.
In one embodiment, as shown in figure 3, a kind of graphite based on addition process covers copper heat dissipation film, including graphite flake 110, the side of graphite flake 110 has catalyzed oil layer of ink 120, and opposite side is fixed with copper foil layer 140, catalyzed oil by glue-line 130 The outside of layer of ink 120 has copper plate 150, and the thickness of graphite flake 110 is 5-50um, and the thickness of catalyzed oil layer of ink 120 is 2- 5um, the thickness of copper plate 150 is 2-35um, and the thickness of copper foil layer 140 is 7-50um, and the thickness of glue-line 130 is 2-15um.
Preferably, in another embodiment, as shown in figure 4, graphite flake 110, catalyzed oil layer of ink 120, glue-line 130 and plating There is through hole A, the cohesive force of graphite in itself is very low, easily layering, is by levels in the purpose of increase hole on graphite in layers of copper 150 Layers of copper be connected, graphite is had more preferable cohesive force, reliability is stronger.
The present embodiment further relates to the preparation method that a kind of graphite covers copper heat dissipation film, including：
First, catalytic ink is printed：
A, catalyzed oil layer of ink is printed in the both sides of graphite flake, the thickness of graphite flake is 5-50um, the thickness of catalyzed oil layer of ink For 2-5um, the mixing time of catalytic ink is 20-30min, ink viscosity 200-260/dPa.s, scraper angle 60- 70 °, machine scales are 20-30 °, are highly 4-6mm, scraper pressure 4-6Kg, scraper speed 160-260mm/s from version, net Mesh is 300 mesh, thickness 8-12m, 4-10 μm of print thickness.
B, baking-curing, 120 DEG C of temperature, 100 minutes time.
2nd, copper plate is electroplated in the outside of catalyzed oil layer of ink, the thickness of copper plate is 2-35um, and plating solution composition includes five water Copper sulphate 200-250g/l, sulfuric acid 30-40ml/l, chlorion 60-80mg/l, high speed brightening agent for acid copper electroplating 1-3mg/l and high speed Sour copper fills and leads up agent 3-7mg/l, current density 20ASD, electroplating time 15min, and electroplating temperature is 40-50 DEG C.
Heat dissipation film prepared by the present embodiment method is shown in Fig. 1.
Preferably, in one embodiment, through hole can be made on graphite flake before step 1, the heat dissipation film of preparation is shown in Fig. 2, the cohesive force of graphite in itself is very low, easily layering, is that the layers of copper of levels is connected in the purpose of increase hole on graphite, makes Graphite has more preferable cohesive force, and reliability is stronger.
Wherein it is possible to through hole is made on graphite flake using the mode of mould punching or machine drilling.
Embodiment 1
A kind of graphite covers the preparation method of copper heat dissipation film, including：
First, catalytic ink is printed：
A, catalyzed oil layer of ink is printed in the both sides of graphite flake, the thickness of graphite flake is 5um, and the thickness of catalyzed oil layer of ink is 2um, the mixing time of catalytic ink is 20min, and ink viscosity 200/dPa.s, scraper angle is 60 °, and machine scales are 20 °, be highly 4mm, scraper pressure 4Kg, scraper speed 160mm/s from version, and mesh is 300 mesh, and thickness 8m, prints thick 4 μm of degree.
B, baking-curing, 120 DEG C of temperature, 100 minutes time.
2nd, copper plate is electroplated in the outside of catalyzed oil layer of ink, the thickness of copper plate is 2um, and plating solution composition includes five water sulphur Sour copper 200g/l, sulfuric acid 30ml/l, chlorion 60mg/l, high speed brightening agent for acid copper electroplating 1mg/l and the sour copper of high speed fill and lead up agent 7mg/ L, current density 20ASD, electroplating time 15min, electroplating temperature are 40 DEG C.
Embodiment 2
A kind of graphite covers the preparation method of copper heat dissipation film, including：
First, through hole is made on graphite flake.
2nd, catalytic ink is printed：
A, catalyzed oil layer of ink is printed in the both sides of graphite flake, the thickness of graphite flake is 50um, and the thickness of catalyzed oil layer of ink is 5um, the mixing time of catalytic ink is 30min, and ink viscosity 260/dPa.s, scraper angle is 70 °, and machine scales are 30 °, be highly 6mm, scraper pressure 6Kg, scraper speed 260mm/s from version, and mesh is 300 mesh, and thickness 12m, prints 10 μm of thickness.
B, baking-curing, 120 DEG C of temperature, 100 minutes time.
3rd, copper plate is electroplated in the outside of catalyzed oil layer of ink, the thickness of copper plate is 35um, and plating solution composition includes five water sulphur Sour copper 250g/l, sulfuric acid 40ml/l, chlorion 80mg/l, high speed brightening agent for acid copper electroplating 3mg/l and the sour copper of high speed fill and lead up agent 3mg/ L, current density 20ASD, electroplating time 15min, electroplating temperature are 50 DEG C.
Embodiment 3
A kind of graphite covers the preparation method of copper heat dissipation film, including：
First, through hole is made on graphite flake.
2nd, catalytic ink is printed：
A, catalyzed oil layer of ink is printed in the both sides of graphite flake, the thickness of graphite flake is 27um, and the thickness of catalyzed oil layer of ink is 4um, the mixing time of catalytic ink is 25min, and ink viscosity 230/dPa.s, scraper angle is 65 °, and machine scales are 25 °, be highly 5mm, scraper pressure 5Kg, scraper speed 210mm/s from version, and mesh is 300 mesh, and thickness 10m, prints 7 μm of thickness.
B, baking-curing, 120 DEG C of temperature, 100 minutes time.
3rd, copper plate is electroplated in the outside of catalyzed oil layer of ink, the thickness of copper plate is 19um, and plating solution composition includes five water sulphur Sour copper 225g/l, sulfuric acid 35ml/l, chlorion 70mg/l, high speed brightening agent for acid copper electroplating 2mg/l and the sour copper of high speed fill and lead up agent 5mg/ L, current density 20ASD, electroplating time 15min, electroplating temperature are 45 DEG C.
The present embodiment further relates to the preparation method that a kind of graphite covers copper heat dissipation film, including：
First, by glue-line in the side of graphite flake heat rolling copper foil, formation copper foil layer, hot 160 DEG C of rolling temperatures, speed 1 M/min.
2nd, catalyzed oil layer of ink is printed：
A, catalyzed oil layer of ink is printed in the opposite side of graphite flake, the thickness of graphite flake is 5-50um, the thickness of catalyzed oil layer of ink Spend for 2-5um, the mixing time of catalytic ink is 20-30min, ink viscosity 200-260/dPa.s, scraper angle 60- 70 °, machine scales are 20-30 °, are highly 4-6mm, scraper pressure 4-6Kg, scraper speed 160-260mm/s from version, net Mesh is 300 mesh, thickness 8-12m, 4-10 μm of print thickness.
B, baking-curing, 120 DEG C of temperature, 100 minutes time.
3rd, copper plate is electroplated in the outside of catalyzed oil layer of ink, the thickness of copper plate is 2-35um, and plating solution composition includes five water Copper sulphate 200-250g/l, sulfuric acid 30-40ml/l, chlorion 60-80mg/l, high speed brightening agent for acid copper electroplating 1-3mg/l and high speed Sour copper fills and leads up agent 3-7mg/l, current density 20ASD, electroplating time 15min, and electroplating temperature is 40-50 DEG C.
Heat dissipation film prepared by the present embodiment method is shown in Fig. 3.
Preferably, through hole can be made on graphite flake before step 1, the heat dissipation film of preparation is shown in Fig. 4, and graphite is in itself Cohesive force is very low, easily layering, is that the layers of copper of levels is connected in the purpose of increase hole on graphite, graphite is had in preferably Poly- power, reliability are stronger.
Wherein it is possible to through hole is made on graphite flake using the mode of mould punching or machine drilling.
Embodiment 1
A kind of graphite covers the preparation method of copper heat dissipation film, including：
First, by glue-line in the side of graphite flake heat rolling copper foil, formation copper foil layer, hot 160 DEG C of rolling temperatures, speed 1 M/min.
2nd, catalyzed oil layer of ink is printed：
A, catalyzed oil layer of ink is printed in the opposite side of graphite flake, the thickness of graphite flake is 5um, and the thickness of catalyzed oil layer of ink is 2um, the mixing time of catalytic ink is 20min, and ink viscosity 200/dPa.s, scraper angle is 60-70 °, and machine scales are 20 °, be highly 4mm, scraper pressure 4Kg, scraper speed 160mm/s from version, and mesh is 300 mesh, and thickness 8m, prints thick 4 μm of degree.
B, baking-curing, 120 DEG C of temperature, 100 minutes time.
3rd, copper plate is electroplated in the outside of catalyzed oil layer of ink, the thickness of copper plate is 2um, and plating solution composition includes five water sulphur Sour copper 200g/l, sulfuric acid 30ml/l, chlorion 60mg/l, high speed brightening agent for acid copper electroplating 1mg/l and the sour copper of high speed fill and lead up agent 7mg/ L, current density 20ASD, electroplating time 15min, electroplating temperature are 40 DEG C.
Embodiment 2
First, through hole is made on graphite flake.
2nd, by glue-line in the side of graphite flake heat rolling copper foil, formation copper foil layer, hot 160 DEG C of rolling temperatures, speed 1 M/min.
3rd, catalyzed oil layer of ink is printed：
A, catalyzed oil layer of ink is printed in the opposite side of graphite flake, the thickness of graphite flake is 50um, the thickness of catalyzed oil layer of ink For 5um, the mixing time of catalytic ink is 30min, and ink viscosity 260/dPa.s, scraper angle is 70 °, and machine scales are 30 °, be highly 6mm, scraper pressure 6Kg, scraper speed 260mm/s from version, and mesh is 300 mesh, and thickness 12m, prints 10 μm of thickness.
B, baking-curing, 120 DEG C of temperature, 100 minutes time.
4th, copper plate is electroplated in the outside of catalyzed oil layer of ink, the thickness of copper plate is 35um, and plating solution composition includes five water sulphur Sour copper 250g/l, sulfuric acid 40ml/l, chlorion 80mg/l, high speed brightening agent for acid copper electroplating 3mg/l and the sour copper of high speed fill and lead up agent 3mg/ L, current density 20ASD, electroplating time 15min, electroplating temperature are 50 DEG C.
Embodiment 3
A kind of graphite covers the preparation method of copper heat dissipation film, including：
First, through hole is made on graphite flake.
2nd, by glue-line in the side of graphite flake heat rolling copper foil, formation copper foil layer, hot 160 DEG C of rolling temperatures, speed 1 M/min.
3rd, catalyzed oil layer of ink is printed：
A, catalyzed oil layer of ink is printed in the opposite side of graphite flake, the thickness of graphite flake is 27um, the thickness of catalyzed oil layer of ink For 4um, the mixing time of catalytic ink is 25min, and ink viscosity 230/dPa.s, scraper angle is 75 °, and machine scales are 25 °, be highly 5mm, scraper pressure 5Kg, scraper speed 210mm/s from version, and mesh is 300 mesh, and thickness 10m, prints 7 μm of thickness.
B, baking-curing, 120 DEG C of temperature, 100 minutes time.
4th, copper plate is electroplated in the outside of catalyzed oil layer of ink, the thickness of copper plate is 19um, and plating solution composition includes five water sulphur Sour copper 225g/l, sulfuric acid 35ml/l, chlorion 70mg/l, high speed brightening agent for acid copper electroplating 2mg/l and the sour copper of high speed fill and lead up agent 5mg/ L, current density 20ASD, electroplating time 15min, electroplating temperature are 45 DEG C.
But those of ordinary skill in the art is it should be appreciated that the embodiment of the above is intended merely to explanation originally Invention, and be not used as limitation of the invention, as long as in the spirit of the present invention, to embodiment described above Change, modification will all fall in the range of claims of the present invention.

Claims (8)

1. a kind of graphite based on addition process covers copper heat dissipation film, it is characterised in that including graphite flake, the both sides of the graphite flake are equal With catalyzed oil layer of ink, copper plate is respectively provided with the outside of two catalyzed oil layer of ink, the thickness of the graphite flake is 5-50um, described The thickness of catalyzed oil layer of ink is 2-5um, and the thickness of the copper plate is 2-35um.
2. a kind of graphite based on addition process according to claim 1 covers copper heat dissipation film, it is characterised in that the graphite There is through hole on piece, catalyzed oil layer of ink and copper plate.
3. a kind of graphite based on addition process covers copper heat dissipation film, it is characterised in that including graphite flake, the side tool of the graphite flake There is catalyzed oil layer of ink, opposite side is fixed with copper foil layer by glue-line, and the outside of the catalyzed oil layer of ink has copper plate, the stone The thickness of ink sheet is 5-50um, and the thickness of the catalyzed oil layer of ink is 2-5um, and the thickness of the copper plate is 2-35um, described The thickness of copper foil layer is 7-50um, and the thickness of the glue-line is 2-15um.
4. a kind of graphite based on addition process according to claim 3 covers copper heat dissipation film, it is characterised in that the graphite There is through hole on piece, catalyzed oil layer of ink, glue-line and copper plate.
5. a kind of graphite described in a kind of claim 1 covers the preparation method of copper heat dissipation film, it is characterised in that including：
First, catalytic ink is printed：
A, catalyzed oil layer of ink is printed in the both sides of graphite flake, the thickness of the graphite flake is 5-50um, the catalyzed oil layer of ink Thickness is 2-5um, and the mixing time of catalytic ink is 20-30min, ink viscosity 200-260/dPa.s, and scraper angle is 60-70 °, machine scales are 20-30 °, are highly 4-6mm, scraper pressure 4-6Kg, scraper speed 160-260mm/ from version S, mesh are 300 mesh, thickness 8-12m, 4-10 μm of print thickness；
B, baking-curing, 120 DEG C of temperature, 100 minutes time；
2nd, copper plate is electroplated in the outside of catalyzed oil layer of ink, the thickness of the copper plate is 2-35um, and plating solution composition includes five water Copper sulphate 200-250g/l, sulfuric acid 30-40ml/l, chlorion 60-80mg/l, high speed brightening agent for acid copper electroplating 1-3mg/l and high speed Sour copper fills and leads up agent 3-7mg/l, current density 20ASD, electroplating time 15min, and electroplating temperature is 40-50 DEG C.
6. a kind of graphite according to claim 5 covers the preparation method of copper heat dissipation film, it is characterised in that is additionally included in step Before one through hole is made on the graphite flake.
7. a kind of graphite described in a kind of claim 3 covers the preparation method of copper heat dissipation film, it is characterised in that including：
First, by glue-line in the side of graphite flake heat rolling copper foil, formation copper foil layer, hot 160 DEG C of rolling temperatures, 1 m/min of speed Clock；
2nd, catalyzed oil layer of ink is printed：
A, catalyzed oil layer of ink is printed in the opposite side of the graphite flake, the thickness of the graphite flake is 5-50um, the catalyzed oil The thickness of layer of ink is 2-5um, and the mixing time of catalytic ink is 20-30min, and ink viscosity 200-260/dPa.s, scrapes nose angle Spend for 60-70 °, machine scales are 20-30 °, are highly 4-6mm, scraper pressure 4-6Kg, scraper speed 160- from version 260mm/s, mesh are 300 mesh, thickness 8-12m, 4-10 μm of print thickness；
B, baking-curing, 120 DEG C of temperature, 100 minutes time；
3rd, copper plate is electroplated in the outside of catalyzed oil layer of ink, the thickness of the copper plate is 2-35um, and plating solution composition includes five water Copper sulphate 200-250g/l, sulfuric acid 30-40ml/l, chlorion 60-80mg/l, high speed brightening agent for acid copper electroplating 1-3mg/l and high speed Sour copper fills and leads up agent 3-7mg/l, current density 20ASD, electroplating time 15min, and electroplating temperature is 40-50 DEG C.
8. a kind of graphite according to claim 7 covers the preparation method of copper heat dissipation film, it is characterised in that is additionally included in step Before one through hole is made on the graphite flake.
CN201610914686.4A 2016-10-20 2016-10-20 Graphite based on addition process covers copper heat dissipation film and preparation method thereof Pending CN107969091A (en)

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JP3205998U (en) * 2016-06-14 2016-08-25 林鉦絖 Metal heat sink structure
CN206136564U (en) * 2016-10-20 2017-04-26 上海光线新材料科技有限公司 Graphite covers copper thermal film based on addition process

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TW200923132A (en) * 2007-11-21 2009-06-01 Everskill Technology Co Ltd Method for combination of graphite sheet and metal
CN202135441U (en) * 2011-07-22 2012-02-01 长沙理工大学 Composite radiating fin
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